JPH03115153A - Step coverage sheet - Google Patents
Step coverage sheetInfo
- Publication number
- JPH03115153A JPH03115153A JP2216049A JP21604990A JPH03115153A JP H03115153 A JPH03115153 A JP H03115153A JP 2216049 A JP2216049 A JP 2216049A JP 21604990 A JP21604990 A JP 21604990A JP H03115153 A JPH03115153 A JP H03115153A
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- ceramic green
- ceramic
- powder
- laminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims abstract description 72
- 239000000843 powder Substances 0.000 claims abstract description 48
- 239000011230 binding agent Substances 0.000 claims abstract description 17
- 229920005596 polymer binder Polymers 0.000 claims abstract description 8
- 239000002491 polymer binding agent Substances 0.000 claims abstract description 8
- 238000010304 firing Methods 0.000 claims description 21
- 239000012530 fluid Substances 0.000 claims description 7
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 abstract description 8
- 239000000853 adhesive Substances 0.000 abstract description 7
- 230000001070 adhesive effect Effects 0.000 abstract description 7
- 239000000203 mixture Substances 0.000 abstract description 6
- 239000002245 particle Substances 0.000 abstract description 5
- 239000005639 Lauric acid Substances 0.000 abstract description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 4
- 230000009969 flowable effect Effects 0.000 abstract description 4
- 230000009477 glass transition Effects 0.000 abstract description 4
- 238000002156 mixing Methods 0.000 abstract description 4
- 239000000945 filler Substances 0.000 abstract description 2
- 238000005245 sintering Methods 0.000 abstract description 2
- 239000002904 solvent Substances 0.000 abstract description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 21
- 239000004020 conductor Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 16
- 229920000642 polymer Polymers 0.000 description 8
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000001993 wax Substances 0.000 description 6
- 239000011229 interlayer Substances 0.000 description 4
- 239000005995 Aluminium silicate Substances 0.000 description 3
- 235000012211 aluminium silicate Nutrition 0.000 description 3
- 239000003985 ceramic capacitor Substances 0.000 description 3
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 239000000454 talc Substances 0.000 description 3
- 229910052623 talc Inorganic materials 0.000 description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- RZJRJXONCZWCBN-UHFFFAOYSA-N octadecane Chemical compound CCCCCCCCCCCCCCCCCC RZJRJXONCZWCBN-UHFFFAOYSA-N 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- POOSGDOYLQNASK-UHFFFAOYSA-N tetracosane Chemical compound CCCCCCCCCCCCCCCCCCCCCCCC POOSGDOYLQNASK-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 229940038384 octadecane Drugs 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 235000019809 paraffin wax Nutrition 0.000 description 1
- 235000019271 petrolatum Nutrition 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Compositions Of Oxide Ceramics (AREA)
- Producing Shaped Articles From Materials (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、多層セラミック回路基板や着層セラミックコ
ンデンサなどの形成に好適な段差補償シートに関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a step compensating sheet suitable for forming multilayer ceramic circuit boards, layered ceramic capacitors, and the like.
発明の背景及び課題
セラミックグリーンシートの積層体を焼成処理して一体
物からなる積層焼成体を形成するにあたり、セラミック
回路基板やセラミックコンデンサ等を得る場合のように
、導体粉末層からなるパターンを付与したセラミックグ
リーンシートを用いる場合がある。Background and Problems of the Invention When firing a laminate of ceramic green sheets to form a monolithic laminate sintered body, a pattern consisting of a conductive powder layer is applied, as in the case of obtaining a ceramic circuit board, a ceramic capacitor, etc. Ceramic green sheets may be used.
従来、かかる場合における積層焼成体の製造方法として
は、ポリマ系接着剤を塗工してセラミックグリーンシー
トを接着積層し、それを焼成処理する方法、あるいはセ
ラミックグリーンシートの単なる積層体を熱プレスして
シート中のバインダの溶融下に圧着し、それを焼成処理
する方法が知られていた。Conventionally, methods for manufacturing a laminated fired body in such cases include coating a polymer adhesive to adhere and laminate ceramic green sheets, and then firing it, or hot pressing a simple laminate of ceramic green sheets. There is a known method in which the binder in the sheet is molten and pressed and then fired.
