CN109195330A - A kind of pcb board without copper optical point manufacturing method and its without bronzing point structure - Google Patents
A kind of pcb board without copper optical point manufacturing method and its without bronzing point structure Download PDFInfo
- Publication number
- CN109195330A CN109195330A CN201811018275.2A CN201811018275A CN109195330A CN 109195330 A CN109195330 A CN 109195330A CN 201811018275 A CN201811018275 A CN 201811018275A CN 109195330 A CN109195330 A CN 109195330A
- Authority
- CN
- China
- Prior art keywords
- copper
- pcb board
- optical point
- tin
- welding resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0015—Orientation; Alignment; Positioning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Abstract
The manufacturing method that the invention discloses a kind of PCB without copper optical point and its without bronzing point structure.Photosensitive dry film is added on the surface of pcb board layers of copper, the preliminary configuration of no copper optical point will be obtained in pattern transfer to photosensitive dry film previously fabricated on the black film by ultraviolet light, the pcb board layers of copper progress layers of copper of no photosensitive dry film is added after plating and being tin plating, the layers of copper for exposing region locating for dry film is corroded using etch process, obtains no copper optical point；After moving back tin and ink for screen printing, tin is sprayed after carrying out photosensitive dissolution by the welding resistance protective film to the annular region on the outside of no copper optical point, to obtain the outside tin ring of no copper optical point, basis is established to light for no copper optical point.
Description
Technical field
The present invention relates to pcb board optical point manufacturing field, especially a kind of pcb board without copper optical point manufacturing method and its
No bronzing point structure.
Background technique
Currently, SMT patch is a highly important process, in the production process of pcb board in order to accurately install each member
Device, how accurate contraposition is related to the production efficiency of pcb board when SMT patch.Conventional method, which is typically employed on pcb board, to be arranged
Although optical point when round copper is aligned as SMT, may be implemented to align using this way, but more to pcb board progress
Optical point can usually be wiped to flower after secondary carrying or hit missing, planarization cannot ensure when causing vertically to spray tin.In order to solve this
A problem needs using no copper optical point and is arranged in the marginal position of pcb board, moreover it is possible to it is black to realize to have the tin plating structure of annular
It is white to light, in the prior art there are no a kind of method can produce annular without copper optical point.
Summary of the invention
To solve the above problems, the purpose of the present invention is to provide a kind of methods is manufactured in pcb board without copper optical point,
And tin ring on the outside of no copper optical point plus on the outside of plating.Hardware foundation is established to light for the later period.
Technical solution used by the present invention solves the problems, such as it is: a kind of pcb board without copper optical point manufacturing method, including
Following steps:
Step A, removes the pollutant on pcb board surface, and photosensitive dry film hot pressing is adhered to pcb board layers of copper surface；
Step B will be placed on pcb board on the black film with figure, by ultraviolet light to being exposed on photosensitive dry film
After obtain exposure dry film, unexposed photosensitive dry film is dissolved using developing machine, expose pcb board layers of copper；
Step C carries out copper facing to the pcb board layers of copper of the exposing and obtains adding copper plate, copper plate electroplating surfaces with tin is being added to obtain
To tin layers；
Exposure dry film on pcb board is dissolved, is invaded using etching solution the copper face exposed after dissolution by step D
Erosion exposes the surface of pcb board substrate, obtains no copper optical point；
Step E carries out after moving back tin processing the tin layers on pcb board using tin liquid medicine is moved back, the ink for screen printing on PCB；
Step F places the welding resistance film of exterior annular figure of the band without copper optical point on the welding resistance protective film of ink pellet surface,
After being exposed by ultraviolet light to welding resistance protective film, unexposed welding resistance protective film is dissolved, obtains the outside of no copper optical point
Annulus；
Step G carries out spray tin using outer annular of the tin-spraying machine to no copper optical point, obtains with outside tin ring without bronzing
Learn point.
