CN101005747A - Liquid cooling heat sink and heat exchanger for said liquid cooling heat sink - Google Patents

Liquid cooling heat sink and heat exchanger for said liquid cooling heat sink Download PDF

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Publication number
CN101005747A
CN101005747A CNA2006100332394A CN200610033239A CN101005747A CN 101005747 A CN101005747 A CN 101005747A CN A2006100332394 A CNA2006100332394 A CN A2006100332394A CN 200610033239 A CN200610033239 A CN 200610033239A CN 101005747 A CN101005747 A CN 101005747A
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CN
China
Prior art keywords
heat exchanger
cavity volume
liquid
sub
perforated portion
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Granted
Application number
CNA2006100332394A
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Chinese (zh)
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CN101005747B (en
Inventor
赖振田
周志勇
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Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN200610033239A priority Critical patent/CN101005747B/en
Publication of CN101005747A publication Critical patent/CN101005747A/en
Application granted granted Critical
Publication of CN101005747B publication Critical patent/CN101005747B/en
Expired - Fee Related legal-status Critical Current
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Abstract

The liquid cooling device comprises: a baseboard, a liquid entrance, a liquid outlet and a heat exchanger set on the top of baseboard and held in the chamber of case; forming a column-like hollow unit on the heat exchanger and multi micro flow channels to interconnect the column-like hollow unit to the outside; the heat exchanger partitions the chamber into a first sub-chamber surrounded by the heat exchanger and a second sub-chamber surrounding the heat exchanger; the second sub-chamber is interconnected to the first sub-chamber through multi micro flow channels; the liquid entrance is connected to the first sub-chamber and is used to eject the liquid cooling agent to strike the top of baseboard; the liquid outlet is connected to the second chamber and is used to outlet the liquid cooling agent in the second sub-chamber.