しかしながら、得られる積層焼成体において、導体粉末
層からなるパターンを付与したセラミックグリーンシー
トにおける導体粉末層を介した界面の該パターン近傍に
隙間を生じる問題点があった。かかるパターンは、電気
回路を形成するもので、その近傍の隙間は浸水経路等と
なり致命的問題となる。加えて接着剤の塗布方法の場合
には接着剤の均厚塗布が困難で、焼成時にボイドや脹れ
が発生してシート間の密着性を阻害し、得られる製品の
歩留まりや品質を低下させる問題点があった。また接着
剤の塗布状態などに高度な管理が要求されることから全
工程を自動化させ難(製造効率に劣る問題点もあった。However, in the obtained laminated fired product, there is a problem in that a gap is formed in the vicinity of the pattern at the interface between the conductor powder layer in the ceramic green sheet provided with the pattern made of the conductor powder layer. Such patterns form electrical circuits, and gaps in the vicinity become water ingress routes, which poses a fatal problem. In addition, in the case of the adhesive application method, it is difficult to apply the adhesive evenly, and voids and swells occur during firing, which impairs the adhesion between the sheets and reduces the yield and quality of the resulting product. There was a problem. In addition, it was difficult to automate the entire process because it required a high degree of control over things such as the state of adhesive application (there was also the problem of poor manufacturing efficiency).
一方、熱プレス方法の場合にはセラミックグリーンシー
トに付与した導体粉末層が分断されて通電不良を誘発す
る問題点があった。また接着力不足とシートの変形を予
防しつつ積層するための温度、圧力のコントロールが複
雑で困難な問題点、積層焼成体にソリや収縮を生じやす
く、寸法精度に劣る問題点などもあった。On the other hand, in the case of the hot press method, there is a problem in that the conductive powder layer applied to the ceramic green sheet is divided, leading to poor conduction. In addition, there were also problems such as insufficient adhesive strength, complicated and difficult control of temperature and pressure for laminating sheets while preventing sheet deformation, and problems such as warping and shrinkage of laminated fired products, which tend to occur, and poor dimensional accuracy. .
本発明は、前記の如くセラミックグリーンシートを段差
の関与下に被着体に積層して焼成固着する場合に、段差
に基づく隙間が形成されないように処理できる技術の開
発を課題とする。An object of the present invention is to develop a technique that can prevent the formation of gaps due to the steps when ceramic green sheets are laminated on an adherend with the involvement of steps and then baked and fixed.
従来の技術
従来、セラミック粉末をバインダでシート形態に保形し
たものとしては、バインダにポリマーを用いた前記のセ
ラミックグリーンシートが知られていた。2. Description of the Related Art Conventionally, the above-mentioned ceramic green sheet using a polymer as a binder has been known as a product in which ceramic powder is held in the form of a sheet with a binder.
しかし、かかるセラミックグリーンシートを用いたので
は上記した問題点が発生すること、前記したとおりであ
る。However, as described above, the use of such ceramic green sheets causes the above-mentioned problems.
課題を解決するための手段
本発明は、上記の課題を克服できるセラミック系シート
の開発に成功したものである。Means for Solving the Problems The present invention has succeeded in developing a ceramic sheet that can overcome the above problems.
すなわち本発明は、セラミックグリーンシートをその焼
成下に被着体に接着するためのシートであり、前記セラ
ミックグリーンシートの焼成時に焼成されるセラミック
粉末を、感熱流動性バインダとポリマーバインダでシー
ト形態に保形してなることを特徴とする段差補償シート
を提供するものである。That is, the present invention is a sheet for adhering a ceramic green sheet to an adherend during firing, and the ceramic powder fired during firing of the ceramic green sheet is shaped into a sheet using a heat-sensitive fluid binder and a polymer binder. The present invention provides a level difference compensating sheet characterized by shape-retaining.
作用
上記の段差補償シートにおいては、感熱流動性バインダ
の易流動性に基づいて段差補償シート中のセラミック粉
末が段差部分等に良好に補填される。その結果、段差が
関与する界面にも隙間を形成することなくセラミックグ
リーンシートを良密着状態に被着体に積層することがで
き、形成した積層体を必要に応じ打抜き加工する際や、
その他の取り扱い時にも積層間に剥離や位置ズレ等を生
じ難い。また、ボイドや脹れを生じることなく焼成でき
て層間の密着性に優れる高品質の積層焼成体を歩留まり
よく製造することができる。Effect: In the above-mentioned level difference compensating sheet, the ceramic powder in the level difference compensating sheet is well filled into the level difference portions etc. based on the easy-flowing property of the heat-sensitive flowable binder. As a result, the ceramic green sheets can be laminated to the adherend with good adhesion without forming gaps even at interfaces involving steps, and when punching the formed laminate as necessary,
Even during other handling, peeling or misalignment between the laminated layers is unlikely to occur. In addition, a high-quality laminated fired body that can be fired without producing voids or swelling and has excellent interlayer adhesion can be produced with a high yield.
