CN110267375A - A kind of preparation process and graphene electric heating film of graphene electric heating film - Google Patents
A kind of preparation process and graphene electric heating film of graphene electric heating film Download PDFInfo
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- CN110267375A CN110267375A CN201910555878.4A CN201910555878A CN110267375A CN 110267375 A CN110267375 A CN 110267375A CN 201910555878 A CN201910555878 A CN 201910555878A CN 110267375 A CN110267375 A CN 110267375A
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 165
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 165
- 238000005485 electric heating Methods 0.000 title claims abstract description 52
- 238000002360 preparation method Methods 0.000 title claims abstract description 36
- 239000011241 protective layer Substances 0.000 claims abstract description 62
- 239000000463 material Substances 0.000 claims description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 239000002002 slurry Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 238000001035 drying Methods 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 238000007639 printing Methods 0.000 claims description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 claims description 6
- 239000002994 raw material Substances 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 150000001336 alkenes Chemical class 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000004575 stone Substances 0.000 claims description 3
- 239000010408 film Substances 0.000 description 164
- 239000003292 glue Substances 0.000 description 33
- 229920000139 polyethylene terephthalate Polymers 0.000 description 23
- 238000010438 heat treatment Methods 0.000 description 17
- 239000010410 layer Substances 0.000 description 16
- 238000010586 diagram Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000013532 laser treatment Methods 0.000 description 4
- 229920006267 polyester film Polymers 0.000 description 4
- 230000002633 protecting effect Effects 0.000 description 4
- 238000002955 isolation Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- 241000252254 Catostomidae Species 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000011031 large-scale manufacturing process Methods 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/03—Electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/145—Carbon only, e.g. carbon black, graphite
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/34—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
Landscapes
- Carbon And Carbon Compounds (AREA)
- Surface Heating Bodies (AREA)
Abstract
The invention discloses a kind of preparation process of graphene electric heating film and graphene electric heating films, comprising: forms conductive electrode on graphene film surface；Locating plate is formed in the conductive circuit electrode surface；Protective layer is formed on the graphene film surface, wherein the conductive electrode and the locating plate are respectively positioned between the graphene film and the protective layer；It is positioned by the locating plate, forms electrode ports.Electrode ports can be formed by precise positioning on graphene electric heating film through the embodiment of the present invention, and will not destroy graphene.
Description
Technical field
The present invention relates to technical field of graphene more particularly to a kind of preparation processes and graphene of graphene electric heating film
Electric heating film.
Background technique
Electric radiant Heating Film be after a kind of energization can heating film, by conductive special ink, metal current-carrying item is processed, hot pressing
It is made between insulation polyester film.Using Electric radiant Heating Film as heater when work, heat is sent into space in the form of radiation, reaches hair
Hot purpose.Graphene Electric radiant Heating Film is a kind of using graphene film as the New Electrothermal Film of exothermic material.As a kind of two dimension
Carbon material, graphene Electric radiant Heating Film are a face calandria, homogeneous heating.And graphene itself flexible and transparent heats graphene
Film also has same characteristic.It is similar with current electric heating membrane structure.
The preparation approach of common Electric radiant Heating Film is as follows: first conductive electrode is formed in substrate surface, generally using metals such as copper, aluminium
It is made, then forms heating layer by spraying or printing electrically conductive ink on surface, be packaged again after drying, obtain Electric radiant Heating Film.
But this process is not particularly suited for graphene transparent heating film, in graphene electric heating film preparation process, needs in conduction
Electrode ports are formed at electrode to be used for external electrode, however common preparation method is used to be easy to cause to scrape to graphene surface
It wipes, causes graphene damaged.
Summary of the invention
The present invention provides the preparation process and graphene electric heating film of a kind of graphene electric heating film, in graphene electricity
Electrode ports are formed in heating film.
One aspect of the present invention provides a kind of preparation process of graphene electric heating film, comprising: in graphene film surface shape
At conductive electrode；Locating plate is formed in the conductive circuit electrode surface；Protective layer is formed on the graphene film surface, wherein
The conductive electrode and the locating plate are respectively positioned between the graphene film and the protective layer；It is fixed by the locating plate
Position forms electrode ports.
It is described to form conductive electrode on graphene film surface, comprising: to pass through printing technology in a kind of embodiment
Electrocondution slurry is compounded on the graphene film；It will be compounded with the graphene film drying of the electrocondution slurry, obtained
To conductive electrode；Wherein, it is compounded on the electrocondution slurry on the graphene film and is formed with location hole, the locating plate
The conductive circuit electrode surface is formed in using the location hole.
