CN202121873U - Pad structure of circuit board - Google Patents
Pad structure of circuit board Download PDFInfo
- Publication number
- CN202121873U CN202121873U CN2011201827901U CN201120182790U CN202121873U CN 202121873 U CN202121873 U CN 202121873U CN 2011201827901 U CN2011201827901 U CN 2011201827901U CN 201120182790 U CN201120182790 U CN 201120182790U CN 202121873 U CN202121873 U CN 202121873U
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- Prior art keywords
- pad
- circuit board
- cover
- utility
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model provides a pad structure of circuit board, comprising a circuit board and a pad thereon, wherein the pad is of sectional structure and comprises a plurality of pad sections which are separately arranged on the peripheral end of the circuit board. With the sectional structure arrangement of the pad, the pad structure of circuit board can enhance the one-time acceptability of product, reduce maintenance cost and improve product quality; and the pad structure of circuit board can also effectively solve the problem of pseudo or insufficient soldering for the pad and a shielding frame/cover soldered with the pad due to slight non-coplanar performance so as to effectively improve the confidence level of customers upon product quality and reduce quality risks caused by unreliable soldering of shielding frame/cover.
Description
Technical field
The utility model relates to the surface mounting technology field, relates in particular to a kind of board pads structure.
Background technology
Along with SMT (Surface mount technology; Be surface mounting technology) technological continuous evolution, product will be more and more integrated, and device is more and more littler; Closeness is more and more closeer; Require increasingly highly, the manufacturing process window is also more and more littler, and therefore the connector welding requirements to us also can bring certain negative effect.As: the Welding Problems of mask frame/cover.
The relevant design of present mask frame/cover includes:
1, PCB Layout designs, and pad is the whole piece pad design on it, in Overwelding and rewelding furnace, liquid phaseization can occur, produces infiltration and mobile, thereby causes the tin cream relative altitude to reduce, and reduction fully contacts with mask frame/cover solder side.
2, the segmented perforate is adopted in steel mesh perforate, because mask frame/cover position is the whole piece pad design; So cannot window at whole area; Otherwise it is excessive that steel disc can come off or extend out, and section is narrow with intersegmental spacing, can influence the tension force of steel mesh; Influence the stripping result of product print solder paste, influence product quality.
In addition, the design of existing whole piece pad make with the mask frame/cover device evenness of its welding can be slightly slight non-coplane (± 0.05MM～± 0.1MM), thereby cause mask frame/be covered with dry joint or the phenomenon of rosin joint about 0.5%.
The utility model content
The purpose of the utility model is to provide a kind of board pads structure, adopts the segmented pad design, can effectively promote the disposable qualification rate of product, reduces maintenance cost, promotes product quality, strengthens the product soldering reliability, wins client's satisfaction.
Be to realize above-mentioned purpose, the utility model provides a kind of board pads structure, comprising: circuit board and pad provided thereon, and said pad adopts segmentation structure, and it comprises that several spacer segments are located at the pad section on the circuit board Zhou Duan.
Spacing between the said two pad sections is 1.5-2.5mm.
The beneficial effect of the utility model is: the board pads structure of the utility model; Pad adopts segmentation structure, can promote the disposable qualification rate of product, reduces maintenance cost; Promote product quality; Effectively solve mask frame/cover with its welding because of welding dry joint or problem of faulty soldering that slight non-coplane causes, effectively improve and strengthens the degree of belief of client to product quality, minimizing is because of mask frame/cover soldering reliability next quality risk of strong band not.
Description of drawings
Below in conjunction with accompanying drawing, describe in detail through embodiment the utility model, the technical scheme that makes the utility model and other beneficial effects is obvious.
In the accompanying drawing,
Fig. 1 is the structural representation of the board pads structure of the utility model;
Fig. 2 is the structural representation of the die sinking of said mask frame/cover.
Embodiment
Below in conjunction with accompanying drawing the utility model is described in detail.
As shown in Figure 1, the board pads structure of the utility model, it comprises: circuit board 2 and pad 4 provided thereon, on the circuit board 2 configuration is arranged, pad 4 is located on the Zhou Duan of this circuit board 2, and the cover position of corresponding mask frame/cover is with its welding.
Wherein, pad 4 adopts segmentation structure, promptly comprises the pad section 40 that several spacer segments are provided with, and around being located on the Zhou Duan of circuit board 2, the spacing between the two pad sections 40 is 1.5-2.5mm.The design of this kind segmented pad 4, when the steel mesh perforate, the perforate two ends are done coextensive and are handled, and keeping perforate section and intersegmental spacing is 0.8mm.In addition; As shown in Figure 2, with die sinking 3 design and the pad 4 corresponding settings of the corresponding mask frame/cover of the utility model welding, cooperation segmented pad 4 structures and adopt the serration type structural design; So that the cover position of mask frame/cover that die sinking is produced and pad coincide; Guarantee welding quality, avoid the welding dry joint or the problem of faulty soldering that cause because of slight non-coplane, improve product reliability.
In sum, the board pads structure of the utility model, pad adopts segmentation structure; Can promote the disposable qualification rate of product; Reduce maintenance cost, promote product quality, welding dry joint or problem of faulty soldering that the mask frame/cover of effective solution and its welding causes because of slight non-coplane; Effectively improve and strengthen the degree of belief of client, reduce because of mask frame/cover soldering reliability next quality risk of strong band not to product quality.
The above; For the person of ordinary skill of the art; Can make other various corresponding changes and distortion according to the technical scheme and the technical conceive of the utility model, and all these changes and distortion all should belong to the protection range of the utility model accompanying Claim.
Claims (2)
1. a board pads structure is characterized in that, comprising: circuit board and pad provided thereon, and said pad adopts segmentation structure, and it comprises that several spacer segments are located at the pad section on the circuit board Zhou Duan.
2. board pads structure as claimed in claim 1 is characterized in that, the spacing between the said two pad sections is 1.5-2.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201827901U CN202121873U (en) | 2011-06-01 | 2011-06-01 | Pad structure of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201827901U CN202121873U (en) | 2011-06-01 | 2011-06-01 | Pad structure of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202121873U true CN202121873U (en) | 2012-01-18 |
Family
ID=45462907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201827901U Expired - Fee Related CN202121873U (en) | 2011-06-01 | 2011-06-01 | Pad structure of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202121873U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106803488A (en) * | 2015-11-26 | 2017-06-06 | 株洲南车时代电气股份有限公司 | A kind of power model welder |
-
2011
- 2011-06-01 CN CN2011201827901U patent/CN202121873U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106803488A (en) * | 2015-11-26 | 2017-06-06 | 株洲南车时代电气股份有限公司 | A kind of power model welder |
| CN106803488B (en) * | 2015-11-26 | 2019-10-29 | 株洲南车时代电气股份有限公司 | A kind of power module welder |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120118 Termination date: 20180601 |