CN202393078U - Novel heat radiation assembly of semiconductor refrigeration chip of vehicle-mounted refrigerator - Google Patents
Novel heat radiation assembly of semiconductor refrigeration chip of vehicle-mounted refrigerator Download PDFInfo
- Publication number
- CN202393078U CN202393078U CN2011204581015U CN201120458101U CN202393078U CN 202393078 U CN202393078 U CN 202393078U CN 2011204581015 U CN2011204581015 U CN 2011204581015U CN 201120458101 U CN201120458101 U CN 201120458101U CN 202393078 U CN202393078 U CN 202393078U
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- semiconductor refrigeration
- refrigeration chip
- temperature
- uniforming plate
- heat
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Abstract
The utility model discloses a novel heat radiation assembly of a semiconductor refrigeration chip of a vehicle-mounted refrigerator. The novel heat radiation assembly comprises a container, a semiconductor refrigeration chip, a first vapor chamber, a second vapor chamber and a cooling fin. According to the novel heat radiation assembly of a semiconductor refrigeration chip of the vehicle-mounted refrigerator, the vapor chambers are respectively arranged on the hot end and the cold end of the semiconductor refrigeration chip, the vapor chamber on the hot end can rapidly spread heat from the semiconductor refrigeration chip of a refrigerator, so that the heat is uniformly spread and transmitted to the surface of the cooling fin; the vapor chamber on the cold end is used for increasing the contact area between the semiconductor refrigeration chip and a container to be cooled, thus the temperature of the inner surface of the refrigerator container is more uniformly distributed, and is controlled more accurately; and the heat exchange quantity of the cold end can be increased, and energy can be effectively saved.
Description
Technical field
The utility model relates to refrigerator radiating subassembly field, particularly relates to a kind of intelligent refrigerator control chip radiating subassembly.
Background technology
Be accompanied by rapid development of automobile industry, people to the pursuit of automobile consumption also in continuous lifting, wherein have a lot of consumers to the demand of car refrigerator with use also increasingly extensive.
Mostly present car refrigerator on the market is the semiconductor car refrigerator, and it is to lean on the semiconductor refrigeration chip refrigeration, and semiconductor refrigeration chip comprises two potsherds; The semi-conducting material (bismuth telluride) that N type and P type are arranged wherein; This semiconductor element is to link with the series connection form to form on circuit, and n type material has unnecessary electronics, and subzero temperature difference electromotive force is arranged; The P-type material electron deficiency has positive thermoelectric force; After in this circuit, connecting DC current, when electronics flow to P model material from the N type, the upper end temperature descended and heat absorption, becomes cold junction; Opposite lower end flows to the joint release heat of N type element by P type element, becomes the hot junction.The radiating condition in semiconductor refrigeration chip hot junction is its performance of restriction and the key in service life.
The mode of fin heat radiation is adopted in traditional refrigerator semiconductor refrigeration chip heat radiation, is about to directly fixing applying the in hot junction of fin and refrigerating chip.
When the refrigerator semiconductor refrigeration chip is worked; The heat that the cold junction absorption refrigerator semiconductor refrigeration chip work of refrigerating chip produces is delivered to the hot junction of refrigerating chip fast; Hot junction at refrigerating chip dissipates through the heat that radiating modes such as forced convertion or free convection transmit the hot junction; With the ability of the low temperature heat absorption of the cold junction that keeps refrigerating chip, thereby reach the container of refrigerator cooling purpose.
Because the refrigerator semiconductor refrigeration chip is less with respect to the area of fin; And mostly the traditional heat-dissipating sheet is the aluminium heat sink material, when the hot junction heat when fin transmits, can form bigger thermograde on radiator heat-dissipation surface; Promptly near more apart from thermal source; Its heat and temperature superelevation, far away more apart from thermal source, its heat and temperature are low more.Because spreader surface temperature and heat distribution is inhomogeneous, refrigerator semiconductor refrigeration chip refrigerating efficiency is reduced, significantly reduced the service life of automobile refrigerator semiconductor refrigeration chip.
The utility model content
The technical problem that the utility model mainly solves provides a kind of heat sinking assembly of car refrigerator semiconductor refrigeration chip, can effectively improve radiating efficiency.
