CN103966603B - Stage total eclipse carving technology - Google Patents

Abstract

The invention discloses a kind of stage total eclipse carving technology, it is characterised in that the processing stage of including following: the second etch stage of the two-sided inking of substrate and exposure stage-substrate one side etch phase first-substrate another side. The invention have benefit that: processing step is reasonable in design, processing procedure is simple, it is easy to operation; Center of gravity is low, stable, it is not easy to damage product; Adopt the etching products connectionless point produced of method of the present invention, both attractive in appearance in turn ensure that good use function; Being carrier by toughness film, after all having etched, product is not at random, and still proper alignment is on the film of viscosity, facilitates subsequent product processing or uses.

Description

Stage total eclipse carving technology

Technical field

The present invention relates to a kind of etch process, be specifically related to a kind of stage total eclipse carving technology.

Background technology

Use existing etch process to produce etching products, for preventing from product circular flow comes off, or facilitate back segment product surface to process, it will usually design junction point at product design edge portions. But, the existence of this junction point not only have impact on the attractive in appearance of product, and the product that damage of product is in contact with it can be caused, ultimately cause product function bad, so, in order to ensure the attractive in appearance of product and have good use function, it is necessary to use additional process to remove the junction point on product, this cost allowing for product increases.

Summary of the invention

For solving the deficiencies in the prior art, it is an object of the invention to provide a kind of etching products connectionless point making to produce and proper alignment facilitates the stage total eclipse carving technology of following process.

In order to realize above-mentioned target, the present invention adopts the following technical scheme that:

A kind of stage total eclipse carving technology, it is characterised in that comprise the following steps:

(1), upper solder mask is printed on A, B two sides of substrate uniformly, and be dried;

(2), A, B two sides of aforesaid base plate is exposed;

(3), in the A face of aforesaid base plate pasting adhesive film, B face is etched, etch depth does not penetrate through substrate;

(4) solder mask in B face, is removed;

(5), the B face of aforesaid base plate being pasted adhesive film, A face is etched, etch depth penetrates substrate;

(6) solder mask in A face, is removed.

Aforesaid stage total eclipse carving technology, it is characterised in that aforesaid tackiness film is corrosion-resistant adhesive film.

Aforesaid stage total eclipse carving technology, it is characterised in that aforementioned corrosion-resistant adhesive film is PET film.

Aforesaid stage total eclipse carving technology, it is characterised in that in step (1), uses 85-95 order half tone that substrate is printed.

Aforesaid stage total eclipse carving technology, it is characterised in that in step (1), the substrate after printing is heat-wind circulate drying at 80 DEG C.

Aforesaid stage total eclipse carving technology, it is characterised in that in step (2), substrate exposes in exposure machine.

Aforesaid stage total eclipse carving technology, it is characterised in that aforementioned exposure machine is cooled exposure machine, exposure desk surface temperature is 28 DEG C, and exposure energy is 400-600mJ/cm²。

Aforesaid stage total eclipse carving technology, it is characterised in that in step (2), also include following sub-step:

1., use imaging liquid that the substrate after exposure is developed;

2., the substrate after development being carried out hot air circulation solidification, temperature is 145 DEG C, and the time is 50-60min.

Aforesaid stage total eclipse carving technology, it is characterised in that what the solder mask on removal substrate adopted is detergent for ink.

The invention have benefit that: processing step is reasonable in design, processing procedure is simple, it is easy to operation; Center of gravity is low, stable, it is not easy to damage product; Adopt the etching products connectionless point produced of method of the present invention, both attractive in appearance in turn ensure that good use function; Being carrier by toughness film, after all having etched, product is not at random, and still proper alignment is on the film of viscosity, facilitates subsequent product processing or uses.

Detailed description of the invention

The present invention stage total eclipse carving technology is described in detail below.

The stage total eclipse carving technology of the present invention mainly included for three megastages, it may be assumed that in the second etch stage of substrate inking and exposure stage, substrate one side etch phase first and substrate another side, the operating procedure in each stage is described in detail below:

(1), substrate inking and exposure stage

First, its two sides is denoted as A face, B face after finishing cleaning process by substrate respectively, then uses 85-95 order half tone that the A face of substrate, B face are printed upper solder mask uniformly. Screen painting can effectively control coating thickness, it is prevented that film is too thick or too thin, too thick residual film or the dry deficiency of easily causing of film, too thin, easily causes weak to processing procedures such as sprayings.

