CN204014278U - One prevents BGA short circuit line plate - Google Patents
One prevents BGA short circuit line plate Download PDFInfo
- Publication number
- CN204014278U CN204014278U CN201420493587.XU CN201420493587U CN204014278U CN 204014278 U CN204014278 U CN 204014278U CN 201420493587 U CN201420493587 U CN 201420493587U CN 204014278 U CN204014278 U CN 204014278U
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- bga
- solder mask
- region
- short circuit
- mask window
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Abstract
One prevents BGA short circuit line plate, comprise wiring board and BGA region is in the circuit board set, BGA region is provided with circular pad PAD and circular solder mask window region, described pad PAD and solder mask window regional connectivity, outside, solder mask window region is provided with the anti-weld-ring of an annular, in the BGA region outside described solder mask window region and anti-weld-ring, is coated with one deck word ink layer.The utility model can prevent that the green oil bridge that wiring board covers in the circuit board when part on SMT from coming off, cause BGA short circuit, BGA short circuit ratio is reduced to below one of percentage, greatly improve the yields of product quality and wiring board, reduce the loss causing because of BGA short circuit, save to produce and drop into, improve the competitiveness of enterprise.
Description
Technical field
The utility model belongs to wiring board and makes field, is specifically related to one and prevents BGA short circuit line plate.
Background technology
Along with the development of wiring board technology, wiring board production and research and development are proposed to new challenge.Circuit integrated on wiring board becomes increasingly complex, and all contains one to several wiring rule bga chip on present wiring board.Bga chip precision prescribed in the production of wiring board is high, has a little a mistake, easily causes wiring board problem, as factor impacts such as the pressing skew at wiring board, the skew of lamina rara externa exposure aligning, anti-welding exposure aligning skews.
In the existing wiring board that contains BGA region, as depicted in figs. 1 and 2, the diameter that is arranged on the solder mask window region in BGA region is 0.38mm, spacing between solder mask window is 0.5mm, in order to prevent pad PAD short circuit, in the extra-regional BGA of solder mask window region, cover one deck ink, and wiring board production process is many, long flow path is in through the multistep operation course of processing, and there is the problems such as skew and error, the ink that easily causes covering in BGA region comes off in part process on SMT, causes BGA short circuit.Affect production efficiency, increase enterprise's production cost.The diameter in solder mask window region is identical with the leg diameter of components and parts, green oil covers on the outer edge in solder mask window region while covering, easily cause components and parts not prison welding to consolidate or the not first-class situation of welding, increase defective products rate and rework rate, increase production cost, reduce the competitiveness of enterprise, be unfavorable for enterprise's long term growth.
Summary of the invention
In view of this, the technical problems to be solved in the utility model is a kind of wiring board yields that improves, prevent BGA green oil bridge come off cause BGA short circuit prevent BGA short circuit line plate.
In order to solve the problems of the technologies described above, the utility model adopts following scheme to realize: one prevents BGA short circuit line plate, comprise wiring board and BGA region is in the circuit board set, BGA region is provided with circular pad PAD and circular solder mask window region, described pad PAD and solder mask window regional connectivity, outside, solder mask window region is provided with the anti-weld-ring of an annular, in the BGA region outside described solder mask window region and anti-weld-ring, is coated with one deck word ink layer.
As improvement of the present utility model, the diameter in described solder mask window region is than the large 3mil of the diameter of the component's feet of answering in contrast.
As improvement of the present utility model, the Ring Width of described anti-weld-ring is 5mil.
As further improvement of the utility model, the gap between the outside of two described anti-weld-rings is 3.5mil.
