US20120024500A1 - Thermosyphon for cooling electronic components - Google Patents
Thermosyphon for cooling electronic components Download PDFInfo
- Publication number
- US20120024500A1 US20120024500A1 US13/139,869 US201013139869A US2012024500A1 US 20120024500 A1 US20120024500 A1 US 20120024500A1 US 201013139869 A US201013139869 A US 201013139869A US 2012024500 A1 US2012024500 A1 US 2012024500A1
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- Prior art keywords
- thermosyphon
- evaporator section
- section
- condensate
- working fluid
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
- F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
- F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- Thermal management is an important aspect in the design of electronic packaging. Proper thermal management of electronic devices ensures that operating temperatures remain within a reliable operating range. Operating at temperatures beyond the set boundary is undesirable as it leads to lower device performance, an increased probability of failure and a reduced lifespan.
- the condensate guide includes a plurality of pores, the pores of the condensate guide being sized to allow vapour to pass through and prevent condensate flow through.
- this aids in returning the condensate to the evaporator section.
- a boiling enhancement structure may be coupled to the evaporator section.
- the boiling enhancement structure enhances nucleate boiling at the evaporator section and thereby increases the boiling heat transfer coefficient.
- the boiling enhancement structure is configured to draw the condensate back to the evaporator section.
- this enhances the heat transfer process.
- a working fluid is provided in the evaporator section in an amount sufficient to submerge the boiling enhancement structure.
- the working fluid is preferably in a saturated state.
- a port is provided for charging the evaporation section with a working fluid and for deaerating the thermosyphon.
- the present invention provides a thermosyphon including an evaporator section, a condenser section coupled to the evaporator section, and a boiling enhancement structure coupled to the evaporator section.
- the boiling enhancement structure includes a plurality of pin fins.
- the boiling enhancement structure enhances nucleate boiling at the evaporator section and increases both the boiling heat transfer coefficient and critical heat flux.
- FIG. 2 is an enlarged perspective view of a boiling enhancement structure for the thermosyphon of FIG. 1 .
- the thermosyphon 10 is hermetically-sealed and is configured to receive heat from a heat source (not shown).
- the heat source may have a high heat flux and examples of the heat source include, but are not limited to, central processing units (CPUs), graphics processing units (GPUs) and concentrating solar cells.
- the heat receiving portion 24 of the evaporator section 12 includes a base plate 32 .
- the base plate 32 may be mounted or attached to the heat source.
- the base plate 32 is preferably fabricated from a thermally conductive material such as, for example, aluminium, copper, silver or graphite.
- the condenser section 14 is provided with an external means of heat exchange in the form of the cooling fins 30 extending from the tube 34 of the condenser section 14 .
- the fins 30 are attached to the tube 34 with a degree of interference in order to have proper contact and thereby avoid the presence of gaps that could deteriorate the heat transfer performance of the fins 30 .
- an inner surface of the tube 34 of the condenser section 14 may be formed with a plurality of grooves or a knurled surface.
- the condensate guide 16 is configured to return condensate to the evaporator section 12 regardless of an orientation of the thermosyphon 10 .
- the condensate guide 16 is porous and the pores of the condensate guide 16 are sized to allow vapour to pass through and prevent condensate flow through. More particularly, the pores of the condensate guide 16 are designed small enough such that liquid is held by surface tension against liquid flow.
- the condensate guide 16 lines the boiling enhancement structure 20 , the inner walls of the tube 34 and an inner surface of the top cover 36 .
- the vapour core 18 serves as a conduit for vapour generated from the evaporator section 12 to flow into the condenser section 14 and is therefore designed in a manner such that vapour flow is not constricted so as to prevent pressure build up in the evaporator section 12 .
- the boiling enhancement structure 20 is employed within the evaporator section 12 and forms a part of the internal surface of the evaporator section 12 .
- the boiling enhancement structure 20 is configured to draw the condensate back to the evaporator section 12 . More particularly, the boiling enhancement structure 20 serves as a thermally activated pumping unit that absorbs condensate from the condenser section 12 .
- the provision of the groove 40 in the base plate 32 helps to facilitate bonding of the evaporator section 12 to the condenser section 14 .
