411749 1 1 ___-—. 五、發明說明（1) 【發明領域】 本發明係關於一種多層印刷電路板之直接鍍層壓合製法 ，其特別有關於印刷電路板壓合裝置之鋼板上直接鍍層^ ，將該鍍層壓合至一原板〔Thin Core〕上形成一多層印 刷電路板。 【先前技術】 習用印刷電路板壓合方法如第一及二圖所承’ 一原板1 〇 包含一第一絕緣層11、一第一銅箔層12及一第二銅箔層13 ，該第一銅箔層12及第二銅箔層13分別疊置於該第〜絕緣 層11上表面及下表面’將該原板1〇進行加熱使該第一絕緣 層11成一熔融狀’並壓合使該第一絕緣層11、第一鋼箔層 12及第二銅箔層13黏合形成具有雙面板之原板10。在該原 板10上表面疊置一第二絕緣層14及一第三銅箔層16，而在 該原板10下表面疊置一第三絕緣層15及一第四銅箔層>7， 進而組成一多層印刷電路板1 。將該多層印刷電路板^進 行加熱使該第二絕緣層1 4及第三絕緣層1 5成，溶融狀，在 該多層印刷電路板1上表面之第三銅箔層16及下表面之第 四銅箔層1 7上分別以二鋼板2 〇進行壓合，將該原板1 〇上表 面、第二絕緣層14及第三銅箔層16壓合，而該原板1〇下表 面、第三絕緣層1 5及第四銅箔層1 7壓合，而組成一多層印 刷電路板1 ，如第四圖所示。該多層印刷電路板1作為一 原板10再製成具有更多層之一多層印刷電路板2 ，如第五 圖所示。 然而’該印刷電路板壓合方法必須先將銅箔裁剪一規格411749 1 1 ___-. V. Description of the invention (1) [Field of the invention] The present invention relates to a method for directly plating and laminating a multilayer printed circuit board, and particularly to direct plating on a steel plate of a printed circuit board pressing device ^ Then, the plated layer is laminated on a thin plate to form a multilayer printed circuit board. [Prior art] The conventional printed circuit board bonding method is as carried out in the first and second drawings. An original board 10 includes a first insulating layer 11, a first copper foil layer 12, and a second copper foil layer 13. The first A copper foil layer 12 and a second copper foil layer 13 are respectively stacked on the upper surface and the lower surface of the first to the first insulating layer 11 to 'heat the original plate 10 to make the first insulating layer 11 into a molten state' and press-fit The first insulating layer 11, the first steel foil layer 12 and the second copper foil layer 13 are bonded together to form an original plate 10 having a double-sided board. A second insulating layer 14 and a third copper foil layer 16 are stacked on the upper surface of the original plate 10, and a third insulating layer 15 and a fourth copper foil layer are stacked on the lower surface of the original plate 10> 7, further Forms a multilayer printed circuit board 1. The multilayer printed circuit board ^ is heated to melt the second insulating layer 14 and the third insulating layer 15 into a molten state, and the third copper foil layer 16 on the upper surface of the multilayer printed circuit board 1 and the first The four copper foil layers 17 are laminated with two steel plates 20 respectively, and the upper surface of the original plate 10, the second insulating layer 14 and the third copper foil layer 16 are laminated, and the lower surface of the original plate 10 and the third The insulating layer 15 and the fourth copper foil layer 17 are laminated to form a multilayer printed circuit board 1, as shown in the fourth figure. The multilayer printed circuit board 1 is made into a multilayer printed circuit board 2 having more layers as an original board 10, as shown in the fifth figure. However, the printed circuit board pressing method must first cut the copper foil to a specification
