CN108761971B - Electronic equipment and heat dissipation assembly - Google Patents

Electronic equipment and heat dissipation assembly Download PDF

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Publication number
CN108761971B
CN108761971B CN201810597798.0A CN201810597798A CN108761971B CN 108761971 B CN108761971 B CN 108761971B CN 201810597798 A CN201810597798 A CN 201810597798A CN 108761971 B CN108761971 B CN 108761971B
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area
camera
heat
frame
region
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CN201810597798.0A
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CN108761971A (en
Inventor
田汉卿
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Priority to CN201810597798.0A priority Critical patent/CN108761971B/en
Publication of CN108761971A publication Critical patent/CN108761971A/en
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • G03B17/55Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft

Abstract

The application relates to an electronic equipment and radiator unit, radiator unit includes: a camera; the middle frame comprises a main body part, and the first side surface of the main body part comprises a first area for arranging a camera and a second area for arranging a battery of the electronic equipment; and the heat pipe is arranged on the middle frame and extends from the first area to the second area, and is in heat conduction connection with the camera in the first area so as to guide heat generated by the camera to the second area. Therefore, the heat generated by the camera is guided to the area of the middle frame where the battery is arranged by the heat conduction characteristic of the heat pipe, and the heat is effectively diffused to the periphery by the low-temperature area, so that the heat is effectively dissipated.

Description

Electronic equipment and heat dissipation assembly
Technical Field
The present application relates to the field of electronic devices, and in particular, to an electronic device and a heat dissipation assembly.
Background
With the progress of science and technology and the pursuit of people on the living standard, various functions are continuously developed and perfected aiming at electronic equipment to meet the needs of people. For example, in the existing mobile phone, only the functions of telephone and short message can not meet the requirements of people any more, so that the functions of camera shooting, qq, WeChat and the like are added. This causes problems such as power consumption and heat generation. If the camera generates heat, the function of the camera is affected, and the use experience of a user is reduced.
Disclosure of Invention
The embodiment of the application adopts a technical scheme that: provided is a heat dissipation assembly of an electronic device, the heat dissipation assembly including:
a camera;
the middle frame comprises a main body part, and a first side face of the main body part comprises a first area for arranging the camera and a second area for arranging a battery of the electronic equipment;
at least one heat pipe is arranged on the middle frame and extends from the first area to the second area, and the heat pipe is in heat conduction connection with the camera in the first area so as to guide heat generated by the camera to the second area.
Another technical scheme adopted by the embodiment of the application is as follows: there is provided an electronic device comprising the heat dissipation assembly as described above.
This application sets up the region of battery through the heat pipe with the heat guide of camera production to the center, dispels the heat to the camera through the center in battery region. Because the battery is usually arranged in the middle or near the middle of the middle frame, the position is usually far away from the camera, and when the camera works, the temperature of the area is usually low, so that the heat generated by the camera can be guided to the area of the middle frame where the battery is arranged through the heat conduction characteristic of the heat pipe, and the heat is effectively diffused to the periphery through the low-temperature middle area to be effectively dissipated.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:
fig. 1 is a schematic structural diagram of an electronic device in a top view according to an embodiment of the present disclosure;
FIG. 2 is a schematic cross-sectional view of the electronic device shown in FIG. 1 along the dashed line A1-A2;
FIG. 3 is a schematic structural diagram of a middle frame of the electronic device shown in FIG. 1;
fig. 4 is a schematic structural diagram of another electronic device in a top view according to an embodiment of the present disclosure;
fig. 5 is a schematic top view of another electronic device provided in the embodiments of the present application;
FIG. 6 is a schematic structural diagram of a middle frame of the electronic device shown in FIG. 5;
FIG. 7 is a schematic structural view of a middle frame of another heat dissipation assembly provided in the present application;
FIG. 8 is a schematic structural view of another heat dissipation assembly provided herein;
fig. 9 is a schematic structural diagram of another heat dissipation assembly provided in the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application. It should be further noted that, for the convenience of description, only some of the structures related to the present application are shown in the drawings, not all of the structures. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms "first", "second", etc. in this application are used to distinguish between different objects and not to describe a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Referring to fig. 1 and fig. 3 together, fig. 1 is a schematic top view structure diagram of an electronic device according to an embodiment of the present disclosure, fig. 2 is a schematic cross-sectional structure diagram of the electronic device shown in fig. 1 along a dashed line a1-a2, and fig. 3 is a schematic structure diagram of a middle frame of the electronic device shown in fig. 1. As shown in fig. 1 to 3, the electronic device 10 of the present embodiment includes a heat dissipation assembly 11, a display 12, and a battery 13.