Description

Liquid-cooling heat radiator and be used for the heat exchanger of this liquid-cooling heat radiator
[technical field]
The present invention relates to a kind of heat abstractor, particularly a kind of electronic component liquid-cooling heat radiator.
[background technology]
The heat abstractor of existing electronic component or device usefulness adopts cross-ventilation to disperse the heat that thermal source produces usually.Yet the thermal capacity of air is relatively low, makes these heat abstractors only be suitable for distributing the heat that the relatively low thermal source of power produces.Along with the increase of the speed of service, power density also and then increases, thereby needs more effectively heat abstractor.For this reason, the water of employing high heat capacity or water-ethylene glycol (water-glycol) solution etc. are used to distribute the heat that the highdensity thermal source of high power produces as in bulk the putting of the liquid cooling of working solution.Be applied to be transferred at a distance after cooling liquid in these heat abstractors absorbs the heat that thermal source produces, use liquid-gas-heat exchanger can easily heat be distributed in the middle of the air stream a long way off.
Existing liquid-cooling heat radiator generally includes a metal derby that is drilled with most runners, and these runners connect into a continuous runner by the U-shaped pipe.Electronic device is connected in a surface of this metal derby, and liquid coolant flows in these runners and U-shaped pipe, and the surface of this metal derby can connect one or more electronic devices.This type of heat abstractor also can be used the side that a coil is installed on metal derby, realizes and microelectronic component is connected in the opposite side of metal derby.Yet this type of heat abstractor is relatively heavy, and the circuit board of heat abstractor being installed for the electronic device and being used for of being cooled has brought unnecessary mechanical pressure.
Spraying bump (Jet Impinging) cooling device is another kind of liquid-cooling heat radiator, the weight of this heat abstractor is lighter, its operation principle is when the liquid coolant injection impinges upon a substrate surface, suddenly deceleration supercharging, form extremely thin boundary layer at impingement region, this boundary layer has very high heat exchange coefficient.United States Patent (USP) the 5th, 329, promptly disclosed for No. 419 and a kind ofly used integrated circuit encapsulation that liquid coolant sprays bump and use cooling device, this cooling device to comprise that a coldplate that contacts with the end face of integrated circuit (IC) chip, an end are fixed on cylindrical shell, on this coldplate and are inserted into the discharging tube that is used for the nozzle and that liquid coolant strikes the cardinal principle middle position of this coldplate is arranged on the cooling agent discharge that is used on this housing being ejected in this housing in this housing.Yet this type of heat abstractor only forms higher heat exchange coefficient in central stagnant areas, and sharply descends at the heat exchange coefficient away from the zone of central authorities, thereby when being applied in the bigger occasion of heat-transfer surface, average radiating efficiency is not high.
[summary of the invention]
Technical problem to be solved by this invention is, proposes a kind of liquid-cooling heat radiator, has higher radiating efficiency, and in light weight, volume is little.
Another technical problem to be solved by this invention is, a kind of liquid-cooling heat radiator is provided, and can be applicable to the occasion that heat-transfer surface is bigger, and this liquid-cooling heat radiator will spray the bump cooling and combine with the fluid channel cooling, have higher radiating efficiency.
The technical solution used in the present invention is as follows: a kind of liquid-cooling heat radiator, comprise that a substrate, cooperates and have cavity volume and liquid inlet that is communicated with this cavity volume and liquid outlet with this substrate housing and is arranged at the end face of this substrate and is placed in heat exchanger in the cavity volume of this housing, is formed with a hollow bulb and most individual fluid channel with this hollow bulb and external communications on this heat exchanger; This heat exchanger is separated into the second sub-cavity volume that first a sub-cavity volume that is surrounded by this heat exchanger and surrounds this heat exchanger with this cavity volume, and this second sub-cavity volume and this first sub-cavity volume are by the fluid channel connection of this majority; This liquid inlet is communicated with this first sub-cavity volume, in order to liquid coolant is sprayed the end face that impinges upon this substrate; This liquid outlet is communicated with this second sub-cavity volume, discharges in order to the liquid coolant that will enter in the second sub-cavity volume.The present invention adopts impinging jet cooling in the first sub-cavity volume mode to substrate on the concentrated area of heat cool off, utilization is cooled off the zone away from central point around most fluid channel in the heat exchanger of this first sub-cavity volume, impinging jet cooling and fluid channel cooling are organically combined, thereby improved the integral heat sink performance of liquid-cooling heat radiator effectively.
A kind of heat exchanger comprises most ring-type heat exchanger plates, and each ring-type heat exchanger plates all has majority first punch unit and most and staggered second punch unit of these first punch units; This majority ring-type heat exchanger plates is staggeredly stacked together coaxially, most first punch units of each ring-type heat exchanger plates all most second punch units with adjacent ring-type heat exchanger plates are corresponding, form most individual should majority individual with the inside of these ring-type heat exchanger plates and the fluid channel of external communications.Heat exchanger among the present invention adopts the annular metal heat exchanger plates to be staggeredly stacked and forms, and the size of fluid channel and the stacks as high of heat exchanger plates all are easy to regulate and optimization, and this heat exchanger volume is little, in light weight, cost is low, processing procedure is simple and reliable.