- the port 28 functions as an evacuation port that is sealed subsequent to liquid charging and deaeration.
- the port 28 is provided in the form of a tube and is located on the top cover 36 .
- an electronic component In use, an electronic component generates heat. Heat from the electronic component is absorbed by the base plate 32 and spreads from the base plate 32 to the boiling enhancement structure 20 where nucleate boiling of the working fluid 22 occurs and the working fluid 22 changes from a liquid to a vapour. Vapour bubbles are formed on the heated surface of the boiling enhancement structure 20 creating a higher pressure region in the evaporator section 12 . The higher pressure at the evaporator section 12 drives the vapour through the vapour core 18 to the condenser section 14 where pressure is lower.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
A thermosyphon including an evaporator section, a condenser section coupled to the evaporator section, and a condensate guide lining an inner portion of the evaporator section and inner surfaces of the condenser section. The condensate guide defines a vapour core in the evaporator and condenser sections and is configured to return condensate to the evaporator section regardless of an orientation of the thermosyphon.
Description
- The present invention relates to thermosyphons and more particularly to thermosyphons for cooling electronic components such as, for example, central processing units (CPUs), graphics processing units (GPUs) and concentrating solar cells.
- Thermal management is an important aspect in the design of electronic packaging. Proper thermal management of electronic devices ensures that operating temperatures remain within a reliable operating range. Operating at temperatures beyond the set boundary is undesirable as it leads to lower device performance, an increased probability of failure and a reduced lifespan.
- With the introduction of multi-core processors and high-power electronics, component heat fluxes have risen to new higher levels and there is concern that current heat management technologies will not be able to cope with future heat load requirements. Thus, there is a need for a cooling device that is capable of dissipating waste heat generated by electronic components effectively.
- Accordingly, in a first aspect, the present invention provides a thermosyphon including an evaporator section, a condenser section coupled to the evaporator section, and a condensate guide lining an inner portion of the evaporator section and inner surfaces of the condenser section. The condensate guide defines a vapour core in the evaporator and condenser sections and is configured to return condensate to the evaporator section regardless of an orientation of the thermosyphon. Advantageously, this allows operation of the thermosyphon at various physical orientations with minimal or no performance degradation.
- Preferably, the condensate guide includes a plurality of pores, the pores of the condensate guide being sized to allow vapour to pass through and prevent condensate flow through. Advantageously, this aids in returning the condensate to the evaporator section.
- A boiling enhancement structure may be coupled to the evaporator section. Advantageously, the boiling enhancement structure enhances nucleate boiling at the evaporator section and thereby increases the boiling heat transfer coefficient.
- The boiling enhancement structure may include a plurality of pin fins. Preferably, a separation between adjacent ones of the pin fins is less than a bubble characteristic length of a working fluid in the evaporator section. Advantageously, the bubble confinement effect enhances nucleate boiling of the working fluid and consequently increases heat transfer away from the heat source.
- In a preferred embodiment, the boiling enhancement structure is configured to draw the condensate back to the evaporator section. Advantageously, this enhances the heat transfer process.
- Preferably, the boiling enhancement structure is integrally formed with a heat receiving portion of the evaporator section. Advantageously, this reduces the heat transfer resistance.
- In yet another preferred embodiment, a thermal interface material is coupled to the heat receiving portion of the evaporator section. Advantageously, this further reduces the heat transfer resistance.
- Preferably, a working fluid is provided in the evaporator section in an amount sufficient to submerge the boiling enhancement structure. Advantageously, this maximizes the boiling heat transfer. The working fluid is preferably in a saturated state.
- One of a plurality of grooves and a plurality of knurls may be formed on the inner surfaces of the condenser section for condensation enhancement.
- In one embodiment, a port is provided for charging the evaporation section with a working fluid and for deaerating the thermosyphon.
- In a second aspect, the present invention provides a thermosyphon including an evaporator section, a condenser section coupled to the evaporator section, and a boiling enhancement structure coupled to the evaporator section. The boiling enhancement structure includes a plurality of pin fins. Advantageously, the boiling enhancement structure enhances nucleate boiling at the evaporator section and increases both the boiling heat transfer coefficient and critical heat flux.
