CN208387037U - A kind of flexible circuit board - Google Patents
A kind of flexible circuit board Download PDFInfo
- Publication number
- CN208387037U CN208387037U CN201721559322.5U CN201721559322U CN208387037U CN 208387037 U CN208387037 U CN 208387037U CN 201721559322 U CN201721559322 U CN 201721559322U CN 208387037 U CN208387037 U CN 208387037U
- Authority
- CN
- China
- Prior art keywords
- metal
- circuit board
- dots
- flexible circuit
- developed film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The utility model discloses a kind of flexible circuit board, forms main body by sheet metal sawing sheet, and photosensitive developed film is covered in main body, is directly made on photosensitive developed film by welding gun on circuit boards and loses metal dots or circuit connection metal dots in advance.The utility model flexible circuit board saves drilling operating, epiphragma is directly pasted after single-layer metal sawing sheet, then press dry film, and by making circuit board figure on the film, the production of hole and route can be completed through overexposure, development, etching.Cost has been saved using the utility model, has shortened the production cycle, has avoided influence of the drilling waste material to environment.
Description
Technical field
The utility model relates to flexible printed circuit board field, specially a kind of flexible circuit board.
Background technique
Flexible circuit board in real life with more and more extensive.Traditional single circuit board manufacturing method is single layer
After metal sawing sheet first drill on the metal layer, after stick reverse side cover film again.Film is pressed dry through overexposure using conventional method front again
Light, development, etching carry out route production.Such way needs first to drill on the metal layer, and which adds costs, extends
Production cycle, while the waste material for the generation that drills has some impact on environment.
Utility model content
The purpose of this utility model is that it, which is able to achieve, saves drillman in view of the above problems, providing a kind of flexible circuit board
Sequence directly pastes epiphragma after single-layer metal sawing sheet, then press dry film, by being made on photosensitive developed film for losing in advance or electricity
The metal dots of road connection, the production disk of hole and route can be completed through overexposure, development, etching；Using the utility model section
About cost, shortens the production cycle, improves production efficiency while also avoiding influence of the drilling waste material to environment.
In order to achieve the above object, the technical solution adopted in the utility model is: a kind of flexible circuit board is opened by sheet metal
Material forms metal-based layer, and photosensitive developed film is covered on the metal-based layer, and it is straight to pass through welding gun on the photosensitive developed film
Production on circuit boards is connect for the metal dots of erosion or circuit connection in advance；The metal dots are cylindrical, and the metal dots are being felt
Photodevelopment film face forms the weld ddge to contract, and the metal dots are formed in metal-based layer to be extended outwardly and be fixedly connected
Leg.
Further, the metal-based layer is single-layer metal plate, and the metal-based layer is copper foil, aluminium foil, silver foil, zinc foil
Or alloying metal foil；The metal dots can be copper point, zinc point, aluminium point, silver point or alloying metal point.
Further, the metal dots are to carry out heat fusion joint postwelding on photosensitive developed film surface by welding gun to be cooled into
's.
Further, the metal dots can be formed in the melting welding of circuit board two sides, and its height is not less than photosensitive developing rubber
The thickness of piece.
The utility model has the beneficial effects that
1, utility model device can make pre- pitting to circuit board surface in a manner of direct metal spot welding and be used to etch
One step pore-forming directly can also form energization connector in circuit board surface, so that the connection of circuit element is more convenient.
2, the metal dots in the utility model are formed by heating spot welding, will not be emitted beam and be influenced photographic film
Property.
3, the leg of metal dots can guarantee more to be stably connected with metal-based layer, realize circuit conduct or be integrally etched into
Hole avoids influence of the drilling waste material to environment without drilling.
Detailed description of the invention
Fig. 1 is the utility model cross section structure schematic diagram.
Fig. 2 is the utility model structure diagram.
In figure: 1, metal-based layer；2, photosensitive developed film；3, metal dots；301, weld ddge；302, leg.
Specific embodiment
In order to enable those skilled in the art to better understand the technical solutions of the present invention, with reference to the accompanying drawing to this reality
Be described in detail with novel, the description of this part be only it is exemplary and explanatory, should not be to the protection scope of the utility model
There is any restriction effect.
As Figure 1-Figure 2, the specific structure of the utility model are as follows: a kind of flexible circuit board, by sheet metal sawing sheet shape
At metal-based layer 1, photosensitive developed film 2 is covered on the metal-based layer 1, it is straight to pass through welding gun on the photosensitive developed film 2
Production on circuit boards is connect for the metal dots 3 of erosion or circuit connection in advance；The metal dots 3 are cylindrical, and the metal dots 3 exist
Photosensitive 2 surface of developed film forms the weld ddge 301 to contract, and the metal dots 3 extend outwardly and consolidate in the formation of metal-based layer 1
Surely the leg 302 connected.