[description of drawings]
Fig. 1 is the constitutional diagram of the liquid-cooling heat radiator in a preferred embodiment of the invention;
Fig. 2 is the exploded view of the liquid-cooling heat radiator among Fig. 1;
Fig. 3 is the cutaway view of liquid-cooling heat radiator on the III-III direction among Fig. 1;
Fig. 4 is the partial sectional view of the housing among Fig. 2;
Fig. 5 is the exploded view of the heat exchanger among Fig. 2;
Fig. 6 is the partial sectional view of the housing of the liquid-cooling heat radiator in another embodiment of the present invention.
[embodiment]
Below in conjunction with the drawings and specific embodiments the present invention is described in further detail:
As shown in Figure 1 to Figure 3, the liquid-cooling heat radiator in a preferred embodiment of the invention is to adopt liquid coolant to dispel the heat as hydraulic fluid, is particularly suitable for to dispelling the heat such as golf calorific value thermals source such as microprocessor and computer chips.This liquid-cooling heat radiator mainly comprises a substrate 10, a housing 20 and that cooperates with substrate 10 is arranged on the substrate 10 and be placed in heat exchanger 30 in the housing 20.
Substrate 10 is by making such as the good material of heat conductivilitys such as copper, steel, and it has an end face and a bottom surface, and its bottom surface is used for joining with thermal source (not shown), absorbs the heat that thermal source produces.Housing 20 can be by the end face that is spirally connected, conventional connected mode such as welding is combined in substrate 10 hermetically.As shown in Figure 4, housing 20 comprises the sidewall 22 that a roof 21 and stretches out from the periphery of roof 21 downwards, roof 21 and sidewall 22 can be one-body molded, also can be to combine, and sidewall 22 cooperates formation one to be used to load the cavity volume 24 of heat exchanger 30 with roof 21.The internal face of the end face of substrate 10 and cavity volume 24 can be done some anti-corrosion treatment as required, in case corroded by liquid coolant.Sidewall 22 has one and is used for the root edge face 23 that cooperates with substrate 10, offers an endless groove 25 on the root edge face 23, and this endless groove 25 is used to accommodate a sealing ring 29, mat sealing ring 29 and cooperating of substrate 10 to prevent that liquid coolant from leaking.In order to strengthen the sealing between housing 20 and the substrate 10, twice or the above endless groove of twice can be formed, on the root edge face 23 of sidewall 22 with further raising sealing property.
Heat exchanger 30 is fixed on the end face of substrate 10, and it is formed with a column hollow bulb 33 in the axial direction, is used for cooperating with substrate 10 forming the first sub-cavity volume 241.Hollow bulb 33 and substrate 10 end faces are vertical substantially, impinge upon and carry out heat exchange on the substrate 10 so that liquid coolant can pass these hollow bulb 33 direct injections.The bottom surface of heat exchanger 30 can be fixed on substrate 10 end faces by heat conductivility good binding modes such as brazings, so that heat can easily conduct to heat exchanger 30 from substrate 10.The end face of substrate 10 is divided into three zones by heat exchanger 30: a second area 12 and the 3rd zone 13 around this heat exchanger 30 that a first area that is surrounded by heat exchanger 30 11, is covered by this heat exchanger 30.The end face of heat exchanger 30 contacts with the lower surface of the roof 21 of housing 20 or with adosculation, thereby cavity volume 24 is separated into two sub-cavity volumes: first a sub-cavity volume 241 and that is surrounded by heat exchanger 30 surrounds the second sub-cavity volume 242 of heat exchanger 30.The first sub-cavity volume 241 is that the first area 11 by these substrate 10 end faces cooperates with the column hollow bulb 33 of heat exchanger 30 and forms, and the second sub-cavity volume 242 is to be cooperated with the lateral wall of heat exchanger 30 and cavity volume 24 by the 3rd zone 13 of substrate 10 end faces to form.Heat exchanger 30 is formed with most diametrically with the fluid channel 32 of hollow bulb 33 with external communications, this majority fluid channel 32 is communicated with the first sub-cavity volume 241 with the second sub-cavity volume 242, the liquid coolant that enters in the first sub-cavity volume 241 can be entered in the second sub-cavity volume 242 by this majority fluid channel 32.
As shown in Figure 5, heat exchanger 30 is column substantially, and it is to be staggeredly stacked coaxially from the bottom up by most ring-type heat exchanger plates 31 to form, and all the interior circle combination back at ring-type heat exchanger plates 31 middle parts forms the column hollow bulb 33 of heat exchanger 30.Heat exchanger plates 31 can adopt such as the good material of heat conductivilitys such as copper, steel and make, and all adopts the good connected mode combinations of heat conductivility such as brazing between every adjacent two heat exchanger plates 31, so that heat can easily conduct to the upper strata heat exchanger plates from lower floor's heat exchanger plates.For the ease of making and producing in batches, the shape of each heat exchanger plates 31, structure and manufactured materials are all identical.This majority ring-type heat exchanger plates 31 is in piling up manufacture process, the 1st, 3,5....2n+1 odd number group heat exchanger plates 31 is arranged by identical angle, the 2nd, 4, all relative odd number group ring-type heat exchanger plates 31 of 6...2n even number set ring-type heat exchanger plates 31 is after the longitudinal axis rotates a predetermined angle, be stacked on again on the odd number group heat exchanger plates 31, this odd number group and even number set are stacked alternately.
