CN202652696U - Two-sided conducting wire circuit board with conducting wire lines mutually overlapped on two surfaces - Google Patents
Two-sided conducting wire circuit board with conducting wire lines mutually overlapped on two surfaces Download PDFInfo
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- CN202652696U CN202652696U CN 201220284988 CN201220284988U CN202652696U CN 202652696 U CN202652696 U CN 202652696U CN 201220284988 CN201220284988 CN 201220284988 CN 201220284988 U CN201220284988 U CN 201220284988U CN 202652696 U CN202652696 U CN 202652696U
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- wire line
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- conducting wire
- wire
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Abstract
The present utility model relates to a two-sided conducting wire circuit board with conducting wire lines mutually overlapped on two surfaces. The circuit board comprises a first conducting wire line layer which comprises a first conducting wire line; a second conducting wire line layer which comprises a second conducting wire line; and a middle insulation layer, the first conducting wire line layer is combined on one surface of the middle insulation layer, the second conducting wire line layer is combined on the other surface of the middle insulation layer; the first conducting wire line and the second conducting wire line are mutually overlapped to form intersection points on overlapped and crossed parts, conducting holes are arranged on the intersection points which need to be conducted on the two-sided line, the conducting holes pass through the middle insulation layer and pass through the corresponding first and/or second conducting wire lines/line; and a breaking opening is arranged on a position which needs to be disconnected on the first and/or second conducting wire lines/line according to the line design. In the circuit board, etching, copper sinking or copper plating are not necessary, environmental protection can be realized, energy saving can be realized, materials can be saved, and LED series-connected and parallel-connected circuits can be flexibly designed according to application occasions.
Description
Technical field
The utility model belongs to circuit-board industry, is specifically related to the two-sided wire line plate with the wire juxtaposition formation of two groups of Alignments.Making two-sided wire circuit plate by the utility model and need not etching, need not heavy copper, need not copper facing, is new technology a kind of very environmental protection, energy-conservation, material saving.
Background technology
Traditional board circuit all is that copper-clad plate etches circuit usually, or takes laser and the unwanted metal-made of milling cutter cutting removal to go out circuit.But the former cost is high and pollution is very serious, and latter's efficient is too low, can't produce in enormous quantities.And the circuit board of prior art can't satisfy very flexibly circuit design requirement.
The utility model is compared with a series of single-sided circuit board and Double-side lines of making of the flat conductor juxtaposition that the inventor invents in front, can satisfy the diversified line design of more complexity, has widened application scenario and the scope of application.Compare with traditional production circuit board, the utility model has adopted and a kind ofly need not etching, need not heavy copper, need not copper-plated new method, and new technology is new technology a kind of very environmental protection, energy-conservation, material saving.
Summary of the invention
The utility model relates to a kind of two-sided wire line plate of wire line layout intersected with each other of two sides, comprising: the first wire line layer comprises the first wire line of two above Alignments; The second wire line layer comprises the second wire line of two above Alignments; Intermediate insulating layer, wherein, the first wire line layer is combined on the one side of intermediate insulating layer, and the second wire line layer is combined on the opposite another side of intermediate insulating layer; Wherein, the first and second wire lines are arranged intersected with each otherly, thereby form the crosspoint in overlapping crossover sites, need the crosspoint of conducting that via is set at the first and second wire lines, via runs through intermediate insulating layer and runs through the corresponding first and/or second wire line; And according to the design of circuit, the position that disconnects at needs arranges the disconnection breach on the first and/or second wire line.The utility model need not etching, need not heavy copper, need not copper facing, very environmental protection, energy-conservation, material saving, and can design very neatly according to the application scenario combination of LED series, parallel circuit.
According to an embodiment of the present utility model, described the first wire line is arranged parallel to each other, and described the second wire line is arranged parallel to each other.
According to an embodiment of the present utility model, in described via, be filled with tin cream, conductive oil or conducting resinl.