The heat sink assembly 11 includes a camera 111, a middle frame 112, and a heat pipe 113.
The material of the middle frame 112 may include metal, glass, plastic, and the like. The metal material may include copper, aluminum, silver, and alloys of at least two thereof. The material of the middle frame 112 in the present embodiment is preferably metal because metal has good hardness, thermal conductivity, and the like.
The middle frame 112 includes a side wall 1121 and a body portion 1122. The body portion 1122 may have a quadrilateral configuration including a first side 1123 and a second side 1124 disposed opposite to each other. The four side walls 1121 extend from the four sides of the main body 1122 in a direction perpendicular to the main body 1122. Specifically, the four side walls 1121 extend in the same direction from four sides of the first side surface 1123 of the main body 1122, and intersect end to end. The four sidewalls 1121 and the first side surface 1123 of the body portion 1122 form an accommodating space. Wherein the first side 1123 comprises a first area 1125 and a second area 1126.
In the present embodiment, four sides of the quadrilateral structure of the main body 1122 may be connected at right angles or in an arc transition.
It should be understood that in other embodiments, body portion 1122 may have other configurations, such as a polygonal configuration, a circular configuration, or the like.
The camera 111 is disposed in the first region 1125 of the first side surface 1123 of the body portion 1122. The camera 111 is disposed on the first region 1125 of the main body 1122 with the main body of the first region 1125 as a supporting surface.
As shown in fig. 1 and 3, the first region 1125 is proximate to the intersecting two sidewalls 1126 and 1127. I.e., the camera 111 is positioned adjacent to the sidewalls 1126 and 1127 of the center frame 112. The sidewalls 1126 and 1127 are the left and upper sidewalls shown in fig. 1 and 3, respectively. That is, the camera 111 is disposed at the upper left position of the middle frame 112.
In other embodiments, the camera 111 may be disposed at other positions, such as only near the upper sidewall 1126 and at a corresponding middle position of the upper sidewall 1126. Or at an end of the upper sidewall 1126 remote from the left sidewall 1127.
Further, a heat insulating member 14 is further provided between the camera 111 and the adjacent side wall.
In this embodiment, as shown in fig. 1 and 3, the sidewalls 1126 and 1127 are hollowed out at locations corresponding to the cameras 111 to form recesses 1128. The thermal insulation 14 is disposed in the groove 1128. The thermal shield 14 may be formed of plastic and may be injection molded with the sidewalls 1126 and 1127. Whereby the strength of the side walls 1126 and 1127 can be ensured. Of course, the sidewalls 1126 and 1127 and the thermal insulation 14 may also be separate elements, with the thermal insulation 14 being disposed in the recess 1128 by nesting or gluing, etc.
The thickness of the thermal shield 14 may be equal to the depth of the groove 1128. The length of the thermal shield 14 may be equal to the length of the groove 1128. The length of the camera head 111 may be equal to the length of the thermal shield 14, thereby thermally isolating the camera head 111 from its corresponding side walls 1126 and 1127. The heat generated by the camera 111 is prevented from being concentrated in the middle frame nearby the camera 111, so that the electronic device 10 is prevented from being locally heated excessively at the position of the camera 111, and the performance of the camera and the experience of a user are prevented from being influenced.
In other embodiments, the thickness of the thermal shield 14 may also be greater than the depth of the groove 1128. The length of the thermal shield 14 may also be greater than the length of the camera head 111. The strength of the sidewalls 1126 and 1127 and the thermal isolation effect on the camera head 111 can be further improved.
It should be understood that when the camera 111 is disposed at other positions, the relationship between the camera and the thermal insulation member is similar to that described above, and will not be described herein.