All have most the first fan-shaped punch unit a and most the second fan-shaped punch unit b (shown in the dotted portion) on each heat exchanger plates 31, this majority second fan-shaped punch unit b and this majority first fan-shaped punch unit a are staggered, error angle between the two also is α, so that most the first punch unit a of each heat exchanger plates 31 are all corresponding with the individual second punch unit b of the majority of an adjacent heat exchanger plates 31, thereby form most fluid channel 32.Each first punch unit a all has the first V-type perforated portion 311, second perforated portion 312 that is communicated with the second sub-cavity volume 242 that is communicated with the first sub-cavity volume 241; Each second punch unit b all have two the 3rd perforated portions 313 and that are communicated with this second sub-cavity volume 242 independently the 4th perforated portion 314, the four perforated portions 314 be not in communication with the outside diametrically.In this heat exchanger 30, first perforated portion 311 of the first punch unit a of each ring-type heat exchanger plates 31 all is communicated with the 3rd perforated portion 313 of the second punch unit b of adjacent ring-type heat exchanger plates 31, so that the liquid coolant in the first sub-cavity volume 241 can enter in the second sub-cavity volume 242 by first perforated portion 311 and the 3rd perforated portion 313, this is the first kind of form that forms fluid channel 32.First perforated portion 311 of the first punch unit a of each ring-type heat exchanger plates 31 and second perforated portion 312 all are communicated with the 4th perforated portion 314 of the second punch unit b of adjacent ring-type heat exchanger plates, so that the liquid coolant in the first sub-cavity volume 241 enters the 4th perforated portion 314 from first perforated portion 311 earlier, enter second perforated portion 312 by the 4th perforated portion 314 again, enter the second sub-cavity volume 242 at last, this is the second kind of form that forms fluid channel.Therefore, form most the fluid channel 32 that the first sub-cavity volume 241 is communicated with the second sub-cavity volume 242.Being understandable that, though the formation of fluid channel 32 has in the present embodiment comprised above-mentioned the first and second two kinds of forms, singly only also can forming fluid channel 32 with one of these two kinds of forms, is that fluid channel 32 quantity are less relatively; In addition, the quantity of first perforated portion 311, second perforated portion 312, the 3rd perforated portion 313 and the 4th perforated portion 314 all can be more than one.
Housing 21 is provided with a liquid inlet 26 that is communicated with the first sub-cavity volume 241, and liquid inlet 26 links to each other with pump (not shown) at a distance, with input liquid coolant in cavity volume 24.Liquid inlet 26 is over against the first area 11 of substrate 10 end faces, carries out heat exchange so that the liquid coolant direct injection can be impinged upon on the first area 11 of substrate 10 end faces.In order to improve the issuing velocity of cooling agent, be provided with one at liquid inlet 26 places and reduce nozzle 28.The edge of the roof 21 of housing 21 is provided with a liquid outlet 27, and the second sub-cavity volume 242 in liquid outlet 27 and the cavity volume 24 is communicated with, so that will enter into the liquid coolant discharge of the second sub-cavity volume 242 from the first sub-cavity volume 241.
The present invention in the course of the work, liquid coolant at first penetrates from nozzle 28, pass the first area 11 that directly impinges upon substrate 10 end faces behind the first sub-cavity volume 241, flow in the second sub-cavity volume 242 by most the fluid channel 32 in the heat exchanger 30 then, flow out the second sub-cavity volume 242 by liquid outlet 27 at last, and be transferred at a distance a cooler (not shown) and cool off, and after cooling, enter next duty cycle.In this running, the heat that thermal source (not shown) produces is conducted to substrate 10, first's heat in the substrate 10 is passed in the cooling agent when liquid coolant bump first area 11, the second portion heat is conducted to heat exchanger earlier, yet when liquid coolant is flowed through most fluid channel 32, be passed in the liquid coolant, the third part heat is passed in the liquid coolant when liquid cools flows in the second sub-cavity volume 242.
The present invention adopts impinging jet cooling to be dispelled the heat in the concentrated area of heat on the substrate 10, has improved liquid-cooling heat radiator effectively at this regional heat dispersion.In addition, for overcoming the shortcoming that descends rapidly at regional heat exchange coefficient away from central point, with the heat exchanger 30 that has most fluid channel 32 be centered around the impinging jet zone around, can be the time after making liquid coolant finish bump by fluid channel 32, continue to carry out heat exchange, thereby improved the whole heat exchange efficiency of liquid-cooling heat radiator greatly with heat exchanger 30 edge region.
Heat exchanger 30 among the present invention adopts annular metal heat exchanger plates 31 to be staggeredly stacked and forms, have advantages such as volume is little, in light weight, cost is low, processing procedure is simple and reliable, and the stacks as high of the size of fluid channel and heat exchanger plates 31 all is easy to regulate and optimization.
As shown in Figure 6, the housing 40 of the liquid-cooling heat radiator in another preferred embodiment of the present invention and the similar of the housing 20 among the last embodiment, its difference is, be provided with the extension 481 of the cavity volume inside that extend into housing 40 in the lower end of reducing nozzle 48 that liquid inlet 46 is provided with, the liquid outlet of nozzle 48 and the distance between substrate 10 end faces are shortened, and then optimize the performance of spraying bump.The extension elongation of extension 481 as required can be different, to adapt to different occasions or the isoparametric demand of different cooling agent kinds.