It is described to form locating plate in the conductive circuit electrode surface, comprising: to judge the conduction in a kind of embodiment
It whether there is location hole on electrode；When being judged as on the conductive electrode there are when location hole, institute is connected on the location hole
State locating plate.
In a kind of embodiment, the diameter of the location hole is less than the diameter of the electrode ports.
In a kind of embodiment, the locating plate is connected to the conductive electrode by viscosity, and the protective layer is logical
It crosses viscosity and is connected to the graphene film；Wherein, the viscosity between the locating plate and the conductive electrode is less than the guarantor
Viscosity between sheath and the graphene film.
In a kind of embodiment, the locating plate is any of nonmetallic locating plate and metal locating plate；Wherein,
The raw material of the nonmetallic locating plate includes any one or more of PET material, PI material, PEN material；The metal positioning
The raw material of piece includes any one or more of copper, aluminium, iron.
In a kind of embodiment, the viscosity of the nonmetallic locating plate is 0~20g/25mm, and the protective layer glues
Degree is greater than 80g/25mm.
In a kind of embodiment, the metal locating plate is connected to the conductive electrode, institute by adhesive viscosity
The viscosity for stating adhesive is 0~20g/25mm, and the viscosity of the protective layer is greater than 80g/25mm.
It is described to be positioned by the locating plate in a kind of embodiment, form electrode ports, comprising: cut by laser
Cut the protective layer being located above the locating plate；Remove the locating plate and the protection above the locating plate
Layer forms electrode ports.
Another aspect of the present invention provides a kind of graphene electric heating film, and the graphene electric heating film is by above-mentioned implementable side
The preparation process of graphene electric heating film described in any one of formula is made.
In the preparation process of graphene electric heating film provided by the invention and graphene electric heating film, pass through protective layer pair
Graphene film is protected, and is positioned by locating plate to electrode ports, while being carried out when forming electrode ports to electrode ports
Protection, to obtain the mesh for forming electrode ports on graphene electric heating film and not will cause graphene and conductive electrode damage
, method is simple, is suitable for large-scale production.
Detailed description of the invention
Fig. 1 shows a kind of structural schematic diagram of graphene electric heating film of the embodiment of the present invention；
Fig. 2 shows a kind of configuration schematic diagrams of graphene electric heating film of the embodiment of the present invention；
Fig. 3 shows a kind of flow diagram one of the preparation process of graphene electric heating film of the embodiment of the present invention；
Fig. 4 shows a kind of flow diagram two of the preparation process of graphene electric heating film of the embodiment of the present invention；
Fig. 5 shows a kind of flow diagram three of the preparation process of graphene electric heating film of the embodiment of the present invention；
Fig. 6 shows a kind of flow diagram four of the preparation process of graphene electric heating film of the embodiment of the present invention.
Specific embodiment
To keep the purpose of the present invention, feature, advantage more obvious and understandable, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is only
It is only a part of the embodiment of the present invention, and not all embodiments.Based on the embodiments of the present invention, those skilled in the art are not having
Every other embodiment obtained under the premise of creative work is made, shall fall within the protection scope of the present invention.
Fig. 1 shows a kind of structural schematic diagram of graphene electric heating film of the embodiment of the present invention；Fig. 2 shows realities of the present invention
Apply a kind of configuration schematic diagram of graphene electric heating film of example；Fig. 3 shows a kind of graphene electric heating of the embodiment of the present invention
The flow diagram one of the preparation process of film.
Referring to figure 1, figure 2 and figure 3, on the one hand the embodiment of the present invention provides the preparation process of a kind of graphene electric heating film,
Include: step 101, forms conductive electrode 2 on 1 surface of graphene film；Step 102, locating plate is formed on 2 surface of conductive electrode
4；Step 103, protective layer 5 is formed on 1 surface of graphene film, wherein it is thin that conductive electrode 2 and locating plate 4 are respectively positioned on graphene
Between film 1 and protective layer 5；Step 104, it is positioned by locating plate 4, forms electrode ports 3.
Preparation process provided in an embodiment of the present invention aims at the mesh quickly accurately punched on graphene electric heating film
's.By forming locating plate 4 on 2 surface of conductive electrode, machine can be accurately positioned by locating plate 4, thus being formed
There are formation electrode ports 3 on the position of locating plate 4.The electrode ports 3 being thusly-formed can be positioned exactly at 2 top of conductive electrode, and partially
Shifting rate is low, can be completely coincident with conductive electrode 2, to avoid the occurrence of since 3 language of electrode ports is overlapped with electric electrode section or not
The situation for being overlapped and causing graphene Electric radiant Heating Film inferior occurs.
