TWI747714B - Heat dissipation module and manufacturing method thereof - Google Patents
Heat dissipation module and manufacturing method thereof Download PDFInfo
- Publication number
- TWI747714B TWI747714B TW110101607A TW110101607A TWI747714B TW I747714 B TWI747714 B TW I747714B TW 110101607 A TW110101607 A TW 110101607A TW 110101607 A TW110101607 A TW 110101607A TW I747714 B TWI747714 B TW I747714B
- Authority
- TW
- Taiwan
- Prior art keywords
- ring
- heat dissipation
- wall
- ring wall
- cylindrical
- Prior art date
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
本發明是有關於一種包括熱管及複數散熱鰭片的散熱模組,且特別是有關於一種散熱模組及其製造方法。 The invention relates to a heat dissipation module including a heat pipe and a plurality of heat dissipation fins, and more particularly to a heat dissipation module and a manufacturing method thereof.
按,隨著電子元件的運算速度不斷提昇,其所產生的熱量亦越來越高,為了有效地解決此高發熱量的問題,業界已設計有多種形式的散熱裝置來提供散熱,但現存的散熱裝置在實際應用上仍存在需要改善的空間。 According to the fact that as the computing speed of electronic components continues to increase, the heat generated by them is getting higher and higher. In order to effectively solve the problem of high heat generation, the industry has designed various types of heat dissipation devices to provide heat dissipation, but the existing heat dissipation There is still room for improvement in the actual application of the device.
習知的散熱裝置,其主要包括熱管、導熱塊及複數散熱鰭片,熱管穿接於導熱塊,複數散熱鰭片串設於熱管,再利用導熱塊貼接於中央處理器等電子元件,從而將中央處理器等電子元件之熱量經由熱管及鰭片組散逸至外部環境。 The conventional heat dissipation device mainly includes a heat pipe, a heat conduction block and a plurality of heat dissipation fins. The heat pipe penetrates the heat conduction block, and the plurality of heat dissipation fins are arranged in series on the heat pipe, and then the heat conduction block is attached to electronic components such as the central processing unit. Dissipate the heat of the electronic components such as the central processing unit to the external environment through the heat pipe and the fin group.
然而,上述複數散熱鰭片串設於熱管之過程,若各散熱鰭片無法穩固地定位在熱管上,則會影響散熱裝置的散熱效率與結構強度。因此,如何讓各散熱鰭片穩固定位於熱管,係散熱裝置業者亟待加以解決的問題。 However, in the process of arranging the plurality of heat dissipation fins in series on the heat pipe, if the heat dissipation fins cannot be firmly positioned on the heat pipe, the heat dissipation efficiency and structural strength of the heat dissipation device will be affected. Therefore, how to securely fix the heat dissipation fins on the heat pipe is a problem that the heat dissipation device industry needs to solve urgently.
有鑑於此,本發明人遂針對上述現有技術,特潛心研究並配合學理的運用,盡力解決上述之問題點,即成為本發明人開發之目標。 In view of this, the inventor of the present invention focused on the above-mentioned prior art, and made great efforts to solve the above-mentioned problems, which became the goal of the present inventor's development.
本發明提供一種散熱模組及其製造方法,其係利用環圈以迫緊方式套接於環牆,以令環牆嵌入且束緊於外環壁,以達到散熱模組具有優良地散熱效率與結構強度。 The present invention provides a heat dissipation module and a manufacturing method thereof, which utilizes a ring ring to be sleeved on a ring wall in a tight manner, so that the ring wall is embedded and tightened on the outer ring wall, so that the heat dissipation module has excellent heat dissipation efficiency And structural strength.
於本發明實施例中,本發明係提供一種散熱模組,包括:一熱管,具有一外環壁;複數散熱鰭片,每一該散熱鰭片設有一穿孔及具有形成在該穿孔外周緣的一環牆,該複數散熱鰭片透過各該穿孔以間隔疊置方式套設於該熱管;以及複數環圈,各該環圈以迫緊方式套接於各該環牆,以令各該環牆嵌入且束緊於該外環壁。 In an embodiment of the present invention, the present invention provides a heat dissipation module, including: a heat pipe with an outer ring wall; A ring wall, the plurality of radiating fins are sleeved on the heat pipe in an overlapping manner through each of the through holes; Embedded and tightened to the outer ring wall.
