CN114828387A - Production process for improving thermoelectric separation heat conduction efficiency of metal circuit board by etching method - Google Patents
Production process for improving thermoelectric separation heat conduction efficiency of metal circuit board by etching method Download PDFInfo
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- CN114828387A CN114828387A CN202210401843.7A CN202210401843A CN114828387A CN 114828387 A CN114828387 A CN 114828387A CN 202210401843 A CN202210401843 A CN 202210401843A CN 114828387 A CN114828387 A CN 114828387A
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- copper
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- 238000005530 etching Methods 0.000 title claims abstract description 66
- 238000000034 method Methods 0.000 title claims abstract description 44
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 38
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 35
- 239000002184 metal Substances 0.000 title claims abstract description 35
- 238000000926 separation method Methods 0.000 title claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 63
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 238000010586 diagram Methods 0.000 claims abstract description 35
- 229910052802 copper Inorganic materials 0.000 claims abstract description 33
- 239000010949 copper Substances 0.000 claims abstract description 33
- 239000011889 copper foil Substances 0.000 claims abstract description 30
- 238000004140 cleaning Methods 0.000 claims abstract description 14
- 238000003825 pressing Methods 0.000 claims abstract description 10
- 238000004080 punching Methods 0.000 claims abstract description 9
- 229910000679 solder Inorganic materials 0.000 claims abstract description 8
- 238000005553 drilling Methods 0.000 claims abstract description 5
- 230000009286 beneficial effect Effects 0.000 claims description 6
- 238000003698 laser cutting Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000003814 drug Substances 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 34
- 239000000463 material Substances 0.000 abstract description 8
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 69
- 238000009713 electroplating Methods 0.000 description 13
- 238000004544 sputter deposition Methods 0.000 description 12
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000002313 adhesive film Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000013502 data validation Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention belongs to the technical field of production of thermoelectric separation heat conduction efficiency of a metal circuit board, in particular to a production process for improving the thermoelectric separation heat conduction efficiency of the metal circuit board by an etching method, aiming at the problem that the existing copper-based circuit board is a single-sided designed circuit, and the circuit layer, the insulating layer and the copper-based material heat dissipation layer can not complete good heat conduction to a heating power element, the following scheme is proposed, and the production process comprises the following process steps: s1: making a circuit diagram; s2: pressing RE copper foil and the insulating layer; s3: etching a circuit; s4: punching an insulating layer; s5: etching the copper substrate; copper substrate etching includes cleaning, pattern-sensitive ink, exposure, development, etching and stripping; s6: pressing the circuit layer, the insulating layer and the copper substrate; s7: manufacturing a solder mask layer and a character layer; s8: and (6) drilling and forming. The invention still keeps the circuit layer, the insulating layer and the copper substrate heat dissipation layer, and changes the planar three-layer structure into a three-dimensional three-layer nested structure by modifying the drawing design section and the manufacturing process section.
Description
Technical Field
The invention relates to the technical field of production of thermoelectric separation heat conduction efficiency of a metal circuit board, in particular to a production process for improving the thermoelectric separation heat conduction efficiency of the metal circuit board by an etching method.
Background
Detailed description of the heat conduction principle and the heat conduction capability of the original copper-based circuit board (refer to fig. 12): the heat-generating electronic component needs to conduct heat out, so that the service life of the component can be prolonged, and the heat conduction to the circuit board is required. As shown in the figure, the heat conduction path is a set of heat conduction path in which a heating type power element generates heat, the heat is conducted to the circuit layer, the circuit layer is conducted to the insulating layer, the insulating layer is conducted to the heat dissipation layer, the heat dissipation layer is combined with the radiator, and finally heat dissipation (cooling) is completed.
The thermal conductivity of copper is about 400W/(M × K), and the thermal conductivity of the metal substrate insulating layer is only about 5W/(M × K). Therefore, the thermal conductivity of such copper-based circuit boards is only about 5W/(M × K). Good heat conduction to the heating power element cannot be accomplished.
The existing copper-based circuit board is a single-sided design circuit, and the circuit layer, the insulating layer and the copper-based material heat dissipation layer cannot complete good heat conduction to a heating power element.
Disclosure of Invention
The invention aims to solve the defect that the existing copper-based circuit board is a single-sided designed circuit, and the circuit layer, the insulating layer and the copper-based material heat dissipation layer cannot finish good heat conduction to a heating power element, and provides a production process for improving the thermoelectric separation heat conduction efficiency of a metal circuit board by an etching method.