Specifically, step 101 is first carried out, is formed on 1 surface of graphene film in the preparation process that the present invention is implemented
Conductive electrode 2.Wherein, commercially available graphene film 1 can be used in graphene film 1, oneself can also be prepared.Graphene is thin
Film 1 includes substrate and the graphene layer for being formed in substrate surface.Substrate can use the isolation material for being capable of forming graphene,
Further, substrate is flexible material, keeps graphene film 1 coiled, by roll-to-roll graphene film 1, using this hair
The large-scale production of graphene electric heating film may be implemented in preparation process provided by bright embodiment.In a kind of specific implementation
In example, substrate can be polyester film, such as PET film, PI film, PEN film or other polyester films.The embodiment of the present invention is not
The method that graphene is formed in substrate is defined, can make to generate graphene in substrate using chemical vapour deposition technique.
When the embodiment of the present invention selects graphene film 1, it need to only meet the substrate and be compounded in that it includes isolation material
Graphene layer in substrate.In the present invention, the spreading area of graphene layer needs to sprawl face equal to or less than substrate
Product, thus with the operation after convenient.Conductive electrode 2 is for conduction so that graphene layer can generate heat in energization.
What the embodiment of the present invention was not defined the mode for forming conductive electrode 2 on 1 surface of graphene film, only need conductive electrode 2
1 surface of graphene film can be compound in contact with graphene film 1, conductive electrode 2, which carries out conduction, makes graphene in energization feelings
It can generate heat under condition.The specific material of conductive electrode of the embodiment of the present invention 2 is defined, and can use can arbitrarily lead
The metal of electricity, preferably conductive silver paste are needed when conductive electrode 2 is formed in 1 surface of graphene film in a manner of electrocondution slurry
Drying makes electrocondution slurry form conductive electrode 2.In step 101, after 1 surface of graphene film forms conductive electrode 2, execute
Step 102, locating plate 4 is formed on 2 surface of conductive electrode.In this step, the diameter of locating plate 4 needs to be less than conductive electrode 2
Width, to keep locating plate 4 completely set up above conductive electrode 2, i.e., the periphery of locating plate 4 is not thin with graphene
Film 1 contacts.It, can be by the way that locating plate 4 be placed directly in conduction between the locating plate 4 and conductive electrode 2 of the embodiment of the present invention
On electrode 2, locating plate 4 can also be adhered on conductive electrode 2 by adhesive, locating plate 4 itself can also be made with viscous
Property, by the adhesive bond of locating plate 4 on conductive electrode 2.The embodiment of the present invention is not between locating plate 4 and conductive electrode 2
Connection type be defined, only need locating plate 4 that can position the position on conductive electrode 2.
In step 103, protective layer 5 is formed on 1 surface of graphene film；Wherein, conductive electrode 2 and locating plate 4 are respectively positioned on
Between graphene film 1 and protective layer 5.Protective layer 5 is formed in graphene surface by bonding, and the purpose is to pass through protective layer 5
It plays a protective role to graphene film 1.Therefore, in order to keep protective layer 5 preferable to the protecting effect of graphene film 1,
Protective layer 5 needs to be fixed on 1 surface of graphene film using the biggish adhesive of viscosity, keeps protective layer 5 and graphene thin
Film 1 keeps synchronizing moving, to avoid occurring rubbing between protective layer 5 and graphene film 1 causing graphene layer from graphene
It falls off on film 1.Specifically, protective layer 5 can be selected as isolation material identical with base's material, as PET film, PI film,
PEN film or other polyester films, when substrate and protective layer 5 belong to material of the same race at that time, the deformation quantity of the two is identical, can keep away
Exempt from graphene electric heating film and occur that deformation is poor in deformation, to keep protective layer 5 more preferable to the protecting effect of graphene film 1.
Have base consistent with graphene layer area based on graphene film 1 and the big both of these case of area of base's friendship graphene layer,
The generation type of protective layer 5 has difference.When base is consistent with graphene layer area, protective layer 5 is by bonding connection in stone
Then black alkene layer surface carries out insulation processing to the graphene layer for being exposed to edge using laser insulation or other insulation modes,
To achieve the purpose that packaging protection graphene layer.When the area of base is greater than the area of graphene layer, by protective layer 5
By bonding connection on the surface of graphene layer, meanwhile, the periphery of protective layer 5 is connected in base, to by base and protect
Graphene layer is encapsulated between base and protective layer 5 by the bonding of sheath 5.Later, step 104 is executed, is positioned by locating plate 4,
Form electrode ports 3.Specifically, script anchor point can be made by removing locating plate 4 and the protective layer 5 above locating plate 4
Position is exposed on protective layer 5, forms electrode ports 3.