- Other aspects and advantages of the invention will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, illustrating by way of example the principles of the invention.
- Embodiments of the invention will now be described, by way of example only, with reference to the accompanying drawings, in which:
-
FIG. 1 is an enlarged cross-sectional view of a thermosyphon in accordance with one embodiment of the present invention; and -
FIG. 2 is an enlarged perspective view of a boiling enhancement structure for the thermosyphon ofFIG. 1 . - The detailed description set forth below in connection with the appended drawings is intended as a description of a presently preferred embodiment of the invention, and is not intended to represent the only form in which the present invention may be practiced. It is to be understood that the same or equivalent functions may be accomplished by different embodiments that are intended to be encompassed within the scope of the invention.
- Referring now to
FIG. 1 , athermosyphon 10 for cooling electronic components such as, for example, central processing units (CPUs) and graphics processing units (GPUs) is shown. Thethermosyphon 10 includes anevaporator section 12, acondenser section 14 coupled to theevaporator section 12, and acondensate guide 16 lining an inner portion of theevaporator section 12 and inner surfaces of thecondenser section 14. Avapour core 18 is defined in the evaporator andcondenser sections condensate guide 16. Aboiling enhancement structure 20 is coupled to theevaporator section 12. A workingfluid 22 is provided in theevaporator section 12 in an amount sufficient to submerge theboiling enhancement structure 20. Theboiling enhancement structure 20 is integrally formed with aheat receiving portion 24 of theevaporator section 12. Athermal interface material 26 is coupled to theheat receiving portion 24 of theevaporator section 12. Aport 28 is provided for deaerating thethermosyphon 10 and for charging theevaporation section 12 with the workingfluid 22. A plurality offins 30 is coupled to thecondenser section 14. - The
thermosyphon 10 is hermetically-sealed and is configured to receive heat from a heat source (not shown). The heat source may have a high heat flux and examples of the heat source include, but are not limited to, central processing units (CPUs), graphics processing units (GPUs) and concentrating solar cells. - In the embodiment shown, the
heat receiving portion 24 of theevaporator section 12 includes abase plate 32. Thebase plate 32 may be mounted or attached to the heat source. Thebase plate 32 is preferably fabricated from a thermally conductive material such as, for example, aluminium, copper, silver or graphite. - The
condenser section 14 is connected to and in fluid communication with theevaporator section 12. In the embodiment shown, thecondenser section 14 includes atube 34 and atop cover 36, thetop cover 36 sealing one end of thetube 34. To ensure that thethermosyphon 10 is hermetically sealed, thetube 34 and thetop cover 36 are bonded via a bonding process such as welding, soldering or diffusion. Thetube 34 is preferably made of a thermally conductive material such as, for example, aluminium, copper, silver or graphite. - In the embodiment shown, the
condenser section 14 is provided with an external means of heat exchange in the form of thecooling fins 30 extending from thetube 34 of thecondenser section 14. Thefins 30 are attached to thetube 34 with a degree of interference in order to have proper contact and thereby avoid the presence of gaps that could deteriorate the heat transfer performance of thefins 30. - The
fins 30 are preferably made of a thermally conductive material such as, for example, copper or aluminium. Although the use of air-cooled fins is described in the present embodiment, it should be appreciated by those of ordinary skill in the art that the present invention is not limited by the cooling method employed to cool thecondenser section 14. In alternative embodiments, thecondenser section 14 may be cooled by other well known methods of cooling such as, for example, evaporative cooling, liquid cooling, spray cooling and impinging jet. - Further, for condensation enhancement, an inner surface of the
tube 34 of thecondenser section 14 may be formed with a plurality of grooves or a knurled surface. - The