於本發明實施例中,本發明係提供一種散熱模組的製造方法,其步驟包括:a)提供一散熱鰭片,該散熱鰭片設有一穿孔及具有形成在該穿孔外周緣的一環牆;b)提供一環圈,該環圈為一錐形環圈,該錐形環圈具有上、下配置的一上底開口及一下底開口,該上底開口的內徑小於該環牆的外徑,該下底開口的內徑大於該環牆的外徑,將該錐形環圈套設在該環牆上;c)提供一熱管,該散熱鰭片透過該穿孔束緊地套接在該熱管的外部;以及d)提供一擠壓治具,所述擠壓治具對該錐形環圈進行下壓作業,使得該錐形環圈變形而迫緊地套接於該環牆,直到該環牆被該環圈抵壓變形而嵌入且束緊於該外環壁。 In an embodiment of the present invention, the present invention provides a method for manufacturing a heat dissipation module, the steps of which include: a) providing a heat dissipation fin, the heat dissipation fin is provided with a through hole and a ring wall formed on the outer periphery of the through hole; b) Provide a ring, the ring is a conical ring, the conical ring has an upper bottom opening and a lower bottom opening arranged on top and bottom, the inner diameter of the upper bottom opening is smaller than the outer diameter of the ring wall , The inner diameter of the lower bottom opening is larger than the outer diameter of the ring wall, and the tapered ring is sleeved on the ring wall; c) a heat pipe is provided, and the heat dissipation fin is tightly sleeved on the heat pipe through the perforation And d) providing an extrusion jig that presses down the tapered ring so that the tapered ring is deformed and tightly sleeved on the ring wall until the The ring wall is pressed and deformed by the ring ring to be embedded and tightened to the outer ring wall.
於本發明實施例中,本發明係提供一種散熱模組的製造方法,其步驟包括:e)提供一散熱鰭片,該散熱鰭片設有一穿孔及具有形成在該穿孔外周緣的一環牆;f)提供一環圈,該環圈為一柱形環圈,將該柱形環圈束緊地套接在該環牆的外部;g)提供一熱管,該熱管具有一外環壁,該散熱鰭片透過該穿孔束緊地套接在該熱管的外部;以及h)提供一擠壓治具,所述擠壓治具對該 柱形環圈進行內壓作業,直到該環牆被該環圈抵壓變形而嵌入且束緊於該外環壁。 In an embodiment of the present invention, the present invention provides a method for manufacturing a heat dissipation module, the steps of which include: e) providing a heat dissipation fin, the heat dissipation fin is provided with a through hole and a ring wall formed on the outer periphery of the through hole; f) Provide a ring, the ring is a cylindrical ring, the cylindrical ring is tightly sleeved on the outside of the ring wall; g) Provide a heat pipe, the heat pipe has an outer ring wall, the heat dissipation The fins are tightly sleeved on the outside of the heat pipe through the perforation; and h) an extrusion jig is provided to the The cylindrical ring performs internal pressure operation until the ring wall is pressed and deformed by the ring to be embedded and tightened on the outer ring wall.
基於上述,散熱鰭片透過穿孔束緊地套接在熱管的外部時,熱管會些微撐大環牆,導致散熱鰭片無法穩固地定位在熱管上,之後將環圈以迫緊方式套接於環牆,則環牆會被環圈擠壓而嵌入且束緊於外環壁,使得環牆緊密地熱貼接於外環壁,進而讓熱管的熱量能快速地傳遞至散熱鰭片,同時散熱鰭片也能穩固地定位在熱管上,以達到散熱模組具有優良地散熱效率與結構強度。 Based on the above, when the radiating fins are tightly sleeved on the outside of the heat pipe through the perforations, the heat pipe will slightly support the ring wall, resulting in the radiating fins cannot be firmly positioned on the heat pipe, and then the ring is sleeved tightly Ring wall, the ring wall will be squeezed by the ring to be embedded and tightened to the outer ring wall, so that the ring wall is closely thermally attached to the outer ring wall, so that the heat of the heat pipe can be quickly transferred to the radiating fins, and at the same time dissipate heat. The fins can also be firmly positioned on the heat pipe to achieve excellent heat dissipation efficiency and structural strength of the heat dissipation module.