従って、例えば導体粉末層からなるパターンを有するセ
ラミックグリーンシートの積層に用いた場合には、シー
ト方式による接着層厚さの調節容易性や均一性に加えて
、セラミックグリーンシートを変形させずに、また導体
粉末層からなるパターンを断線させずに容易に、かつ均
質な接着状態に積層することができ、導体パターンの断
線やその近傍の隙間等を生じ難い。また、積層体の形成
から焼成体の形成までを容易に自動化することができる
。Therefore, when used for laminating ceramic green sheets having a pattern made of conductor powder layers, for example, in addition to the ease of adjusting and uniformity of the adhesive layer thickness due to the sheet method, it is possible to laminate ceramic green sheets without deforming the ceramic green sheets. In addition, patterns made of conductor powder layers can be laminated easily and in a homogeneous adhesive state without disconnection, and disconnections in the conductor patterns and gaps in the vicinity thereof are less likely to occur. Further, the process from forming the laminate to forming the fired body can be easily automated.
発明の構成要素の例示
本発明の段差補償シートは、セラミックグリーンシート
の焼成時に焼成されるセラミック粉末を感熱流動性バイ
ンダとポリマーバインダでシート形態に保形したもので
ある。Examples of Constituent Elements of the Invention The level difference compensating sheet of the present invention is made by holding the ceramic powder fired during firing of the ceramic green sheet into a sheet form using a heat-sensitive fluid binder and a polymer binder.
セラミック粉末としては焼成条件等に応じ適宜なものを
用いてよい。焼成対象のセラミックグリーンシートと同
じ組成のものを用いることが接合性などの点で好ましい
。異種のセラミック製品を接合する場合には、それらの
併用系や各別に含有させた層の積層シートなどとしても
よい。一般に用いられるセラミック粉末の例としては、
アルミナ粉、窒化アルミニウム粉、ジルコニア粉、チタ
ニア粉、ベリリア粉、チタン酸バリウム粉、チタン酸マ
グネシウム粉、ムライト粉、ステアタイト粉、その他低
温焼成用セラミック粉末などがあげられる。用いるセラ
ミック粉末の平均粒径は0.1〜lOμIが適当であり
、その使用量は20〜95重量%の含有組成となる量が
適当である。その含有割合が20重量%未満では充分な
接合力が発現せず、焼成時の収縮が大きくて導体粉末層
等からなる段差の近傍等に隙間が生じやすくなり、95
重量%を超えるとシートとして取扱い難くなる。Any suitable ceramic powder may be used depending on the firing conditions and the like. It is preferable to use a ceramic green sheet having the same composition as the ceramic green sheet to be fired, from the viewpoint of bondability. When joining different types of ceramic products, it is also possible to use a combination system of them or a laminated sheet of layers containing each product separately. Examples of commonly used ceramic powders include:
Examples include alumina powder, aluminum nitride powder, zirconia powder, titania powder, beryllia powder, barium titanate powder, magnesium titanate powder, mullite powder, steatite powder, and other ceramic powders for low-temperature firing. The average particle size of the ceramic powder to be used is suitably 0.1 to 1OμI, and the amount used is suitably an amount that provides a content composition of 20 to 95% by weight. If the content is less than 20% by weight, sufficient bonding strength will not be developed, and shrinkage during firing will be large and gaps will easily form near the steps formed by the conductor powder layer, etc.
If it exceeds % by weight, it becomes difficult to handle it as a sheet.
感熱流動性バインダとしては、セラミックグリーンシー
トの積層時の加熱温度等により適宜に決定してよい。一
般には、ステアリン酸やラウリン酸等のカルボン酸系ワ
ックス、オクタデカンやテトラコサンの如きパラフィン
系ワックス、高級アルコール系ワックス、ポリエチレン
系ワックス、エステル系ワックス、アミン系ワックスの
如き常温で固体のワックス類等が好ましく用いられる。The heat-sensitive fluid binder may be appropriately determined depending on the heating temperature during lamination of the ceramic green sheets. Generally, waxes that are solid at room temperature such as carboxylic acid waxes such as stearic acid and lauric acid, paraffin waxes such as octadecane and tetracosane, higher alcohol waxes, polyethylene waxes, ester waxes, and amine waxes are used. Preferably used.