Then, by the substrate heat-wind circulate drying at 80 DEG C after printing, the solvent in solder mask is evaporated.

It follows that utilize exposure machine that the A face of substrate, B face are exposed.

As the preferred scheme of one, exposure machine can select cooled exposure machine, exposure desk surface temperature to be 28 DEG C, and exposure energy is 400-600mJ/cm², the too high residual film of follow-up development that easily causes of exposure energy is too low then it is possible that develop lateral erosion.

For convenient etching and the quality improving etching, the substrate after exposure is further proceeded with development, cured, concrete:

1., use imaging liquid that the substrate after exposure is developed, unexposed film is dissolved with imaging liquid and removes, retain the part of exposure. The selection of imaging liquid, time of developing, solution temperature, hydro-peening pressure etc. select for this area routine and operation, do not repeat them here;

2., the substrate after development is carried out hot air circulation solidification, make solder mask heating after-hardening become molecule crosslinked state. During solidification, it is preferred that temperature is 145 DEG C, the corresponding time is 50-60min.

(2), substrate one side etch phase first

When substrate is after above-mentioned inking and exposure stage, proceed by the etching first of one side, it may be assumed that

First, adhesive film on the A face of substrate is pasted.

Then, utilizing etching solution that exposed B face is etched, etch depth does not penetrate through substrate. If it is to say, the adhesive film now removed on A face, substrate in terms of A face, it is still one piece of intact, substrate without leak.

Owing to adhesive film is the carrier of fixing substrate, thus that other have a stickiness and corrosion material can be not etched by can be employed as the adhesive film of the present invention, its preferred PET film.

After the B facet etch of substrate, remove the solder mask in B face with detergent for ink, now at the beginning of the product on substrate, have a model, but still all neat fixing on substrate, it is not scattered, next the wait second etch to A face.

(3), the second etch stage of substrate another side

After having etched first, continuing aforesaid substrate is carried out second etch, this time etching is that original A face, B face are carried out phase inverse processing, and concrete operations are as follows:

First, adhesive film is pasted in the B face of aforesaid substrate.

Then, the A face of substrate being etched, this time etch depth penetrates substrate, if now removing the adhesive film on B face, the product etched will all be scattered.

Etch complete, adopt detergent for ink to remove the solder mask in A face.

Now, after twice etching, etch the still neat arrangement of the product obtained, be pasted onto on adhesive film, the processing that very convenient product is follow-up.

It should be noted that etching solution and imaging liquid are existing in this area; It addition, those skilled in the art it should be known that above-described embodiment does not limit the present invention in any form, all employings are equal to the technical scheme that the mode of replacement or equivalent transformation obtains, and all fall within protection scope of the present invention.

Claims (9)

1. stage total eclipse carving technology, it is characterised in that comprise the following steps:

(1), upper solder mask is printed on A, B two sides of substrate uniformly, and be dried;

(2), A, B two sides of aforesaid substrate is exposed;

(3), in the A face of aforesaid substrate pasting adhesive film, B face is etched, etch depth does not penetrate through substrate;

(4) solder mask in B face, is removed;

(5), the B face of aforesaid substrate being pasted adhesive film, A face is etched, etch depth penetrates substrate;

(6) solder mask in A face, is removed.

2. stage total eclipse carving technology according to claim 1, it is characterised in that above-mentioned adhesive film is corrosion-resistant adhesive film.

3. stage total eclipse carving technology according to claim 2, it is characterised in that above-mentioned corrosion-resistant adhesive film is PET film.

4. stage total eclipse carving technology according to claim 1, it is characterised in that in step (1), uses 85-95 order half tone that substrate is printed.

5. stage total eclipse carving technology according to claim 1, it is characterised in that in step (1), the substrate after printing is heat-wind circulate drying at 80 DEG C.

6. stage total eclipse carving technology according to claim 1, it is characterised in that in step (2), substrate exposes in exposure machine.

7. stage total eclipse carving technology according to claim 6, it is characterised in that above-mentioned exposure machine is cooled exposure machine, and exposure desk surface temperature is 28 DEG C, and exposure energy is 400-600mJ/cm²。

8. stage total eclipse carving technology according to claim 6, it is characterised in that in step (2), also include following sub-step:

1., use imaging liquid that the substrate after exposure is developed;

2., the substrate after development being carried out hot air circulation solidification, temperature is 145 DEG C, and the time is 50-60min.

9. the stage total eclipse carving technology according to claim 1 to 8 any one, it is characterised in that what the solder mask on removal substrate adopted is detergent for ink.