According to an embodiment of the present utility model, in the first and second wire lines connection conducting with correspondence of described via position soldered elements electrode, soldered elements pin or welding conductors.
According to an embodiment of the present utility model, described the first and second wire lines are the flat conductors that adopt the circle line pressure to prolong, or divide the flat conductor that cuts into metal forming, metallic plate or metal tape, or flatten the flat conductor made from the stranded conductor bundle.
According to an embodiment of the present utility model, described two-sided wire line plate is comprising on the interlayer structure successively: comprise at least the element layer that is installed in the LED on the first wire line; The first insulation solder mask; Described the first wire line layer; Described intermediate insulating layer; Described the second wire line layer; With the second insulation solder mask.
According to an embodiment of the present utility model, described LED adopts the COB mode directly led chip to be encapsulated in the LED that obtains on the first and/or second wire line, or adopting surface mounted LED, direct insertion LED or Piranha formula LED.
According to an embodiment of the present utility model, described the second wire line layer comprises the second wire line of two Alignments, and on each bar first wire line and the second wire line, according to the design of circuit, the breach of disconnection is set in the position that needs disconnect.
According to an embodiment of the present utility model, described two-sided wire line plate is the double-sided PCB for LED lamp band, LED illuminating module, LED guardrail pipe, LED neon light, LED Panel light, LED corn lamp, LED Down lamp, LED shot-light, LED sign module, LED fluorescent tube or LED Christmas lamp.
According to the utility model, a kind of two-sided wire line plate of wire juxtaposition of two groups of Alignments is provided, comprising: the wire line layer of ground floor Alignment; Intermediate insulating layer; The wire line layer of second layer Alignment; Two-layer wire line intersection has a certain degree overlapping heat pressure adhesive together, form the crosspoint at the overlapping infall of two layer conductors, design according to Double-side line, need the crosspoint of conducting that via is set at the first and second wire lines, via is taked conductive oil or conducting resinl or soldering or soldered elements or soldered elements pin or welding conductors conducting two sides wire line; According to the design of circuit, the position that disconnects at needs arranges the disconnection breach on ground floor and second layer wire line, makes the two sides wire form the conducting wire.
According to an embodiment of the present utility model, described via is arranged on the crossover points of ground floor wire line and second layer wire line, and described via is conducting bowl hole or conducting through hole.
According to an embodiment of the present utility model, described two-sided wire line plate is flexible PCB or rigid circuit board.
According to an embodiment of the present utility model, when needs are installed the jack element, can be directly in bond pad locations boring or punching, thereby with in the component pins patchhole and be welded on the wire line.
According to an embodiment of the present utility model, described wire is: copper cash, copper-clad aluminum conductor, copper covered steel wire, copper tinned wire, copper nickel plating gold thread, iron tinned wire or steel tinned wire.
According to an embodiment of the present utility model, the wire of the first and second wire lines is to adopt the circle line pressure to prolong the flat conductor of making, or divide the flat conductor that cuts into metal forming, metallic plate or metal tape, or flatten the flat conductor made from the stranded conductor bundle.
According to an embodiment of the present utility model, described the first wire line is along vertical layout of described two-sided wire line plate, and described the second wire line is along the transverse arrangement of turbo of described two-sided wire line plate
In following description to the drawings and specific embodiments, will set forth one or more embodiments of the detail of the present utility model.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present utility model.
Description of drawings
Fig. 1 is the schematic diagram of the flat conductor of an embodiment of the present utility model.
Fig. 2 is the schematic diagram of the juxtaposition groove mould of an embodiment of the present utility model.
Fig. 3 is the cross sectional representation of juxtaposition groove mould shown in Figure 2.
Fig. 4 is the flat conductor juxtaposition wiring schematic diagram of an embodiment of the present utility model.
Fig. 5 is the ground floor wire line layer schematic diagram of the vertical Alignment of wire.