感熱流動性バインダの使用量は、全バインダの5〜70
重量%、就中20〜50重量%が適当である。その使用
量が5重量%未満では積層時に段差を補償できない場合
があるし、70重量%を超えるとシート形成が困難にな
る。The amount of thermosensitive fluid binder used is 5 to 70% of the total binder.
% by weight, especially from 20 to 50% by weight, is suitable. If the amount used is less than 5% by weight, it may not be possible to compensate for differences in level during lamination, and if it exceeds 70% by weight, sheet formation becomes difficult.
ポリマーバインダとしては、ガラス転移温度が100℃
以下、就中−5〜20℃のポリマー、例えば炭化水素系
ポリマー、ビニル系ないしスチレン系ポリマー、アセタ
ール系ポリマー (メタ)アクリル系ポリマー、エステ
ル系ポリマー、ウレタン系ポリマーなどが用いられる。As a polymer binder, the glass transition temperature is 100℃
Hereinafter, among others, polymers having a temperature of -5 to 20°C, such as hydrocarbon polymers, vinyl-based or styrene-based polymers, acetal-based polymers, (meth)acrylic polymers, ester-based polymers, urethane-based polymers, etc., are used.
そのガラス転移温度が100℃を超えると積層時に段差
を補償できない場合がある。If the glass transition temperature exceeds 100° C., it may not be possible to compensate for the difference in level during lamination.
段差補償シートの形成は、セラミック粉末、感熱流動性
バインダ、ポリマ−バインダの1種又は2種以上を必要
に応じ、例えばキシレン、トルエン、ブタノールの如き
適宜な溶剤を用いるなどして混合し、これをロールコー
タ等の適宜な塗工機でセパレータ上や、その他のシート
体等の上に展開する方式などにより行うことができる。The step compensation sheet is formed by mixing one or more of ceramic powder, thermosensitive fluid binder, and polymer binder as necessary, for example, using an appropriate solvent such as xylene, toluene, or butanol. This can be carried out by spreading it on a separator or other sheet body using an appropriate coating machine such as a roll coater.
段差補償シートの形成に際しては必要に応じ、タルク、
カオリン、酸化カルシウム、シリカ、マグネシアの如き
充填剤、ないし焼成助剤などを配合してよい。When forming the level difference compensation sheet, talc,
Fillers such as kaolin, calcium oxide, silica, and magnesia, or sintering aids may be added.
形成する段差補償シートの厚さは、補償すべき段差など
により適宜に決定される。ちなみに段差が5〜100μ
m厚の導体粉末層である場合、用いる段差補償シートの
一般的な厚さは、5〜200pm 。The thickness of the level difference compensating sheet to be formed is appropriately determined depending on the level difference to be compensated for. By the way, the height difference is 5 to 100μ.
In the case of a conductor powder layer having a thickness of m, the typical thickness of the level difference compensating sheet used is 5 to 200 pm.
就中30〜120μmである。段差補償シートが薄すぎ
ると、打抜き加工時等に積層体間に剥離や位置ズレを生
じやすくなり、厚すぎると接合界面にボイドや抜れを生
じて眉間密着性が低下しやすい。In particular, it is 30 to 120 μm. If the level difference compensating sheet is too thin, peeling or misalignment will easily occur between the laminates during punching, etc., and if it is too thick, voids or omissions will occur at the bonding interface, resulting in poor glabella adhesion.
本発明の段差補償シートは、セラミックグリーンシート
を被着体にその焼成下に接着するためのものである。就
中、例えば導体粉末層からなるパターンを有するセラミ
ックグリーンシートの場合な゛どの如く、段差が関与す
る状態でセラミックグリーンシートを被着体に焼成接着
する場合に有利に用いられる。その際、少なくとも段差
が生じることとなる層間には段差補償シートを介在させ
ることが好ましい。The level difference compensating sheet of the present invention is for adhering a ceramic green sheet to an adherend during firing. In particular, it is advantageously used when bonding a ceramic green sheet to an adherend by firing in a state where a step is involved, such as in the case of a ceramic green sheet having a pattern consisting of a conductive powder layer. In this case, it is preferable to interpose a level difference compensating sheet at least between layers where a level difference will occur.
