CN102098904A - Anti-burning heat radiating device and method of electronic components - Google Patents
Anti-burning heat radiating device and method of electronic components Download PDFInfo
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- CN102098904A CN102098904A CN 201110047727 CN201110047727A CN102098904A CN 102098904 A CN102098904 A CN 102098904A CN 201110047727 CN201110047727 CN 201110047727 CN 201110047727 A CN201110047727 A CN 201110047727A CN 102098904 A CN102098904 A CN 102098904A
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Abstract
The invention discloses an anti-burning heat radiating device and method of electronic components, and the device comprises an outer wall, a radiator, a conduction device, a cavity and a tube body, wherein a heat insulation layer and an internal side wall are arranged between the outer wall and the cavity; the heat insulation layer is located between the outer wall and the internal side wall; the radiator is arranged at the external surface of the outer wall; a heating electronic component on a circuit board is communicated with the tail end of the tube body after successively passing through a heat conduction pad, an inner layer wall and a liquid absorbing core of a liquid storage cavity; the liquid absorbing core in the tube body is arranged at the inner side close to the tube wall, of the tube body; the cavity is internally provided with a liquid storage core of the liquid storage cavity; the conduction device is arranged at the other opposite tail end close to the external surface of radiator, of the tube body; the conduction device controls the communication between the tube body and the atmosphere; and the conduction device further isolates heat and takes away the heat entering into the product via evaporation heat absorption. By the technical scheme provided the embodiment of the invention, the heat radiating performance of the electronic components is improved, and the key electronic components in the electronic apparatus can be protected under the condition of high temperature or being burned by fire.
Description
Technical field
The present invention relates to a kind of anti-burn heat abstractor and method thereof, especially relate to a kind of crucial electronic devices and components that are applied to electronic equipments such as data logger or black box and prevent burning the devices and methods therefor of heat radiation, this invention also can be applied in the anti-of other electronic equipment electronic devices and components and burn in the heat abstractor.
Background technology
At present, in the mode that the electronic devices and components in the electronic equipment are dispelled the heat, mainly contain: metal fin heat radiation, wind-cooling heat dissipating, three kinds of modes of heat pipe heat radiation.As everyone knows, the heat dispersion of heat pipe can surpass all known metal fin in the middle of these three kinds of radiating modes.
Heat pipe is the fabulous artificial member of a kind of conductivity of heat, and as shown in Figure 1, heat pipe commonly used is made up of three parts: main body is the metal tube of a sealing, and promptly shell 31; The a little amount of work medium is arranged in the internal cavities, and promptly working solution 34; And capillary structure, i.e. tube core 32 and vapor chamber 33.And air and other foreign material in the pipe must foreclose.Utilized three kinds of physics principles during heat pipe work:
(1) under vacuum state, the boiling point of liquid reduces;
(2) latent heat of vaporization of material of the same race is than high many of sensible heat;
(3) porous capillary structure can make liquid flow to the suction force of liquid.
From heat transfer conditions, heat pipe can be divided into evaporation section vertically, adiabatic section and condensation segment three parts.Adopt heat pipe principle to dispel the heat, thereby be in lower temperature with the fluid of the heat pipe principle work maintenance electronic devices and components that under high-temperature condition, volatilizes simultaneously.
But no matter be which kind of radiating mode, present heat abstractor all is that consideration is carried out heat insulation with the environment short duration protection purpose that reaches a high temperature to product.And opposite, the heat insulation internal circuit heat that causes is difficult to shed, and reduces circuit reliability, and reduces the design freedom that heat dispersion can limit the internal circuit part, thereby reduces some performance.On the other hand, if it is more limited just to resist high temperature action by heat insulation mode, this reason that just why former many equipment (as: aircraft black box) are finally burnt.At present, thus have only consideration to product carry out heat insulation with and adopt heat-barrier material or vacuum chamber to intercept the reach a high temperature way of environment short duration protection of other passage of heats.
Summary of the invention
The invention provides anti-heat abstractor and the method thereof of burning of a kind of electronic devices and components; these apparatus and method can guarantee again under the situation the crucial electronic devices and components (as the data memory cell) of electronic equipment to be protected in several days in high temperature and by flame incineration under the situation that improves heat dispersion.