Fig. 6 is the die-cut position that flat conductor need to disconnect and the schematic diagram that punches out simultaneously via removed of ground floor wire line layer.
Fig. 7 is the schematic diagram of the second layer wire line layer of the horizontal Alignment of wire.
Fig. 8 is the die-cut schematic diagram of removing the position that flat conductor need to disconnect of second layer wire line layer.
Fig. 9 is via when being through hole, and second layer wire line layer punches out the schematic diagram of via.
Figure 10 is via when being conducting bowl hole, the schematic diagram that ground floor wire line layer and second layer wire line layer contraposition hot pressing shown in Figure 8 fit together.
Figure 11 is the schematic cross-section of Figure 10.
Figure 12 is via when being the conducting through hole, the schematic diagram that ground floor wire line layer and second layer wire line layer contraposition hot pressing shown in Figure 9 fit together.
Figure 13 is the schematic cross-section of Figure 12.
Figure 14 is the coverlay schematic diagram that has the pad window.
Figure 15 is the schematic diagram on the two-sided wire line plate ground floor wire line of the coverlay contraposition that has the pad window wire juxtaposition that is attached to two groups of Alignments.
Figure 16 is the schematic diagram after the two-sided wire line plate SMT of the wire juxtaposition of two groups of Alignments mounts LED.
Figure 17 is that via is the schematic cross-section after the two-sided wire line plate SMT in conducting bowl hole mounts LED.
Figure 18 is that via is the schematic cross-section after the two-sided wire line plate SMT of conducting through hole mounts LED.
Embodiment
The below will be described in more detail the specific embodiment of the wire of two groups of Alignments of the utility model overlapping two-sided wire line plate intersected with each other.
But, it will be appreciated by those skilled in the art that the following stated only is to illustrate and describe some preferred implementations, some other similarly or the execution mode that is equal to equally also can be used for implementing the utility model.
1, wire producing: the flat conductor 1 (as shown in Figure 1) that the round metal line is rolled into design width and thickness with the flat conductor calender.
2, the juxtaposition groove mould is made: the method that adopts etching or machining with minute surface stainless steel plate, process the juxtaposition groove 3 consistent with line width (such as Fig. 2, shown in Figure 3), gash depth can more shallow than the thickness of flat conductor 1 (as shown in Figure 3).
3, the layout of ground floor wire: design and produce in advance and have the juxtaposition groove mould consistent with flat conductor 1 width, flat conductor 1 juxtaposition is arranged be fixed on 3 li of grooves, adopt by vaccum suction tube 2 to vacuumize air-breathing method and fix (as shown in Figure 4).With one side and 1 pair of good position of juxtaposed flat conductor of the insulating substrate 4 of double-sided belt glue, with 120 ℃ to 150 ℃ precompressed 5 to 10 seconds, the ground floor wire line layer 1 (as shown in Figure 5) of the vertical Alignment of preliminary fixing formation wire.
4, ground floor wire line processing: according to the circuit of design, removing flat conductor 1 with die punching needs the position that disconnects and forms breach 5, simultaneously need the position corresponding to crossover points of conducting to go out via 6 at odt circuit, this via 6 passes wire 1 and the insulating barrier 4 (such as Fig. 6 and shown in Figure 11) of crossover points position.
5, the layout of second layer wire: design and produce in advance and have the juxtaposition groove mould consistent with flat conductor 7 width, flat conductor 7 juxtapositions are arranged be fixed on 3 li of grooves, adopt by vaccum suction tube 2 to vacuumize air-breathing method and fix (as shown in Figure 4).With the one side that glue is arranged and the 7 pairs of good positions of juxtaposed flat conductor with the insulating substrate 8 of glue, with 120 ℃ to 150 ℃ precompressed 5 to 10 seconds, the second layer wire line layer 7 (as shown in Figure 7) of the horizontal Alignment of preliminary fixing formation wire.