セラミックグリーンシートと被着体の接着処理は例えば
、先ず段差補償シートを介してセラミックグリーンシー
トと被着体を圧着して積層体としたのち、その積層体を
焼成処理することにより行うことができる。The bonding process between the ceramic green sheet and the adherend can be carried out, for example, by first press-bonding the ceramic green sheet and the adherend through a step compensation sheet to form a laminate, and then subjecting the laminate to a firing process. .
前記積層体を形成するための圧着力は5〜150kg
/ crl 、就中20〜100 kg / c+Jが
適当である。その圧着力が過小では段差部分への段差補
償シートの補填が不十分となって隙間が生じやすくなり
、強いとセラミックグリーンシートの変形問題や、段差
が導体粉末層である場合にはその断線問題を誘発する。The pressing force for forming the laminate is 5 to 150 kg.
/crl, especially 20 to 100 kg/c+J is suitable. If the pressure is too low, the level difference compensating sheet will not be enough to compensate for the level difference, and gaps will easily occur. If the pressure is too strong, there will be problems with deformation of the ceramic green sheet, and if the level difference is a layer of conductive powder, there will be problems with disconnection. induce.
圧着温度はポリマーバインダのガラス転移温度や、感熱
流動性バインダの融点、ないしその混合割合などに応じ
適宜に決定してよい。一般には、室温から100℃の範
囲である。積層体の形成に際しては、段差補償シートを
予めセラミックグリーンシート、ないし被着体に貼着し
ておいてもよい。なお、セラミックグリーンシート面等
の一部に段差補償シートを介在させて積層する方式など
も採ることができる。The compression temperature may be appropriately determined depending on the glass transition temperature of the polymer binder, the melting point of the heat-sensitive fluid binder, the mixing ratio thereof, and the like. Generally, the temperature ranges from room temperature to 100°C. When forming the laminate, the level difference compensating sheet may be attached to the ceramic green sheet or the adherend in advance. Note that it is also possible to adopt a method in which a level difference compensating sheet is interposed on a part of the surface of the ceramic green sheet and laminated.
接着対象のセラミックグリーンシートとしてはセラミッ
ク粉末とバインダとの有機溶剤等を用いた混合物をスク
リーン印刷方式や、ドクターブレード方式などによりシ
ート形態に成形したものなど、適宜なものを用いてよい
。被着体についても適宜なものを用いてよい。As the ceramic green sheet to be bonded, any suitable material may be used, such as one formed by forming a mixture of ceramic powder and a binder using an organic solvent or the like into a sheet form by a screen printing method, a doctor blade method, or the like. An appropriate adherend may also be used.
形成した積層体には、焼成処理前に必要に応じ打抜き加
工等の中間加工を施すこともできる。焼成温度や焼成雰
囲気等の焼成条件は、セラミックグリーンシートの種類
などにより適宜に決定してよい。一般には、800〜2
000℃の温度で焼成される。焼成処理により、セラミ
ックグリーンシートや段差補償シート中におけるバイン
ダ等の有機成分が熱分解等して消失し、セラミックグリ
ーンシートを形成するセラミック粉末が、また導体粉末
層が介在する場合にはその導体粉末もそれぞれ融和して
一体化すると共に、段差補償シート中のセラミック粉末
に基づいてセラミックグリーンシートの焼成体と被着体
間で層間接合し、セラミックグリーンシートの積層焼成
体などからなる目的物が形成される。The formed laminate may be subjected to intermediate processing such as punching, if necessary, before the firing process. Firing conditions such as firing temperature and firing atmosphere may be determined as appropriate depending on the type of ceramic green sheet. Generally, 800-2
It is fired at a temperature of 000°C. Through the firing process, organic components such as binders in the ceramic green sheet and the step compensation sheet are thermally decomposed and disappear, leaving the ceramic powder that forms the ceramic green sheet, and the conductor powder if there is a conductor powder layer. At the same time, the ceramic powder in the step compensation sheet causes interlayer bonding between the fired ceramic green sheet and the adherend, forming a target object such as a laminated fired ceramic green sheet. be done.