It further, further include that pcb board is stood 30 minutes after by ultraviolet light to photosensitive dry film exposure.
Further, the ink of silk-screen is solidification welding resistance type ink, the surface for solidifying welding resistance type ink on the pcb board
Including welding resistance protective film.
Further, after to ink for screen printing, further include the processing by mending furnace with cramps, stamp-pad ink is subjected to semi-solid preparation.
Further, the welding resistance protective film is made of light-sensitive material, when by the ultraviolet light welding resistance film, photosensitive part
Light-sensitive material hardened under ultraviolet light.
Further, after unexposed welding resistance protective film dissolution, heat hardening and drying are carried out to the welding resistance protective film of exposure.
A kind of a kind of pcb board described above without the manufacture of copper optical point manufacturing method without bronzing point structure, comprising:
Pcb board substrate and PCB copper plate layer, the PCB copper plate layer are bonded with pcb board substrate top surface；
It further include outside tin ring, the outside tin ring is bonded with PCB copper plate layer top surface；
It further include no copper optical point, the no copper optical point runs through outside tin ring and PCB copper plate layer to the top of pcb board substrate
Side surface.
Further, the no copper optical point is circle without copper optical point；The outside tin ring is tin ring on the outside of circular ring shape.
Further, the no bronzing point is located at outside Xi Huan circle ring center；The annular width of the outside tin ring is
0.5mm-0.9mm。
It further, further include welding resistance protective film for protecting pcb board route, the welding resistance protective film and PCB copper plate layer
Top surface fitting；The outside of the outside tin ring is bonded with welding resistance protective film；The thickness of the outside tin ring is protected greater than welding resistance
The thickness of cuticula.
The beneficial effects of the present invention are: the present invention is using a kind of pcb board without copper optical point manufacturing method and its without bronzing
Learn point structure, on pcb board first in outer layer dry film by exposure, be electroplated and etching obtains no copper optical point, then by ink
It after on silk-screen to pcb board, is exposed, dissolved and plating is obtained by the welding resistance protective film to the ink pellet surface around optical point
With outside tin ring without copper optical point.To the method that can only manufacture annular copper optical point compared with the prior art, technology of the invention
Scheme can the edge of manufacture pcb board produce with outside tin ring without copper optical point, be subsequent no copper optical point to light
It lays the foundation.
Detailed description of the invention
The invention will be further described with example with reference to the accompanying drawing.
Fig. 1 is a kind of pcb board of the present invention without copper optical point manufacturing method flow chart；
Fig. 2 is a kind of pcb board of the present invention without pcb board schematic diagram used in copper optical point manufacturing method；
Fig. 3 is that a kind of present invention pcb board places the signal of the black film on pcb board surface without copper optical point manufacturing method
Figure；
Fig. 4 is the pcb board schematic diagram of a kind of pcb board of the present invention executed after step B without copper optical point manufacturing method；
Fig. 5 is the pcb board schematic diagram of a kind of pcb board of the present invention executed after step C without copper optical point manufacturing method；
Fig. 6 is the pcb board schematic diagram of a kind of pcb board of the present invention executed after step D without copper optical point manufacturing method；
Fig. 7 is the pcb board schematic diagram of a kind of pcb board of the present invention executed after step E without copper optical point manufacturing method；
Fig. 8 is the pcb board schematic diagram of a kind of pcb board of the present invention executed after step F without copper optical point manufacturing method；
Fig. 9 is the pcb board schematic diagram of a kind of pcb board of the present invention executed after step G without copper optical point manufacturing method；
Figure 10 is a kind of annular without completion manufactured by copper optical point manufacturing method of pcb board of the present invention without copper optical point
Top view.
Drawing reference numeral explanation:
1.PCB plate substrate；2.PCB plate layers of copper；3. photosensitive dry film；4. the black film；5. black film figure；6. exposing dry film；
7. adding copper plate；8. tin layers；9. welding resistance protective film；10. outer annular；11. outside tin ring；12. without copper optical point.