6, second layer wire line processing: according to the circuit of design, removing flat conductor 7 with die punching needs the position that disconnects and forms breach 9 (as shown in Figure 8).When if via may need to be formed in the through hole of the whole wiring board of complete break-through, then also need the position corresponding to crossover points of conducting to go out via 10 (as shown in Figure 9) at odt circuit simultaneously, connection is converged in this via 10 and conducting bowl hole 6, penetrate together whole wiring board, comprise ground floor wire line 1, insulating barrier 4 and second layer wire line 7 and insulating substrate 8 (as shown in figure 13).
7, bonding making double sided board: another surface with glue of the insulating substrate 4 of the double-sided belt glue of usefulness ground floor wire line layer as shown in Figure 6, fit together (if when via is through hole with the one side contraposition of the wire 7 that has rushed breach 9 of as shown in Figure 8 second layer wire line layer, just the one side contraposition with the wire that has rushed breach 9 and via 10 of as shown in Figure 9 second layer wire line layer fits together), with bonder 120 ℃ to 150 ℃ parameter precompressed 5 to 10 seconds, superimposed forcing together, preliminary fixing (such as Figure 10,11,12, shown in 13), then, the coverlay 11 (as shown in figure 14) that will have again pad window 12 fits together with the contraposition of ground floor wire line, with bonder 120 ℃ to 150 ℃ parameter precompressed 5 to 10 seconds, superimposed forcing together, after preliminary the fixing, be covered with again release film, with pressing machine at 150 ℃ to 180 ℃, 90 to 180 seconds, the parameter of 12MPa continues heat pressure adhesive, with the ground floor wire line, second layer wire line and coverlay 11 press together.Solidified 45 minutes to 90 minutes with 120 ℃ to 160 ℃ of baking boxs again, namely realize the adhering and solidifying (as shown in figure 15) of insulating substrate 4, wire 7 and the insulating substrate 8 of coverlay 11, wire 1, two sides band glue.
8, printing word, this technique is traditional handicraft, does not carefully state at this.
9, butt welding point is carried out the OSP processing, and this technique is traditional handicraft, does not carefully state at this.
10, SMT mounts welding LED: mount welding procedure with traditional SMT, pad with the two-sided wire line plate of steel mesh contraposition, print solder paste, LED lamp 13 is mounted on the ground floor wire line plate of two-sided wire line plate of juxtaposition, cross reflow machine tin cream is fused into scolding tin 15 with LED lamp 13 lamps welding in the circuit board (as shown in figure 16), the tin cream 14 that is imprinted on simultaneously 6 li in conducting bowl hole is welded to connect conducting (such as Figure 16, shown in Figure 17) with ground floor wire line and second layer wire line.When if via is the conducting through hole of the whole wiring board of complete break-through, tin cream 16 is welded to connect conducting (as shown in figure 18) with ground floor wire line and second layer wire line.
The technique that other is concrete and flow process are well known to a person skilled in the art, therefore repeat no more.
Below by reference to the accompanying drawings the method specific embodiment is described in detail the utility model.But, it will be appreciated by those skilled in the art that the above only is to illustrate and describe some embodiments, to scope of the present utility model, especially the scope of claim does not have any restriction.
Claims (10)
1. the two-sided wire line plate of the wire line layout intersected with each other on a two sides is characterized in that, comprising:
The first wire line layer, described the first wire line layer comprises the first wire line;
The second wire line layer, described the second wire line layer comprises the second wire line; With
Intermediate insulating layer, wherein, described the first wire line layer is combined on the one side of described intermediate insulating layer, and described the second wire line layer is combined on the opposite another side of described intermediate insulating layer;
Wherein, described the first wire line and described the second wire line are arranged intersected with each otherly, thereby form the crosspoint in overlapping crossover sites, need the crosspoint of conducting that via is set at the first and second wire lines, described via runs through described intermediate insulating layer and runs through corresponding the first wire line and/or the second wire line.