In summary technical solution, through the embodiment of the present invention provided by preparation method, can be in graphene electric heating
Electrode ports 3 are accurately formed on film, electrode ports 3 is avoided to deviate, and improve the lumber recovery of graphene electric heating film, factually
It tests, forms electrode ports 3 on graphene electric heating film using the above method, success rate reaches 99.9%.
Fig. 4 shows a kind of flow diagram two of the preparation process of graphene electric heating film of the embodiment of the present invention.
Referring to fig. 4, in embodiments of the present invention, step 101, conductive electrode 2 is formed on 1 surface of graphene film, comprising:
Step 1011, electrocondution slurry is compounded on graphene film 1 by printing technology；Step 1012, electrocondution slurry will be compounded with
Graphene film 1 dry, obtain conductive electrode 2；Wherein, it is fixed to be formed on the electrocondution slurry being compounded on graphene film 1
Position hole, locating plate 4 are formed in 2 surface of conductive electrode using location hole.
In embodiments of the present invention, locating plate 4 need to accurately be set to 2 top of conductive electrode, 4 facing conductive electrode of locating plate
2 positioning accuracy will affect the position precision of final electrode mouth 3.In order to enable locating plate 4 to be accurately positioned.The present invention is real
Example is applied when forming conductive electrode 2 on 1 surface of graphene film, by step 1011, is answered electrocondution slurry by printing technology
It closes on graphene film 1.Wherein, printing technology is specially by roll-to-roll screen printer print by electrocondution slurry in volume pair
It rolls up on graphene film 1.When using printing technology, when can control electrocondution slurry and be printed on graphene film 1
The specific printing shape of electrocondution slurry, so set, can be when the specific printing shape of electrocondution slurry is arranged, in default print
Brush retains a location hole in shape, so that locating plate 4 is positioned.Specifically, the diameter of location hole is less than the straight of locating plate 4
Diameter.Such as in a specific embodiment, conductive electrode 2 is 5 millimeters, and locating plate 4 is 3 millimeters, and location hole is 1 millimeter.So
Electrocondution slurry is dried afterwards, the conductive electrode 2 installed conducive to locating plate 4 can be formed with.
Fig. 5 shows a kind of flow diagram three of the preparation process of graphene electric heating film of the embodiment of the present invention.
Referring to Fig. 5, in embodiments of the present invention, step 102, locating plate 4 is formed on 2 surface of conductive electrode, comprising: step
1021, judge on conductive electrode 2 with the presence or absence of location hole；Step 1022, when being judged as on conductive electrode 2 there are when location hole,
Locating plate 4 is connected on location hole.
In embodiments of the present invention, it is different from the conductive electrode 2 of no location hole, when having location hole on conductive electrode 2,
The embodiment of the present invention can identify location hole using CCD visual identifying system, or use other target systems to positioning
Hole is identified, identifies location hole using target system, machine can be made to determine location hole position, so as to accurately will
Locating plate 4 is sticked on location hole, and then realizing makes locating plate 4 accurately be set to the purpose on conductive electrode 2, and then is conducive to
The formation of subsequent electrode mouth 3 keeps the forming position of electrode ports 3 more accurate.Meanwhile using the positioning of target system, can make
The setting of locating plate 4 is sticked positioning by automatic placement machine or other equipment with automatic chip mounting function on conductive electrode 2
Piece 4, using with target system automatic placement machine or other equipment with automatic chip mounting function mention without human intervention
Efficiency during high location hole is sticked is conducive to advise greatly to improve the efficiency of whole graphene electric heating film preparation
Mould production.
In embodiments of the present invention, the diameter of location hole is less than the diameter of locating plate 4.
When locating plate 4 is attached on location hole, it should be noted that the needs of locating plate 4 are connect with conductive electrode 2,
And in order to which machine is to 4 deviation of locating plate caused by the deviations of the location hole center of circle, the diameter of location hole, which is less than, needs locating plate 4
Diameter, specifically, the aperture of location hole is preferably 0.1-3mm, the diameter of locating plate is greater than the aperture 1-8mm of location hole.
In embodiments of the present invention, locating plate 4 is connected to conductive electrode 2 by viscosity, and protective layer 5 is connected to by viscosity
Graphene film 1；Wherein, the viscosity between locating plate 4 and conductive electrode 2 is less than viscous between protective layer 5 and graphene film 1
Property.