In order to achieve the purpose, the invention adopts the following technical scheme:
the production process for improving the thermoelectric separation heat conduction efficiency of the metal circuit board by the etching method comprises the following process steps:
s1: making a circuit diagram;
s2: pressing the copper foil and the insulating layer;
s3: etching a circuit;
s4: punching an insulating layer;
s5: etching the copper substrate; copper substrate etching includes cleaning, pattern-sensitive ink, exposure, development, etching and stripping;
s6: pressing the circuit layer, the insulating layer and the copper substrate;
s7: manufacturing a solder mask layer and a character layer;
s8: and (6) drilling and forming.
Preferably, in S1, in the designing and manufacturing process, the copper foil is left only during etching of the circuit having an overcurrent, and the heat-dissipating pad is etched away during designing of the circuit pattern and the film pattern and manufacturing of the film pattern or the screen pattern.
Preferably, in S4, holes are formed in the insulating layer based on the position of the heat dissipation pad as a coordinate and the size of the pad at the coordinate point as a standard. The manufacturing quantity is small, the laser cutting process can be used for manufacturing, and the punching process is used for manufacturing the large-quantity product. The purpose is to make corresponding hole sites by taking the position and the size of the heat dissipation plate as standards.
Preferably, in S5, the cleaning is metal substrate cleaning, and the metal plate to be etched is degreased and cleaned. The purpose is to proceed with the next step of applying the photosensitive ink. If the metal plate contains oil or stains, the adhesion between the ink and the metal substrate is poor after the metal plate is coated with the photosensitive ink and exposed, and the exposed ink is easily washed and shed by a developing solution in the developing process, so that the final etching effect is influenced.
Preferably, in S5, the operation of the image sensing ink is: firstly, cleaning a metal substrate, and then coating photosensitive ink; secondly, pre-baking is carried out, so that the ink is cured to be beneficial to the next exposure.
In S5, the engraved film is preferably attached to the photosensitive ink surface (with accurate alignment), and is placed in an exposure machine for exposure. The position to be protected is exposed, and the position to be etched is shielded from light and is not exposed.
Preferably, in S5, the exposed product is sent to a developing machine, and the developer washes away the unexposed area, leaving the exposed area as an etching protection area (resist layer).
Preferably, in S5, the etching device is used to etch the unprotected area with etching solution, the metal substrate is etched by the etching process to protect the heat dissipation pad from being etched, the etching is performed at the position except the heat dissipation pad, and the height of the etched area is the remaining height (a value) of the heat dissipation pad.
The value of a = copper foil thickness + PP thickness;
the copper foil means: a circuit layer copper foil, wherein the thickness of the 1OZ copper foil =35um copper foil;
PP means: an insulating layer PP layer and an adhesive film, wherein 1MIL =25.4 um;
if the etching difficulty is reduced, the thickness of the value A is reduced, and the copper foil with the thickness of 0.5OZ is selected, so that the requirement of the copper foil thickness can be met by electroplating copper again finally even if the copper foil thickness cannot reach the circuit requirement. The insulating layer can be 0.5MIL of adhesive film. In order to reduce side corrosion during etching, the etch height value is therefore minimized.
Preferably, in S5, the stripping operation is: after the etching is completed, the ink (the etching resist) on the metal plate is washed away with a stripping solution.
Preferably, in S6, the finished product with the punched insulating layer and the finished product with the etched insulating layer are pressed together.
Compared with the prior art, the invention has the advantages that:
through the design principle, the heat conductivity of the whole circuit board is improved to about 230W/(M) from about 5W/(M) K, so that the heat conductivity is improved by about 40 times.
The invention still keeps the circuit layer, the insulating layer and the copper substrate heat dissipation layer, and changes the planar three-layer structure into a three-dimensional three-layer nested structure by modifying the drawing design section and the manufacturing process section.