10:散熱模組 10: Cooling module
1:熱管 1: Heat pipe
11:外環壁 11: Outer ring wall
112:柱形環槽 112: Cylindrical ring groove
12:頂端 12: top
2:散熱鰭片 2: cooling fins
21:穿孔 21: Piercing
22:環牆 22: Ring Wall
222:柱形環牆 222: Columnar Ring Wall
23:凸字形搭接片 23: Embossed lap joint
24:卡榫 24: Tenon
3:環圈 3: ring
31:錐形環圈 31: Conical ring
311:上底開口 311: upper bottom opening
312:下底開口 312: bottom opening
32:柱形環圈 32: Cylindrical ring
S1、S2、S3:內徑 S1, S2, S3: inner diameter
W1、W2:外徑 W1, W2: outer diameter
100:擠壓治具 100: Extrusion fixture
a~h:步驟 a~h: steps
圖1 係本發明散熱模組的製造方法之步驟流程圖。 FIG. 1 is a flowchart of the steps of the manufacturing method of the heat dissipation module of the present invention.
圖2 係本發明環圈欲套接於環牆之立體圖。 Figure 2 is a three-dimensional view of the ring of the present invention to be sleeved on the ring wall.
圖3 係本發明散熱鰭片欲套設於熱管之立體圖。 Fig. 3 is a perspective view of the heat dissipation fins of the present invention to be sheathed on the heat pipe.
圖4 係本發明散熱鰭片欲套設於熱管之剖面圖。 Figure 4 is a cross-sectional view of the heat dissipation fins of the present invention to be sleeved on the heat pipe.
圖5 係本發明複數散熱鰭片欲依序套設於熱管之立體圖。 Fig. 5 is a three-dimensional view of a plurality of heat dissipation fins of the present invention to be sequentially fitted on the heat pipe.
圖6 係本發明複數散熱鰭片欲依序套設於熱管之剖面圖。 Fig. 6 is a cross-sectional view of a plurality of heat dissipation fins of the present invention to be sequentially nested on the heat pipe.
圖7 係本發明複數散熱鰭片已套設於熱管之立體圖。 Figure 7 is a three-dimensional view of the present invention in which a plurality of heat dissipation fins have been sheathed on the heat pipe.
圖8 係本發明複數散熱鰭片已套設於熱管之剖面圖。 Fig. 8 is a cross-sectional view of the heat pipe with the plurality of heat dissipation fins of the present invention.
圖9 係圖8中虛線框選處之局部放大圖。 Figure 9 is a partial enlarged view of the part selected by the dotted line in Figure 8.
圖10 係本發明散熱模組的製造方法另一實施例之步驟流程圖。 10 is a flowchart of another embodiment of the manufacturing method of the heat dissipation module of the present invention.
圖11 係本發明環圈欲套接於環牆另一實施例之立體圖。 Figure 11 is a three-dimensional view of another embodiment of the ring of the present invention to be sleeved on the ring wall.
圖12 係本發明散熱鰭片欲套設於熱管另一實施例之剖面圖。 FIG. 12 is a cross-sectional view of another embodiment of the heat dissipation fins to be sleeved on the heat pipe of the present invention.
圖13 係本發明複數散熱鰭片已套設於熱管另一實施例之剖面圖。 FIG. 13 is a cross-sectional view of another embodiment of the present invention where a plurality of heat dissipation fins have been sleeved on the heat pipe.
圖14 係本發明擠壓治具對柱形環圈進行內壓作業之剖面圖。 Figure 14 is a cross-sectional view of the internal pressure operation of the cylindrical ring by the extrusion jig of the present invention.
有關本發明之詳細說明及技術內容,將配合圖式說明如下,然而所附圖式僅作為說明用途,並非用於侷限本發明。 The detailed description and technical content of the present invention will be described as follows in conjunction with the drawings. However, the accompanying drawings are for illustrative purposes only, and are not intended to limit the present invention.