The battery 13 is disposed in the second region 1126 of the first side surface 1123 of the body portion 1122. Wherein the second region 1126 is generally disposed away from the first region 1125. For example, as shown in fig. 1 and 3, the first region 1125 is disposed at the upper left of the middle frame 112, and the second region 1126 is disposed at the middle and lower portions of the middle frame 112. The battery 13 typically generates a relatively large amount of heat during charging and a relatively small amount of heat during power use. Therefore, in a state where the camera 111 is used, the heat amount of the first region 1125 is generally higher than that of the second region 1126.
At least one heat pipe 113. The present embodiment illustrates only one heat pipe, and it should be understood that in other embodiments, the number of heat pipes 113 may be increased according to actual situations. For example, as shown in fig. 4, two heat pipes 113 may be provided, and similarly, other numbers of heat pipes may be provided, which are not described herein.
The heat pipe 113 is disposed on the middle frame 112 and extends from the first region 1125 to the second region 1126. In the first region 1125 is in heat conducting connection with the camera head 111 for conducting heat generated by the camera head 111 to the second region 1126.
The heat pipe 113 uses the phase change principle and capillary action, so that its heat transfer efficiency is hundreds to thousands times higher than that of metal of the same material. The heat pipe 113 is a vacuum copper pipe, and the working fluid injected therein is a medium for heat transfer. The working liquid can be purified water. The wall of the heat pipe is provided with a liquid absorption core structure. The condensed liquid is returned from the condensing end to the evaporating end by virtue of capillary forces generated by the wick.
Since the liquid is injected before the sealing after the inside of the heat pipe 113 is evacuated, the pressure inside the heat pipe 113 is determined by the vapor pressure after the working liquid is evaporated. The working liquid evaporates as long as the surface of the heat pipe 113 is heated. The vapor at the evaporator end is at a slightly higher temperature and pressure than the rest of the heat pipe, and therefore, a pressure differential is created within the heat pipe 113, causing vapor to flow to the cooler end of the heat pipe. When the steam condenses on the hot tube walls, the steam gives off latent heat of vaporization, thereby transferring heat to the condensing end. The wick structure of the heat pipe then returns the condensed liquid to the evaporator end. The process is cycled as long as the heat source is available for heating.
In a state where the camera 111 is used, the first region 1125 has a higher heat amount than the second region 1126. The heat pipe 113 in the first region 1125 has a higher temperature, the working liquid evaporates, and the vapor has a higher temperature and pressure than the rest of the heat pipe 113 (including the heat pipe in the second region). A pressure differential is created within the heat pipe 113 that causes steam to flow into one end of the heat pipe at the second region 1126. As the steam condenses on the walls of the heat pipe, the steam gives off latent heat of vaporization, transferring the heat to the middle frame of the second region 1126, allowing heat to be dissipated in the middle frame of the second region 1126 away from the first region 1125.
In this embodiment, the main body 1122 of the middle frame 112 is provided with a groove 1129. The groove 1129 extends from the first region 1125 to the second region 1126, and the groove 1129 extends in a curved manner and passes through a central position of the body portion 1122. The heat pipe 113 is disposed in the groove 1129 and is embedded inside the main body portion 1122 of the bezel 112. That is, the heat pipe 113 extends from the first region 1125 to the second region 1126 in a curved manner and passes through the center of the main body 1122, so that the length of the pipe section of the heat pipe can be increased to achieve a better heat dissipation effect. The heat pipe is arranged in the center of the main body portion 1122 of the middle frame, so that heat can be guided to the center of the main body portion 1122, the heat can be conveniently diffused to the periphery of the main body portion 1122, and the heat dissipation effect is further improved.
The thickness of the heat pipe 113 may be equal to the thickness of the groove 1129. Accordingly, the outer surface of the heat pipe 113 is flush with respect to the first side surface 1123 of the body portion 1122.
In other embodiments, the thickness of the heat pipe 113 may be greater than the thickness of the groove 1129. An outer surface of the heat pipe 13 protrudes with respect to the first side surface 1123 of the body portion 1122.
The heat pipe 113 is in contact with the camera 111 at a first region 1125 to form a thermally conductive connection. In a second region 1126, is connected in a thermally insulating manner to the battery 13. Specifically, the heat dissipating module 11 further provides a heat insulator 114, and the heat insulator 114 is disposed between the battery 13 and the heat pipe 113 and covers the heat pipe 113 located in the second region 1126. And the size of the thermal insulation member 114 may be equal to or greater than the size of the battery 13. For preventing the heat of the heat pipe 113 and the heat of the middle frame of the second region 1126 from being transferred to the battery 13 to heat the battery 13. The material used for the insulation 114 may be the same as that of the insulation 14.