It is set to 2 surface of conductive electrode in order in a step 102, enable locating plate 4 stablize, avoids locating plate 4 rear
It is subjected to displacement in continuous process, locating plate 4 is preferably connected to 2 surface of conductive electrode by viscosity by the embodiment of the present invention, is glued
Property connection mode locating plate 4 can also be made using having sticking material to be bonded by adhesive, make locating plate
4 itself have viscosity.And protective layer 5 is equally set to 1 surface of graphene film by way of viscosity connection.Due in the later period
In process, need to take out locating plate 4, form electrode ports 3, in order to facilitate the removal of locating plate 4, locating plate 4 and conductive electrode 2 it
Between viscosity need it is smaller；Since protective layer 5 is for protecting graphene film 1, protective layer 5 and graphene film 1 in order to prevent
Between there is relative motion, therefore viscosity between protective layer 5 and graphene film 1 need it is larger.Therefore, locating plate 4 with lead
Viscosity between electrode 2 is less than the viscosity between protective layer 5 and graphene film 1.
In embodiments of the present invention, locating plate 4 is any of nonmetallic locating plate 4 and metal locating plate 4；Wherein, non-
The raw material of metal locating plate 4 includes any one or more of PET material, PI material, PEN material；The raw material of metal locating plate 4
Including any one or more of copper, aluminium, iron.
It needs to remove simultaneously as locating plate 4 is subsequent, the locating plate 4 of the embodiment of the present invention can be selected as metal locating plate 4
Or nonmetallic locating plate 4, only need locating plate 4 after taking-up not in 2 remained on surface of conductive electrode.Likewise, the present invention is real
It applies example not to be defined the material of locating plate 4, but what needs to be satisfied is that when locating plate 4 does not take out also, it will not be to protective layer 5
Protecting effect and the conductive effect of conductive electrode 2 impact, i.e., locating plate 4 is preferably non-corrosive material.
In embodiments of the present invention, the viscosity of nonmetallic locating plate 4 is 0~20g/25mm, and the viscosity of protective layer 5 is greater than
80g/25mm。
Specifically, the resin that can choose per se with viscosity carries out when locating plate 4 is selected as nonmetallic locating plate 4
The viscosity of production, last molding nonmetallic locating plate 4 needs between 0~20g/25mm, so set, when removal positioning
When piece 4, the setting smaller to the damage of conductive electrode 2 of the viscosity of locating plate 4 is not present, in this way, avoiding when locating plate 4 takes out
Destroy conductive electrode 2.It should be noted that 4 selection of locating plate be do not have viscosity sheet material when, can be in itself and conductive electrode
One face adhesive coating of 2 connections, to make nonmetallic locating plate 4 that there is viscosity to connect with conductive electrode 2.
And the viscosity of protective layer 5 needs to be greater than 80g/25mm, so set, when carrying out the taking-up of locating plate 4, protective layer 5
Still it is strongly adhered to 2 surface of conductive electrode of graphene film 1 and not connected locating plate 4, and protective layer 5, graphene are thin
Be not in relative movement between film 1 and conductive electrode 2, play the purpose of protection graphene film 1 and conductive electrode 2.
In embodiments of the present invention, metal locating plate 4 is connected to conductive electrode 2 by adhesive viscosity, and adhesive glues
Degree is 0~20g/25mm, and the viscosity of protective layer 5 is greater than 80g/25mm.
It in embodiments of the present invention, can be in itself and conduction since metal locating plate 4 itself does not have viscosity
The face adhesive coating that electrode 2 connects, to make metal locating plate 4 that there is viscosity to connect with conductive electrode 2.
And the viscosity of protective layer 5 needs to be greater than 80g/25mm, so set, when carrying out the taking-up of locating plate 4, protective layer 5
Still it is strongly adhered to 2 surface of conductive electrode of graphene film 1 and not connected locating plate 4, and protective layer 5, graphene are thin
Be not in relative movement between film 1 and conductive electrode 2, play the purpose of protection graphene film 1 and conductive electrode 2.
Fig. 6 shows a kind of flow diagram four of the preparation process of graphene electric heating film of the embodiment of the present invention.
It referring to Fig. 6, in embodiments of the present invention, step 104, is positioned by locating plate 4, forms electrode ports 3, comprising: step
Rapid 1041, the protective layer 5 above locating plate 4 is cut by laser；Step 1042, it removes locating plate 4 and is located at locating plate 4
The protective layer 5 of top forms electrode ports 3.
