CN104155805A - Preparation method of aligned film - Google Patents
Preparation method of aligned film Download PDFInfo
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- CN104155805A CN104155805A CN201410360313.8A CN201410360313A CN104155805A CN 104155805 A CN104155805 A CN 104155805A CN 201410360313 A CN201410360313 A CN 201410360313A CN 104155805 A CN104155805 A CN 104155805A
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Abstract
The invention relates to the technical field of displaying and discloses a preparation method of an aligned film. The preparation method includes: coating a substrate with PI (propidium iodide) liquid covering a valid area and an invalid area of the substrate, and solidifying the PI liquid; removing the part, located in the invalid area of the substrate, of the solidified PI liquid to form a pattern of the aligned layer. According to the preparation method, distinguishing the invalid area and the valid area of the substrate is not required when the PI liquid is applied to the substrate; the invalid area of the substrate is controlled in such a manner that the part, located in the invalid area of the substrate, of the solidified PI liquid to form the pattern of the aligned layer; at this moment, the PI liquid is solidified and has no fluidity, and accordingly, the invalid area of the substrate is convenient to control when the preparation method is used in preparing the aligned layer.
Description
Technical field
The present invention relates to display technique field, particularly a kind of preparation method of alignment films.
Background technology
In display technique field, the preparation technology of liquid crystal display device is mainly divided into three parts, prepare array base palte, prepare color membrane substrates and array base palte and color membrane substrates to box; First technique when wherein pair array substrate and color membrane substrates carry out box is alignment films preparation technology.
In prior art, the preparation technology of alignment films mainly comprises base-plate cleaning, the coating of PI (Polyimide, polyimide) liquid, preparation is dry, PI detects, main five parts of solidifying.Wherein, the coating of PI liquid is that PI liquid is applied to a step on substrate, is specially PI liquid is applied on transfer printing board, and then by transfer printing board, PI liquid is transferred on corresponding substrate.
On array base palte and color membrane substrates, all have multiple effective coverages and multiple inactive area, wherein, each effective coverage is corresponding to the territory, effective display area of the small display that after box, cutting forms with array base palte and color membrane substrates; Inactive area refers to the region except effective coverage on substrate, comprises the region corresponding to frame region of a small display to box cutting formation afterwards with array base palte and color membrane substrates; For ensureing the effect of PI liquid coating on substrate, the transfer printing board using in the preparation technology of above-mentioned alignment films need be distinguished according to the effective coverage on substrate and inactive area, while again PI liquid being applied on transfer printing board, only in transfer printing board, the region corresponding with the effective coverage of substrate is coated with PI liquid, and the region corresponding with the inactive area of substrate is not coated with PI liquid in transfer printing board.
But, because the PI liquid being coated with on transfer printing board is for liquid, then while PI liquid being applied on substrate by transfer printing board because the mobility of PI liquid can flow, thereby while causing the coating of PI liquid, cannot carry out strict management and control to the inactive area on substrate by transfer printing board; Particularly, along with the narrow frame of liquid crystal display device, the wireless zone on substrate is more and more narrow, adopts transfer printing board to carry out management and control to the inactive area on substrate more and more difficult in the preparation technology of alignment films.
Summary of the invention
The invention provides a kind of preparation method of alignment films, the preparation method of above-mentioned alignment films is convenient to realize the management and control to inactive area on substrate.
For achieving the above object, the invention provides following technical scheme:
A preparation method for alignment films, comprising:
On substrate, form the effective coverage of covered substrate and the PI liquid of inactive area and solidify;
The part of PI liquid level after removal is solidified in the inactive area of substrate is to form the figure of oriented layer.
In above-mentioned preparation method, first on substrate, adopt the modes such as coating form the effective coverage of covered substrate and the PI liquid of inactive area and solidify, in the time that being applied on substrate, PI liquid need not distinguish inactive area and the effective coverage of substrate, the each several part being coated on after liquid-solidization of PI on substrate no longer has mobility, and then remove the part of PI liquid level in the inactive area of substrate after solidifying, after liquid-solidization of reservation PI, be positioned at the part of the effective coverage of substrate, finally form the figure of oriented layer.
While adopting above-mentioned preparation method to prepare oriented layer on substrate, that the part of PI liquid level in the inactive area of substrate of removing after solidifying by step realizes with the figure that forms oriented layer to the management and control of substrate inactive area, now PI liquid has cured, after solidifying, PI liquid has not possessed mobility, therefore, be convenient to the management and control to substrate inactive area.
So, while adopting above-mentioned preparation method to prepare oriented layer, be convenient to realize the management and control to inactive area on substrate.
Preferably, the part of the PI liquid level after described removal is solidified in the inactive area of substrate, to form the figure of oriented layer, specifically comprises:
Adopt plasma bombardment technique remove PI liquid level after solidifying on substrate the part in inactive area to form the figure of oriented layer.