Claims (20)

1. liquid-cooling heat radiator, comprise that a substrate, cooperates and have cavity volume and liquid inlet that is communicated with this cavity volume and liquid outlet with this substrate housing and is arranged at the end face of this substrate and is placed in heat exchanger in the cavity volume of this housing, is characterized in that: be formed with a hollow bulb and most individual fluid channel with this hollow bulb and external communications on this heat exchanger; This heat exchanger is separated into the second sub-cavity volume that first a sub-cavity volume that is surrounded by this heat exchanger and surrounds this heat exchanger with this cavity volume, and this second sub-cavity volume and this first sub-cavity volume are by the fluid channel connection of this majority; This liquid inlet is communicated with this first sub-cavity volume, in order to liquid coolant is sprayed the end face that impinges upon this substrate; This liquid outlet is communicated with this second sub-cavity volume, in order to will enter liquid coolant discharge in the second sub-cavity volume.
2. liquid-cooling heat radiator as claimed in claim 1 is characterized in that: the hollow bulb of this heat exchanger is column substantially, and vertical substantially with the end face of this substrate.
3. liquid-cooling heat radiator as claimed in claim 2 is characterized in that: this heat exchanger with the end face of this substrate be divided into one by this heat exchanger around first area, the second area and the 3rd zone around this heat exchanger that are covered by this heat exchanger.
4. liquid-cooling heat radiator as claimed in claim 3 is characterized in that: the first area of this substrate top surface cooperates this first sub-cavity volume of formation with the column hollow bulb of this heat exchanger.
5. liquid-cooling heat radiator as claimed in claim 3 is characterized in that: the second area of this substrate top surface cooperates this second sub-cavity volume of formation with the madial wall of the lateral wall of this heat exchanger and this cavity volume.
6. liquid-cooling heat radiator as claimed in claim 1 is characterized in that: this heat exchanger comprises most the ring-type heat exchanger plates that coaxially are stacked.
7. liquid-cooling heat radiator as claimed in claim 6 is characterized in that: each ring-type heat exchanger plates includes most first punch units and most second punch units with this first punch unit interlaced arrangement.
8. liquid-cooling heat radiator as claimed in claim 7 is characterized in that: this majority ring-type heat exchanger plates is stacked alternately, so that first punch unit of each ring-type heat exchanger plates is corresponding with second punch unit of adjacent ring-type heat exchanger plates.
9. liquid-cooling heat radiator as claimed in claim 8 is characterized in that: each first punch unit all has at least one first perforated portion that is communicated with the first sub-cavity volume, and each second punch unit all has at least one the 3rd perforated portion that is communicated with the second sub-cavity volume.
10. liquid-cooling heat radiator as claimed in claim 9 is characterized in that: at least one first perforated portion of the unit, first hole of each ring-type heat exchanger plates all is communicated with at least one the 3rd perforated portion of second punch unit of adjacent ring-type heat exchanger plates.
11. liquid-cooling heat radiator as claimed in claim 8, it is characterized in that: each first punch unit all has at least one first perforated portion that is communicated with the first sub-cavity volume and at least one second perforated portion that is communicated with the second sub-cavity volume, and each second punch unit all has at least one the 4th perforated portion.
12. liquid-cooling heat radiator as claimed in claim 11 is characterized in that: at least the first perforated portion on each first punch unit all is communicated with at least one second perforated portion by at least one the 4th perforated portion of adjacent ring-type heat exchanger plates.
13. liquid-cooling heat radiator as claimed in claim 1 is characterized in that: be provided with a negative throat noz(zle) at this liquid inlet.
14. liquid-cooling heat radiator as claimed in claim 12 is characterized in that: this negative throat noz(zle) has an extension.
15. a heat exchanger is characterized in that: comprise most ring-type heat exchanger plates, each ring-type heat exchanger plates all has majority first punch unit and most and staggered second punch unit of these first punch units; A most ring-type heat exchanger plates are staggeredly stacked together coaxially, most first punch units of each ring-type heat exchanger plates all most second punch units with adjacent ring-type heat exchanger plates are corresponding, form most the inside and outside fluid channel of linking up these these ring-type heat exchanger plates.
16. heat exchanger as claimed in claim 15 is characterized in that: each first punch unit all has at least one first perforated portion that is communicated with the first sub-cavity volume, and each second punch unit all has at least one the 3rd perforated portion that is communicated with the second sub-cavity volume.
17. heat exchanger as claimed in claim 16 is characterized in that: at least one first perforated portion of the unit, first hole of each ring-type heat exchanger plates all is communicated with at least one the 3rd perforated portion of second punch unit of adjacent ring-type heat exchanger plates.
18. heat exchanger as claimed in claim 15, it is characterized in that: each first punch unit all has at least one first perforated portion that is communicated with the first sub-cavity volume and at least one second perforated portion that is communicated with the second sub-cavity volume, and each second punch unit all has at least one the 4th perforated portion.
19. heat exchanger as claimed in claim 18 is characterized in that: at least the first perforated portion on each first punch unit all is communicated with at least one second perforated portion by at least one the 4th perforated portion of adjacent ring-type heat exchanger plates.
20. heat exchanger as claimed in claim 15 is characterized in that: this first perforated portion is V-shaped substantially.
CN200610033239A 2006-01-21 2006-01-21 Liquid cooling heat sink and heat exchanger for said liquid cooling heat sink Expired - Fee Related CN101005747B (en)