C:\Program F iles\Patent\PK6635. ptd 第 4 頁 ^U74d 五、發明說明（2) 後再進行疊合，因此，其具有製程繁雜及浪費時間之缺點 。當進行壓合時’在該第三銅箔層16與鋼板2〇之間或該第 四銅箱層1 7與鋼板2〇之間產生間隙而接著不密合，因而造 成被壓合之該第三銅箔層16及第四銅箔層17產生皺褶。此 外’在該鋼板2〇表面上附著灰塵粒子而進行壓合時，在該 第三銅落層16及第四銅箔層17上產生針點下陷〔Pin Dent ]0 有鑑於此本發明在壓合鋼板上先鍍一銅箔層，以避免裁 剪及堆疊銅箔層’亦可避免在鋼板表面及銅箔層之間附著 灰塵或避免該銅箔層與鋼板間不密合而該銅箔層被壓合時 產生敵相。 【發明概要】 本發明主要目的係提供一種多層印刷電路板之直接鍍層 壓合製法，其將加壓鋼板上鍍上一銅箔，其具有提升^^質 、降低製造成本、簡化製程及節省製造時間。 根據本發明之多層印刷電路板之直接鍍層壓合製法，其 係在一鋼板之光滑表面上鍍銅落層，該銅落層達一預定厚 度’在一原板上表面及下表面各疊置一絕緣層；再將鑛銅 箔之鋼板在該原板上表面及下表面之絕緣層上進行加熱加 壓’使因加熱而成熔融狀態的絕緣層乾化（cur i ng )成固 狀的基材’並與該銅猪層形成緊密結合；剝離該二鋼板後 使該一鋼板與已被壓合完成之一多層印刷電路板分開，由 於該鋼板光滑表面與銅箔層附著力小於該絕緣層與銅洛層 附著力’因此’該銅箔層附著在該原板之絕緣層上。該多C: \ Program Files \ Patent \ PK6635. Ptd page 4 ^ U74d V. Description of the invention (2) and then superimpose, therefore, it has the disadvantages of complicated process and waste of time. When the lamination is performed, a gap is created between the third copper foil layer 16 and the steel plate 20 or between the fourth copper box layer 17 and the steel plate 20, and then it is not tightly sealed, so that it is pressed. The third copper foil layer 16 and the fourth copper foil layer 17 are wrinkled. In addition, when dust particles are adhered to the surface of the steel plate 20 and pressed, pin point depressions occur on the third copper falling layer 16 and the fourth copper foil layer 17 [Pin Dent]. A copper foil layer is first plated on the steel plate to avoid cutting and stacking the copper foil layer. It can also prevent dust from adhering to the surface of the steel plate and the copper foil layer, or to prevent the copper foil layer from being incompatible with the steel plate and the copper foil layer. Enemy appearance when pressed. [Summary of the invention] The main purpose of the present invention is to provide a direct plating and laminating method for a multilayer printed circuit board, which is a copper foil plated on a pressurized steel plate, which has the advantages of improving quality, reducing manufacturing costs, simplifying manufacturing processes and saving manufacturing. time. According to the direct plating and laminating method for a multilayer printed circuit board of the present invention, a copper plated layer is plated on the smooth surface of a steel plate, and the copper plated layer reaches a predetermined thickness, one on each of the upper and lower surfaces of an original board. Insulating layer; then heat and press the steel plate of mineral copper foil on the insulating layer on the upper and lower surfaces of the original plate to dry the insulating layer that has been melted by heating (cur i ng) into a solid substrate 'And form a tight bond with the copper pig layer; after peeling the two steel plates, the one steel plate is separated from a multilayer printed circuit board that has been laminated, because the smooth surface of the steel plate and the copper foil layer have less adhesion than the insulating layer Adhesion to the copper layer 'thus' the copper foil layer is attached to the insulating layer of the original plate. The more
