CN104039085A - Method for preventing optical positioning point off - Google Patents
Method for preventing optical positioning point off Download PDFInfo
- Publication number
- CN104039085A CN104039085A CN201410249276.3A CN201410249276A CN104039085A CN 104039085 A CN104039085 A CN 104039085A CN 201410249276 A CN201410249276 A CN 201410249276A CN 104039085 A CN104039085 A CN 104039085A
- Authority
- CN
- China
- Prior art keywords
- solder mask
- mask window
- copper
- optical
- locating point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Abstract
The invention discloses a method for preventing an optical positioning point off. The method for preventing the optical positioning point off includes the following steps: S1, arranging a copper-free open area at the periphery of an optical positioning point, wherein the copper-free open area is arranged at the outer surface of a circuit board for surface mounting or locating in testing; S2, opening a solder mask window in the copper-free open area, and arranging solder mask paint at the periphery of the solder mask window; S3, arranging a protecting circular ring at the outer edge of the solder mask window, wherein the protecting circular ring is arranged below the solder mask paint and circles the solder mask window therein, and the distance between the protecting circular ring and the solder mask window is 1.00 millimeters. By means of the method for preventing the optical positioning point off, the solder mask window of the optical point is smaller than the circular ring; ink covers the circular ring to prevent influencing optical scanning.
Description
Technical field
The present invention relates to wiring board field, particularly prevent the method that optical locating point comes off.
Background technology
The optical locating point that optical point is namely said conventionally, generally speaking optical point is divided into two classes, and a class is the whole plate identification benchmark in wiring board assembling process, the another kind of identification basic point as the element that in PCB, indivedual assembly precisions are had relatively high expectations.
In PCB technology is produced, meet sometimes the optical locating point of design in some client's plate around for without the spacious district of copper, repeatedly pass through in process of production the cleaning of pre-treatment liquid medicine; Cause optical point obscission, cause losing positioning function.
Summary of the invention
For overcoming the shortcomings and deficiencies of above-mentioned prior art, the present invention proposes a kind of method that prevents that optical locating point from coming off.
Technical scheme of the present invention is:
Prevent the method that optical locating point comes off, comprise the steps:
S1: arrange around optical locating point without the spacious district of copper, the described outer surface that is arranged at wiring board without the spacious district of copper is to be used as surface mount and test position fix;
S2: open up solder mask window described without the spacious district of copper, and be provided with anti-welding paint at solder mask window periphery;
S3: increase protection annulus in the outer of described solder mask window, described protection annulus is arranged under anti-welding paint, and this solder mask window circle is established wherein, and the spacing of this protection annulus and solder mask window is 1.00mm.
As further technical scheme, be also included in described solder mask window place and arrange the reference column main body of interference, described and be furnished with some protrusion muscle at the ancon of reference column main body.
As further technical scheme, the straight lower floor of described optical locating point is complete copper sheet.
As further technical scheme, described protection annulus is copper ring.
As further technical scheme, described copper ring is 3.8 ~ 4.5mm.
Technique effect of the present invention is: this invention can make optical point solder mask window less than annulus; With ink lid annulus. prevent from affecting optical scanner.
Embodiment
Understand technology contents of the present invention for convenience of those skilled in the art, below the present invention is described in further detail.
In a preferred embodiment, a kind of method that prevents that optical locating point from coming off, comprises the steps:
S1: arrange around optical locating point without the spacious district of copper, the described outer surface that is arranged at wiring board without the spacious district of copper is to be used as surface mount and test position fix;
S2: open up solder mask window described without the spacious district of copper, and be provided with anti-welding paint at solder mask window periphery;
S3: increase protection annulus in the outer of described solder mask window, described protection annulus is arranged under anti-welding paint, and this solder mask window is located at wherein, and the spacing of this protection annulus and solder mask window is 1.00mm.
In this embodiment, the method is also included in described solder mask window place reference column main body is set, described and be furnished with some protrusion muscle at the ancon of reference column main body.
In addition,, in this preferred embodiment, the straight lower floor of described optical locating point is complete copper sheet.In addition, described protection annulus is copper ring, certainly, in other embodiment, also can be other becket, and being not limited to must be copper ring.In this embodiment, described copper ring is 3.8 ~ 4.5mm.
Above-described embodiment is only wherein specific implementation of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these apparent replacement forms all belong to protection scope of the present invention.