Specifically, during the embodiment of the present invention forms electrode ports 3, it is necessary first to be cut by laser and be located at positioning
The protective layer 5 of the top of piece 4, due to the protective layer 5 that cut portion is 4 top of locating plate, locating plate 4 can be to being disposed below
Conductive electrode 2 is protected, and avoids being cut by laser too deep and damaging conductive electrode 2, in this way, when being cut by laser, laser
Power have bigger range of choice.The embodiment of the present invention does not carry out the shape being cut by laser above locating plate 4
It limits, according to taking out locating plate 4 and stripping the complexity of the protective layer 5 above locating plate 4, cutting profile can be set to
Linear type, cross or the circle coincideing with 4 edge of locating plate, wherein the round hole being preferably arranged concentrically with locating plate 4, when
When the shape of laser cutting is set as round hole, the aperture of the round hole formed by laser boring is greater than location hole 1-5mm, fixed
The diameter of bit slice is greater than laser boring 0-3mm, preferably 1-3mm.
When being cut by laser, equally using CCD visual identifying system or other target systems pair can be used
Locating plate 4 is identified, so that the accuracy of cutting is improved, specifically, can set using the laser cutting with target system
The standby cutting completed to protective layer 5.After cutting the protective layer 5 being located above locating plate 4, step 1042 is executed, removes positioning
Piece 4 and the protective layer 5 above locating plate 4 form electrode ports 3.Its locating plate 4 and the protective layer 5 above locating plate 4
Removing mode can be manually using tweezers, sucker class tool remove, also can use machine removal.
For the understanding convenient for above-described embodiment, specific embodiment presented below is illustrated.
Embodiment 1
Firstly, roll-to-roll 7 mm wide of screen printer print is utilized on 1 coiled material of graphene film, it is 230 millimeters long to lead
Electric ag paste electrode forms conductive electrode 2 by drying tunnel drying and laser treatment.
Then, diameter is sticked on conductive electrode 2 to be 6 millimeters, be the low viscous PI of 3g/25mm with a thickness of 50 microns, viscosity
Thin discs.
Later, that 1 surface of graphene film for posting low viscous PI thin discs is covered with 150 using the technique of roll-to-roll overlay film is micro-
The PEN glue film that the thick viscosity of rice is 80g/25mm.Wherein, conductive electrode 2 and PI thin discs are located at graphene film 1 and PEN glue film
Between.
After again, the laser of glue film can be cut off using the center location and getting of CCD fixation and recognition PI thin discs, and laser is set
Power is 1.5w, cuts out the concentric circles that diameter is 5.5 millimeters.
Then, manually diameter is gone for 5.5 millimeters of concentric circles PEN glue film and PI thin discs using tweezers or sucker tool
It removes, exposure electrode ports 3 obtain graphene electric heating film.
Finally, determining the product of graphene heating film using CCD para-position guillotine exactitude position according to size requirements.
Wherein, PI thin discs, PEN glue film thickness be 0.005 millimeter~1 millimeter, preferred PI thin discs, PEN glue
The thickness of film is 0.010 millimeter~0.5 millimeter, and does not have relevance between the thickness of PI thin discs, PEN glue film.
Embodiment 2
Firstly, roll-to-roll 7 mm wide of screen printer print is utilized on 1 coiled material of graphene film, it is 230 millimeters long to lead
Electric ag paste electrode forms conductive electrode 2 by drying tunnel drying and laser treatment.
Then, it is thin that the low viscous PET that diameter is 5 millimeters, 5 microns of thickness, viscosity are 10g/25mm is sticked on conductive electrode 2
Disk.
Later, 1 surface of graphene film for posting thin discs 10 microns of thickness are covered with using the technique of roll-to-roll overlay film to glue
Degree is the PEN glue film of 90g/25mm, can just cut off swashing for glue film followed by the fixation and recognition thin discs position CCD and getting
Light, laser power 1.2w cut out the concentric circles that diameter is 5 millimeters.
Then, it is manually removed using tools such as tweezers or suckers by PET thin discs and positioned at the glue film of PET thin discs, cruelly
Reveal electrode ports 3, obtains graphene electric heating film.
Finally, determining graphene heating film product using CCD para-position guillotine exactitude position according to size requirements.
Wherein, PET thin discs, PEN glue film thickness be 0.005 millimeter~1 millimeter, preferred PET thin discs, PEN
The thickness of glue film is 0.010 millimeter~0.5 millimeter, and does not have relevance between the thickness of PET thin discs, PEN glue film.