Preferably, the metal-based layer 1 is single-layer metal plate, and the metal-based layer 1 is copper foil, aluminium foil, silver foil, zinc foil
Or alloying metal foil；The metal dots 3 can be copper point, zinc point, aluminium point, silver point or alloying metal point.
Preferably, the metal dots 3 are to carry out heat fusion joint postwelding on photosensitive 2 surface of developed film by welding gun to be cooled into
's.
Preferably, the metal dots 3 can be formed in the melting welding of circuit board two sides, and its height is not less than photosensitive developed film
2 thickness.
The utility model flexible circuit board saves drilling operating, epiphragma is directly pasted after single-layer metal sawing sheet, then press dry film,
Be covered with photosensitive developed film in main body, on photosensitive developed film by welding gun directly on circuit boards the pre- erosion metal dots of production or
Person's circuit connection metal dots；The production of hole and route can be completed through overexposure, development or etching.
It should be noted that, in this document, the terms "include", "comprise" or its any other variant are intended to non-row
His property includes, so that the process, method, article or equipment for including a series of elements not only includes those elements, and
And further include other elements that are not explicitly listed, or further include for this process, method, article or equipment institute it is intrinsic
Element.
Specific case used herein is expounded the principles of the present invention and embodiment, above example
Illustrate the method and its core concept for being merely used to help understand the utility model.The above is only the preferred of the utility model
Embodiment, it is noted that due to the finiteness of literal expression, and objectively there is unlimited specific structure, for this technology
For the those of ordinary skill in field, without departing from the principle of this utility model, several improvement, retouching can also be made
Or variation, above-mentioned technical characteristic can also be combined in the right way；These improve retouching, variation or combination, or not
It is improved that the conception and technical scheme of utility model are directly applied into other occasions, it is regarded as the protection of the utility model
Range.
Claims (4)
1. a kind of flexible circuit board forms metal-based layer (1) by sheet metal sawing sheet, which is characterized in that the metal-based layer (1)
On be covered with photosensitive developed film (2), on the photosensitive developed film (2) by welding gun directly on circuit boards production for pre-
The metal dots (3) of erosion or circuit connection；The metal dots (3) are cylindrical, and the metal dots (3) are in photosensitive developed film (2)
Surface forms the weld ddge (301) to contract, and the metal dots (3) are formed in metal-based layer (1) to be extended outwardly and be fixedly connected
Leg (302).
2. a kind of flexible circuit board according to claim 1, which is characterized in that the metal-based layer (1) is single-layer metal
Plate, the metal-based layer (1) are copper foil, aluminium foil, silver foil, zinc foil or alloying metal foil；The metal dots (3) can be copper
Point, zinc point, aluminium point, silver point or alloying metal point.
3. a kind of flexible circuit board according to claim 1, which is characterized in that the metal dots (3) are existed by welding gun
Photosensitive developed film (2) surface carries out what heat fusion joint postwelding was cooled into.
4. a kind of flexible circuit board according to claim 1, which is characterized in that the metal dots (3) can be in circuit board
Two sides melting welding is formed, and its height is not less than the thickness of photosensitive developed film (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721559322.5U CN208387037U (en) | 2017-11-21 | 2017-11-21 | A kind of flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721559322.5U CN208387037U (en) | 2017-11-21 | 2017-11-21 | A kind of flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208387037U true CN208387037U (en) | 2019-01-15 |
Family
ID=64979027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721559322.5U Expired - Fee Related CN208387037U (en) | 2017-11-21 | 2017-11-21 | A kind of flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208387037U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110519917A (en) * | 2019-08-27 | 2019-11-29 | 江苏上达电子有限公司 | A kind of manufacturing method of through-hole |
-
2017
- 2017-11-21 CN CN201721559322.5U patent/CN208387037U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110519917A (en) * | 2019-08-27 | 2019-11-29 | 江苏上达电子有限公司 | A kind of manufacturing method of through-hole |
| CN110519917B (en) * | 2019-08-27 | 2021-08-17 | 江苏上达电子有限公司 | Method for manufacturing through hole |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190605 Address after: 414517 Pingjiang Industrial Park, Pingjiang County, Yueyang City, Hunan Province Patentee after: Hunan Founder Da New Material Technology Co., Ltd. Address before: 414500 Xingxing Road, Wushi Industrial Park, Pingjiang County, Yueyang City, Hunan Province Patentee before: HUNAN FOUNDER SOONEST ELECTRONICS TECHNOLOGY CO., LTD. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190115 Termination date: 20201121 |