CN103207544A - Dry film development process - Google Patents
Dry film development process Download PDFInfo
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- CN103207544A CN103207544A CN2012100649380A CN201210064938A CN103207544A CN 103207544 A CN103207544 A CN 103207544A CN 2012100649380 A CN2012100649380 A CN 2012100649380A CN 201210064938 A CN201210064938 A CN 201210064938A CN 103207544 A CN103207544 A CN 103207544A
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Abstract
The invention provides a dry film development process used for manufacturing a masking plate. An adopted developing liquid is a potassium carbonate solution with a mass percentage concentration of 0.6-1.2%, wherein an acrylic additive is added according to a mass percentage concentration of 0-2.0%. A developing temperature during developing is 30 (+/-3) DEG C, a solution pH value is 10.40-11.40, a development pressure is 1-4kg/cm<2>, and a development point is 90(+/-6)%. In a preferable scheme, the developing liquid comprises a potassium carbonate solution with a mass percentage concentration of 0.8% and an acrylic additive with a mass percentage concentration of 1.0%, a developing temperature during developing is 30 (+/-1) DEG C, a solution pH value is 10.8, a development pressure is 2kg/cm<2>, and a development point is 90(+/-3)%. With the process provided by the invention, problems such as low development speed, poor uniformity, and easy over-development and coating diffusion caused by sodium carbonate as a developing liquid commonly used in current PCB industries can be solved.
Description
Technical field
The present invention relates to a kind of dry film developing process, belong to high-accuracy mask plate and make the field.
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Background technology
Printed circuit board (being pcb board) is one of electronics industry important electron parts.Nearly all electronic equipment, little to accutron, counter, arrive robot calculator, communication electronic equipment, military armament systems greatly, all be applied to printed circuit board (PCB).The function of pcb board in electronic equipment is as follows: provide that various electronic devices and components such as integrated circuit are fixed, the carrier of assembling and mechanical support; Realize that the electrical equipment between the various electronic devices and components such as integrated circuit connects or electrical isolation, desired electrical specification is provided, as characteristic impedance etc.; For automatic soldering provides the welding resistance figure, for components and parts are installed (comprising plug-in mounting and surface mount), inspection, maintenance provides identification character and figure.
Along with the demand of social development is more and more higher, the dimensional requirement of pcb board is more accurate, and this each procedure with regard to its correspondence has proposed new challenge.Wherein as an important follow-up link, the product quality that the printing quality of paste solder printing is used final input has very large influence, and in this link, influence factor is except the performance of stencil printer own, and the performance of printing mask plate also can badly influence final printing quality.This just requires industry to produce to satisfy high-accuracy printing mask plate, namely can strictly optimize various parameters in the manufacture process of mask plate.
Make in the mask plate process in electroforming or etch process, all can relate to the pad pasting exposure imaging usually needed figure is shifted, obtain required mask plate by electroforming or etching then.Owing to often by virtue of experience control parameters in traditional mask plate manufacturing process, particularly when technologies such as electroforming or etching are made the link that relates to the developing machine use in the mask plate process.This developing process lack of standardization may cause the not high problems such as even unqualified of the measure of precision of mask plate.
Summary of the invention
At the problems referred to above that occur in traditional mask plate manufacture process, the invention provides developer formula and the related process parameter of development phase in electroforming or etch process.Concrete scheme is as follows:
Developing solution is: mass percent concentration is 0.6%-1.2% solution of potassium carbonate, and wherein concentration 0～2.0% adds the acrylic compounds additive by mass percentage;
The technological parameter of development phase is: development temperature is 30 ± 3 ℃, and the pH value of solution value is 10.40 ~ 11.40.Development pressure is 1-4kg/cm
2, the point that develops is 90 ± 6%.
As preferably: contain mass percent concentration in the developer solution and be 0.8% solution of potassium carbonate, mass percent concentration is 1.0% acrylic compounds additive;
As preferably: development temperature is 30 ± 1 ℃ during development, and the solution pH value is 10.8.Development pressure is 2kg/cm
2, the point that develops is 90 ± 3%.
Operate according to above-mentioned developing process provided by the present invention, can control the development quality well, resulting mask plate opening size is even, no plating burr, and hole wall is smooth.
Embodiment
Following examples will be discussed to dry film developing process of the present invention.Should be understood that following examples only are for purpose of explanation, but not protection domain of the present invention is limited, so all can all fall within the scope of protection of the present invention by the application that simple transformation obtains.
In electroforming mask plate manufacture craft, common technological process is core pre-treatment-pad pasting-exposure-development-electroforming-peel off and take off film etc.By the pad pasting exposure imaging needed figure is shifted, electroforming obtains required mask plate then.SAF2120 dry film developing process when present embodiment is produced electroforming is done and is specified.But not it will be appreciated by those skilled in the art that and following detailed description should be considered as limiting the scope of the invention.
Employed developing solution is mass percent concentration 0.8% solution of potassium carbonate in the developing process, wherein contains mass percent concentration 1.0% acrylic compounds additive.Because the photo polymerization monomer in the dry film is generally polyvalent alcohol alkene esters of gallic acid and methyl acrylic ester, suitably adds the development capability that the acrylic compounds material can be stablized developer solution in developer solution.