請參考圖1至圖9所示,本發明係提供一種散熱模組及其製造方法,此散熱模組10主要包括一或複數熱管1、複數散熱鰭片2及複數環圈3。
Please refer to FIG. 1 to FIG. 9. The present invention provides a heat dissipation module and a manufacturing method thereof. The
如圖1所示,係本發明散熱模組10的製造方法之步驟,詳細說明如下。第一、如圖1之步驟a、圖2所示,提供一散熱鰭片2,散熱鰭片2設有一穿孔21及具有形成在穿孔21外周緣的一環牆22。其中,本實施例之散熱鰭片2上的穿孔21、環牆22的數量為複數,但不以此為限制。
As shown in FIG. 1, the steps of the method for manufacturing the
第二、如圖1之步驟b、圖2至圖4所示,提供一環圈3,環圈3為一錐形環圈31,錐形環圈31具有上、下配置的一上底開口311及一下底開口312,上底開口311的內徑S2小於環牆22的外徑W2,下底開口312的內徑S3大於環牆22的外徑W2,將錐形環圈31套設在環牆22上。
Second, as shown in step b of Figure 1 and Figures 2 to 4, a
詳細說明如下,步驟b中,錐形環圈31的內徑自下底開口312至上底開口311逐漸縮減尺寸。
The detailed description is as follows. In step b, the inner diameter of the
其中,上底開口311的內徑S2與環牆22的外徑W2的尺寸差介於0.05mm至0.1mm,下底開口312的內徑S3與環牆22的外徑W2的尺寸差介於0.05mm至0.1mm,且本實施例之環圈3的數量為複數,但不以此為限制。
Wherein, the size difference between the inner diameter S2 of the upper bottom opening 311 and the outer diameter W2 of the
此外,環圈3的硬度大於環牆22的硬度,舉例說明如下,環牆22為銅材質所構成,則環圈3為鋁、鐵或不銹鋼等硬度大於銅的材質所構成。
In addition, the hardness of the
第三、如圖1之步驟c、圖3至圖6所示,提供一熱管1,熱管1具有一外環壁11,散熱鰭片2透過穿孔21束緊地套接在熱管1的外部。其中,本實施例之熱管1的數量為複數,但不以此為限制。
Third, as shown in step c of FIG. 1 and FIGS. 3 to 6, a
另外,步驟c中,熱管1具有一頂端12,下底開口312相較上底開口311鄰近於頂端12配置,散熱鰭片2自熱管1的頂端12套設於熱管1上,且環牆22為一柱形環牆222,柱形環牆222的內徑S1小於熱管1的外徑W1,柱形環牆222的內徑S1與熱管1的外徑W1的尺寸差介於0.05mm至0.1mm,以令柱形環牆222束緊於外環壁11。舉例說明如下,熱管1的外徑W1為8mm時,則柱形環牆222的內徑S1約為7.9mm,但不以此為限制。
In addition, in step c, the
第四、如圖1之步驟d、圖5至圖9所示,提供一擠壓治具100,擠壓治具100對錐形環圈31進行下壓作業,使得錐形環圈31變形而迫緊地套接於環牆22,直到環牆22被環圈3抵壓變形而嵌入且束緊於外環壁11。
Fourth, as shown in step d of Figure 1 and Figures 5 to 9, an
進一步說明如下,步驟d中,環圈3以迫緊方式套接於環牆22,使外環壁11被環牆22擠壓而形成有一柱形環槽112,柱形環牆222以迫緊方式嵌設於柱形環槽112,以令各環牆22嵌入且束緊於外環壁11。
Further description is as follows. In step d, the
另外,本實施例之散熱鰭片2的數量為複數,複數散熱鰭片2透過各穿孔21以間隔疊置方式套設於熱管1,各散熱鰭片2的外周緣向上延伸有相互嵌接的複數凸字形搭接片23及向外延伸有插接在各相鄰的二凸字形搭接片23之間的複數卡榫24,使複數散熱鰭片2穩固地搭接且層疊在一起。
In addition, the number of radiating
如圖4至圖9所示,係本發明散熱模組10之使用狀態,當散熱鰭片2透過穿孔21束緊地套接在熱管1的外部時,熱管1會些微撐大環牆22,導致散熱鰭片2無法穩固地定位在熱管1上,之後將環圈3以迫緊方式套接於環牆22,則環
牆22會被環圈3擠壓而嵌入且束緊於外環壁11,使得環牆22緊密地熱貼接於外環壁11,進而讓熱管1的熱量能快速地傳遞至散熱鰭片2,同時散熱鰭片2也能穩固地定位在熱管1上,以達到散熱模組10具有優良地散熱效率與結構強度。
As shown in Figs. 4-9, the