The display screen 12 is disposed on a side of a second side 1124 disposed on the center frame 112. The substrate of the display 12 may be glass. Other materials are also possible. The heat dissipation assembly 11 further includes a heat dissipation member 115, the heat dissipation member 115 is disposed between the display 12 and the second side 1124 of the middle frame 112, and the heat in the middle frame 112 can be further transmitted to the display 12 through the heat dissipation member 115, and the heat dissipation is assisted by the display 12. If the substrate of the display 12 is made of glass, it also has a better heat dissipation capability, so as to improve the heat dissipation capability of the whole electronic device 10.
The heat dissipation member 115 may be made of graphite or metal.
Referring to fig. 5, fig. 5 is a schematic top view of another electronic device according to an embodiment of the present disclosure. As shown in fig. 5, the electronic device 20 of the present embodiment still includes a heat dissipation assembly 21, a display (not shown), and a battery 23.
The heat sink assembly 21 includes a camera 211, a middle frame 212, and a heat pipe 213.
The difference from the electronic device 10 described in the previous embodiment is that: the middle frame 212 of the electronic device 20 of the present embodiment includes a first region 213, a second region 214, a third region 215, and a fourth region 216. The electronic device 20 further includes a speaker 24 and a USB interface accessory 25. The speakers 24 are respectively provided at both side positions of the USB interface accessory 25.
The first region 213 is used to set the camera 211. The second region 214 is used for disposing the battery 23. The third area 215 is used to set the speaker 24 of the electronic device 20, and the fourth area 216 is used to set the USB interface accessory 25 of the electronic device 20.
Heat is also generated during operation due to the speaker 24 and USB interface accessory 25. Therefore, the heat pipe 213 of this embodiment can further conduct heat generated by the speaker 24 and the USB interface accessory 25 to dissipate the heat through the middle frame.
Specifically, as shown in fig. 6, a recess 2123 is provided in the main body portion 2122 of the middle frame 212. The grooves 2123 extend from the first region 213 to the second region 214, and further extend between the third region 215 and the fourth region 216.
The heat pipe 213 is disposed on the groove 2123, and the specific configuration can be as described above, which is not described herein again. Therefore, when the speaker 24 and the USB interface accessory 25 are in operation, the heat generated by the speaker 24 and the USB interface accessory 25 can be conducted to the middle position of the middle frame 212 through the heat pipe 213, and the heat dissipation effect can be greatly improved by dissipating the heat through the large area of the middle position of the middle frame 212.
Referring to fig. 7, fig. 7 is a schematic structural diagram of a middle frame of another heat dissipation assembly provided in the present application. As shown in fig. 7, the middle frame 312 of the heat dissipation assembly 31 of the present embodiment includes a side wall 3121 and a main body portion 3122. The main body portion 3122 may have a quadrangular structure, and the side walls 3121 may have four sides, and extend from the four sides of the main body portion 3122 in a direction perpendicular to the main body portion 3122. The four side walls 3121 extend in the same direction and intersect end to end. The four side walls 3121 and the main body portion 3122 form an accommodating space. Wherein the main body portion 3122 includes a first region 3125 for disposing a camera and a second region 3126 for disposing a battery.
The four sides of the quadrilateral structure of the main body portion 3122 of the present embodiment may be connected at right angles, or may be connected in an arc transition manner.
It should be understood that in other embodiments, the main body portion 3122 may also have other configurations, such as a polygonal configuration, a circular configuration, or the like.
As shown in fig. 7, the first region 3125 is proximate to the intersecting two sidewalls 3126 and 3127. I.e., the cameras are positioned adjacent to the side walls 3126 and 3127 of the center frame 312. The side walls 3126 and 3127 are the left and upper side walls, respectively, as shown in fig. 7. That is, the camera of the present embodiment is disposed at the upper left position of the middle frame 312. A thermal shield (not shown) is further provided between the camera head and the adjacent two side walls 3126 and 3127.