本発明の段差補償シートは、例えばセラミック回路基板
やセラミックコンデンサ等を得る場合の導体粉末層を有
するセラミックグリーンシートのように、段差を有する
セラミックグリーンシートを他のセラミックグリーンシ
ートと積層して焼成接着する場合に有利に用いることが
できる。また平坦なセラミックグリーンシートを、表面
に凹凸等の段差を有する被着体、例えばガラスや金属等
からなる版体などに積層して焼成接着する場合等にも有
利に用いることができる。The level difference compensating sheet of the present invention is produced by laminating a ceramic green sheet having a level difference with another ceramic green sheet and bonding it by firing, such as a ceramic green sheet having a conductive powder layer when producing a ceramic circuit board, a ceramic capacitor, etc. It can be advantageously used when It can also be advantageously used when a flat ceramic green sheet is laminated and bonded by firing on an adherend having unevenness or other steps on its surface, such as a printing plate made of glass, metal, or the like.
発明の効果
本発明の段差補償シートによれば、感熱流動性バインダ
を含有するので、導体粉末層等に基づく段差に段差補償
シート中のセラミック粉末を補填できて密着力に優れる
セラミックグリーンシートの積層焼成体を層間隙間なく
得ることができる。Effects of the Invention According to the level difference compensating sheet of the present invention, since it contains a heat-sensitive flowable binder, the ceramic powder in the level difference compensating sheet can be supplemented to the level difference based on the conductor powder layer, etc., and the ceramic green sheet is laminated with excellent adhesion. A fired body can be obtained without interlayer gaps.
またシート方式に基づいて、薄(、かつ均質な接着層を
介してセラミックグリーンシートを積層でき、高品質の
積層焼成体を歩留まりよく製造することができる。Further, based on the sheet method, ceramic green sheets can be laminated via a thin (and homogeneous) adhesive layer, and a high-quality laminated fired body can be manufactured with a high yield.
実施例
平均粒径1.5−のアルミナ粉末95部(重量部、以下
同じ)、タルク2.5部、カオリン2.5部、ポリメタ
クリル酸アルキルエステル20部、融点が45℃のラウ
リン酸5部をトルエン100部を用いてボールミルで均
一に混合してスラリーを調製し、これをシリコーン樹脂
で離型処理したポリエステルフィルムからなるセパレー
タ上に展開して乾燥させ、厚さ40−の段差補償シート
を得た。Example 95 parts of alumina powder (parts by weight, the same applies hereinafter) with an average particle size of 1.5, 2.5 parts of talc, 2.5 parts of kaolin, 20 parts of polymethacrylic acid alkyl ester, 5 parts of lauric acid with a melting point of 45°C and 100 parts of toluene were uniformly mixed in a ball mill to prepare a slurry, spread on a separator made of a polyester film that had been released with a silicone resin, and dried to form a step compensation sheet with a thickness of 40 mm. I got it.
評価試験
実施例で得た段差補償シートを、厚さ1薗のセラミック
グリーンシートの片面に50℃、10kg/cr&の条
件で接着した。前記のセラミックグリーンシートは、平
均粒径1.5μmのアルミナ粉末95部、タルク2.5
部、カオリン2.5部をポリビニルブチラール10部で
保形したものである。The level difference compensating sheet obtained in the evaluation test example was adhered to one side of a ceramic green sheet having a thickness of 1 inch under the conditions of 50° C. and 10 kg/cr&. The above ceramic green sheet contains 95 parts of alumina powder with an average particle size of 1.5 μm and 2.5 parts of talc.
2.5 parts of kaolin and 10 parts of polyvinyl butyral.
次に、前記と同種のセラミックグリーンシートの片面に
、平均粒径5μsの白金粉末100部、ニトロセルロー
ス2部をキシ1210部で混合してなる導体粉末ペース
トをスクリーン印刷方式にてパターン塗工し、厚さ30
17mの導体粉末層を形成してなるものを、前記段差補
償シートの上にその導体粉末層側を介して重ね合わせ5
0℃、20kg / cd 、 10秒間の条件で圧着
して積層体を得た。この積層体はセラミックグリーンシ
ート間の密着性、ないし接着性に優れてセラミックグリ
ーンシートの変形や導体粉末層の分断は認められず、導
体粉末層の近傍にも隙間は認められなかった。Next, on one side of the same type of ceramic green sheet as above, a conductive powder paste made by mixing 100 parts of platinum powder with an average particle size of 5 μs, 2 parts of nitrocellulose, and 1210 parts of oxygen was applied in a pattern using a screen printing method. , thickness 30
A 17 m long conductor powder layer is laminated on the level difference compensating sheet with the conductor powder layer side interposed therebetween.