另外,環牆22被環圈3朝熱管1方向擠壓,使環牆22的部分確實地嵌入且束緊熱管1的外環壁11,進而更加強散熱模組10之散熱效率與結構強度。
In addition, the
請參考圖10至圖14所示,係本發明散熱模組10的製造方法另一實施例,如圖10所示,係本發明散熱模組10的製造方法另一實施例之步驟,詳細說明如下。
Please refer to FIG. 10 to FIG. 14, which is another embodiment of the method of manufacturing the
第一、如圖10之步驟e、圖11所示,提供散熱鰭片2,散熱鰭片2設有穿孔21及具有形成在穿孔21外周緣的環牆22。其中,本實施例之散熱鰭片2上的穿孔21、環牆22的數量為複數,但不以此為限制。
First, as shown in step e of FIG. 10 and FIG. 11, a
第二、如圖10之步驟f、圖11至圖12所示,提供環圈3,環圈3為一柱形環圈32,將柱形環圈32束緊地套接在環牆22的外部。
Second, as shown in step f of Figure 10 and Figures 11 to 12, a
其中,柱形環圈32的內徑與環牆22的外徑W2的尺寸差介於0.05mm至0.1mm,且本實施例之環圈3的數量為複數,但不以此為限制。
Wherein, the size difference between the inner diameter of the
此外,環圈3的硬度大於環牆22的硬度,舉例說明如下,環牆22為銅材質所構成,則環圈3為鋁、鐵或不銹鋼等硬度大於銅的材質所構成。
In addition, the hardness of the
第三、如圖10之步驟g、圖12至圖13所示,提供熱管1,熱管1具有外環壁11,散熱鰭片2透過穿孔21束緊地套接在熱管1的外部。其中,本實施例之熱管1的數量為複數,但不以此為限制。
Third, as shown in step g of FIG. 10 and FIGS. 12 to 13, a
另外,步驟g中,環牆22為柱形環牆222,柱形環牆222的內徑S1小於熱管1的外徑W1,柱形環牆222的內徑S1與熱管1的外徑W1的尺寸差介於0.05mm至0.1mm,以令柱形環牆222束緊於外環壁11。舉例說明如下,熱管1的外徑W1為8mm時,則柱形環牆222的內徑S1約為7.9mm,但不以此為限制。
In addition, in step g, the
第四、如圖10之步驟h、圖14所示,提供一擠壓治具100,擠壓治具100對柱形環圈32進行內壓作業,直到環牆22被環圈3抵壓變形而嵌入且束緊於外環壁11。
Fourth, as shown in step h of Figure 10 and Figure 14, an
進一步說明如下,步驟h中,環圈3以迫緊方式套接於環牆22,使外環壁11被環牆22擠壓而形成有柱形環槽112,柱形環牆222以迫緊方式嵌設於柱形環槽112,以令各環牆22嵌入且束緊於外環壁11。
Further description is as follows. In step h, the
另外,本實施例之散熱鰭片2的數量為複數,複數散熱鰭片2透過各穿孔21以間隔疊置方式套設於熱管1,各散熱鰭片2的外周緣向上延伸有相互嵌接的複數凸字形搭接片23及向外延伸有插接在各相鄰的二凸字形搭接片23之間的複數卡榫24,使複數散熱鰭片2穩固地搭接且層疊在一起。
In addition, the number of radiating
藉此,經過上述圖10之步驟e至步驟h,即可完成相同於圖7至圖9的散熱模組10結構,因此採用上述步驟a至步驟d及步驟e至步驟h之兩種製造方法皆可製作出本發明散熱模組10。
Thereby, after step e to step h in FIG. 10, the same structure as the
綜上所述,本發明之散熱模組及其製造方法,亦未曾見於同類產品及公開使用,並具有產業利用性、新穎性與進步性,完全符合專利申請要件,爰依專利法提出申請,敬請詳查並賜准本案專利,以保障發明人之權利。 In summary, the heat dissipation module and its manufacturing method of the present invention have never been seen in similar products and publicly used, and it is industrially usable, novel and progressive, and fully meets the requirements of a patent application. The application is filed in accordance with the Patent Law. Please check carefully and grant the patent for this case to protect the rights of the inventor.