The invention provides the anti-embodiment of burning heat abstractor of a kind of electronic devices and components, the anti-heat abstractor that burns of a kind of electronic devices and components, comprise: outer wall, radiator, conducting device, cavity and body, between outer wall and the cavity thermal insulation layer and madial wall, thermal insulation layer is between outer wall and madial wall, radiator is arranged at the outer surface of outer wall, the heating electronic component that is positioned on the circuit board is passed through heat conductive pad successively, inner layer wall, the liquid storage cylinder wick is communicated with the end of body, inboard at the close tube wall of body is provided with wick in the body, be provided with the liquid storage cylinder liquid storage core in the cavity, be provided with conducting device at another terminal relatively outer surface near radiator of body, conducting device control body is communicated with atmosphere.
Burn the further execution mode of heat abstractor as a kind of electronic devices and components of the present invention are anti-, be provided with two place's liquid storage cylinder liquid storage cores in the cavity, two place's liquid storage cylinder liquid storage cores lay respectively at the relative both sides of body.
As the anti-further execution mode of heat abstractor that burns of a kind of electronic devices and components of the present invention, conducting device is sealing fusing alloy or temperature-sensitive valve.
The present invention also provides a kind of electronic devices and components anti-embodiment of burning heat dissipating method, and a kind of electronic devices and components are anti-to burn heat dissipating method, may further comprise the steps:
(A) when the electronic devices and components operate as normal, the heat on the electronic devices and components successively the evaporation ends by wick, tube wall in the heat conductive pad, inner layer wall, liquid storage cylinder wick, body and heat sink in atmosphere;
(B) when electronic devices and components are in hot environment, the conducting device that is used to seal is opened, and wick merges in the body simultaneously, and wick stops to carry liquid in the body, and a part of heat on the electronic devices and components imports in the cavity by the stub segment of body; A part of in addition heat is successively by outer wall, thermal insulation layer, madial wall and liquid storage cylinder wick, and the mode by steam is delivered in the atmosphere.
As the anti-further execution mode of heat dissipating method that burns of a kind of electronic devices and components of the present invention, the conducting device that is used to seal is opened and is comprised the fusing of sealing fusing alloy, is communicated with the step of body and atmosphere.
As the anti-another kind of execution mode that burns heat dissipating method of a kind of electronic devices and components of the present invention, the conducting device that is used to seal is opened and is comprised the temperature-sensitive valve open, is communicated with the step of body and atmosphere.
The described a kind of electronic devices and components of embodiment of the present invention are anti-to burn heat abstractor and method thereof by using, and can solve well under the components and parts operate as normal on the electronic equipment that (as under 1200 ℃ of continuous 48 hours high temperature) electronic devices and components need keep the contradiction of lower temperature under the heat radiation and extreme case.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the described heat-pipe radiating apparatus structural representation of a kind of prior art;
Fig. 2 is the anti-structural representation Fig. 1 that burns heat abstractor of the described electronic devices and components of a kind of embodiment of the present invention;
Fig. 3 is the anti-structural representation Fig. 2 that burns heat abstractor of the described electronic devices and components of a kind of embodiment of the present invention;
Fig. 4 is the anti-structure principle chart that burns heat abstractor of the described electronic devices and components of a kind of embodiment of the present invention.
Wherein, 1-outer wall, 2-radiator, 3-conducting device, the 4-thermal insulation layer, 5-madial wall, 6-circuit board, 7-heating electronic component, the 8-heat conductive pad, 9-inner layer wall, 10-liquid storage cylinder wick, wick in the 11-tube wall, 12-body, 13-liquid storage cylinder liquid storage core, the 14-cavity, 15-body, 31-shell, the 32-tube core, 33-vapor chamber, 34-working solution.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is a part of embodiment of the present invention, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that is obtained under the creative work prerequisite.