Embodiment 3
Firstly, utilizing the conductive silver of roll-to-roll screen printer print 7mm wide, 230mm long on 1 coiled material of graphene film
Electrode is starched, by drying tunnel drying and laser treatment, obtains conductive electrode 2.
Then, 6 millimeters of diameter, 100 microns of thickness, the low viscous PEN thin discs that viscosity is 20g are sticked on conductive electrode 2.
Later, 1 surface of graphene film for posting thin discs 500 microns of thickness are covered with using the technique of roll-to-roll overlay film to glue
Degree is the PET glue film of 100g, and the laser of glue film can just be cut off followed by the fixation and recognition thin discs position CCD and getting, and is swashed
Optical power is 4.5w, cuts out the concentric circles that diameter is 5 millimeters.
It is artificial to be removed using tools such as tweezers or suckers by PEN thin discs and positioned at the PET glue film of PEN thin discs after again,
Exposure electrode ports 3 simultaneously, obtain graphene electric heating film.
Finally, determining graphene heating film product using CCD para-position guillotine exactitude position according to size requirements.
Wherein, PEN thin discs, PET glue film thickness be 0.005 millimeter~1 millimeter, preferred PEN thin discs, PET
The thickness of glue film is 0.010 millimeter~0.5 millimeter, and does not have relevance between the thickness of PEN thin discs, PET glue film.
Embodiment 4
Firstly, utilizing the conductive silver of roll-to-roll screen printer print 7mm wide, 230mm long on 1 coiled material of graphene film
Electrode is starched, by drying tunnel drying and laser treatment, forms conductive electrode 2.
Then, copper thin discs are put on conductive electrode 2, recycle the technique of roll-to-roll overlay film that will post the stone of thin discs
Black 1 surface of alkene film is covered with PET glue film.
Later, it is located in electrode ports 3 using CCD to go out to get laser, laser power 9w cuts out diameter and copper thin discs phase
Same concentric circles.
After again, copper thin discs and the PET glue film above copper thin discs are blown away using compressed air, expose conductive electricity
Pole 2 obtains graphene electric heating film.
Finally, determining graphene heating film product using CCD para-position guillotine exactitude position according to size requirements.
Wherein, copper thin discs, PET glue film thickness be 0.005 millimeter~1 millimeter, preferred copper thin discs, PET glue
The thickness of film is 0.010 millimeter~0.5 millimeter, and does not have relevance between the thickness of copper thin discs, PET glue film.
Embodiment 5
Firstly, utilizing the conductive silver of roll-to-roll screen printer print 7mm wide, 230mm long on 1 coiled material of graphene film
Electrode is starched, conductive silver paste electrode is rectangle, and both ends are formed with the hole of diameter 1mm, at drying tunnel drying and laser
Reason forms conductive electrode 2 of the both ends with hole.
Then, using the automatic placement machine positioned with CCD, position hole location using CCD, using machine hole circle
Diameter 5mm copper thin discs are put in the heart, and the technique of roll-to-roll overlay film is recycled to cover 1 surface of graphene film for posting thin discs
Upper PET glue film.
Later, it is located in electrode ports 3 using CCD to go out to get laser, laser power 9w cuts out the concentric circles of diameter 3mm.
After again, copper thin discs and the PET glue film above copper thin discs are blown away using compressed air, expose conductive electricity
Pole 2 obtains graphene electric heating film.
Finally, determining graphene heating film product using CCD para-position guillotine exactitude position according to size requirements.
Wherein, copper thin discs, PET glue film thickness be 0.005 millimeter~1 millimeter, preferred copper thin discs, PET glue
The thickness of film is 0.010 millimeter~0.5 millimeter, and does not have relevance between the thickness of copper thin discs, PET glue film.
On the other hand the embodiment of the present invention provides a kind of graphene electric heating film, graphene electric heating film is by above-mentioned implementable
The preparation process of any one of mode graphene electric heating film is made.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.Moreover, particular features, structures, materials, or characteristics described
It may be combined in any suitable manner in any one or more of the embodiments or examples.In addition, without conflicting with each other, this
The technical staff in field can be by the spy of different embodiments or examples described in this specification and different embodiments or examples
Sign is combined.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic." first " is defined as a result, the feature of " second " can be expressed or hidden
It include at least one this feature containing ground.In the description of the present invention, the meaning of " plurality " is two or more, unless otherwise
Clear specific restriction.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (10)
1. a kind of preparation process of graphene electric heating film characterized by comprising
Conductive electrode is formed on graphene film surface；
Locating plate is formed in the conductive circuit electrode surface；
Protective layer is formed on the graphene film surface, wherein the conductive electrode and the locating plate are respectively positioned on the stone
Between black alkene film and the protective layer；
It is positioned by the locating plate, forms electrode ports.