C:\ProgramFiles\Patent\PK6635.ptd 第 5 頁 411749 五、發明說明（3) 層印刷電路板可作為一原板 ^ 刷電路板。 再製成具有更多層之一多層印 在兮鋼2壓合鋼板上先鍍—銅箔層’使該方杏避& 鋼；與銅羯之間產生間隙而提升品質，該^免 埯：規格由該鋼板大小規袼來控制，進而減少使 卜銅：製程而簡化製程及節省製造時間，由該方J 2 之銅vl較不需要裁剪銅箔成本低廉而降低製造成本。1 【圖式說明】 為了讓本發明之上述和其他目的、特徵、和優點能更明 確被了解’下文將特舉本發明較佳實施例，並配合所附圖 式’作洋細說明如下。 第1圖：習用多層印刷電路板之原板壓合示意圖； 第2圖：習用多層印刷電路板之壓合示意圖； 第3圖：本發明較佳實施例製造多層印刷電路板之摩合 示意圖； 第4圖：多層印刷電路板之示意圖；及 第5圖：多層印刷電路板之示意圖。 【圖號說明】 1 多層印刷電路板 2 多層印刷電路板 10 原板 11 第一絕緣層 12 第一銅箔層 13 第二銅箔層 14 第二絕緣層 15 第三絕緣層 16 第三銅箔層 17 第四銅馆層 20 鋼板 21 絕緣層C: \ ProgramFiles \ Patent \ PK6635.ptd Page 5 411749 V. Description of the Invention (3) The printed circuit board with three layers can be used as an original board. ^ Brush the circuit board. It can be made into one layer with more layers and printed on Xigang 2 laminated steel plate-copper foil layer to make the side apricot & steel to avoid gaps and improve the quality.埯: The size is controlled by the size of the steel plate, thereby reducing the use of copper: The process simplifies the process and saves manufacturing time. The copper vl of the square J 2 is cheaper than the copper foil without cutting and reduces the manufacturing cost. 1 [Schematic description] In order to make the above and other objects, features, and advantages of the present invention more clearly understood, hereinafter, the preferred embodiments of the present invention will be specifically described, and the accompanying drawings will be described in detail below. Fig. 1: Schematic diagram of lamination of a conventional multi-layer printed circuit board; Fig. 2: Schematic diagram of lamination of a conventional multi-layer printed circuit board; Fig. 3: Schematic diagram of friction-coupling for manufacturing a multilayer printed circuit board according to a preferred embodiment of the present invention; Figure 4: Schematic diagram of a multilayer printed circuit board; and Figure 5: Schematic diagram of a multilayer printed circuit board. [Illustration of drawing number] 1 Multi-layer printed circuit board 2 Multi-layer printed circuit board 10 Original plate 11 First insulating layer 12 First copper foil layer 13 Second copper foil layer 14 Second insulating layer 15 Third insulating layer 16 Third copper foil layer 17 Fourth copper pavilion layer 20 Steel plate 21 Insulation layer
C:\Prograra F iles\Patent\PK6635. ptd 第 6 頁 411749 五、發明說明（4) 22 銅箔層 【發明說明】 本發明多層印刷電路板之直接鍍層壓合製法係二鋼板之 光滑表面上鍍銅箔層，該銅箔層達一預定厚度；在一原板 上表面及下表面各疊置一絕緣層：再將鍍銅箔之鋼板在該 原板上表面及下表面之絕緣層上進行加熱加壓，使因加熱 而成炼融狀態的絕緣層乾化（curing)成固狀基材，並與 該銅箔層結合形成緊密結合；剝離該二鋼板使該二鋼板與 已被壓合完成之一多層印刷電路板分開。該多層印刷電路 板可作為一原板再製成具有更多層之一多層印刷電路板。 請參照第三、四及五圖，本發明較佳實施例係將二鋼板 20之光滑表面上Μ —第三銅箱層16及一第四銅猪層17，該 第三銅箔層16及第四銅箔層17達一預定厚度時停止作業準 備進行壓合’將該鋼板20置於硫酸銅槽内充當陰極， 第三銅箔層16及第四銅箔層17達一預定厚度時，停止 取出該鋼板20進行壓合。一原板1〇至少包含一第一絕緣層 11、一第一銅猪層12及一第二銅箔層13，該原板10上表面 及下表面具有該第一銅箔層12及第二銅箔層η而形成一雙 面板’在該原板10上表面及下表面各疊置一第二絕緣層14 及一第二絕緣層15。