2. two-sided wire line plate according to claim 1 is characterized in that, described the first wire line is arranged parallel to each other, and described the second wire line is arranged parallel to each other.
3. two-sided wire line plate according to claim 1 is characterized in that, is filled with tin cream, conductive oil or conducting resinl in described via.
4. two-sided wire line plate according to claim 1 is characterized in that, in the first and second wire lines connection conducting with correspondence of described via position soldered elements electrode, soldered elements pin or welding conductors.
5. each described two-sided wire line plate according to claim 1-4, it is characterized in that: described the first and second wire lines are the flat conductors that adopt the circle line pressure to prolong, or divide the flat conductor that cuts into metal forming, metallic plate or metal tape, or flatten the flat conductor made from the stranded conductor bundle.
6. each described two-sided wire line plate is characterized in that according to claim 1-4, on described the first wire line and/or described the second wire line, the breach of disconnection is set in the position that needs disconnect.
7. each described two-sided wire line plate is characterized in that according to claim 1-4, and described the first wire line is along vertical layout of described two-sided wire line plate, and described the second wire line is along the transverse arrangement of turbo of described two-sided wire line plate.
8. two-sided wire line plate according to claim 1 is characterized in that, described two-sided wire line plate comprises on interlayer structure successively:
At least comprise the element layer that is installed in the LED on the first wire line;
The first insulation solder mask;
Described the first wire line layer;
Described intermediate insulating layer;
Described the second wire line layer; With
The second insulation solder mask.
9. the two-sided wire line plate of the wire line layout intersected with each other on a two sides is characterized in that, comprising:
The first wire line layer, described the first wire line layer comprises the first wire line;
The second wire line layer, described the second wire line layer comprises the second wire line; With
Intermediate insulating layer, wherein, described the first wire line layer is combined on the one side of described intermediate insulating layer, and described the second wire line layer is combined on the opposite another side of described intermediate insulating layer;
Wherein, described the first wire line and described the second wire line are arranged intersected with each otherly, thereby form the crosspoint in overlapping crossover sites, wherein, only remove described intermediate insulation layer material and form buried via hole in position, described crosspoint, the described buried via hole in position, described crosspoint only runs through described intermediate insulating layer and does not run through described the first wire line and described the second wire line thus; Perhaps remove insulating barrier and form described crosspoint in the position in described crosspoint.
10. two-sided wire line plate according to claim 9, it is characterized in that, be filled with conductive materials in the described buried via hole, be used for making described the first wire line and described the second wire line conductive communication, perhaps carry out butt-joint welding conducting in described crosspoint, perhaps the vertical perverse two-layer line layer clamping conducting of wearing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220284988 CN202652696U (en) | 2012-06-08 | 2012-06-08 | Two-sided conducting wire circuit board with conducting wire lines mutually overlapped on two surfaces |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220284988 CN202652696U (en) | 2012-06-08 | 2012-06-08 | Two-sided conducting wire circuit board with conducting wire lines mutually overlapped on two surfaces |
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| Publication Number | Publication Date |
|---|---|
| CN202652696U true CN202652696U (en) | 2013-01-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220284988 Expired - Lifetime CN202652696U (en) | 2012-06-08 | 2012-06-08 | Two-sided conducting wire circuit board with conducting wire lines mutually overlapped on two surfaces |
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| CN (1) | CN202652696U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102711371A (en) * | 2012-06-08 | 2012-10-03 | 王定锋 | Double-sided lead wire circuit board with mutually-crossed lead wire circuits on two sides |
-
2012
- 2012-06-08 CN CN 201220284988 patent/CN202652696U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102711371A (en) * | 2012-06-08 | 2012-10-03 | 王定锋 | Double-sided lead wire circuit board with mutually-crossed lead wire circuits on two sides |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130102 |
|
| CX01 | Expiry of patent term |