Specifically, the side walls 3126 and 3127 are hollowed out to form a groove 3128 at a position corresponding to the first region 3125 (i.e., the camera). The thermal insulation members are disposed in the groove 3128. The heat insulation member may be made of plastic, and may be integrally formed with the sidewalls 3126 and 3127 by injection molding. Whereby the strength of the side walls 3126 and 3127 can be secured. And may be disposed in the groove 3128 by nesting or gluing, etc.
The relationship of the thermal shield to the recess 3128 and the camera head is as described above and will not be described further herein.
The difference from the foregoing middle boxes is: this embodiment also provides a recess 3124 at the location of the first area 3125 of the main body portion 3122. The groove 3124 communicates with grooves 3128 on the side walls 3126 and 3127. Further, a heat insulating member is provided on the groove 3124, which may be integrally formed with the heat insulating member on the groove 3128.
The camera is disposed on the thermal insulation of the groove 3124, thereby further preventing heat generated by the camera from being conducted to the main body portion 3122 of the first region 3215.
It is noted that the groove 3124 of the main body portion 3122 is spaced from the groove 3129 in which the heat pipe is disposed within the first region 3125.
Referring to fig. 8, fig. 8 is a schematic structural diagram of another heat dissipation assembly provided in the present application. As shown in fig. 8, the heat dissipation assembly 41 of the present embodiment includes a camera 411, a middle frame 412, and a heat pipe 413.
The bezel 412 includes a side wall 4121 and a body portion 4122. The main body 4122 may have a quadrangular structure, and the four side walls 4121 may extend from four sides of the main body 4122 in a direction perpendicular to the main body 4122. The four side walls 4121 extend in the same direction and intersect end to end. The four side walls 4121 and the main body 4122 form an accommodating space. The main body portion 4122 includes a first region 4125 for disposing the camera 411 and a second region 4123 for disposing the battery 43.
In the present embodiment, four sides of the quadrangular structure of the main body portion 4122 may be connected at right angles or may be connected in an arc transition manner.
It should be understood that in other embodiments, the body portion 4122 may have other configurations, such as a polygonal configuration, a circular configuration, or the like.
As shown in fig. 8, the first region 4125 is adjacent to the intersecting two sidewalls 4126 and 4127. I.e., the camera 411 is disposed adjacent to the side walls 4126 and 4127 of the middle frame 412. The side walls 4126 and 4127 are the left and upper side walls, respectively, shown in fig. 8. That is, the camera 411 of the present embodiment is disposed at the upper left position of the middle frame 412. A heat insulation member is provided between the camera 411 and the adjacent side wall.
Specifically, the side walls 4126 and 4127 are hollowed out at positions corresponding to the cameras 411 to form grooves 4128. The heat sink assembly 41 further includes a thermal insulation member 44 disposed in the groove 4128. The thermal insulation member 44 may be made of plastic, and may be integrally formed with the sidewalls 4126 and 4127 by injection molding. Whereby the strength of the side walls 4126 and 4127 can be secured. May be disposed in the groove 4128 by nesting or gluing, etc.
The difference from the previous embodiment is: in this embodiment, the thermal insulation member 44 further includes two sub-thermal insulation members 441 and 442, and the two sub-thermal insulation members 441 and 442 are disposed at intervals between the side wall and the camera head 411. As shown in fig. 8, the sub-insulator 441 is disposed between the side wall 4126 and the camera head 411. The sub-insulator 442 is disposed between the sidewall 4127 and the camera head 411.
The arrangement of the sub-insulating members 441 and 442 may be the same as that of the insulating member 14 described above, and thus, the description thereof will be omitted.
The sub-insulating members 441 and 442 are spaced apart from each other in this embodiment, so that the material of the insulating members can be reduced while ensuring heat insulation, thereby achieving the purpose of reducing the cost.
It should be appreciated that in other embodiments, other numbers of sub-insulators may be provided, spaced apart in the groove 4128.
Referring to fig. 9, fig. 9 is a schematic structural diagram of another heat dissipation assembly provided in the present application. As shown in fig. 9, the heat dissipation assembly 51 of the present embodiment includes a camera 511, a middle frame 512, and a heat pipe 513.
