CN110519917A - A kind of manufacturing method of through-hole - Google Patents
A kind of manufacturing method of through-hole Download PDFInfo
- Publication number
- CN110519917A CN110519917A CN201910795486.5A CN201910795486A CN110519917A CN 110519917 A CN110519917 A CN 110519917A CN 201910795486 A CN201910795486 A CN 201910795486A CN 110519917 A CN110519917 A CN 110519917A
- Authority
- CN
- China
- Prior art keywords
- hole
- insulation film
- sides
- carried out
- development
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
Abstract
The present invention relates to a kind of manufacturing methods of through-hole, belong to printed-board technology field.It include: the two sides coating photoresist in insulation film, two sides exposure is carried out to the insulation film of coating photoresist, development, two facet etches are carried out to the insulation film after development, form concave groove, to the insulation film two sides coating photoresist after etching, the film of coating photoresist is exposed, development, two facet etches are carried out to the insulation film by re-expose development, form stair-stepping through-hole, photoresist is coated with to two sides and there is the insulation film of stair-stepping through-hole to carry out film process, copper facing is carried out to the insulation film of striping, complete plating, form ladder hole.The beneficial effects of the present invention are: the broken needle avoided the occurrence of, bore it is inclined phenomena such as；Reduce residue glue or copper ashes that drilling can generate；Two sides is etched simultaneously, guarantees the quality in hole；The formation of stepped hole is conducive to the circulation of electroplate liquid when subsequent copper facing, so as to preferably guarantee the quality of hole copper.
Description
Technical field
The present invention relates to a kind of manufacturing methods of through-hole, belong to printed-board technology field.
Background technique
As the continuous development of electronic product and technology is innovated, the design concept of electronic product gradually moves towards frivolous, short and small,
The design of printed circuit board (PCB) also develops to the direction of small-bore, high density, multilayer number, fine rule road.And with wiring board
The reduction in the increased aperture of number of plies thickness, product through-hole radius-thickness ratio increase obviously, and PTH difficulty of processing is gradually increased, and is easy to cause
In hole metal foil phenomenon or without metal phenomenon occur.
The step of the manufacturing method key of through-hole is aperture and electro-coppering.Hole opening technology is different according to the radius-thickness ratio in hole, effect
Fruit also can be different, equally heavy process for copper also can cost and environmental protection aspect there is very big deficiency, main disadvantage is as follows:
1, with the reduction in aperture, remaining colloid and copper ashes processing are more difficult in device to hole, and it is duplicate mechanically and chemically
Processing, the size for being not only easy device to hole affects, but also is easy to deform plate.Possibly even cause to scrap, increase manufacture at
This.
2, in the case where drilling deep hole, machine drilling is unable to satisfy quality requirements, while can also it is possible that broken needle problem
Increase processing cost
3, after drilling finishes, since what is be connected between copper foil is PI substrate, it cannot achieve conducting, so needing through chemistry
Mode deposits upper one layer of copper in through-hole surfaces, and electroless copper plating liquid medicine, which contains a large amount of formaldehyde, can also impact environment.
4, when electro-coppering, the copper in hole is very thin, simultaneously because the too small limitation of liquid medicine covering power and aperture, had been electroplated
Cheng Zhong, the deposition rate in hole is relatively low, so printed circuit plate surface can deposit more copper, also indirectly increases in this way
Manufacturing cost.
5, similarly in Deep hole electroplating, since radius-thickness ratio is big, electroplate liquid circulation is uneven in the process, and it is copper to will cause hole
Measure low, the problem of reliability difference.
Summary of the invention
Place, the present invention provide a kind of manufacturing method of through-hole in order to overcome the above-mentioned deficiencies of the prior art, thin insulating
Film two sides obtains stepped hole by etching method, then does full copper to stepped hole and fills, forms through-hole.It can be realized by this method
The uniform circulation of electroplate liquid can be good at the quality for guaranteeing hole copper.