As the anti-embodiment of burning heat abstractor of a kind of electronic devices and components of the present invention, a kind of electronic devices and components as shown in Figures 2 and 3 prevent that burning heat abstractor comprises: outer wall 1, radiator 2, conducting device 3, cavity 14 and body 15, between outer wall 1 and the cavity 14 thermal insulation layer 4 and madial wall 5, thermal insulation layer 4 is between outer wall 1 and madial wall 5, radiator 2 is arranged at the outer surface of outer wall 1, the heating electronic component 7 that is positioned on the circuit board 6 is passed through heat conductive pad 8 successively, inner layer wall 9, liquid storage cylinder wick 10 is communicated with the end of body 15, inboard at body 15 close tube walls 11 is provided with wick 12 in the body, be provided with liquid storage cylinder liquid storage core 13 in the cavity 14, another terminal relatively outer surface near radiator 3 at body 15 is provided with conducting device 3, and conducting device 3 control bodys 15 are communicated with atmosphere.
Burn a kind of preferred implementation of heat abstractor as electronic devices and components of the present invention are anti-, be provided with the relative both sides that two place's liquid storage cylinder liquid storage cores, 13, two place's liquid storage cylinder liquid storage cores lay respectively at body 15 in the cavity 14.Conducting device 3 is sealing fusing alloy or temperature-sensitive valve.
As the anti-embodiment of burning heat dissipating method of a kind of electronic devices and components of the present invention, the electronic devices and components shown in Fig. 3 radiator structure schematic diagram are anti-to burn heat dissipating method, may further comprise the steps:
(A) when the electronic devices and components operate as normal, the heat on the electronic devices and components 7 is delivered in the atmosphere by the evaporation ends and the radiator 2 of wick 12, tube wall 11 in heat conductive pad 8, inner layer wall 9, liquid storage cylinder wick 10, the body successively;
(B) when electronic devices and components are in hot environment, the conducting device 3 that is used to seal is opened, wick 12 merges in the body simultaneously, and wick 12 stops to carry liquid in the body, and a part of heat on the electronic devices and components 7 imports in the cavity 14 by the stub segment of body 15; A part of in addition heat is successively by outer wall 1, thermal insulation layer 4, madial wall 5 and liquid storage cylinder wick 10, and the mode by steam is delivered in the atmosphere.
As the anti-exemplary embodiment of burning heat dissipating method of a kind of electronic devices and components of the present invention, conducting device 3 opening steps that are used to seal comprise the fusing of sealing fusing alloy, are communicated with the step of body 15 and atmosphere.
As the anti-another kind of exemplary embodiment of burning heat dissipating method of a kind of electronic devices and components of the present invention, conducting device 3 opening steps that are used to seal comprise the temperature-sensitive valve open, are communicated with the step of body 15 and atmosphere.
The described a kind of electronic devices and components of the specific embodiment of the invention are anti-burn heat abstractor and method thereof the electronic devices and components to electronic equipment carry out heat insulation in, utilize evaporation heat absorption principle to take away the heat that enters product inside again, can improve the ability of product high temperature resistance so greatly.Simultaneously, by using material commonly used can reach designing requirement.
The above only is a preferred implementation of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (7)
1. electronic devices and components prevent burning heat abstractor, it is characterized in that: comprise outer wall (1), radiator (2), conducting device (3), cavity (14) and body (15), between outer wall (1) and the cavity (14) thermal insulation layer (4) and madial wall (5), thermal insulation layer (4) is positioned between outer wall (1) and the madial wall (5), radiator (2) is arranged at the outer surface of outer wall (1), the heating electronic component (7) that is positioned on the circuit board (6) is passed through heat conductive pad (8) successively, inner layer wall (9), liquid storage cylinder wick (10) is communicated with the end of body (15), inboard at the close tube wall (11) of body (15) is provided with wick in the body (12), be provided with liquid storage cylinder liquid storage core (13) in the cavity (14), another terminal relatively outer surface near radiator (3) at body (15) is provided with conducting device (3), and conducting device (3) control body (15) is communicated with atmosphere.
2. a kind of electronic devices and components according to claim 1 are anti-to burn heat abstractor, and it is characterized in that: be provided with two place's liquid storage cylinder liquid storage cores (13) in the described cavity (14), two place's liquid storage cylinder liquid storage cores lay respectively at the relative both sides of body (15).
3. a kind of electronic devices and components according to claim 1 and 2 are anti-to burn heat abstractor, it is characterized in that: described conducting device (3) is sealing fusing alloy.
4. a kind of electronic devices and components according to claim 1 and 2 are anti-to burn heat abstractor, and it is characterized in that: described conducting device (3) is the temperature-sensitive valve.