condensate guide 16 is configured to return condensate to theevaporator section 12 regardless of an orientation of thethermosyphon 10. Thecondensate guide 16 is porous and the pores of thecondensate guide 16 are sized to allow vapour to pass through and prevent condensate flow through. More particularly, the pores of thecondensate guide 16 are designed small enough such that liquid is held by surface tension against liquid flow. The condensate guide 16 lines the boilingenhancement structure 20, the inner walls of thetube 34 and an inner surface of thetop cover 36. Accordingly, when vapour condensation occurs in thecondenser section 14, the workingfluid 22 in vapour form is allowed to pass through thecondensate guide 16 but the condensate is prevented from returning to thevapour core 18, and thecondensate guide 16 guides the flow of the condensate back to theevaporator section 12. Orientation independence of thethermosyphon 10 is thus achieved with thecondensate guide 16. Thecondensate guide 16 may be made from a perforated sheet, a metallic wire mesh for structural integrity, or other porous medium. In one embodiment, the pores of thecondensate guide 16 have a diameter of between about 0.1 millimetre (mm) and about 2 mm. - The
vapour core 18 serves as a conduit for vapour generated from theevaporator section 12 to flow into thecondenser section 14 and is therefore designed in a manner such that vapour flow is not constricted so as to prevent pressure build up in theevaporator section 12. - The boiling
enhancement structure 20 is employed within theevaporator section 12 and forms a part of the internal surface of theevaporator section 12. - Referring now to
FIG. 2 , the boilingenhancement structure 20 of thethermosyphon 10 ofFIG. 1 is shown. In the embodiment shown, the boilingenhancement structure 20 comprises a plurality ofpin fins 38 integrally formed or mounted on an interior surface of thebase plate 32. As can be seen fromFIG. 2 , acircular groove 40 is formed in thebase plate 32 for receiving thetube 34 of thecondenser section 14. - The boiling
enhancement structure 20 improves the boiling heat transfer coefficient by increasing the number of nucleation sites and the heat transfer surface area. Additionally, the boilingenhancement structure 20 also improves the critical heat flux by effectively minimizing the build-up of vapour film in theevaporator section 12 which causes dry out. - In a preferred embodiment, a separation between adjacent ones of the
pin fins 38 is less than a bubble characteristic length of the workingfluid 22 in theevaporator section 12. Advantageously, it has been shown through experimentation that the bubble confinement effect enhances nucleate boiling of the workingfluid 22 and consequently increases heat transfer away from the heat source. The bubble characteristic length of the workingfluid 22 may be computed with the following equation: -
- where σ represents surface tension, g represents gravitational acceleration, ρl represents liquid density, and ρg represents vapour density.
- The boiling
enhancement structure 20 is configured to draw the condensate back to theevaporator section 12. More particularly, the boilingenhancement structure 20 serves as a thermally activated pumping unit that absorbs condensate from thecondenser section 12. - The boiling
enhancement structure 20 and thebase plate 32 may be fabricated from a thermally conductive material such as, for example, aluminium, copper, silver or graphite. Thepin fins 38 may be bonded to thebase plate 32 via known bonding methods such as, for example, soldering, brazing or diffusion. - In the embodiment shown, each of the
pin fins 38 has a square profile. In one embodiment, each of thepin fins 38 has a height of between about 2 mm and about 20 mm and a thickness of between about 0.5 mm and about 5 mm. However, it should be understood that thepin fins 38 are not limited to these geometric parameters as optimization of the geometric parameters such as fin profile, fin thickness and fin height is determined based on the thermal properties of the material from which the boilingenhancement structure 20 and thebase plate 32 are made and the boiling heat transfer coefficient of the workingfluid 22 for a specific geometry. - In alternative embodiments, the boiling
enhancement structure 20 may be other forms of fins, grooves or an open-cell metal foam. - The provision of the
groove 40 in thebase plate 32 helps to facilitate bonding of theevaporator section 12 to thecondenser section 14. - Referring again to
FIG. 1 , the workingfluid 22 is preferably in a saturated state. - Advantageously, this ensures that the working
fluid 22 undergoes phase change instantaneously at any temperature within the component operating range. Examples of the workingfluid 22 include, for example, water, a refrigerant or a dielectric fluid. In the embodiment shown, the boilingenhancement structure 20 is fully immersed in the workingfluid 22. Advantageously, this maximizes the boiling heat transfer. - The
thermal interface material 26 serves to reduce thermal interface resistance between theheat receiving portion 24 and the heat source. - The
port 28 functions as an evacuation port that is sealed subsequent to liquid charging and deaeration. In the embodiment shown, theport 28 is provided in the form of a tube and is located on thetop cover 36. - The operation of the
thermosyphon 10 will now be described with reference toFIG. 1 . - In use, an electronic component generates heat. Heat from the electronic component is absorbed by the