10:散熱模組 10: Cooling module
1:熱管 1: Heat pipe
11:外環壁 11: Outer ring wall
12:頂端 12: top
2:散熱鰭片 2: cooling fins
22:環牆 22: Ring Wall
23:凸字形搭接片 23: Embossed lap joint
24:卡榫 24: Tenon
3:環圈 3: ring
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110101607A TWI747714B (en) | 2021-01-15 | 2021-01-15 | Heat dissipation module and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110101607A TWI747714B (en) | 2021-01-15 | 2021-01-15 | Heat dissipation module and manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI747714B true TWI747714B (en) | 2021-11-21 |
TW202230660A TW202230660A (en) | 2022-08-01 |
Family
ID=79907577
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110101607A TWI747714B (en) | 2021-01-15 | 2021-01-15 | Heat dissipation module and manufacturing method thereof |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI747714B (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2284885A1 (en) * | 2009-07-31 | 2011-02-16 | Cpumate Inc. | Heat-dissipating fin capable of increasing heat-dissipating area, heat sink having such heat-dissipating fins, and method for manufacturing the same |
CN204272573U (en) * | 2014-11-26 | 2015-04-15 | 林俊宏 | One is exempted to weld finned radiator |
WO2017098706A1 (en) * | 2015-12-10 | 2017-06-15 | パナソニックIpマネジメント株式会社 | Light conversion device and projection display device provided with same |
TWM558388U (en) * | 2017-12-20 | 2018-04-11 | Taiwan Microloops Corp | Heat-dissipation module |
-
2021
- 2021-01-15 TW TW110101607A patent/TWI747714B/en active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2284885A1 (en) * | 2009-07-31 | 2011-02-16 | Cpumate Inc. | Heat-dissipating fin capable of increasing heat-dissipating area, heat sink having such heat-dissipating fins, and method for manufacturing the same |
CN204272573U (en) * | 2014-11-26 | 2015-04-15 | 林俊宏 | One is exempted to weld finned radiator |
WO2017098706A1 (en) * | 2015-12-10 | 2017-06-15 | パナソニックIpマネジメント株式会社 | Light conversion device and projection display device provided with same |
TWM558388U (en) * | 2017-12-20 | 2018-04-11 | Taiwan Microloops Corp | Heat-dissipation module |
Also Published As
Publication number | Publication date |
---|---|
TW202230660A (en) | 2022-08-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20110162206A1 (en) | Method for connecting heat-dissipating fin and heat pipe | |
US8997839B2 (en) | Thin heat pipe structure and method of manufacturing same | |
US8359745B2 (en) | Method for manufacturing a heat sink | |
US7898809B2 (en) | Heat sink and method of manufacturing the same | |
WO2014134911A1 (en) | Rib-line type radiator and manufacturing method therefor | |
JP5491634B2 (en) | Manufacturing method of heat pipe type heat dissipation device | |
TWI747714B (en) | Heat dissipation module and manufacturing method thereof | |
TWM613927U (en) | Heat dissipation module | |
TWI781515B (en) | Heat dissipation structure and manufacturing method thereof | |
US7142426B2 (en) | Heat dissipating device and method for manufacturing it | |
TWM613925U (en) | Heat dissipation structure | |
US20220364798A1 (en) | Heat dissipation module and manufacturing method thereof | |
JP2009222218A (en) | Fastener with flange | |
CN214381956U (en) | Heat radiation module | |
US20220346274A1 (en) | Heat dissipation structure and manufacturing method thereof | |
CN214381955U (en) | Heat radiation structure | |
US20110277965A1 (en) | Fin and heat sink having the same | |
CN114828534A (en) | Heat dissipation structure and manufacturing method thereof | |
JP6734594B2 (en) | Heat sink, method for manufacturing the heat sink, and electronic component package using the heat sink | |
CN114828535A (en) | Heat radiation module and manufacturing method thereof | |
TWI398214B (en) | A heat-dissipating fin capable of increasing heat-dissipating area includes a lower plate and an upper plate | |
EP2284885B1 (en) | Heat-dissipating fin capable of increasing heat-dissipating area, heat sink having such heat-dissipating fins, and method for manufacturing the same | |
TWM558388U (en) | Heat-dissipation module | |
CN104869783B (en) | Heat dissipation module assembly structure and manufacturing method thereof | |
TW201407326A (en) | Heat sink structure and manufacturing method thereof |