再將該二鋼板2 0疊在該原板1〇上表面 及下表面之第二絕緣層1 4及第三絕緣層1 5上進行加熱加壓 ，加熱使該第二絕緣層1 4及第三絕緣層1 5呈溶融狀，而加 壓則使該原板1 0上表面 '第二絕緣層丨4及第三銅箔層〗6壓 合，亦使該原板10下表面、第三絕緣層及第四銅箱層C: \ Prograra Files \ Patent \ PK6635. Ptd Page 6 411749 V. Description of the invention (4) 22 Copper foil layer [Explanation of the invention] The multi-layer printed circuit board of the present invention is directly plated and laminated on the smooth surface of the second steel plate. Copper foil layer, the copper foil layer has a predetermined thickness; an insulating layer is stacked on the upper and lower surfaces of an original plate: the copper-plated steel plate is heated on the insulating layer on the upper and lower surfaces of the original plate Pressing to dry the insulating layer in a molten state due to heating into a solid substrate, and combining it with the copper foil layer to form a tight bond; peeling off the two steel plates to complete the two steel plates being pressed together One multilayer printed circuit board is separated. The multilayer printed circuit board can be reformed as a master plate into a multilayer printed circuit board having more layers. Please refer to the third, fourth, and fifth drawings. The preferred embodiment of the present invention is to place M—the third copper box layer 16 and a fourth copper pig layer 17 on the smooth surface of the two steel plates 20—the third copper foil layer 16 and When the fourth copper foil layer 17 reaches a predetermined thickness, the operation is stopped and the pressing is performed. The steel plate 20 is placed in a copper sulfate tank to serve as a cathode. When the third copper foil layer 16 and the fourth copper foil layer 17 reach a predetermined thickness, The steel sheet 20 is stopped from being taken out and pressed. An original board 10 includes at least a first insulating layer 11, a first copper pig layer 12, and a second copper foil layer 13. The upper and lower surfaces of the original board 10 have the first copper foil layer 12 and the second copper foil. Layer n to form a double panel. A second insulating layer 14 and a second insulating layer 15 are stacked on the upper surface and the lower surface of the original plate 10, respectively. Then, the two steel plates 20 are stacked on the second insulating layer 14 and the third insulating layer 15 on the upper surface and the lower surface of the original plate 10, and heated and pressed to heat the second insulating layer 14 and the third. The insulating layer 15 is melted, and pressing presses the upper surface of the original plate 10 into a second insulating layer 4 and a third copper foil layer 6, and also causes the lower surface of the original plate 10, the third insulating layer, and Fourth copper box layer
C:\PrograraFiles\Patent\PK6635.ptd 第 7 頁 411749 五、發明說明（5) 壓合。剝離該二鋼板20與已被壓合完之一多層印刷電路板 1分開，此時，由於該鋼板20光滑表面與第三銅箔層丨6附 著力小於該第二絕緣層〗4與第三銅箔層〗6附著力，因此，· 該第三銅箔層16附著在該原板10上表面之第二絕緣層14，· 及由於該鋼板20光滑表面與第四銅箔層17附著力小於該第 三絕緣層15與第四銅箔層17附著力，因此，該第四銅箱層 17附著在該原板1〇下表面之第三絕緣層15 ’因而形成一多 層印刷電路板1 。 請參照第五圖所示，該多層印刷電路板丨上表面及下表 面各設有一銅箔層而形成一原板10，將該原板10上表面及 下表面各以前述方法將一絕緣層21及一銅羯層22疊置壓合 ，以形成具有更多層之一多層印刷電路板2 。 請再參照第二及四圖所示，習用該第三鋼箔層“及第四 銅羯廣17需要裁剪成一規格，而具有製程繁雜及浪費 之缺點。在該第三銅箔層U及鋼板2〇之間或第四鋼箔 及鋼板20之間形成不密| ’當進行壓合多層印刷電路= ’該第三銅箱層16及第四銅落層17易產生皺褶。在該鋼板 20表面上附著灰塵粒子而進行壓合時，在該第三銅箔 及第四銅箔層17上產生針點下陷〔Pin Dent〕。反觀， 發明在鋼板20光滑表面上鍵該第三鋼箔層16及第四銅箱声 17 ’其將該第三銅羯層16及第四鋼箔層17大小規格由該二 板大小規格來控制，其避免在該第三銅箔層16及鋼板Μ 間或第四銅箔層1 7及鋼板20之間形成間隙，或其避免在玆 第二銅岛層16及鋼板20之間或第四鋼箔層17及鋼板2〇之間 釅 圓 C:\Program F iles\Patent\PK6635. ptd 第 8 頁 411749 五、發明說明（6) 存在灰塵。 