For solving the problems of the technologies described above; The technical scheme that the utility model adopts is: the heat sinking assembly that a kind of car refrigerator semiconductor refrigeration chip is provided; Comprise: container, semiconductor refrigeration chip, first temperature-uniforming plate, second temperature-uniforming plate and fin; The one side of said first temperature-uniforming plate and the outer surface of said container are close to fixing; The another side of first temperature-uniforming plate and the cold junction of said semiconductor refrigeration chip are close to fixing, and the one side of the hot junction of said semiconductor refrigeration chip and second temperature-uniforming plate is close to fixing, and the another side of said second temperature-uniforming plate and fin are close to fixing.
In preferred embodiment of the utility model, the cold junction of said semiconductor refrigeration chip is close to fixing through heat conductive silica gel and said first temperature-uniforming plate.
In preferred embodiment of the utility model, the hot junction of said semiconductor refrigeration chip is close to fixing through the one side of the heat conductive silica gel and second temperature-uniforming plate.
In preferred embodiment of the utility model, said second temperature-uniforming plate and fin are fixing through welding.
In preferred embodiment of the utility model, said second temperature-uniforming plate and fin carry out fixing and locking through retaining element.
The beneficial effect of the utility model is: the heat sinking assembly of the utility model car refrigerator semiconductor refrigeration chip; Hot junction and cold junction at semiconductor refrigeration chip use temperature-uniforming plate respectively; The temperature-uniforming plate in hot junction can spread apart the heat that the refrigerator semiconductor refrigeration chip transmits rapidly, makes heat diffusion uniformly be delivered to the surface of fin; The temperature-uniforming plate of cold junction increases refrigerating chip and wants the contact area of cooled containers, thereby makes the Temperature Distribution of container of refrigerator inner surface more even, thereby makes temperature control more accurate, can increase the heat exchange amount of cold junction simultaneously, effectively energy savings.
Description of drawings
Fig. 1 is the perspective view of heat sinking assembly one preferred embodiment of the utility model car refrigerator semiconductor refrigeration chip;
Fig. 2 is that the master of the heat sinking assembly of car refrigerator semiconductor refrigeration chip shown in Figure 1 looks sketch map;
The mark of each parts is following in the accompanying drawing: 1 is container, and 2 is first temperature-uniforming plate, and 3 is semiconductor refrigeration chip, and 4 is second temperature-uniforming plate, and 5 is fin.
The specific embodiment
Below in conjunction with accompanying drawing the preferred embodiment of the utility model is set forth in detail, thereby the protection domain of the utility model is made more explicit defining so that advantage of the utility model and characteristic can be easier to it will be appreciated by those skilled in the art that.
See also Fig. 1 and Fig. 2, the utility model embodiment comprises:
A kind of heat sinking assembly of car refrigerator semiconductor refrigeration chip; Comprise: container 1, first temperature-uniforming plate 2, semiconductor refrigeration chip 3, second temperature-uniforming plate 4 and fin 5; The outer surface of the one side of first temperature-uniforming plate 2 and container 1 is close to fixing; The cold junction of the another side of first temperature-uniforming plate 2 and semiconductor refrigeration chip 3 is close to fixing, and the one side of the hot junction of semiconductor refrigeration chip 3 and second temperature-uniforming plate 4 is close to fixing, and the another side of second temperature-uniforming plate 4 and fin 5 are close to fixing.
The installation process of the heat sinking assembly of the utility model car refrigerator semiconductor refrigeration chip is following: earlier with fin through soldering welding or sealed being fastened on second temperature-uniforming plate, and with first temperature-uniforming plate and container of refrigerator is firm fits together; After semiconductor refrigeration chip is up and down smeared heat-conducting silicone grease in the potsherd surface, afterwards the refrigerator semiconductor refrigeration chip is clung to fin welding or second temperature-uniforming plate surface that is locked together in; Refrigerator semiconductor refrigeration chip cold junction is close to first temperature-uniforming plate surface that partly tightens together with container of refrigerator; Through mode such as sealed, fastening each parts is fit together closely at last, pressure remains on (10～15kg/cm
2).
The heat sinking assembly of the utility model car refrigerator semiconductor refrigeration chip has following advantage:
1. the single ﹑ of big (utilizing latent heat) ﹑ volume in light weight little (hollow container) ﹑ knot of (steam flow rate is fast) ﹑ heat output structure letter can be in characteristics such as agravic runnings after the match, so the use temperature-uniforming plate can satisfy the thermal diffusion and the heat conducting demand of refrigerator semiconductor refrigeration chip fast because temperature-uniforming plate has uniformity of temperature profile (thermal diffusion due to steam is mobile) the little ﹑ thermal response of ﹑ thermal resistance.The heat that can as early as possible chip be produced is taken away, and has reduced traditional structure longer time thermal balance process, is in the higher temperature state for a long time thereby reduce euthermic chip, thereby promotes chip reliability and service life.
2. use temperature-uniforming plate can the heat that the refrigerator semiconductor refrigeration chip transmits be spread apart rapidly in the hot junction, make heat diffusion uniformly be delivered to the surface of fin, thus reduce refrigerator semiconductor refrigeration chip heat source region with apart from the thermograde of chip than the territory, far field.Thereby promoted the heat exchanger effectiveness of fin greatly.
3. use temperature-uniforming plate can utilize the function of the equal gentle heat of transformation transmission of temperature-uniforming plate at cold junction, increase refrigerating chip indirectly and want the contact area of cooled containers, thereby make the Temperature Distribution of container of refrigerator inner surface more even, thereby make temperature control more accurate.Can increase simultaneously the heat exchange amount of cold junction, effectively energy savings.
4. use temperature-uniforming plate can make cold junction (low-temperature end) remain on a stable low-temperature condition.Thereby refrigerator semiconductor refrigeration chip refrigerating efficiency significantly promotes, and the service life that can effectively prolong the refrigerator semiconductor refrigeration chip simultaneously is big.
The above is merely the embodiment of the utility model; Be not thus the restriction the utility model claim; Every equivalent structure or equivalent flow process conversion that utilizes the utility model specification and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the utility model.
Claims (5)
1. the heat sinking assembly of a car refrigerator semiconductor refrigeration chip; It is characterized in that; Comprise: container, semiconductor refrigeration chip, first temperature-uniforming plate, second temperature-uniforming plate and fin; The one side of said first temperature-uniforming plate and the outer surface of said container are close to fixing; The another side of first temperature-uniforming plate and the cold junction of said semiconductor refrigeration chip are close to fixing, and the one side of the hot junction of said semiconductor refrigeration chip and second temperature-uniforming plate is close to fixing, and the another side of said second temperature-uniforming plate and fin are close to fixing.
2. the heat sinking assembly of car refrigerator semiconductor refrigeration chip according to claim 1 is characterized in that, the cold junction of said semiconductor refrigeration chip is close to fixing through heat conductive silica gel and said first temperature-uniforming plate.
3. the heat sinking assembly of car refrigerator semiconductor refrigeration chip according to claim 1 is characterized in that, the hot junction of said semiconductor refrigeration chip is close to fixing through the one side of the heat conductive silica gel and second temperature-uniforming plate.
4. the heat sinking assembly of car refrigerator semiconductor refrigeration chip according to claim 1 is characterized in that, said second temperature-uniforming plate and fin are fixing through welding.
5. the heat sinking assembly of car refrigerator semiconductor refrigeration chip according to claim 1 is characterized in that, said second temperature-uniforming plate and fin carry out fixing and locking through retaining element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204581015U CN202393078U (en) | 2011-11-18 | 2011-11-18 | Novel heat radiation assembly of semiconductor refrigeration chip of vehicle-mounted refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204581015U CN202393078U (en) | 2011-11-18 | 2011-11-18 | Novel heat radiation assembly of semiconductor refrigeration chip of vehicle-mounted refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202393078U true CN202393078U (en) | 2012-08-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204581015U Expired - Fee Related CN202393078U (en) | 2011-11-18 | 2011-11-18 | Novel heat radiation assembly of semiconductor refrigeration chip of vehicle-mounted refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202393078U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102401507A (en) * | 2011-11-18 | 2012-04-04 | 苏州雪林电器科技有限公司 | Novel radiating component for semiconductor refrigeration chip of vehicle-mounted refrigerator |
| CN104244581A (en) * | 2013-06-06 | 2014-12-24 | 致茂电子(苏州)有限公司 | High heat conduction apparatus for multilayer circuit |
-
2011
- 2011-11-18 CN CN2011204581015U patent/CN202393078U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102401507A (en) * | 2011-11-18 | 2012-04-04 | 苏州雪林电器科技有限公司 | Novel radiating component for semiconductor refrigeration chip of vehicle-mounted refrigerator |
| CN104244581A (en) * | 2013-06-06 | 2014-12-24 | 致茂电子(苏州)有限公司 | High heat conduction apparatus for multilayer circuit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120822 Termination date: 20141118 |
|
| EXPY | Termination of patent right or utility model |