Drawings
FIG. 1 is a schematic diagram of a manufacturing process according to the present invention;
FIG. 2 is a conventional circuit diagram for manufacturing the present invention;
FIG. 3 is a view showing the copper foils remaining during etching in accordance with the present invention;
FIG. 4 is a diagram of the present invention for perforating an insulating layer;
FIG. 5 is a flow chart of metal etching proposed by the present invention;
FIG. 6 is an etching diagram according to the present invention;
FIG. 7 is a drawing of the release film proposed by the present invention;
FIG. 8 is a diagram illustrating a circuit layer, an insulating layer and an aluminum substrate according to the present invention;
FIG. 9 is a diagram of the present invention for perforating an insulating layer;
FIG. 10 is a diagram of electroplating, sputtering or sputtering + electroplating according to a second embodiment of the present invention;
FIG. 11 is a diagram illustrating the completion of electroplating, sputtering or sputtering + electroplating according to the second embodiment of the present invention;
FIG. 12 is a detailed illustration of the thermal conductivity principle and the thermal conductivity capability of a conventional copper-based circuit board;
fig. 13 is a detailed description diagram of the heat conduction principle and the heat conduction capability proposed in the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Example one
The production process for improving the thermoelectric separation heat conduction efficiency of the metal circuit board by the etching method comprises the following process steps:
referring to fig. 1, S1: making a circuit diagram; when an engineer makes a circuit diagram design, one horizontal plane is used as a layer of circuit design, and only one layer of circuit design is made for a single-layer metal substrate; when the circuit layer is designed, the heat dissipation bonding pad is not designed in a film file of the circuit layer, the heat dissipation bonding pad is designed on a copper substrate, namely the heat dissipation layer is designed, in the design file and the manufacturing process, only the overcurrent circuit is etched, the copper foils are reserved in etching, a circuit diagram and a film diagram are designed, and the heat dissipation bonding pad is etched when the film diagram or a silk screen diagram is manufactured;
referring to fig. 2, the conventional design is: through design files and manufacturing processes, all over-current circuits and heat dissipation pads are kept in etching;
referring to fig. 3, in the design document and the manufacturing process, only the over-current circuits are etched to leave the copper foils;
s2: pressing the copper foil and the insulating layer; the copper foil and the insulating layer are laminated, and the stage is consistent with the traditional process, so that excessive description is not provided.
S3: etching a circuit; it should be noted that when making a film diagram or a silk screen diagram, the heat dissipation pads are etched away, and reference is made to the technical requirement points in the "making a circuit diagram". The remaining processes are consistent with conventional circuit etching and will not be described in detail.
Referring to fig. 4, S4: punching an insulating layer; and taking the position of the heat dissipation pad as a coordinate, and taking the size of the pad on the coordinate point as a standard to open a hole on the insulating layer. The manufacturing quantity is small, the laser cutting process can be used for manufacturing, and the punching process is used for manufacturing the large-quantity product. The purpose is to make corresponding hole sites by taking the position and the size of the heat dissipation plate as standards.
S5: etching the copper substrate; copper substrate etching includes cleaning, pattern-sensitive ink, exposure, development, etching and stripping;
s6: pressing the circuit layer, the insulating layer and the copper substrate;
s7: manufacturing a solder mask layer and a character layer; this stage is consistent with the conventional process and will not be described in great detail.
Referring to fig. 8, S8: drilling and forming, which are consistent with the traditional process, are not described too much.
Referring to fig. 5, in this embodiment, in S5, the cleaning is metal substrate cleaning, and the metal plate material to be etched is degreased and cleaned. The purpose is to proceed with the next step of applying the photosensitive ink. If the metal plate contains oil or stains, the adhesion between the ink and the metal substrate is poor after the metal plate is coated with the photosensitive ink and exposed, and the exposed ink is easily washed and shed by a developing solution in the developing process, so that the final etching effect is influenced.
In this embodiment, in S5, the operation of the image sensing ink is: firstly, cleaning a metal substrate, and then coating photosensitive ink; secondly, pre-baking is carried out, so that the ink is cured to be beneficial to the next exposure.
In this embodiment, in S5, the engraved film is attached to the photosensitive ink surface (with accurate alignment), and is placed in an exposure machine for exposure. The position to be protected is exposed, and the position to be etched is shielded from light and is not exposed.
In this embodiment, in S5, the exposed product is sent to a developing machine, and the developer washes away the unexposed area, leaving the exposed area as an etching protection area (resist layer).
Referring to fig. 6, in this embodiment, in S5, etching is performed by using an etching apparatus, an unprotected area is etched by using an etching solution, a metal substrate is etched by an etching process, a heat dissipation pad is protected from being etched, etching is performed at a place other than the heat dissipation pad, and the etched height is a height value (a value) of the heat dissipation pad.