5. one kind is utilized the described electronic devices and components of claim 1 to prevent burning the method that heat abstractor dispels the heat, and it is characterized in that, may further comprise the steps:
(A) when the electronic devices and components operate as normal, the heat on the electronic devices and components (7) is delivered in the atmosphere by the evaporation ends and the radiator (2) of wick (12), tube wall (11) in heat conductive pad (8), inner layer wall (9), liquid storage cylinder wick (10), the body successively;
(B) when electronic devices and components are in hot environment, the conducting device that is used to seal (3) is opened, wick (12) merges in the body simultaneously, wick (12) stops to carry liquid in the body, and a part of heat on the electronic devices and components (7) imports in the cavity (14) by the stub segment of body (15); A part of in addition heat is successively by outer wall (1), thermal insulation layer (4), madial wall (5) and liquid storage cylinder wick (10), and the mode by steam is delivered in the atmosphere.
6. a kind of electronic devices and components according to claim 5 are anti-to burn heat dissipating method, it is characterized in that, the described conducting device that is used to seal (3) is opened and comprised the fusing of sealing fusing alloy, is communicated with the step of body (15) and atmosphere.
7. a kind of electronic devices and components according to claim 5 are anti-to burn heat dissipating method, it is characterized in that the described conducting device that is used to seal (3) is opened and comprised the temperature-sensitive valve open, is communicated with the step of body (15) and atmosphere.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110047727 CN102098904B (en) | 2011-02-28 | 2011-02-28 | Anti-burning heat radiating device and method of electronic components |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110047727 CN102098904B (en) | 2011-02-28 | 2011-02-28 | Anti-burning heat radiating device and method of electronic components |
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| Publication Number | Publication Date |
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| CN102098904A true CN102098904A (en) | 2011-06-15 |
| CN102098904B CN102098904B (en) | 2012-12-26 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014101048A1 (en) * | 2012-12-27 | 2014-07-03 | Feng Jin | High-efficiency heat dissipation device |
| CN106455404A (en) * | 2015-08-11 | 2017-02-22 | 奇鋐科技股份有限公司 | Middle frame structure with heat insulation function and electronic device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2704921Y (en) * | 2004-03-22 | 2005-06-15 | 张文辉 | Radiator of electronic components |
| JP2006268527A (en) * | 2005-03-24 | 2006-10-05 | Fuji Xerox Co Ltd | Display medium control device, system, and method |
| CN101059323A (en) * | 2007-06-08 | 2007-10-24 | 株洲南车时代电气股份有限公司 | Plate type integral structure heat-irradiation method and device suitable for large power high efficiency heat pipe heat-radiator |
-
2011
- 2011-02-28 CN CN 201110047727 patent/CN102098904B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2704921Y (en) * | 2004-03-22 | 2005-06-15 | 张文辉 | Radiator of electronic components |
| JP2006268527A (en) * | 2005-03-24 | 2006-10-05 | Fuji Xerox Co Ltd | Display medium control device, system, and method |
| CN101059323A (en) * | 2007-06-08 | 2007-10-24 | 株洲南车时代电气股份有限公司 | Plate type integral structure heat-irradiation method and device suitable for large power high efficiency heat pipe heat-radiator |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014101048A1 (en) * | 2012-12-27 | 2014-07-03 | Feng Jin | High-efficiency heat dissipation device |
| CN106455404A (en) * | 2015-08-11 | 2017-02-22 | 奇鋐科技股份有限公司 | Middle frame structure with heat insulation function and electronic device |
| CN106455404B (en) * | 2015-08-11 | 2022-07-01 | 奇鋐科技股份有限公司 | Heat-insulated middle frame structure and electronic equipment |
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| Publication number | Publication date |
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| CN102098904B (en) | 2012-12-26 |
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Address after: 412001 Hunan Province, Zhuzhou Shifeng District Tian Xin era Road No. 169 Patentee after: ZHUZHOU CRRC TIMES ELECTRIC Co.,Ltd. Address before: 412001 Hunan Province, Zhuzhou Shifeng District Tian Xin era Road No. 169 Patentee before: ZHUZH CSR TIMES ELECTRIC Co.,Ltd. |
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