base plate 32 and spreads from thebase plate 32 to the boilingenhancement structure 20 where nucleate boiling of the workingfluid 22 occurs and the workingfluid 22 changes from a liquid to a vapour. Vapour bubbles are formed on the heated surface of the boilingenhancement structure 20 creating a higher pressure region in theevaporator section 12. The higher pressure at theevaporator section 12 drives the vapour through thevapour core 18 to thecondenser section 14 where pressure is lower. - As the walls of the
condenser section 14 are at a lower temperature compared to the vapour, the vapour condenses into a liquid condensate on the walls of thecondenser section 14 and releases latent heat of vaporization in the process. The heat released from the condensation process is rejected to an external medium via thefins 30 coupled to thecondenser section 14. - The liquid condensate is enclosed by the walls of the
condenser section 14 and thecondensate guide 16 and is forced to flow between the walls of thecondenser section 14 and thecondensate guide 16 back to theevaporator section 12 by gravity and the capillary force provided by the boilingenhancement structure 20. - As is evident from the foregoing discussion, the present invention provides an orientation-free, two-phase thermosyphon that effectively transfers heat from a heat dissipating component to a colder medium. Advantageously, through the provision of a condensate guide lining an inner portion of the evaporator section and inner surfaces of the condenser section, the thermosyphon of the present invention can be operated at various physical orientations with minimal or no performance degradation.
- While the preferred embodiments of the invention have been illustrated and described, it will be clear that the invention is not limited to these embodiments only. Numerous modifications, changes, variations, substitutions and equivalents will be apparent to those skilled in the art without departing from the scope of the invention as described in the claims.
- Further, unless the context dearly requires otherwise, throughout the description and the claims, the words “comprise”, “comprising” and the like are to be construed in an inclusive as opposed to an exclusive or exhaustive sense; that is to say, in the sense of “including, but not limited to”.
Claims (23)
1. A thermosyphon, comprising:
an evaporator section;
a condenser section coupled to the evaporator section; and
a condensate guide lining an inner portion of the evaporator section and inner surfaces of the condenser section, the condensate guide defining a vapour core in the evaporator and condenser sections, wherein the condensate guide is configured to return condensate to the evaporator section regardless of an orientation of the thermosyphon.
2. The thermosyphon of claim 1 , wherein the condensate guide includes a plurality of pores, the pores of the condensate guide being sized to allow vapour to pass through and prevent condensate flow through.
3. The thermosyphon of claim 1 , further comprising a boiling enhancement structure coupled to the evaporator section.
4. The thermosyphon of claim 3 , wherein the boiling enhancement structure comprises a plurality of fins, and wherein a separation between adjacent ones of the fins is less than a bubble characteristic length of a working fluid in the evaporator section.
5. (canceled)
6. The thermosyphon of claim 3 , wherein the boiling enhancement structure is configured to draw the condensate back to the evaporator section.
7. The thermosyphon of claim 3 , wherein the boiling enhancement structure is integrally formed with a heat receiving portion of the evaporator section.
8. The thermosyphon of claim 7 , further comprising a thermal interface material coupled to the heat receiving portion of the evaporator section.
9. The thermosyphon of claim 3 , further comprising a working fluid in the evaporator section, wherein the working fluid is provided in an amount sufficient to submerge the boiling enhancement structure.
10. The thermosyphon of claim 9 , wherein the working fluid is in a saturated state.
11. The thermosyphon of claim 1 , wherein one of a plurality of grooves and a plurality of knurls are formed on the inner surfaces of the condenser section.
12. The thermosyphon of claim 1 , further comprising a port for charging the evaporation section with a working fluid and for deaerating the thermosyphon.
13. A thermosyphon, comprising:
an evaporator section;
a condenser section coupled to the evaporator section; and
a boiling enhancement structure coupled to the evaporator section, the boiling enhancement structure comprising a plurality of fins, wherein a separation between adjacent ones of the fins is less than a bubble characteristic length of a working fluid in the evaporator section.
14. (canceled)
15. The thermosyphon of claim 13 , wherein the boiling enhancement structure is configured to draw condensate back to the evaporator section.