Claims (5)
1. prevent the method that optical locating point comes off, comprise the steps:
S1: arrange around optical locating point without the spacious district of copper, the described outer surface that is arranged at wiring board without the spacious district of copper is to be used as surface mount and test position fix;
S2: open up solder mask window described without the spacious district of copper, and be provided with anti-welding paint at solder mask window periphery;
S3: increase protection annulus in the outer of described solder mask window, described protection annulus is arranged under anti-welding paint, and this solder mask window is located at wherein, and the spacing of this protection annulus and solder mask window is 1.00mm.
2. a kind of method that prevents that optical point from coming off according to claim 1, is characterized in that, is also included in described solder mask window place reference column main body is set, described and be furnished with some protrusion muscle at the ancon of reference column main body.
3. a kind of method that prevents that optical locating point from coming off according to claim 1, is characterized in that, the straight lower floor of described optical locating point is complete copper sheet.
4. a kind of method that prevents that optical locating point from coming off according to claim 1, is characterized in that, described protection annulus is copper ring.
5. a kind of method that prevents that optical locating point from coming off according to claim 1, is characterized in that, described copper ring is 3.8 ~ 4.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410249276.3A CN104039085A (en) | 2014-06-06 | 2014-06-06 | Method for preventing optical positioning point off |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410249276.3A CN104039085A (en) | 2014-06-06 | 2014-06-06 | Method for preventing optical positioning point off |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104039085A true CN104039085A (en) | 2014-09-10 |
Family
ID=51469623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410249276.3A Pending CN104039085A (en) | 2014-06-06 | 2014-06-06 | Method for preventing optical positioning point off |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104039085A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109195330A (en) * | 2018-09-03 | 2019-01-11 | 江门荣信电路板有限公司 | A kind of pcb board without copper optical point manufacturing method and its without bronzing point structure |
| CN110099507A (en) * | 2019-05-29 | 2019-08-06 | 广东依顿电子科技股份有限公司 | Thick copper circuit board and its manufacturing method |
| CN112638048A (en) * | 2020-12-30 | 2021-04-09 | 重庆凯歌电子股份有限公司 | PCB protection type printing method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001251051A (en) * | 2000-03-06 | 2001-09-14 | Ibiden Co Ltd | Printed wiring board and method for manufacturing printed wiring board |
| CN1980522A (en) * | 2005-11-29 | 2007-06-13 | 比亚迪股份有限公司 | Optical identifying welding plate for printed circuit board and mfg. method |
| CN201690673U (en) * | 2010-04-27 | 2010-12-29 | 佛山市顺德区顺达电脑厂有限公司 | Optical locating point with protection copper ring |
| CN201893989U (en) * | 2010-11-04 | 2011-07-06 | 英业达股份有限公司 | Pcb |
| CN202374560U (en) * | 2011-12-15 | 2012-08-08 | 群光电子(苏州)有限公司 | Chip attachment printed circuit board (PCB) |
| CN203366453U (en) * | 2013-08-06 | 2013-12-25 | 福建联迪商用设备有限公司 | Positioning column structure for proofing the loosing of silica gel safety contact of financial POS machine |
-
2014
- 2014-06-06 CN CN201410249276.3A patent/CN104039085A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001251051A (en) * | 2000-03-06 | 2001-09-14 | Ibiden Co Ltd | Printed wiring board and method for manufacturing printed wiring board |
| CN1980522A (en) * | 2005-11-29 | 2007-06-13 | 比亚迪股份有限公司 | Optical identifying welding plate for printed circuit board and mfg. method |
| CN201690673U (en) * | 2010-04-27 | 2010-12-29 | 佛山市顺德区顺达电脑厂有限公司 | Optical locating point with protection copper ring |
| CN201893989U (en) * | 2010-11-04 | 2011-07-06 | 英业达股份有限公司 | Pcb |
| CN202374560U (en) * | 2011-12-15 | 2012-08-08 | 群光电子(苏州)有限公司 | Chip attachment printed circuit board (PCB) |
| CN203366453U (en) * | 2013-08-06 | 2013-12-25 | 福建联迪商用设备有限公司 | Positioning column structure for proofing the loosing of silica gel safety contact of financial POS machine |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109195330A (en) * | 2018-09-03 | 2019-01-11 | 江门荣信电路板有限公司 | A kind of pcb board without copper optical point manufacturing method and its without bronzing point structure |
| CN110099507A (en) * | 2019-05-29 | 2019-08-06 | 广东依顿电子科技股份有限公司 | Thick copper circuit board and its manufacturing method |
| CN112638048A (en) * | 2020-12-30 | 2021-04-09 | 重庆凯歌电子股份有限公司 | PCB protection type printing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140910 |
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| RJ01 | Rejection of invention patent application after publication |