Developing process correlation parameter corresponding to above solution level is: 30 ± 1 ℃ of development temperatures, solution pH value are 10.8, development pressure 2kg/cm
2, the development point control is 90 ± 3%.
The PCB industry generally adopts sodium carbonate as developer solution at present, and its developing powder is slow, and homogeneity is bad, and easy mistake shows plating, disposable use.To have generally the development solute sodium carbonate that adopts among the present invention now and change that developing powder is fast, the sal tartari solute of good uniformity into, add suitable acrylic compounds material again and stablize the effect of developing solution, fast to reach developing powder, development effect is even, be difficult for advantages such as development, not only improve work efficiency, also improved the yield of product quality and product.
Claims (2)
1. a dry film developing process that is used for making mask plate is characterized in that employed developer solution is that mass percent concentration is 0.6%-1.2% solution of potassium carbonate, and wherein concentration 0～2.0% adds the acrylic compounds additive by mass percentage; Development temperature during development is 30 ± 3 ℃, and the pH value of solution value is 10.40～11.40, and development pressure is 1-4kg/cm
2, the point that develops is 90 ± 6%.
2. dry film developing process as claimed in claim 1 is characterized in that, contain mass percent concentration in the described developer solution and be 0.8% solution of potassium carbonate, and mass percent concentration is 1.0% acrylic compounds additive; Development temperature during development is 30 ± 1 ℃, and the solution pH value is 10.8, and development pressure is 2kg/cm
2, the point that develops is 90 ± 3%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210064938.0A CN103207544B (en) | 2012-01-13 | 2012-01-13 | A kind of dry film developing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210064938.0A CN103207544B (en) | 2012-01-13 | 2012-01-13 | A kind of dry film developing process |
Publications (2)
| Publication Number | Publication Date |
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| CN103207544A true CN103207544A (en) | 2013-07-17 |
| CN103207544B CN103207544B (en) | 2015-08-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210064938.0A Expired - Fee Related CN103207544B (en) | 2012-01-13 | 2012-01-13 | A kind of dry film developing process |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103207544B (en) * | 2012-01-13 | 2015-08-12 | 昆山允升吉光电科技有限公司 | A kind of dry film developing process |
| CN107278038A (en) * | 2016-04-08 | 2017-10-20 | 东莞市斯坦得电子材料有限公司 | A kind of dry film developing process for the highly dense circuit of printed wiring board |
| CN109725505A (en) * | 2019-02-27 | 2019-05-07 | 信丰正天伟电子科技有限公司 | A kind of printed wiring board developer solution and preparation method thereof |
| CN113820926A (en) * | 2021-10-29 | 2021-12-21 | 东莞市第玖元素线路板技术服务有限公司 | Efficient developing solution for PCB and preparation method thereof |
Citations (5)
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| US5989769A (en) * | 1998-10-30 | 1999-11-23 | Xerox Corporation | Liquid developers and processes thereof |
| US6645709B1 (en) * | 2002-08-12 | 2003-11-11 | Eastman Kodak Company | Photographic color developing composition containing calcium ion sequestering agent combination and method of use |
| US20060166126A1 (en) * | 2005-01-21 | 2006-07-27 | Sakata Inx Corp. | Liquid developer |
| CN101171550A (en) * | 2005-05-12 | 2008-04-30 | 东京应化工业株式会社 | Method for enhancing optical stability of three-dimensional micromolded product |
| CN101762292A (en) * | 2008-10-27 | 2010-06-30 | 苏州德天自动化科技有限公司 | Clamp frame adjusting device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103207544B (en) * | 2012-01-13 | 2015-08-12 | 昆山允升吉光电科技有限公司 | A kind of dry film developing process |
-
2012
- 2012-01-13 CN CN201210064938.0A patent/CN103207544B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5989769A (en) * | 1998-10-30 | 1999-11-23 | Xerox Corporation | Liquid developers and processes thereof |
| US6645709B1 (en) * | 2002-08-12 | 2003-11-11 | Eastman Kodak Company | Photographic color developing composition containing calcium ion sequestering agent combination and method of use |
| US20060166126A1 (en) * | 2005-01-21 | 2006-07-27 | Sakata Inx Corp. | Liquid developer |
| CN101171550A (en) * | 2005-05-12 | 2008-04-30 | 东京应化工业株式会社 | Method for enhancing optical stability of three-dimensional micromolded product |
| CN101762292A (en) * | 2008-10-27 | 2010-06-30 | 苏州德天自动化科技有限公司 | Clamp frame adjusting device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103207544B (en) * | 2012-01-13 | 2015-08-12 | 昆山允升吉光电科技有限公司 | A kind of dry film developing process |
| CN107278038A (en) * | 2016-04-08 | 2017-10-20 | 东莞市斯坦得电子材料有限公司 | A kind of dry film developing process for the highly dense circuit of printed wiring board |
| CN109725505A (en) * | 2019-02-27 | 2019-05-07 | 信丰正天伟电子科技有限公司 | A kind of printed wiring board developer solution and preparation method thereof |
| CN113820926A (en) * | 2021-10-29 | 2021-12-21 | 东莞市第玖元素线路板技术服务有限公司 | Efficient developing solution for PCB and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103207544B (en) | 2015-08-12 |
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