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CN200610033239A CN101005747B (en) 2006-01-21 2006-01-21 Liquid cooling heat sink and heat exchanger for said liquid cooling heat sink

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Application Number Priority Date Filing Date Title
CN200610033239A CN101005747B (en) 2006-01-21 2006-01-21 Liquid cooling heat sink and heat exchanger for said liquid cooling heat sink

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CN101005747A true CN101005747A (en) 2007-07-25
CN101005747B CN101005747B (en) 2010-05-26

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102123577A (en) * 2009-12-18 2011-07-13 瓦孔厄伊公司 Arrangement in a liquid cooler
CN102841579A (en) * 2011-06-24 2012-12-26 鸿富锦精密工业（深圳）有限公司 Server heat dissipation control system and method
CN103629850A (en) * 2013-12-04 2014-03-12 中国科学院光电技术研究所 Liquid cooling head for air cooling and liquid cooling dual-purpose heat radiator
CN105658028A (en) * 2015-12-31 2016-06-08 上海理工大学 Plate type injection heat radiator
CN107764111A (en) * 2016-08-16 2018-03-06 宏碁股份有限公司 Heat abstractor
CN109923730A (en) * 2017-07-11 2019-06-21 株式会社Lg化学 Battery module and battery pack including the battery module
TWI804768B (en) * 2020-11-06 2023-06-11 建準電機工業股份有限公司 Liquid cooling module and electronic device including the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1057424C (en) * 1996-02-29 2000-10-11 中国科学院上海光学精密机械研究所 Microchannel cooling heat sink
CN2664195Y (en) * 2003-10-17 2004-12-15 鸿富锦精密工业（深圳）有限公司 Liquid cooling type heat sink
CN2664196Y (en) * 2003-10-25 2004-12-15 鸿富锦精密工业（深圳）有限公司 Liquid cooling type heat sink

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102123577A (en) * 2009-12-18 2011-07-13 瓦孔厄伊公司 Arrangement in a liquid cooler
CN102123577B (en) * 2009-12-18 2014-02-19 瓦孔厄伊公司 Arrangement in a liquid cooler
CN102841579A (en) * 2011-06-24 2012-12-26 鸿富锦精密工业（深圳）有限公司 Server heat dissipation control system and method
CN103629850A (en) * 2013-12-04 2014-03-12 中国科学院光电技术研究所 Liquid cooling head for air cooling and liquid cooling dual-purpose heat radiator
CN105658028A (en) * 2015-12-31 2016-06-08 上海理工大学 Plate type injection heat radiator
CN105658028B (en) * 2015-12-31 2017-11-28 上海理工大学 A kind of board-like injection radiator
CN107764111A (en) * 2016-08-16 2018-03-06 宏碁股份有限公司 Heat abstractor
CN107764111B (en) * 2016-08-16 2019-06-14 宏碁股份有限公司 Radiator
CN109923730A (en) * 2017-07-11 2019-06-21 株式会社Lg化学 Battery module and battery pack including the battery module
CN109923730B (en) * 2017-07-11 2022-04-12 株式会社Lg化学 Battery module and battery pack including the same
TWI804768B (en) * 2020-11-06 2023-06-11 建準電機工業股份有限公司 Liquid cooling module and electronic device including the same

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