A laminate was obtained by pressure bonding at 0° C., 20 kg/cd, and 10 seconds. This laminate had excellent adhesion or adhesion between the ceramic green sheets, and no deformation of the ceramic green sheets or separation of the conductor powder layer was observed, and no gaps were observed in the vicinity of the conductor powder layer.
前記の積層体を空気中1600℃で30分間焼成処理し
、総厚的1.7mn+の積層焼成体を得た。その積層焼
成体は、層間の密着性及び接合強度が非常に良好で脹れ
やボイドが認められず、反りなどの形状変化もな(、導
体部の断線もなくて良好な通電性を示し、導体部近傍で
の隙間も認められなかった。The above laminate was fired in air at 1600° C. for 30 minutes to obtain a laminate fired product with a total thickness of 1.7 mm+. The laminated fired product has very good interlayer adhesion and bonding strength, shows no swelling or voids, and no shape changes such as warping (and exhibits good electrical conductivity with no disconnections in the conductor parts). No gaps were observed near the conductor.
比較例
ラウリン酸を用いないほかは実施例に準じ(段差補償)
シートを得た。Comparative example Same as the example except that lauric acid is not used (step compensation)
Got a sheet.
前記のシートを用いて上記評価試験に準じ積層体を形成
し、焼成処理して積層焼成体を得たところ、その積層体
におけるセラミックグリーンシート間の導体粉末層の近
傍に隙間が認められ、その積層焼成体においても導体部
近傍に隙間が認められた。When a laminate was formed using the above-mentioned sheets according to the above evaluation test and fired to obtain a laminate, a gap was observed in the laminate near the conductor powder layer between the ceramic green sheets. Gaps were also observed in the vicinity of the conductor parts in the laminated fired body.
Claims (1)
接着するためのシートであり、前記セラミックグリーン
シートの焼成時に焼成されるセラミック粉末を、感熱流
動性バインダとポリマーバインダでシート形態に保形し
てなることを特徴とする段差補償シート。1. This is a sheet for adhering a ceramic green sheet to an adherend during firing, and is made by holding the ceramic powder fired during firing of the ceramic green sheet into a sheet form with a heat-sensitive fluid binder and a polymer binder. A level difference compensation sheet characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2216049A JPH03115153A (en) | 1990-08-15 | 1990-08-15 | Step coverage sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2216049A JPH03115153A (en) | 1990-08-15 | 1990-08-15 | Step coverage sheet |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1234015A Division JPH0396340A (en) | 1989-09-08 | 1989-09-08 | Manufacture of laminated fired object |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03115153A true JPH03115153A (en) | 1991-05-16 |
Family
ID=16682483
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2216049A Pending JPH03115153A (en) | 1990-08-15 | 1990-08-15 | Step coverage sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03115153A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003051675A (en) * | 2001-08-03 | 2003-02-21 | Kyocera Corp | Method of manufacturing ceramic laminate |
JP2006083063A (en) * | 2003-08-27 | 2006-03-30 | Kyocera Corp | Paste for ceramic green sheet |
JP2013043790A (en) * | 2011-08-22 | 2013-03-04 | Mitsui Chemicals Inc | Binder for firing |
JP2015101514A (en) * | 2013-11-26 | 2015-06-04 | 京セラ株式会社 | Ceramic green sheet and production method thereof |
-
1990
- 1990-08-15 JP JP2216049A patent/JPH03115153A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003051675A (en) * | 2001-08-03 | 2003-02-21 | Kyocera Corp | Method of manufacturing ceramic laminate |
JP4663173B2 (en) * | 2001-08-03 | 2011-03-30 | 京セラ株式会社 | Manufacturing method of ceramic laminate |
JP2006083063A (en) * | 2003-08-27 | 2006-03-30 | Kyocera Corp | Paste for ceramic green sheet |
JP2013043790A (en) * | 2011-08-22 | 2013-03-04 | Mitsui Chemicals Inc | Binder for firing |
JP2015101514A (en) * | 2013-11-26 | 2015-06-04 | 京セラ株式会社 | Ceramic green sheet and production method thereof |
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