The present invention is achieved through the following technical solutions: a kind of manufacturing method of through-hole characterized by comprising
Step 1: in the two sides coating photoresist I of insulation film；
Step 2: two sides exposure, development are carried out to the insulation film of coating photoresist I；
Step 3: two facet etches being carried out to the insulation film after development, form concave groove；
Step 4: to the insulation film two sides coating photoresist II after etching；
Step 5: the film of coating photoresist II being exposed, is developed；
Step 6: two facet etches being carried out to the insulation film by re-expose development, form stair-stepping through-hole；
Step 7: photoresist being coated with to two sides and there is the insulation film of stair-stepping through-hole to carry out film process；
Step 8: copper facing being carried out to the insulation film of striping, plating is completed, forms ladder hole.
The insulation film is polyimides material or epoxy resin material or polyurethane material.
The ladder hole is that circular hole or square hole or circular hole add square hole.
The class number of the ladder hole is two ranks or multistage.
The beneficial effects of the present invention are: 1, lead to the formation that overetched method realizes stepped hole on insulation film, in this way
Avoid tradition machinery drilling it is possible that broken needle, bore it is inclined phenomena such as.
2, reduce the residue glue or copper ashes that traditional machine drilling can generate, caused by the low problem of hole copper mass.
3, two sides is etched simultaneously, more convenient time saving for traditional technique to drill from single side,
It can guarantee the quality in hole simultaneously.
4, the formation of stepped hole is conducive to the circulation of electroplate liquid when subsequent copper facing, so as to preferably guarantee hole copper
Quality.
Detailed description of the invention
Below according to drawings and examples, the present invention is further described.
Fig. 1 is step 1 schematic diagram of the invention；
Fig. 2 is step 2 schematic diagram of the invention；
Fig. 3 is step 3 schematic diagram of the invention；
Fig. 4 is step 4 schematic diagram of the invention；
Fig. 5 is step 5 schematic diagram of the invention；
Fig. 6 is step 6 schematic diagram of the invention；
Fig. 7 is step 7 schematic diagram of the invention；
Fig. 8 is step 8 schematic diagram of the invention.
In figure: 1, insulation film, 2, photoresist I, 3, concave groove, 4, photoresist II, 5, through-hole, 6, ladder hole.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts all other
Embodiment shall fall within the protection scope of the present invention.
In conjunction with shown in Fig. 1 to Fig. 8, a kind of manufacturing method of through-hole characterized by comprising
Step 1: in the two sides coating photoresist I 2 of insulation film 1；
Step 2: two sides exposure, development being carried out to the insulation film 1 of coating photoresist I 2, expose the part for needing to etch；
Step 3: two facet etches being carried out to the insulation film 1 after development, etch the concave groove 3 of two similar blind holes；
Step 4: to the 1 two sides coating photoresist II 4 of insulation film after etching；
Step 5: the film of coating photoresist II 4 being exposed, is developed, and exposes the part for needing to etch on concave groove 3；
Step 6: two facet etches being carried out to the part exposed on 1 concave groove 3 of insulation film by re-expose development, form rank
The through-hole 5 of scalariform；
Step 7: photoresist being coated with to two sides and there is the insulation film 1 of stair-stepping through-hole 5 to carry out film process；
Step 8: copper facing being carried out to the insulation film 1 of striping, completes plating, coating blocks stair-stepping through-hole 5, and it is logical to form ladder
Hole 6.
The insulation film 1 is polyimides material or epoxy resin material or polyurethane material.
The ladder hole 6 is that circular hole or square hole or circular hole add square hole.
The class number of the ladder hole 6 is two ranks or multistage.
The present embodiment beneficial effect is:
Firstly, leading to the formation that overetched method realizes stepped hole on insulation film 1, this avoid tradition machinery drillings can
The broken needle that can will appear bores phenomena such as inclined.
Secondly, reduce the residue glue or copper ashes that traditional machine drilling can generate, caused by hole copper mass is low asks
Topic.
Thirdly, 1 two sides of insulation film is etched simultaneously, compared to traditional technique to drill from single side
Speech, it is more convenient time saving, while can guarantee the quality in hole.
Finally, the formation of stair-stepping through-hole 5, is conducive to the circulation of electroplate liquid when subsequent copper facing, so as to better
Guarantee the quality of hole copper.
Claims (4)
1. a kind of manufacturing method of through-hole characterized by comprising
Step 1: in the two sides coating photoresist I (2) of insulation film (1)；
Step 2: two sides exposure, development are carried out to the insulation film (1) of coating photoresist I (2)；
Step 3: two facet etches being carried out to the insulation film (1) after development, are formed concave groove (3)；
Step 4: to insulation film (1) two sides coating photoresist II (4) after etching；
Step 5: the film of coating photoresist II (4) being exposed, is developed；
Step 6: two facet etches being carried out to the insulation film (1) by re-expose development, form stair-stepping through-hole (5)；
Step 7: photoresist being coated with to two sides and there is the insulation film (1) of stair-stepping through-hole (5) to carry out film process；
Step 8: copper facing being carried out to the insulation film (1) of striping, plating is completed, is formed ladder hole (6).
2. a kind of manufacturing method of through-hole according to claim 1, it is characterised in that: the insulation film (1) is poly-
Acid imide material or epoxy resin material or polyurethane material.
3. a kind of manufacturing method of through-hole according to claim 1, it is characterised in that: the ladder hole (6) is round
Hole or square hole or circular hole add square hole.
4. a kind of manufacturing method of through-hole according to claim 1, it is characterised in that: the rank of the ladder hole (6)
Series is two ranks or multistage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910795486.5A CN110519917B (en) | 2019-08-27 | 2019-08-27 | Method for manufacturing through hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910795486.5A CN110519917B (en) | 2019-08-27 | 2019-08-27 | Method for manufacturing through hole |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110519917A true CN110519917A (en) | 2019-11-29 |
| CN110519917B CN110519917B (en) | 2021-08-17 |
Family
ID=68626131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910795486.5A Active CN110519917B (en) | 2019-08-27 | 2019-08-27 | Method for manufacturing through hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110519917B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111405773A (en) * | 2020-03-19 | 2020-07-10 | 盐城维信电子有限公司 | Circuit board and manufacturing method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3873429A (en) * | 1973-07-09 | 1975-03-25 | Rockwell International Corp | Flush printed circuit apparatus |
| CN202488871U (en) * | 2012-02-14 | 2012-10-10 | 方笑求 | Flexible circuit board |
| CN102946695A (en) * | 2012-10-31 | 2013-02-27 | 华为技术有限公司 | Through hole structure, printed circuit board, and manufacture method of through hole structure |
| CN103352224A (en) * | 2013-07-01 | 2013-10-16 | 广东工业大学 | Double-face etching method for metal product |
| CN107592756A (en) * | 2017-09-27 | 2018-01-16 | 生益电子股份有限公司 | The preparation method of high-density multi-layered PCB a kind of and high-density multi-layered PCB |
| CN208387037U (en) * | 2017-11-21 | 2019-01-15 | 湖南省方正达电子科技有限公司 | A kind of flexible circuit board |
-
2019
- 2019-08-27 CN CN201910795486.5A patent/CN110519917B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3873429A (en) * | 1973-07-09 | 1975-03-25 | Rockwell International Corp | Flush printed circuit apparatus |
| CN202488871U (en) * | 2012-02-14 | 2012-10-10 | 方笑求 | Flexible circuit board |
| CN102946695A (en) * | 2012-10-31 | 2013-02-27 | 华为技术有限公司 | Through hole structure, printed circuit board, and manufacture method of through hole structure |
| CN103352224A (en) * | 2013-07-01 | 2013-10-16 | 广东工业大学 | Double-face etching method for metal product |
| CN107592756A (en) * | 2017-09-27 | 2018-01-16 | 生益电子股份有限公司 | The preparation method of high-density multi-layered PCB a kind of and high-density multi-layered PCB |
| CN208387037U (en) * | 2017-11-21 | 2019-01-15 | 湖南省方正达电子科技有限公司 | A kind of flexible circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111405773A (en) * | 2020-03-19 | 2020-07-10 | 盐城维信电子有限公司 | Circuit board and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110519917B (en) | 2021-08-17 |
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