Specific embodiment
Referring to Fig.1, a kind of pcb board of the invention without copper optical point manufacturing method, comprising the following steps:
Step A, removes the pollutant on pcb board surface, and 3 hot pressing of photosensitive dry film is adhered to 2 surface of pcb board layers of copper；
Step B will be placed on pcb board on the black film 4 with figure, by ultraviolet light to exposing on photosensitive dry film 3
Exposure dry film 6 is obtained after light, is dissolved unexposed photosensitive dry film 3 using developing machine, exposes pcb board layers of copper 2；
Step C carries out copper facing to the pcb board layers of copper 2 of the exposing and obtains adding copper plate 7, adding 7 electroplating surfaces with tin of copper plate
Obtain tin layers 8；
Step D dissolves the exposure dry film 6 on pcb board, is invaded using etching solution the copper face exposed after dissolution
Erosion exposes the surface of pcb board substrate 1, obtains no copper optical point 12；
Step E carries out after moving back tin processing the tin layers 8 on pcb board using tin liquid medicine is moved back, the ink for screen printing on PCB；
Step F, the welding resistance that exterior annular figure of the band without copper optical point is placed on the welding resistance protective film 9 of ink pellet surface are luxuriant and rich with fragrance
Woods after being exposed by ultraviolet light to welding resistance protective film, dissolves unexposed welding resistance protective film, obtains the outer of no copper optical point
Side ring 10；
Step G carries out spray tin using outer annular 10 of the tin-spraying machine to no copper optical point, obtains the nothing with outside tin ring 11
Copper optical point.
With reference to Fig. 2, wherein photosensitive dry film 3 is adhered in the processed pcb board layers of copper 2 of nog plate by rumble film machine hot pressing, complete
Pcb board after as shown in Fig. 2, from the bottom to top 3 layers be respectively pcb board substrate 1, pcb board layers of copper 2 and photosensitive dry film 3.
With reference to Fig. 3 and Fig. 4, wherein be exposed, the figure on the black film 4 can be printed to photosensitive dry film using ultraviolet light
It makes in photosensitive dry film 3, as shown in figure 3, have the black film figure 5 in the part of figure in the black film 4, when carrying out ultraviolet lighting,
The part of the sheltered from photosensitive dry film 3 of the black film 4 is not by influence of ultraviolet light, so that original state is kept, and black 5 region of film figure
Photosensitive dry film 3 directly receives ultraviolet light, and since photosensitive dry film is photosensitive material, the part photosensitive dry film 3 is ultraviolet
Hardening generates exposure dry film 6 under the conditions of light irradiation, to realize image transfer.The black film 4 is removed after image transfer to be used in combination
Sodium carbonate liquor dissolves photosensitive dry film 3, since exposure dry film 6 is hardened, will not be carbonated sodium solution dissolution,
Therefore as shown in figure 4, there is no photosensitive dry films 3, only exposure dry film 6 in pcb board layers of copper 2 after the completion of dissolving, in the present invention,
The shape of photosensitive dry film 6 is the shape without copper optical point.
With reference to Fig. 5, wherein thickeied to obtain plus copper plate 7 to copper face by copper facing chemical medicinal liquid in step C, in turn
Increase the thickness of pcb board, and carry out on adding copper plate 7 it is tin plating obtain tin layers 8, due to it is tin plating be to be carried out on adding copper plate,
Therefore there is no tin layers 8 on exposure dry film 6, will effectively separate without copper optical point.
With reference to Fig. 6, wherein the dissolution of dry film 6 will be exposed using solution in step D and cleaned up, expose originally cover at this time
The layers of copper surface of lid exposure dry film 6, exposing 1 surface of pcb board substrate after being eroded by moment liquid medicine to layers of copper surface, and its
It is remaining partially due to the erosion for thering is the protection of tin layers 8 not will receive etching solution, original state is kept, so as to form no copper optical point
12。
With reference to Fig. 7, wherein pcb board surface needs to do insulation processing, in order to avoid route sends open circuit, therefore carries out to tin layers 8
Silk-screen curing ink after tin is handled is moved back, the surface of the ink is welding resistance protective film 9.