The value of a = copper foil thickness + PP thickness;
the copper foil means: a circuit layer copper foil, 1OZ copper foil =35um copper foil thickness;
PP means: an insulating layer PP layer and an adhesive film, wherein 1MIL =25.4 um;
if the etching difficulty is reduced, the thickness of the value A is reduced, and the copper foil with the thickness of 0.5OZ is selected, so that the requirement of the copper foil thickness can be met by electroplating copper again finally even if the copper foil thickness cannot reach the circuit requirement. The insulating layer can be 0.5MIL of adhesive film. In order to reduce side erosion during etching, the etch height is therefore minimized.
Referring to fig. 7, in this embodiment, in S5, the stripping operation is: after the etching is completed, the ink (the etching resist) on the metal plate is washed away with a stripping solution.
Referring to fig. 9, in this embodiment, in S6, the finished product with the holes punched in the insulating layer and the finished product with the holes etched are pressed together.
Example two
Referring to fig. 1, S1: manufacturing a circuit diagram, an insulating layer PP diagram, an aluminum substrate three-dimensional diagram and a film diagram; when an engineer makes a circuit diagram design, one horizontal plane is used as a layer of circuit design, and only one layer of circuit design is made for a single-layer metal substrate; when the circuit layer is designed, the heat dissipation bonding pad is not designed in a film file of the circuit layer, the heat dissipation bonding pad is designed on a copper substrate, namely the heat dissipation layer is designed, in the design file and the manufacturing process, only the overcurrent circuit is etched, the copper foils are reserved in etching, a circuit diagram and a film diagram are designed, and the heat dissipation bonding pad is etched when the film diagram or a silk screen diagram is manufactured;
referring to fig. 2, the conventional design is: through design files and manufacturing processes, all over-current circuits and heat dissipation pads are kept in etching;
referring to fig. 3, in the design document and the manufacturing process, only the over-current circuits are etched to leave the copper foils;
s2: pressing the copper foil and the insulating layer; the copper foil and the insulating layer are laminated, and the stage is consistent with the traditional process, so that excessive description is not provided.
S3: etching a circuit; it should be noted that when making a film diagram or a silk screen diagram, the heat dissipation pads are etched away, and reference is made to the technical requirement points in the "making a circuit diagram". The remaining processes are consistent with conventional circuit etching and will not be described in detail.
Referring to fig. 4, S4: punching an insulating layer; and taking the position of the heat dissipation pad as a coordinate, and taking the size of the pad on the coordinate point as a standard to open a hole on the insulating layer. The manufacturing quantity is small, the laser cutting process can be used for manufacturing, and the punching process is used for manufacturing the large-quantity product. The purpose is to make corresponding hole sites by taking the position and the size of the heat dissipation plate as standards.
S5: etching the copper substrate; copper substrate etching includes cleaning, pattern-sensitive ink, exposure, development, etching and stripping;
s6: pressing the circuit layer, the insulating layer and the copper substrate;
reference is made to fig. 10-11; s7: electroplating, sputtering or sputtering + electroplating; a material having good soldering property, for example, a metal material such as gold, silver, copper, or the like is plated or sputtered. Selecting a material with a melting point above 500 ℃; a tin-philic type of material is chosen. All the purposes are to facilitate the good soldering of the components and the circuit board by using the solder paste.
According to the requirements, the electroplating process, the sputtering process or the process of sputtering once and then electroplating once is adopted for selection. The ultimate goal is to have a strong adhesive bond of the weldable metal material with aluminum; the solder paste is beneficial to welding in the future; is beneficial to heat dissipation.
The data validation results are: the sputtering process is firstly adopted for carrying out the first sputtering, and then the electroplating is carried out for the first time, so that the effect is optimal.
S8: manufacturing a solder mask layer and a character layer; this stage is consistent with the conventional process and will not be described in great detail.
Referring to fig. 8, S9: drilling and forming, which are consistent with the traditional process, are not described too much.
In this embodiment, the difference between the second embodiment and the first embodiment is: in the second embodiment, the steps of electroplating, sputtering or sputtering plus electroplating are added, the copper substrate is replaced by an aluminum substrate, and a weldable metal material is combined with the strong adhesive force of aluminum; the solder paste is beneficial to welding in the future; the heat dissipation is facilitated; all structures in this application can carry out the selection of material and length according to actual use condition, and the attached drawing is schematic structure chart, and specific actual dimensions can make appropriate adjustment.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (10)
1. The production process for improving the thermoelectric separation heat conduction efficiency of the metal circuit board by the etching method is characterized by comprising the following process steps:
s1: making a circuit diagram;
s2: pressing the copper foil and the insulating layer;
s3: etching a circuit;
s4: punching an insulating layer;
s5: etching the copper substrate; copper substrate etching includes cleaning, pattern-sensitive ink, exposure, development, etching and stripping;
s6: pressing the circuit layer, the insulating layer and the copper substrate;
s7: manufacturing a solder mask layer and a character layer;
s8: and (6) drilling and forming.