Preferably, PI liquid level part in inactive area on substrate that described employing plasma bombardment technique is removed after solidifying, to form the figure of oriented layer, specifically comprises:
Use mask plate to cover described substrate, wherein, the gap in mask plate and the corresponding setting of inactive area on substrate;
The substrate that adopts plasma bombardment technique to cover mask plate bombards, to remove the part corresponding with the gap of mask plate in the PI liquid after solidifying on substrate.
Preferably, the inactive area on gap and the substrate in mask plate is just to arranging.
Preferably, the part of the PI liquid level after described removal is solidified in the inactive area of substrate, to form the figure of oriented layer, specifically comprises:
Adopt etching technics remove PI liquid level after solidifying on substrate the part in inactive area to form the figure of oriented layer.
Preferably, the described effective coverage of covered substrate and the PI liquid of inactive area curing of being coated with on substrate, specifically comprises:
On transfer printing board, be coated with PI liquid, the region of described transfer printing board coating PI liquid is overall region;
The PI liquid of the coating on transfer printing board is transferred on substrate, is transferred to PI liquid on substrate and covers effective coverage and the inactive area of described substrate;
The PI liquid of coating on substrate is prepared to dry technique;
Oriented layer after dry to preparation on substrate is carried out PI characterization processes;
Oriented layer on substrate is carried out to main curing process.
Brief description of the drawings
The preparation method's of the oriented layer that Fig. 1 provides for the embodiment of the present invention process flow diagram;
Principle assumption diagram while adopting plasma bombardment technique in the preparation method that Fig. 2 provides for an embodiment of the present invention;
In the preparation method that Fig. 3 provides for an embodiment of the present invention, adopt the principle assumption diagram after plasma bombardment technique.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiment.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
Please refer to Fig. 1, the preparation method of the alignment films that the embodiment of the present invention provides, comprising:
Step S101 is coated with the effective coverage of covered substrate and the PI liquid of inactive area and solidifies on substrate;
Step S102, the part of the PI liquid level after removal is solidified in the inactive area of substrate is to form the figure of oriented layer.
In above-mentioned preparation method, first on substrate, be coated with the effective coverage of covered substrate and the PI liquid of inactive area and solidify by step S101, in step S101, in the time that being applied on substrate, liquid PI liquid need not distinguish inactive area and the effective coverage of substrate, the each several part being coated on after liquid-solidization of PI on substrate no longer has mobility, then the part of the PI liquid level after solidifying by step S102 removal in the inactive area of substrate, after liquid-solidization of reservation PI, be positioned at the part of the effective coverage of substrate, finally form the figure of oriented layer.Described generation type, except coating, can also be other generation types such as sputter.
While adopting above-mentioned preparation method to prepare oriented layer on substrate, the management and control of inactive area on substrate is realized by step S102, because the PI liquid after step S101 solidifies has not possessed mobility, flowing of liquid PI liquid can not impact the management and control of substrate inactive area.
So, while adopting above-mentioned preparation method to prepare oriented layer, be convenient to realize the management and control to inactive area on substrate.
In a kind of preferred implementation, the part of the PI liquid level after the removal of describing in above-mentioned steps S102 is solidified in the inactive area of substrate, to form the figure of oriented layer, specifically comprises:
Adopt plasma bombardment technique remove PI liquid level after solidifying on substrate the part in inactive area to form the figure of oriented layer.
Adopting plasma bombardment technique to remove PI liquid level after the solidifying part in inactive area on substrate, to form the figure of oriented layer, can reduce step S102 and carry out the rear composition to the oriented layer in substrate effective coverage and impact.
More specifically, as shown in Figure 2, the effective coverage on substrate 1 is as shown in A, and inactive area is as shown in B, and PI liquid level part in inactive area B on substrate 1 that above-mentioned employing plasma bombardment technique is removed after solidifying, to form the figure of oriented layer 11, specifically comprises:
Use mask plate 2 covered substrates 1, wherein, the inactive area B on the gap in mask plate 2 and substrate 1 is just preferably setting, and mask plate 2 carries out covering protection to the effective coverage A of substrate 1;
The substrate 1 that adopts plasma bombardment technique to cover mask plate 2 bombards, and to remove the part just right with the gap of mask plate 2 in the PI liquid after solidifying on substrate 1, adopts result after plasma 3 bombardments as shown in Figure 3.
Certainly, above-mentioned steps S102 can also realize by other means, as, the part of the PI liquid level after above-mentioned steps S102 removal is solidified in the inactive area of substrate, to form the figure of oriented layer, can also comprise:
Adopt etching technics remove PI liquid level after solidifying on substrate the part in inactive area to form the figure of oriented layer.
In a kind of preferred implementation, in above-mentioned steps S101, on substrate, be coated with the effective coverage of covered substrate and the PI liquid of inactive area and solidify, specifically can comprise:
On transfer printing board, be coated with PI liquid, the region of described transfer printing board coating PI liquid is overall region;
The PI liquid of the coating on transfer printing board is transferred on substrate, is transferred to PI liquid on substrate and covers effective coverage and the inactive area of described substrate;
The PI liquid of coating on substrate is prepared to dry technique;
Oriented layer after dry to preparation on substrate is carried out PI characterization processes;
Oriented layer on substrate is carried out to main curing process.