16. The thermosyphon of claim 13 , wherein the boiling enhancement structure is integrally formed with a heat receiving portion of the evaporator section.
17. The thermosyphon of claim 16 , further comprising a thermal interface material coupled to the heat receiving portion of the evaporator section.
18. The thermosyphon of claim 13 , further comprising a working fluid in the evaporator section, wherein the working fluid is in a saturated state.
19. The thermosyphon of claim 18 , wherein the working fluid is provided in an amount sufficient to submerge the boiling enhancement structure.
20. The thermosyphon of claim 13 , wherein one of a plurality of grooves and a plurality of knurls are formed on an inner surface of the condenser section.
21. The thermosyphon of claim 13 , further comprising a port for charging the evaporation section with a working fluid and for deaerating the thermosyphon.
22. The thermosyphon of claim 13 , further comprising a condensate guide defining a vapour core in the evaporator and condenser sections, wherein the condensate guide is configured to return condensate to the evaporator section regardless of an orientation of the thermosyphon.
23. The thermosyphon of claim 22 , wherein the condensate guide includes a plurality of pores, the pores of the condensate guide being sized to allow vapour to pass through and prevent condensate flow through.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/SG2010/000229 WO2011159251A1 (en) | 2010-06-18 | 2010-06-18 | Thermosyphon for cooling electronic components |
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US20120024500A1 true US20120024500A1 (en) | 2012-02-02 |
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US13/139,869 Abandoned US20120024500A1 (en) | 2010-06-18 | 2010-06-18 | Thermosyphon for cooling electronic components |
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SG (1) | SG177233A1 (en) |
WO (1) | WO2011159251A1 (en) |
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GB2503108A (en) * | 2013-06-10 | 2013-12-18 | Gert Pille | Cooling Photo-Voltaic Cells Using Thermosyphon Cooling Circuit |
US9894815B1 (en) | 2016-08-08 | 2018-02-13 | General Electric Company | Heat removal assembly for use with a power converter |
US10638648B2 (en) | 2016-04-28 | 2020-04-28 | Ge Energy Power Conversion Technology Ltd. | Cooling system with pressure regulation |
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-
2010
- 2010-06-18 US US13/139,869 patent/US20120024500A1/en not_active Abandoned
- 2010-06-18 WO PCT/SG2010/000229 patent/WO2011159251A1/en active Application Filing
- 2010-06-18 SG SG2011040565A patent/SG177233A1/en unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5582242A (en) * | 1992-05-15 | 1996-12-10 | Digital Equipment Corporation | Thermosiphon for cooling a high power die |
US7090002B2 (en) * | 2002-02-13 | 2006-08-15 | Thermal Corp. | Deformable end cap for heat pipe |
US7048039B2 (en) * | 2003-06-10 | 2006-05-23 | Thermal Corp. | CTE-matched heat pipe |
US20060196640A1 (en) * | 2004-12-01 | 2006-09-07 | Convergence Technologies Limited | Vapor chamber with boiling-enhanced multi-wick structure |
US20070056712A1 (en) * | 2005-09-09 | 2007-03-15 | Delta Electronics, Inc. | Heat dissipation module and heat pipe thereof |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2503108A (en) * | 2013-06-10 | 2013-12-18 | Gert Pille | Cooling Photo-Voltaic Cells Using Thermosyphon Cooling Circuit |
US10638648B2 (en) | 2016-04-28 | 2020-04-28 | Ge Energy Power Conversion Technology Ltd. | Cooling system with pressure regulation |
US9894815B1 (en) | 2016-08-08 | 2018-02-13 | General Electric Company | Heat removal assembly for use with a power converter |
Also Published As
Publication number | Publication date |
---|---|
WO2011159251A1 (en) | 2011-12-22 |
SG177233A1 (en) | 2012-02-28 |
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Owner name: GATEKEEPER LABORATORIES PTE LTD, SINGAPORE Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:NG, KIM CHOON;YAP, CHRISTOPHER R.;NG, SU HUI JOSEPH;AND OTHERS;SIGNING DATES FROM 20100617 TO 20100826;REEL/FRAME:026449/0397 |
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STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |