CN206879181U - A kind of good circuit board of thermal diffusivity - Google Patents
A kind of good circuit board of thermal diffusivity Download PDFInfo
- Publication number
- CN206879181U CN206879181U CN201720403988.5U CN201720403988U CN206879181U CN 206879181 U CN206879181 U CN 206879181U CN 201720403988 U CN201720403988 U CN 201720403988U CN 206879181 U CN206879181 U CN 206879181U
- Authority
- CN
- China
- Prior art keywords
- copper foil
- thickness
- outer thickness
- insulating barrier
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 114
- 239000011889 copper foil Substances 0.000 claims abstract description 90
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 230000004888 barrier function Effects 0.000 claims abstract description 24
- 239000010949 copper Substances 0.000 claims abstract description 19
- 229910052802 copper Inorganic materials 0.000 claims abstract description 19
- 230000002708 enhancing effect Effects 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 3
- 230000005855 radiation Effects 0.000 abstract description 2
- 238000005530 etching Methods 0.000 description 15
- 239000011521 glass Substances 0.000 description 8
- 239000011265 semifinished product Substances 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 230000005611 electricity Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000003513 alkali Substances 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 235000003392 Curcuma domestica Nutrition 0.000 description 1
- 244000008991 Curcuma longa Species 0.000 description 1
- 241000160765 Erebia ligea Species 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 235000003373 curcuma longa Nutrition 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 235000013976 turmeric Nutrition 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a kind of good circuit board of thermal diffusivity, it is related to field of circuit boards, including wiring board and electronic component, the wiring board is divided into three layers, internal substrate is followed successively by from top to bottom, insulating barrier, outer thickness copper foil, the internal substrate is the substrate with copper foil, the copper thickness on internal substrate surface is 171.5 205.7 μm, the copper thickness of outer thickness copper foil layer is 364.4 452.4 μm, thickness of the insulating barrier in the gap of outer thickness copper foil is more than the thickness of insulating barrier remainder, insulating barrier in outer thickness copper foil gap is lug boss, the thickness of the gap of outer thickness copper foil accounts for the 1/3 2/3 of the thickness of whole outer thickness copper foil.The utility model solves the problems, such as the poor radiation of existing line plate.
Description
Technical field
It the utility model is related to field of circuit boards, more particularly to the circuit board that a kind of thermal diffusivity is good.
Background technology
For wiring board, the element on wiring board can all produce certain heat at work, so that wiring board
Temperature rise rapidly, if the heat distributed not in time, equipment will continue heating, in long-term higher temperature
Under the influence of, the effective power of the element on wiring board can reduce, and reliability reduces, and even causes whole component failure to cause whole
Block wiring board is scrapped.For LED encapsulation, the thermal diffusivity of wiring board has directly to LED life-span with performance
Influence, only heat distributes soon, and light decay is just smaller.Therefore, it is very to carry out good radiating treatment for wiring board
Important.During in general electricity is converted into light, the heat that had nearly 70% one-tenth, so many heat only draws by two
Pin export is far from being enough, it is necessary to be radiated by heat sink.The existing heat dissipating method to wiring board be divided into it is active radiating and
Passive-type radiates, and active radiating is exactly the either above or below installation heat abstractor of assist side, and heat abstractor accelerates circuit
The heat of plate distributes；Passive-type radiating is exactly to be improved on the material of assist side in itself, for example selects good heat dispersion performance
Phenolic resin glass cloth base material either glass fabric of epoxy resin base material etc.., generally will actively in actual circuit board structure
Radiating and the mode passively to radiate combine.But the radiating of wiring board is a great problem all the time, existing wiring board
The radiating effect of structure is still bad.
Utility model content
The purpose of this utility model is：Solves the problems, such as the poor radiation of existing line plate, so as to provide a kind of radiating
Good circuit board.
Scheme of the present utility model is as follows：
A kind of good circuit board of thermal diffusivity, including wiring board and electronic component, the wiring board are divided into three layers, from top to bottom
Internal substrate is followed successively by, insulating barrier, outer thickness copper foil, the internal substrate is the substrate with copper foil, internal substrate surface
Copper thickness is 171.5-205.7 μm, and the copper thickness of outer thickness copper foil layer is 364.4-452.4 μm, and insulating barrier is in outer thickness
The thickness of the gap of copper foil is more than the thickness of insulating barrier remainder, and the insulating barrier in outer thickness copper foil gap is convex
The portion of rising, the thickness of the gap of outer thickness copper foil account for the 1/3-2/3 of the thickness of whole outer thickness copper foil.
Further, the outer thickness copper foil is divided into circuit pack and enhancing radiator portion, and circuit pack is for electronics
The circuit of elements conductive, is separated with gap between the enhancing radiator portion and circuit pack, guarantee does not influence leading for circuit pack
Electricity.
Further, through hole is additionally provided with the wiring board, through hole is located at the enhancing radiator portion of outer thickness copper foil.
Preferably, removed in the internal substrate foil section be high pressure resistant, resistance to CAF, 2116 that high heat conduction, glass are thinner
Or 1080 structure epoxy resin board.
Preferably, the insulating barrier is 1080 thinner prepregs of high gel content, high Tg, glass.
Specifically, connected between electronic component and wiring board by scolding tin.
After such scheme, the beneficial effects of the utility model are：
(1) thickness of inner-layer thick copper foil is 171.5-205.7 μm, and the copper thickness of outer thickness copper foil layer is 364.4-
452.4 μm, and the thickness of the copper foil on traditional internal substrate is 135 μm -140 μm, the thickness of the copper foil of thickening, improves and leads
Hot property
(2) when covering solder mask, it will usually solder mask is covered to the gap of outer copper foil and originally filled and led up substantially, this
Thickness of the utility model insulating barrier in the gap of outer thickness copper foil is more than the thickness of insulating barrier remainder, in outer thickness copper
The insulating barrier of paper tinsel gap is lug boss, and the thickness of the gap of outer thickness copper foil accounts for the thickness of whole outer thickness copper foil
1/3-2/3, using such structure, first, when covering solder mask, reduce solder mask thickness and welding resistance silk-screen it is difficult
Degree；Second, heat conductivility being added, in the case where ensure that outer thickness copper foil inoxidizability is good while avoiding outer thickness
Ink on copper foil is too thick so as to influenceing the heat conduction of copper foil；3rd, reduce lateral erosion when outer thickness copper foil etching.
(3) outer thickness copper foil is divided into circuit pack and enhancing radiator portion, and circuit pack is conductive for electronic component
Circuit, compared with traditional circuit board, add enhancing radiator portion, the radiating effect of the radiating effect of copper foil than epoxy resin
It is good, therefore, radiating effect is enhanced, strengthen and gap is separated between radiator portion and circuit pack, guarantee does not influence circuit pack
Conduction；And enhancing radiator portion is additionally provided with through hole, further increases the contact area of copper foil and air, radiating effect is enhanced
Fruit.
Brief description of the drawings
Fig. 1 is that the partial enlargement of wiring board of the present utility model illustrates slice map；
Fig. 2 is the partial enlargement actual slice figure of wiring board of the present utility model；
Fig. 3 is the partial structurtes top view of circuit board of the present utility model；
Fig. 4 is the partial structurtes top view of existing circuit board；
The procedure chart of first time etching of Fig. 5 positions circuit board of the present utility model in manufacturing process；
Marked in figure：1- internal substrates, 2- insulating barriers, 21- lug bosses, the outer thickness copper foils of 3-, 31- circuit packs, 32- increase
Strong radiator portion, 4- through holes.
Embodiment
All features disclosed in this specification, can be with any in addition to mutually exclusive feature and/or step
Mode combines.
The present invention is elaborated below in conjunction with the accompanying drawings.
As shown in figure 1, the circuit board that a kind of thermal diffusivity is good, including wiring board and electronic component, wiring board are divided into three layers, from
Under to being above followed successively by internal substrate 1, insulating barrier 2, outer thickness copper foil 3, the internal substrate 1 is the substrate with copper foil, internal layer
The copper thickness on the surface of substrate 1 is 171.5 μm, and the copper thickness of outer thickness copper foil layer 3 is 411.6 μm, and insulating barrier 2 is in outer thickness
The thickness of the gap of copper foil 3 is more than the thickness of the remainder of insulating barrier 2, the insulating barrier 2 in the outer gap of thickness copper foil 3
The 1/3 of the entirely thickness of outer thickness copper foil 3 is accounted for for the thickness of the gap of the outer thickness copper foil 3 of lug boss 21.It is raised in Fig. 1
Groove on the outer thickness copper foil 3 of the both sides of portion 21 is that lateral erosion leaves when etching for the first time, the gap two of the top of lug boss 21
Groove on the outer thickness copper foil 3 of side is that second of etching leaves and (etching of first time for mentioning herein and etch for second, see
Following specific manufacture craft part of the present utility model).
It is to be led for electronic component that outer thickness copper foil 3, which divides for circuit pack 31 and enhancing radiator portion 32, circuit pack 31,
The circuit of electricity, strengthen and gap is separated between radiator portion 32 and circuit pack 31, ensure not influenceing the conduction of circuit pack 31.
Through hole 4 is additionally provided with wiring board, through hole is located at the enhancing radiator portion 32 of outer thickness copper foil 3, the big rootlet of through hole 4
According to the size sets itself of wiring board.
Foil section is removed in internal substrate 1 as 2116 or 1080 thinner structures of high pressure resistant, resistance to CAF, high heat conduction, glass
Epoxy resin board.
Insulating barrier 2 is 1080 thinner prepregs of high gel content, high Tg, glass.
Connected between electronic component and wiring board by scolding tin.
In the circuit board, electric elements lower section would generally be provided with heat sink, heat sink directly to be contacted with insulating barrier, can also
Outer copper foil on contact insulation layer, radiator is typically provided with below circuit board, accelerates the radiating of circuit board.
To wiring board of the present utility model, its specific preparation method is：
Step 1：Select surface copper thickness for 135 μm of high pressure resistant, resistance to CAF, high heat conduction, glass it is thinner 2116 or
For the epoxy resin board of 1080 structures as internal substrate, select high gel content, high Tg (Tg170), glass thinner 1,080 half are solid
Change piece, selection identical two panels thickness is the copper foil of 364.4-452.4 μm (12oz/ft2) as outer thickness copper foil.
Step 2：Carry out electric plating of whole board to the surface copper foil of internal substrate and thicken copper foil handling to obtain copper thickness be
171.5-205.7 μm of internal substrate, add the surface copper foil after plating as internal substrate thickness copper foil, the internal substrate table of in the market
Copper thickness on face is 135 μm -140 μm, therefore, to expect 171.5 μm of inner-layer thick copper foil, it is necessary to carries out electricity to it
Plate working process；Then line build-out is carried out to internal substrate, the parameter list of internal layer circuit compensation is shown in table 1；Reuse anti-
It is secondary in the coating of internal substrate thickness copper foil surface to lose strong wet film, is then entered using 8 grades of exposure guide rule thick copper foil basic to internal layer
Row exposure-processed, resistance to corrosion is improved, be etched again after completing above step.
Table 1
Step 3：Carry out etching for the first time simultaneously to thickness copper foil outside two panels and obtain outer thickness copper foil A1, outer thickness copper foil
A2；In Fig. 1, the groove of the outer thickness copper foil 3 of the both sides of lug boss 21 is when etching for the first time, what lateral erosion left；Specifically include as
Lower step：
A. acidic etching liquid is configured, the important parameter of acidic etching liquid is：Cu2+Content is 150g/l, acidity 2.6N, proportion
For 1.2.
Cu2+Content is 140g/l, pH value 8.4, CL-Analyze as 4.7M, proportion 1.191.
B. sawing sheet is carried out to thickness copper foil outside two panels identical, bores rivet hole to outer thickness copper foil a1, outer thickness copper foil a2.
C. outer thickness copper foil a1, outer thickness copper foil a2 are riveted together.
D. respectively outer thickness copper foil a1, outer thickness copper foil a2 make L1- and L4- circuit to outer thickness copper foil b1, outside
Thickness copper foil b2, outer thickness copper foil b1, outer thickness copper foil b2 place on line are corresponding.
E. carried out with the external thickness copper foil b1 of the acidic etching liquid obtained in step A, outer thickness copper foil b2 circuit pack
Acid etching obtains outer thickness copper foil c1, outer layer untill thickness copper foil is 205.7 μm per a piece of residual thickness outside two panels
Thick copper foil c2.
F. go rivet to separate outer thickness copper foil c1, outer thickness copper foil c2, form outer thickness copper foil A1, outer thickness copper foil
A2, that is, outer thickness copper foil A1, A2 form one side circuit.
The process of etching is shown in Fig. 5 for the first time.
Step 4：A. brown processing A is carried out to internal substrate.
B. sawing sheet, dehumidifier processing are carried out to prepreg, wherein, the time of dehumidifier processing is 4h-6h.
C. mechanical press is carried out to thickness copper foil, prepreg, internal substrate outside two panels and obtains semi-finished product；Tool during pressing
Body parameter is shown in Table 2.
Table 2
The structure of semi-finished product is followed successively by outer thickness copper foil A1, prepreg, internal substrate, prepreg, outer from top to bottom
Thickness copper foil A2.
Pay attention to, must use to the prepreg after progress dehumidifier processing in step B and immediately.
Then outer-layer circuit compensation is carried out to the surface of the semi-finished product after pressing, the parameter list of outer-layer circuit compensation is table 1
It is shown.