Compared with prior art, the utility model by covering one deck word ink layer in the BGA region of wiring board, can prevent that the green oil bridge that wiring board covers in the circuit board when part on SMT from coming off, cause BGA short circuit, BGA short circuit ratio is reduced to below one of percentage, has greatly improved the yields of product quality and wiring board, reduced the loss causing because of BGA short circuit, save to produce and drop into, improve the competitiveness of enterprise; In order better to plug in components and parts in solder mask window region, improve the efficiency of follow-up upper components and parts, the diameter in solder mask window region is set to than the large 3mil of the diameter of component's feet; The anti-weld-ring of a 5mil is set outside solder mask window region simultaneously, can prevents that word ink is stained with in solder mask window region, avoided causing processing solder mask window region in subsequent handling, reduce defective products rate and rework rate, save production cost.
Brief description of the drawings
Fig. 1 is the structural representation of prior art.
Fig. 2 is A of the prior art portion enlarged drawing.
Fig. 3 is the utility model structural representation.
Fig. 4 is the B portion enlarged drawing in the utility model.
Embodiment
In order to allow those skilled in the art understand better the technical solution of the utility model, below in conjunction with accompanying drawing, the utility model is further elaborated.
As shown in Figure 3 and Figure 4, one prevents BGA short circuit line plate, comprises wiring board 1 and BGA region 2 is in the circuit board set, and BGA region 2 is provided with circular pad PAD3 and circular solder mask window region 4.Described pad PAD3 is communicated with solder mask window region 4.Outside, solder mask window region is provided with the anti-weld-ring 5 of an annular, and the interior ring diameter of anti-weld-ring 5 equates with the external diameter in solder mask window region 4, the long 10mil of interior electrical path length of the anti-weld-ring of external diameter Length Ratio of anti-weld-ring 5, and the Ring Width of anti-weld-ring 5 is 5mil.In BGA region outside described solder mask window region 4 and anti-weld-ring 5, be coated with one deck word ink layer 6.Gap between the outer shroud of two described anti-weld-rings is 3.5mil.BGA region outside solder mask window region 4 and anti-weld-ring 5 is covering one deck word ink layer after first having covered one deck ink; can protect ink to destroy in subsequent handling; affect the quality in wiring board BGA region, while preventing the upper part of SMT, ink comes off, and causes BGA short circuit.
Be easily mounted in solder mask window region for components and parts are followed, the diameter of offering solder mask window region is greater than the diameter of component's feet, and the diameter in described solder mask window region (4) is than the large 3mil of the diameter of the component's feet of answering in contrast.
Above-described embodiment is only wherein specific implementation of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these apparent replacement forms all belong to protection range of the present utility model.
Claims (4)
1. one kind prevents BGA short circuit line plate, comprise wiring board (1) and BGA region (2) is in the circuit board set, it is characterized in that, BGA region (2) is provided with circular pad PAD(3) and circular solder mask window region (4), described pad PAD(3) be communicated with solder mask window region (4), outside, solder mask window region is provided with the anti-weld-ring (5) of an annular, in the BGA region outside described solder mask window region (4) and anti-weld-ring (5), is coated with one deck word ink layer (6).
2. the BGA short circuit line plate that prevents according to claim 1, is characterized in that, the diameter in described solder mask window region (4) is than the large 3mil of the diameter of the component's feet of answering in contrast.
3. the BGA short circuit line plate that prevents according to claim 1, is characterized in that, the Ring Width of described anti-weld-ring (5) is 5mil.
4. the BGA short circuit line plate that prevents according to claim 1, is characterized in that, the gap between the outside of described two anti-weld-rings (5) is 3.5mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420493587.XU CN204014278U (en) | 2014-08-29 | 2014-08-29 | One prevents BGA short circuit line plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420493587.XU CN204014278U (en) | 2014-08-29 | 2014-08-29 | One prevents BGA short circuit line plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204014278U true CN204014278U (en) | 2014-12-10 |
Family
ID=52054213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420493587.XU Active CN204014278U (en) | 2014-08-29 | 2014-08-29 | One prevents BGA short circuit line plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204014278U (en) |
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2014
- 2014-08-29 CN CN201420493587.XU patent/CN204014278U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |