CN102445020A - Vehicle-mounted refrigerator semiconductor refrigerating chip heat dissipation assembly - Google Patents
Vehicle-mounted refrigerator semiconductor refrigerating chip heat dissipation assembly Download PDFInfo
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- CN102445020A CN102445020A CN2011103662274A CN201110366227A CN102445020A CN 102445020 A CN102445020 A CN 102445020A CN 2011103662274 A CN2011103662274 A CN 2011103662274A CN 201110366227 A CN201110366227 A CN 201110366227A CN 102445020 A CN102445020 A CN 102445020A
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- semiconductor refrigeration
- semiconductor refrigerating
- refrigeration chip
- refrigerating chip
- temperature
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Abstract
The invention discloses a vehicle-mounted refrigerator semiconductor refrigerating chip heat dissipation assembly, which comprises a container, a semiconductor refrigerating chip, a uniform temperature plate and cooling fins. The cold side of the semiconductor refrigerating chip is closely fixed with the outer surface of the container, the hot side of the semiconductor refrigerating chip is closely fixed with one face of the uniform temperature plate, and the other face of the uniform temperature plate is closely fixed with the cooling fins. The vehicle-mounted refrigerator semiconductor refrigerating chip heat dissipation assembly can reduce temperature gradient between a heat source area of the refrigerator semiconductor refrigerating chip and an area far away from the chip, greatly promote heat exchange efficiency of the cooling fins, enables the refrigeration efficiency of the refrigerator semiconductor refrigerating chip to be greatly improved, and effectively prolong service life of the vehicle refrigerator semiconductor refrigerating chip simultaneously.
Description
Technical field
The present invention relates to refrigerator radiating subassembly field, particularly relate to a kind of intelligent refrigerator control chip radiating subassembly.
Background technology
Be accompanied by rapid development of automobile industry, people to the pursuit of automobile consumption also in continuous lifting, wherein have a lot of consumers to the demand of car refrigerator with use also increasingly extensive.
Mostly present car refrigerator on the market is the semiconductor car refrigerator, and it is to lean on the semiconductor refrigeration chip refrigeration, and semiconductor refrigeration chip comprises two potsherds; The semi-conducting material (bismuth telluride) that N type and P type are arranged wherein; This semiconductor element is to link with the series connection form to form on circuit, and n type material has unnecessary electronics, and subzero temperature difference electromotive force is arranged; The P-type material electron deficiency has positive thermoelectric force; After in this circuit, connecting DC current, when electronics flow to P model material from the N type, the upper end temperature descended and heat absorption, becomes cold junction; Opposite lower end flows to the joint release heat of N type element by P type element, becomes the hot junction.The radiating condition in semiconductor refrigeration chip hot junction is its performance of restriction and the key in service life.
The mode of fin heat radiation is adopted in traditional refrigerator semiconductor refrigeration chip heat radiation, is about to directly fixing applying the in hot junction of fin and refrigerating chip.
When the refrigerator semiconductor refrigeration chip is worked; The heat that the cold junction absorption refrigerator semiconductor refrigeration chip work of refrigerating chip produces is delivered to the hot junction of refrigerating chip fast; Hot junction at refrigerating chip dissipates through the heat that radiating modes such as forced convertion or free convection transmit the hot junction; With the ability of the low temperature heat absorption of the cold junction that keeps refrigerating chip, thereby reach the container of refrigerator cooling purpose.
Because the refrigerator semiconductor refrigeration chip is less with respect to the area of fin; And mostly the traditional heat-dissipating sheet is the aluminium heat sink material, when the hot junction heat when fin transmits, can form bigger thermograde on radiator heat-dissipation surface; Promptly near more apart from thermal source; Its heat and temperature superelevation, far away more apart from thermal source, its heat and temperature are low more.Because spreader surface temperature and heat distribution is inhomogeneous, refrigerator semiconductor refrigeration chip refrigerating efficiency is reduced, significantly reduced the service life of automobile refrigerator semiconductor refrigeration chip.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of car refrigerator semiconductor refrigeration chip radiating subassembly, can effectively improve radiating efficiency.