Step 5：Semi-finished product are drilled, heavy copper, plate is electric, and circuit makes, graphic plating, and half is obtained after alkali etching
Finished product A, wherein, the important parameter of the etching solution of alkali etching is:Cu2+Content is 140g/l, pH value 8.4, CL-Analyze and be
4.7M proportion 1.191；Semi-finished product A is as shown in Fig. 2 reservation copper is thick after 411.6 μ m-thick copper foils are etched in pressing
229.727 μm of line layer prepreg has been filled with, free from flaw, the defects of no resin cavity, outside prepreg filling region
Face part, the void area of remaining 181.873 μm of copper thicknesses is solder mask covering part, and the printing of this solder mask belongs to
The working ability of 205.7 μ m-thick copper printed boards, therefore the welding resistance manufacturing technology for solving 411.6 μm of super-thick copper printed boards simultaneously is difficult
Point.
Step 6：Solder mask is covered above semi-finished product A and obtains semi-finished product B.
Step 7：Word, turmeric, profile are carried out successively to semi-finished product B, finally feature detects again, after detection is qualified
To finished product.
The utility model is not limited to above-mentioned specific embodiment, it will be appreciated that one of ordinary skill in the art is without wound
The property made work can makes many modifications and variations according to design of the present utility model.In a word, all technologies in the art
Personnel can be obtained by logical analysis, reasoning, or a limited experiment on the basis of existing technology according to design of the present utility model
The technical scheme arrived, all should be in the protection domain being defined in the patent claims.
Claims (6)
1. a kind of good circuit board of thermal diffusivity, including wiring board and electronic component, it is characterised in that the wiring board is divided into three
Layer, internal substrate (1) is followed successively by from top to bottom, insulating barrier (2), outer thickness copper foil (3), the internal substrate (1) is with copper
The substrate of paper tinsel, the copper thickness on internal substrate (1) surface is 171.5-205.7 μm, and the copper thickness of outer thickness copper foil (3) is
364.4-452.4 μm, thickness of the insulating barrier (2) in the gap of outer thickness copper foil (3) is more than insulating barrier (2) remainder
Thickness, the insulating barrier (2) in outer thickness copper foil (3) gap are lug boss (21), the gap of outer thickness copper foil (3)
Thickness accounts for the 1/3-2/3 of the thickness of whole outer thickness copper foil (3).
A kind of 2. good circuit board of thermal diffusivity according to claim 1, it is characterised in that the outer thickness copper foil (3) point
For circuit pack (31) and enhancing radiator portion (32), circuit pack (31) is the circuit conductive for electronic component, the increasing
It is strong that gap is separated between radiator portion (32) and circuit pack (31), ensure not influenceing the conduction of circuit pack (31).
3. the good circuit board of a kind of thermal diffusivity according to claim 2, it is characterised in that be additionally provided with the wiring board logical
Hole (4), through hole are located at the enhancing radiator portion (32) of outer thickness copper foil (3).
4. the good circuit board of a kind of thermal diffusivity according to claim 1, it is characterised in that removed in the internal substrate (1)
Remove the epoxy resin board that foil section is 2116 or 1080 structures.
5. the good circuit board of a kind of thermal diffusivity according to claim 1, it is characterised in that the insulating barrier (2) is 1080
Prepreg.
6. the good circuit board of a kind of thermal diffusivity according to claim 1, it is characterised in that between electronic component and wiring board
Connected by scolding tin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720403988.5U CN206879181U (en) | 2017-04-17 | 2017-04-17 | A kind of good circuit board of thermal diffusivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720403988.5U CN206879181U (en) | 2017-04-17 | 2017-04-17 | A kind of good circuit board of thermal diffusivity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206879181U true CN206879181U (en) | 2018-01-12 |
Family
ID=61342974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720403988.5U Expired - Fee Related CN206879181U (en) | 2017-04-17 | 2017-04-17 | A kind of good circuit board of thermal diffusivity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206879181U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113163605A (en) * | 2021-04-21 | 2021-07-23 | 深圳市祺利电子有限公司 | Manufacturing method of high-heat-dissipation aluminum-based circuit board and high-heat-dissipation aluminum-based circuit board |
-
2017
- 2017-04-17 CN CN201720403988.5U patent/CN206879181U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113163605A (en) * | 2021-04-21 | 2021-07-23 | 深圳市祺利电子有限公司 | Manufacturing method of high-heat-dissipation aluminum-based circuit board and high-heat-dissipation aluminum-based circuit board |
| CN113163605B (en) * | 2021-04-21 | 2023-07-07 | 深圳市祺利电子有限公司 | Manufacturing method of high-heat-dissipation aluminum-based circuit board and high-heat-dissipation aluminum-based circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180112 |