Preferably, before carrying out ink for screen printing to copper face, the oxide layer of copper face is also removed by pickling and oil removing process, with
Guarantee good contact.
With reference to Fig. 8, what it is due to no copper optical point 12 is to utilize the image seat of giving out light using black and white to light principle
Optical point contraposition, it is therefore desirable to annular tin ring is plated around no copper optical point 12.Used method is similar with step B, root
According to the figure on the actual demand manufacture welding resistance film, due to current embodiment require that being carried out to the annular region near no copper optical point
It is tin plating after removal, therefore the annular region should be covered in the welding resistance film, avoid it from being hardened by ultraviolet lighting.
With reference to Fig. 9, wherein the spray tin region of the tin-spraying machine is set as the region of outer annular 10, completes shape after spray tin
At outside tin ring 11.
With reference to Figure 10, wherein completion is border circular areas without copper optical point 12, and outside is outside tin ring 11.
Wherein, when the carrying out without bronzing point to light of tin ring on the outside of using band produced by the present invention, outside tin ring 11 by
Then white reflection material, as the white polarity identification to light device, no copper optical point 12 due to inside be Primary layer not
It is reflective, it is accordingly used in being identified as black polarity.It is used as the technical solution of optical point using round copper to compared with existing, it is sharp
It can effectively be avoided without copper optical point due to the abrasion of optical point caused by colliding and rubbing in handling process with outside tin ring, and
And it carries out identifying the precision that can improve identification using black and white polarity.
Preferably, the mode that the pollutant on the removal pcb board surface uses is nog plate.
Wherein, pollutant in pcb board layers of copper 2 is removed by nog plate mode, helps to increase copper face roughness, increases photosensitive
The binding force of dry film and pcb board.
It further, further include that pcb board is stood 30 minutes after by ultraviolet light to photosensitive dry film exposure.
Further, the ink of silk-screen is solidification welding resistance type ink, the surface for solidifying welding resistance type ink on the pcb board
Including welding resistance protective film.
Further, after to ink for screen printing, further include the processing by mending furnace with cramps, stamp-pad ink is subjected to semi-solid preparation.
Wherein, after the ink passes through print machine silk-screen to 2 surface of pcb board layers of copper, in order to fix ink, it is therefore desirable to carry out
Semi-solid preparation.
Further, the welding resistance protective film is made of light-sensitive material, when by the ultraviolet light welding resistance film, photosensitive part
Light-sensitive material hardened under ultraviolet light.
Further, after unexposed welding resistance protective film dissolution, heat hardening and drying are carried out to the welding resistance protective film of exposure.
It wherein, further include being removed solder extra on pcb board with hot wind after completion spray tin.
With reference to Fig. 9, a kind of a kind of pcb board described above without the manufacture of copper optical point manufacturing method without copper optical point knot
Structure, comprising: pcb board substrate 1 and PCB copper plate layer 2, the PCB copper plate layer 2 are bonded with 1 top surface of pcb board substrate；
It further include outside tin ring 11, the outside tin ring 11 is bonded with 2 top surface of PCB copper plate layer；
It further include no copper optical point 12, the no copper optical point 12 runs through outside tin ring 11 and PCB copper plate layer 2 to pcb board
The top surface of substrate 1.
Wherein, as shown in figure 9, the no copper optical point 12 runs through outside tin ring 11 and PCB copper plate layer 2 from thickness direction,
I.e. through direction is vertical with the surface of pcb board substrate 1, thus when meeting printing to light the needs of.