Obviously, those skilled in the art can carry out various changes and modification and not depart from the spirit and scope of the present invention the embodiment of the present invention.Like this, if these amendments of the present invention and within modification belongs to the scope of the claims in the present invention and equivalent technologies thereof, the present invention is also intended to comprise these changes and modification interior.
Claims (6)
1. a preparation method for alignment films, is characterized in that, comprising:
On substrate, form the effective coverage of covered substrate and the PI liquid of inactive area and solidify;
The part of PI liquid level after removal is solidified in the inactive area of substrate is to form the figure of oriented layer.
2. preparation method according to claim 1, is characterized in that, the part of the PI liquid level after described removal is solidified in the inactive area of substrate, to form the figure of oriented layer, specifically comprises:
Adopt plasma bombardment technique remove PI liquid level after solidifying on substrate the part in inactive area to form the figure of oriented layer.
3. preparation method according to claim 2, is characterized in that, PI liquid level part in inactive area on substrate that described employing plasma bombardment technique is removed after solidifying, to form the figure of oriented layer, specifically comprises:
Use mask plate to cover described substrate, wherein, the gap in mask plate and the corresponding setting of inactive area on substrate;
The substrate that adopts plasma bombardment technique to cover mask plate bombards, to remove the part corresponding with the gap of mask plate in the PI liquid after solidifying on substrate.
4. preparation method according to claim 3, is characterized in that, the inactive area on gap and substrate in mask plate is just to arranging.
5. preparation method according to claim 1, is characterized in that, the part of the PI liquid level after described removal is solidified in the inactive area of substrate, to form the figure of oriented layer, specifically comprises:
Adopt etching technics remove PI liquid level after solidifying on substrate the part in inactive area to form the figure of oriented layer.
6. according to the preparation method described in claim 1～5 any one, it is characterized in that, the described effective coverage of covered substrate and the PI liquid of inactive area curing of being coated with on substrate, specifically comprises:
On transfer printing board, be coated with PI liquid, the region of described transfer printing board coating PI liquid is overall region;
The PI liquid of the coating on transfer printing board is transferred on substrate, is transferred to PI liquid on substrate and covers effective coverage and the inactive area of described substrate;
The PI liquid of coating on substrate is prepared to dry technique;
Oriented layer after dry to preparation on substrate is carried out PI characterization processes;
Oriented layer on substrate is carried out to main curing process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410360313.8A CN104155805A (en) | 2014-07-25 | 2014-07-25 | Preparation method of aligned film |
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| CN201410360313.8A CN104155805A (en) | 2014-07-25 | 2014-07-25 | Preparation method of aligned film |
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Cited By (6)
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| CN104808396A (en) * | 2015-05-13 | 2015-07-29 | 京东方科技集团股份有限公司 | Liquid crystal box, preparation method thereof and display device |
| CN105665247A (en) * | 2016-04-15 | 2016-06-15 | 深圳市华星光电技术有限公司 | Display and coating method for polyimide resin layer in display module of display |
| CN105954941A (en) * | 2016-07-18 | 2016-09-21 | 京东方科技集团股份有限公司 | Making method and device for display substrate |
| CN106990616A (en) * | 2017-05-17 | 2017-07-28 | 京东方科技集团股份有限公司 | Prepare the System and method for, substrate and display panel of alignment film |
| US10012870B2 (en) | 2016-01-27 | 2018-07-03 | Boe Technology Group Co., Ltd. | Alignment device and manufacturing method of alignment film and display substrate |
| CN114326217A (en) * | 2021-12-29 | 2022-04-12 | 北海惠科光电技术有限公司 | Coating method of alignment liquid and preparation method of array substrate |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104808396A (en) * | 2015-05-13 | 2015-07-29 | 京东方科技集团股份有限公司 | Liquid crystal box, preparation method thereof and display device |
| US10012870B2 (en) | 2016-01-27 | 2018-07-03 | Boe Technology Group Co., Ltd. | Alignment device and manufacturing method of alignment film and display substrate |
| CN105665247A (en) * | 2016-04-15 | 2016-06-15 | 深圳市华星光电技术有限公司 | Display and coating method for polyimide resin layer in display module of display |
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| CN105954941A (en) * | 2016-07-18 | 2016-09-21 | 京东方科技集团股份有限公司 | Making method and device for display substrate |
| CN106990616A (en) * | 2017-05-17 | 2017-07-28 | 京东方科技集团股份有限公司 | Prepare the System and method for, substrate and display panel of alignment film |
| CN114326217A (en) * | 2021-12-29 | 2022-04-12 | 北海惠科光电技术有限公司 | Coating method of alignment liquid and preparation method of array substrate |
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Application publication date: 20141119 |