2. The process of claim 1, wherein in step S1, only the circuit of overcurrent is designed and fabricated, and the copper foils are remained during etching to design the circuit diagram and film diagram.
3. The process of claim 1, wherein in step S4, holes are formed in the insulating layer based on the size of the pads at the coordinate point and the position of the heat dissipating pads is used as the coordinate point, the number of the holes can be reduced by laser cutting, and the number of the holes can be increased by punching.
4. The process of claim 1, wherein in step S5, the cleaning is metal substrate cleaning, and the metal plate to be etched is degreased and cleaned.
5. The process of claim 1, wherein in step S5, the pattern photosensitive ink is prepared by: firstly, cleaning a metal substrate, and then coating photosensitive ink; secondly, pre-baking is carried out, so that the ink is cured to be beneficial to the next exposure.
6. The process of claim 1, wherein in step S5, the engraved film is attached to the surface of the photosensitive ink, and the film is exposed in an exposure machine to expose the position to be protected, and the position to be etched is shielded from light and is not exposed.
7. The process of claim 1, wherein in step S5, the exposed product is sent to a developing machine, and the developer is used to wash away the unexposed area, leaving the exposed area as the etching protection area.
8. The process of claim 1, wherein in step S5, the etching equipment is used to etch the unprotected area with the etching solution, the metal substrate is etched by the etching process, the heat-dissipating pad is protected from etching, the area other than the heat-dissipating pad is etched, and the height of the etched area is the remaining height of the heat-dissipating pad.
9. The process of claim 1, wherein in step S5, the stripping operation is: after etching, the ink on the metal plate is washed away by using stripping liquid medicine.
10. The process of claim 1, wherein in step S6, the finished product with holes on the insulating layer and the finished product with holes on the insulating layer are pressed together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210401843.7A CN114828387A (en) | 2022-04-18 | 2022-04-18 | Production process for improving thermoelectric separation heat conduction efficiency of metal circuit board by etching method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210401843.7A CN114828387A (en) | 2022-04-18 | 2022-04-18 | Production process for improving thermoelectric separation heat conduction efficiency of metal circuit board by etching method |
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| CN101888740A (en) * | 2010-06-02 | 2010-11-17 | 苏州科医世凯半导体技术有限责任公司 | Convex metal printed circuit board and manufacturing method thereof |
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| CN108322993A (en) * | 2017-12-31 | 2018-07-24 | 长沙牧泰莱电路技术有限公司 | A kind of the pcb board part and its processing method of thermoelectricity separation |
| CN112512200A (en) * | 2020-11-11 | 2021-03-16 | 湖南好易佳电路板有限公司 | Novel thermoelectric separation PCB and processing method thereof |
| CN114269068A (en) * | 2021-11-29 | 2022-04-01 | 珠海和进兆丰电子科技有限公司 | Method for manufacturing thermoelectric separation copper substrate |
-
2022
- 2022-04-18 CN CN202210401843.7A patent/CN114828387A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101888740A (en) * | 2010-06-02 | 2010-11-17 | 苏州科医世凯半导体技术有限责任公司 | Convex metal printed circuit board and manufacturing method thereof |
| CN107278030A (en) * | 2017-06-26 | 2017-10-20 | 胜宏科技（惠州）股份有限公司 | The preparation method that a kind of thermoelectricity separates LED board |
| CN107645839A (en) * | 2017-10-23 | 2018-01-30 | 广东冠锋科技股份有限公司 | A kind of preparation method of thermoelectricity separate circuit boards |
| CN108322993A (en) * | 2017-12-31 | 2018-07-24 | 长沙牧泰莱电路技术有限公司 | A kind of the pcb board part and its processing method of thermoelectricity separation |
| CN112512200A (en) * | 2020-11-11 | 2021-03-16 | 湖南好易佳电路板有限公司 | Novel thermoelectric separation PCB and processing method thereof |
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