The middle frame 512 includes a sidewall 5121 and a body 5122. The main body 5122 may have a quadrilateral structure, and four side walls 5121 extend from four sides of the main body 5122 in a direction perpendicular to the main body 5122. The four side walls 5121 extend in the same direction and intersect end to end. The four side walls 5121 and the main body 5122 form an accommodating space. Among them, the main body portion 5122 includes a first region 5124 for disposing the camera 511 and a second region 5123 for disposing the battery 53. The heat pipe 513 extends from the first area 5124 to the second area 5123 to transfer heat of the camera 511 of the first area 5124 into the second area 513. The details can be as described above, and are not described herein.
The four sides of the quadrilateral structure of the main body 5122 of this embodiment may be connected at right angles, or may be connected in an arc transition manner.
It is understood that in other embodiments, the body portion 5122 may have other configurations, such as a polygonal configuration, a circular configuration, or the like.
As shown in fig. 9, the first area 5124 is adjacent to the two sidewalls 5126 and 5127 that intersect. I.e., the camera 511 is disposed adjacent to the side walls 5126 and 5127 of the middle frame 512. The side walls 5126 and 5127 are the left and upper side walls shown in fig. 9, respectively. That is, the camera 511 of the present embodiment is disposed at the upper left position of the middle frame 512. A thermal insulator 54 is further provided between the camera 511 and the adjacent two side walls 5126 and 5127.
Specifically, the side walls 5126 and 5127 are hollowed out at positions corresponding to the positions of the cameras 511 to form grooves 5128. The heat sink assembly 51 further includes a heat insulator 54 disposed in the groove 5128. The thermal insulation members 54 can be made of plastic, and can be integrally formed with the sidewalls 5126 and 5127 by injection molding. Whereby the strength of the side walls 5126 and 5127 can be secured. And may be disposed in the groove 5128 by nesting or adhering, etc.
The difference from the previous embodiment is: in this embodiment, the thermal insulation 54 is provided only at the intersection of the side walls 5126 and 5127. I.e., at the upper left corner of the middle frame 512.
The arrangement of the insulation 54 may be the same as that of the insulation 14 described above and will not be described in detail.
In this embodiment, the heat insulation member 54 is disposed at the joint of the side walls 5126 and 5127, so that the material of the heat insulation member can be reduced while ensuring heat insulation, thereby achieving the purpose of reducing cost.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims (2)

1. A heat dissipation assembly for an electronic device, the heat dissipation assembly comprising:
a camera;
the middle frame comprises a main body part with a quadrilateral structure and four side walls which extend from four sides of the main body part to the direction vertical to the main body part and are intersected end to end, and the first side face of the main body part comprises a first area for arranging the camera, a second area for arranging a battery of the electronic equipment, a third area for arranging a loudspeaker of the electronic equipment and a fourth area for arranging a USB interface accessory of the electronic equipment; the first area is located at one end of the middle frame, the third area and the fourth area are located at the other end of the middle frame side by side, the second area is located between the first area and the third area as well as between the first area and the fourth area, and a second groove is further formed in the first side face of the middle frame and extends from the first area to the second area and further extends between the third area and the fourth area;
at least one heat pipe, set up in said second recess, and extend to said second area from said first area in a curvilinear manner, and further extend to between said third area and said fourth area, and pass the centre of the said middle frame, connect with said camera heat conduction in the said first area, in order to lead the heat that the said camera produces to the middle frame of the said second area and middle frame between said third area and said fourth area, and can lead the heat that the loudspeaker and/or USB interface attachment of the said electronic equipment produce to the middle frame of the said second area and middle frame of the said first area;
the camera is arranged at the joint of two crossed side walls when being arranged in the first area, the two side walls close to the camera are provided with first grooves at positions corresponding to the camera, the first grooves are provided with first heat insulation pieces, the length of each first heat insulation piece is equal to that of each first groove, the first heat insulation pieces are integrally formed with the side walls, so that the camera is thermally isolated from the two side walls close to the camera, and the first heat insulation pieces are further arranged between the camera and the main body part of the first area, so that the camera is thermally isolated from the main body part close to the camera;
further providing a second thermal shield on the second region, the second thermal shield covering the heat pipe located in the second region to isolate the heat pipe located in the second region from the battery located in the second region;
a heat sink is disposed on a second side surface of the body portion opposite the first side surface.
2. An electronic device, characterized in that the electronic device comprises the heat dissipation assembly of claim 1.
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