For solving the problems of the technologies described above; The technical scheme that the present invention adopts is: a kind of car refrigerator semiconductor refrigeration chip radiating subassembly is provided; Comprise: container, semiconductor refrigeration chip, temperature-uniforming plate, fin; The cold junction of said semiconductor refrigeration chip and the outer surface of said container are close to fixing, and the hot junction of said semiconductor refrigeration chip and the one side of temperature-uniforming plate are close to fixing, and the another side of said temperature-uniforming plate and fin are close to fixing.
In preferred embodiment of the present invention, the cold junction of said semiconductor refrigeration chip is close to fixing through the outer surface of heat conductive silica gel and said container.
In preferred embodiment of the present invention, the hot junction of said semiconductor refrigeration chip is close to fixing through the one side of heat conductive silica gel and temperature-uniforming plate.
In preferred embodiment of the present invention, said temperature-uniforming plate and fin are fixing through welding.
In preferred embodiment of the present invention, said temperature-uniforming plate and fin carry out fixing and locking through retaining element.
The invention has the beneficial effects as follows: car refrigerator semiconductor refrigeration chip radiating subassembly of the present invention; Can the heat that semiconductor refrigeration chip transmits be spread apart rapidly; Make heat diffusion uniformly be delivered to the surface of fin; Thereby reduce refrigerator semiconductor refrigeration chip heat source region with apart from chip than the territory, far field thermograde, thereby promoted the heat exchanger effectiveness of fin greatly, make cold junction remain on a stable low-temperature condition; Thereby refrigerator semiconductor refrigeration chip refrigerating efficiency is significantly promoted, and the service life that can effectively prolong automobile refrigerator semiconductor refrigeration chip simultaneously is big.
Description of drawings
Fig. 1 is the perspective view of car refrigerator semiconductor refrigeration chip radiating subassembly of the present invention one preferred embodiment;
Fig. 2 is that the master of car refrigerator semiconductor refrigeration chip radiating subassembly shown in Figure 1 looks sketch map;
The mark of each parts is following in the accompanying drawing: 1 is container, and 2 is semiconductor refrigeration chip, and 3 is temperature-uniforming plate, and 4 is fin.
The specific embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present invention is set forth in detail, thereby protection scope of the present invention is made more explicit defining so that advantage of the present invention and characteristic can be easier to it will be appreciated by those skilled in the art that.
See also Fig. 1 and Fig. 2, the embodiment of the invention comprises:
A kind of car refrigerator semiconductor refrigeration chip radiating subassembly; Comprise: container 1, semiconductor refrigeration chip 2, temperature-uniforming plate 3, fin 4; The outer surface of the cold junction of semiconductor refrigeration chip 2 and container 1 is close to fixing; The one side of the hot junction of semiconductor refrigeration chip 2 and temperature-uniforming plate 3 is close to fixing, and the another side of temperature-uniforming plate 3 and fin 4 are close to fixing.
The installation process of car refrigerator semiconductor refrigeration chip radiating subassembly of the present invention is following: earlier fin is welded or sealed being fastened on the high-performance temperature-uniforming plate through soldering; After semiconductor refrigeration chip is up and down smeared heat-conducting silicone grease in the potsherd surface, the temperature-uniforming plate and the hot junction potsherd that will weld fin afterwards closely stick together; Refrigerator semiconductor refrigeration chip cold junction is close to the automobile refrigerator wants cooled containers surface, through mode such as sealed, fastening each parts is fit together closely at last, pressure remains on 10～15kg/cm
2
The single ﹑ of big (utilizing latent heat) ﹑ volume in light weight little (hollow container) ﹑ knot of (steam flow rate is fast) ﹑ heat output structure letter can be in characteristics such as agravic runnings after the match fast because temperature-uniforming plate (Vapor chamber) has uniformity of temperature profile (thermal diffusion due to steam is mobile) the little ﹑ thermal response of ﹑ thermal resistance; Thereby car refrigerator semiconductor refrigeration chip radiating subassembly of the present invention uses temperature-uniforming plate, can satisfy the thermal diffusion and the heat conducting demand of refrigerator semiconductor refrigeration chip.Temperature-uniforming plate can spread apart the heat that the refrigerator semiconductor refrigeration chip transmits rapidly, makes heat diffusion uniformly be delivered to the surface of fin, thus reduce refrigerator semiconductor refrigeration chip heat source region with apart from the thermograde of chip than the territory, far field.Thereby promoted the heat exchanger effectiveness of fin greatly, made cold junction (low-temperature end) remain on a stable low-temperature condition.Thereby refrigerator semiconductor refrigeration chip refrigerating efficiency significantly promotes, and the service life that can effectively prolong automobile refrigerator semiconductor refrigeration chip simultaneously is big.
The above is merely embodiments of the invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (5)
1. car refrigerator semiconductor refrigeration chip radiating subassembly; It is characterized in that; Comprise: container, semiconductor refrigeration chip, temperature-uniforming plate and fin; The cold junction of said semiconductor refrigeration chip and the outer surface of said container are close to fixing, and the hot junction of said semiconductor refrigeration chip and the one side of temperature-uniforming plate are close to fixing, and the another side of said temperature-uniforming plate and fin are close to fixing.
2. car refrigerator semiconductor refrigeration chip radiating subassembly according to claim 1 is characterized in that the cold junction of said semiconductor refrigeration chip is close to fixing through the outer surface of heat conductive silica gel and said container.
3. car refrigerator semiconductor refrigeration chip radiating subassembly according to claim 1 is characterized in that the hot junction of said semiconductor refrigeration chip is close to fixing through the one side of heat conductive silica gel and temperature-uniforming plate.
4. car refrigerator semiconductor refrigeration chip radiating subassembly according to claim 1 is characterized in that, said temperature-uniforming plate and fin are fixing through welding.
5. car refrigerator semiconductor refrigeration chip radiating subassembly according to claim 1 is characterized in that said temperature-uniforming plate and fin carry out fixing and locking through retaining element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103662274A CN102445020A (en) | 2011-11-18 | 2011-11-18 | Vehicle-mounted refrigerator semiconductor refrigerating chip heat dissipation assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103662274A CN102445020A (en) | 2011-11-18 | 2011-11-18 | Vehicle-mounted refrigerator semiconductor refrigerating chip heat dissipation assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102445020A true CN102445020A (en) | 2012-05-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103662274A Pending CN102445020A (en) | 2011-11-18 | 2011-11-18 | Vehicle-mounted refrigerator semiconductor refrigerating chip heat dissipation assembly |
Country Status (1)
| Country | Link |
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| CN (1) | CN102445020A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107317065A (en) * | 2017-06-23 | 2017-11-03 | 东风商用车有限公司 | A kind of power battery thermal management system and its control method based on TEC |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10292966A (en) * | 1997-04-18 | 1998-11-04 | Hitachi Ltd | Electronic refrigerator |
| JP2001321071A (en) * | 2000-05-12 | 2001-11-20 | Yamamoto Co Ltd | Low-temperature pickle container |
| CN202393077U (en) * | 2011-11-18 | 2012-08-22 | 苏州雪林电器科技有限公司 | Car refrigerator semiconductor refrigeration chip radiating component |
-
2011
- 2011-11-18 CN CN2011103662274A patent/CN102445020A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10292966A (en) * | 1997-04-18 | 1998-11-04 | Hitachi Ltd | Electronic refrigerator |
| JP2001321071A (en) * | 2000-05-12 | 2001-11-20 | Yamamoto Co Ltd | Low-temperature pickle container |
| CN202393077U (en) * | 2011-11-18 | 2012-08-22 | 苏州雪林电器科技有限公司 | Car refrigerator semiconductor refrigeration chip radiating component |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107317065A (en) * | 2017-06-23 | 2017-11-03 | 东风商用车有限公司 | A kind of power battery thermal management system and its control method based on TEC |
| CN107317065B (en) * | 2017-06-23 | 2023-04-25 | 东风商用车有限公司 | TEC-based power battery thermal management system and control method thereof |
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| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120509 |