Preferably, outside tin ring 11 is cooperated to be used as optics point structure using no copper optical point 12, due to being not protrusion
Solid construction, therefore not will cause wiping flower and collision in the handling process.In practical applications, outside tin ring 11 is known as white
Other layer, no copper optical point 12 complete the positioning to optical point as black identification layer.And without copper optical point 12 because being through PCB
Copper plate layer 2 is consequently belonging to no copper design, can't lead to not identify because of the spray tin out-of-flatness of outside tin ring 11.
Further, the no copper optical point 12 is circle without copper optical point；The outside tin ring 11 is tin on the outside of circular ring shape
Ring.
Further, the no copper optical point 12 is located at 11 circle ring center of outside Xi Huan；The annulus of the outside tin ring 11 is wide
Degree is 0.12mm-0.9mm.
Preferably due to the annulus of outside tin ring 11 and be concentric structure without copper optical point 12, therefore when no bronzing
When the radius of point 12 is R, the radius of 11 outermost of outside tin ring circle is R+0.12mm to R+0.9mm.
It further, further include welding resistance protective film 9 for protecting pcb board route, the welding resistance protective film 9 and PCB copper sheet
Layer 2 top surfaces fitting；The outside of the outside tin ring 11 is bonded with welding resistance protective film 9；The thickness of the outside tin ring 11 is big
In the thickness of welding resistance protective film 9.
The above, only presently preferred embodiments of the present invention, the invention is not limited to above embodiment, as long as
It reaches technical effect of the invention with identical means, all should belong to protection scope of the present invention.
Claims (10)
1. a kind of pcb board without copper optical point manufacturing method, which comprises the following steps:
Step A, removes the pollutant on pcb board surface, and photosensitive dry film hot pressing is adhered to pcb board layers of copper surface；
Step B will be placed on pcb board on the black film with figure, be obtained by ultraviolet light to after being exposed on photosensitive dry film
To exposure dry film, unexposed photosensitive dry film is dissolved using developing machine, exposes pcb board layers of copper；
Step C carries out copper facing to the pcb board layers of copper of the exposing and obtains adding copper plate, copper plate electroplating surfaces with tin is being added to obtain tin
Layer；
Step D dissolves the exposure dry film on pcb board, and being eroded using etching solution to the copper face exposed after dissolution is made
The surface of pcb board substrate is exposed, and no copper optical point is obtained；
Step E carries out after moving back tin processing the tin layers on pcb board using tin liquid medicine is moved back, the ink for screen printing on PCB；
Step F places the welding resistance film of exterior annular figure of the band without copper optical point on the welding resistance protective film of ink pellet surface, passes through
After ultraviolet light is exposed welding resistance protective film, unexposed welding resistance protective film is dissolved, obtains the outer annular of no copper optical point；
Step G carries out spray tin using outer annular of the tin-spraying machine to no copper optical point, obtains with outside tin ring without bronzing
Point.
2. a kind of pcb board according to claim 1 without copper optical point manufacturing method, it is characterised in that: pass through ultraviolet light
It further include that pcb board is stood 30 minutes after photosensitive dry film exposure.
3. a kind of pcb board according to claim 1 without copper optical point manufacturing method, it is characterised in that: on the pcb board
The ink of silk-screen is solidification welding resistance type ink, and the surface for solidifying welding resistance type ink includes welding resistance protective film.
4. a kind of pcb board according to claim 3 without copper optical point manufacturing method, it is characterised in that: to ink for screen printing
It afterwards, further include that stamp-pad ink is carried out by semi-solid preparation by the processing of curium furnace.
5. a kind of pcb board according to claim 4 without copper optical point manufacturing method, it is characterised in that: the welding resistance is protected
Cuticula is made of light-sensitive material, and when by the ultraviolet light welding resistance film, the light-sensitive material of photosensitive part is under ultraviolet light
Hardening.
6. a kind of pcb board according to claim 1 without copper optical point manufacturing method, it is characterised in that: unexposed resistance
After welding protective film dissolution, heat hardening and drying are carried out to the welding resistance protective film of exposure.