雖然本發明已以前述較佳實施例揭示，然其並非用以限 定本發明，任何熟習此技藝者，在不脫離本發明之精神和 範圍内，當可作各種之更動與修改，因此本發明之保護範 圍當視後附之申請專利範圍所界定者為準。C: \ PrograraFiles \ Patent \ PK6635.ptd Page 7 411749 5. Description of the invention (5) Lamination. The two steel plates 20 are separated from one of the multilayer printed circuit boards 1 that have been laminated. At this time, since the smooth surface of the steel plate 20 and the third copper foil layer 6 have less adhesion than the second insulating layer 4 and the first The three copper foil layers have an adhesion force of 6, so that the third copper foil layer 16 is adhered to the second insulating layer 14 on the upper surface of the original plate 10, and because of the adhesion between the smooth surface of the steel plate 20 and the fourth copper foil layer 17, The adhesion between the third insulation layer 15 and the fourth copper foil layer 17 is smaller than the third insulation layer 15 ′ attached to the lower surface of the original board 10, thereby forming a multilayer printed circuit board 1. . Please refer to the fifth figure. The multilayer printed circuit board is provided with a copper foil layer on each of the upper surface and the lower surface to form an original plate 10, and an insulating layer 21 and A copper hafnium layer 22 is laminated and laminated to form a multilayer printed circuit board 2 having one more layer. Please refer to the second and fourth figures again. The third steel foil layer and the fourth copper foil 17 need to be cut into a specification, which has the disadvantages of complicated and wasteful processes. The third copper foil layer U and the steel plate A tightness is formed between 20 or between the fourth steel foil and the steel plate 20 | 'When laminating multilayer printed circuits =' The third copper box layer 16 and the fourth copper falling layer 17 are prone to wrinkles. When dust particles are adhered on the surface of the surface 20 and pressed, a pin point depression [Pin Dent] is generated on the third copper foil and the fourth copper foil layer 17. In contrast, the third steel foil was invented on the smooth surface of the steel plate 20. Layer 16 and the fourth copper box sound 17 'It controls the size of the third copper foil layer 16 and the fourth steel foil layer 17 by the size of the two plates, and avoids the third copper foil layer 16 and the steel plate M Or a gap is formed between the fourth copper foil layer 17 and the steel plate 20, or it avoids a circle C between the second copper island layer 16 and the steel plate 20 or between the fourth steel foil layer 17 and the steel plate 20: \ Program Files \ Patent \ PK6635. Ptd Page 8 411749 V. Description of the invention (6) There is dust. Although the present invention has been implemented in the foregoing preferred embodiment The example reveals that it is not intended to limit the present invention. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be regarded as the attached application. The patent scope shall prevail.
C:\ProgramFiles\Patent\PK6635.ptd 第 9 頁C: \ ProgramFiles \ Patent \ PK6635.ptd page 9