2. preparation process according to claim 1, which is characterized in that described to form conductive electricity on graphene film surface
Pole, comprising:
Electrocondution slurry is compounded on the graphene film by printing technology；
It will be compounded with the graphene film drying of the electrocondution slurry, obtains conductive electrode；
Wherein, it is compounded on the electrocondution slurry on the graphene film and is formed with location hole, the locating plate utilizes institute
It states location hole and is formed in the conductive circuit electrode surface.
3. preparation process according to claim 2, which is characterized in that described formed in the conductive circuit electrode surface positions
Piece, comprising:
Judge on the conductive electrode with the presence or absence of location hole；
When being judged as on the conductive electrode there are when location hole, the locating plate is connected on the location hole.
4. preparation process according to claim 2, which is characterized in that the diameter of the location hole is less than the electrode ports
Diameter.
5. preparation process according to claim 1, which is characterized in that the locating plate is connected to the conduction by viscosity
Electrode, the protective layer are connected to the graphene film by viscosity；Wherein, between the locating plate and the conductive electrode
Viscosity be less than viscosity between the protective layer and the graphene film.
6. preparation process according to claim 1, which is characterized in that the locating plate is that nonmetallic locating plate and metal are fixed
Bit slice it is any；
Wherein,
The raw material of the nonmetallic locating plate includes any one or more of PET material, PI material, PEN material；
The raw material of the metal locating plate includes any one or more of copper, aluminium, iron.
7. preparation process according to claim 6, which is characterized in that the viscosity of the nonmetallic locating plate is 0~20g/
The viscosity of 25mm, the protective layer are greater than 80g/25mm.
8. preparation process according to claim 6, which is characterized in that the metal locating plate is connected by adhesive viscosity
In the conductive electrode, the viscosity of the adhesive is 0~20g/25mm, and the viscosity of the protective layer is greater than 80g/25mm.
9. preparation process according to claim 1, which is characterized in that it is described to be positioned by the locating plate, form electrode
Mouthful, comprising:
The protective layer being located above the locating plate is cut by laser；
The locating plate and the protective layer above the locating plate are removed, electrode ports are formed.
10. a kind of graphene electric heating film, which is characterized in that the graphene electric heating film is by any one of claim 1-9 institute
The preparation process for stating graphene electric heating film is made.
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| CN110944414A (en) * | 2019-10-21 | 2020-03-31 | 珠海烯蟀科技有限公司 | Microcrystalline glass or mica sheet heating device and electrode connection method thereof |
| CN110993186A (en) * | 2019-10-21 | 2020-04-10 | 珠海烯蟀科技有限公司 | Method for using conducting strip as graphene layer power supply electrode |
| CN111417222A (en) * | 2020-05-07 | 2020-07-14 | 佛山市新豪瑞科技有限公司 | Laser sintering film forming production line and production method of graphene electric heating body |
| CN111556597A (en) * | 2020-05-27 | 2020-08-18 | 安徽宇航派蒙健康科技股份有限公司 | Method for preparing graphene heating film for battery on surface of polyimide insulating substrate |
| CN113225856A (en) * | 2020-07-07 | 2021-08-06 | 安徽宇航派蒙健康科技股份有限公司 | Method for preparing graphene high-temperature electrothermal film based on LIG method |
| CN113543383A (en) * | 2021-07-30 | 2021-10-22 | 东风商用车有限公司 | Heating pad and manufacturing method thereof |
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| CN113225856A (en) * | 2020-07-07 | 2021-08-06 | 安徽宇航派蒙健康科技股份有限公司 | Method for preparing graphene high-temperature electrothermal film based on LIG method |
| CN113242616A (en) * | 2020-07-07 | 2021-08-10 | 安徽宇航派蒙健康科技股份有限公司 | Method for preparing graphene high-temperature electrothermal film based on LIG method |
| CN113242616B (en) * | 2020-07-07 | 2022-08-05 | 安徽宇航派蒙健康科技股份有限公司 | Method for preparing graphene high-temperature electrothermal film based on LIG method |
| CN113543383A (en) * | 2021-07-30 | 2021-10-22 | 东风商用车有限公司 | Heating pad and manufacturing method thereof |
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| CN110267375B (en) | 2022-03-08 |
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