7. it is a kind of using a kind of any pcb board of claim 1-6 without the manufacture of copper optical point manufacturing method without bronzing
Learn point structure characterized by comprising pcb board substrate (1) and PCB copper plate layer (2), the PCB copper plate layer (2) and pcb board base
The fitting of material (1) top surface；
It further include outside tin ring (11), the outside tin ring (11) is bonded with PCB copper plate layer (2) top surface；
It further include no copper optical point (12), the no copper optical point (12) runs through outside tin ring (11) and PCB copper plate layer (2) extremely
The top surface of pcb board substrate (1).
8. a kind of no bronzing point structure according to claim 7, it is characterised in that: the no copper optical point (12) is circle
Shape is without copper optical point；The outside tin ring (11) is tin ring on the outside of circular ring shape.
9. a kind of no bronzing point structure according to claim 8, it is characterised in that: the no copper optical point (12) is located at
Outside tin ring (11) circle ring center；The annular width of the outside tin ring (11) is 0.5mm-0.9mm.
10. a kind of no bronzing point structure according to claim 7, it is characterised in that: further include for protecting pcb board line
The welding resistance protective film (9) on road, the welding resistance protective film (9) are bonded with PCB copper plate layer (2) top surface；The outside tin ring
(11) outside is bonded with welding resistance protective film (9)；The thickness of the outside tin ring (11) is greater than the thickness of welding resistance protective film (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811018275.2A CN109195330A (en) | 2018-09-03 | 2018-09-03 | A kind of pcb board without copper optical point manufacturing method and its without bronzing point structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811018275.2A CN109195330A (en) | 2018-09-03 | 2018-09-03 | A kind of pcb board without copper optical point manufacturing method and its without bronzing point structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109195330A true CN109195330A (en) | 2019-01-11 |
Family
ID=64917869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811018275.2A Pending CN109195330A (en) | 2018-09-03 | 2018-09-03 | A kind of pcb board without copper optical point manufacturing method and its without bronzing point structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN109195330A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1980522A (en) * | 2005-11-29 | 2007-06-13 | 比亚迪股份有限公司 | Optical identifying welding plate for printed circuit board and mfg. method |
| CN103068179A (en) * | 2012-12-20 | 2013-04-24 | 景旺电子科技(龙川)有限公司 | Teflon printed circuit board anti-welding manufacture technology method |
| CN104039085A (en) * | 2014-06-06 | 2014-09-10 | 胜宏科技（惠州）股份有限公司 | Method for preventing optical positioning point off |
| CN104411099A (en) * | 2014-12-04 | 2015-03-11 | 奥士康科技（益阳）有限公司 | Transfer method for circuitous pattern of heavy copper printed circuit board |
| CN107278023A (en) * | 2017-07-28 | 2017-10-20 | 深圳市景旺电子股份有限公司 | Flex circuit application reinforcement and flex circuit application |
-
2018
- 2018-09-03 CN CN201811018275.2A patent/CN109195330A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1980522A (en) * | 2005-11-29 | 2007-06-13 | 比亚迪股份有限公司 | Optical identifying welding plate for printed circuit board and mfg. method |
| CN103068179A (en) * | 2012-12-20 | 2013-04-24 | 景旺电子科技(龙川)有限公司 | Teflon printed circuit board anti-welding manufacture technology method |
| CN104039085A (en) * | 2014-06-06 | 2014-09-10 | 胜宏科技（惠州）股份有限公司 | Method for preventing optical positioning point off |
| CN104411099A (en) * | 2014-12-04 | 2015-03-11 | 奥士康科技（益阳）有限公司 | Transfer method for circuitous pattern of heavy copper printed circuit board |
| CN107278023A (en) * | 2017-07-28 | 2017-10-20 | 深圳市景旺电子股份有限公司 | Flex circuit application reinforcement and flex circuit application |
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Application publication date: 20190111 |
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