TWI575359B - Internal frame structure with heat isolation effect and electronic apparatus with the internal frame structure - Google Patents

Description

Frame structure and electronic equipment with heat interruption

The invention relates to the field of portable electronic devices, in particular to a frame structure and an electronic device with heat insulation.

At present, smart personal electronic devices such as mobile phones, tablets or portable readers are getting bigger and thinner and thinner, resulting in worse and worse heat dissipation of electronic devices. However, most of the heat generated in electronic devices is The operation of the functional unit is generated, for example, the central processing unit (especially for configuring the multi-core computing unit for improving the execution speed, which is worse for the heat dissipation problem of the terminal device), the operation of the battery, the power converter, the display screen, and the like. Both will increase or increase the heat generated by electronic devices. At present, the heat source of most electronic devices is fixed on the middle frame structure of the electronic device, so the middle frame first absorbs the heat generated when each functional unit is executed. Therefore, after the electronic device is turned on, the temperature of the middle frame is extremely easy to rise, resulting in The temperature of the main body and the outer edge of the frame is extremely high. When the user holds the electronic device, since the size of the electronic device is large (for example, the mainstream of the touch mobile phone is more than 5 inches), the user can hardly grasp it completely, and most of them are only With the grip between the fingers, the contact points or positions of the grasping electronic device are mostly located on the outer edge or the longer sides of the middle frame, so that the high temperature conduction to the outer edge of the middle frame will affect or cause the user to use and inconvenient.

Accordingly, in order to effectively solve the above problems, it is an object of the present invention to provide an outer layer of a frame unit having a frame structure among the heat insulating layers to block heat transfer to the middle frame.

Another object of the present invention is to provide a heat insulating effect for a middle frame structure used in an electronic device for blocking heat generated by internal electronic components of the electronic device from being transmitted to the side of the electronic device.

In order to achieve the above object, the present invention provides a heat-insulating frame structure, comprising a body and a frame unit, the frame unit is disposed at an outer edge of the body to form a boundary of the body, and includes an inner layer and an outer side. a layer and a thermal break layer between the inner layer and the outer layer, the inner layer adjoins the body, the outer layer being located at an outermost side of the frame unit to block heat transfer from the body to the frame unit The outer layer, and the outer layer forms at least opposite sides or four sides of the electronic device exposed to the outside.

In one implementation, another frame structure having a heat-dissipating structure according to the present invention is applied to an electronic device, the electronic device comprising: a display module having a front surface; a front case connecting the display module, the front The cover is provided with a window, the front surface of the display module is exposed in the window; a middle frame is connected to the front case, the middle frame includes a body and a frame unit, and the frame unit includes an inner layer and an outer layer A thermal insulation layer is located between the inner layer and the outer layer, the inner layer abuts the body, the outer layer is located at an outermost side of the frame unit, and a plurality of inner parts are disposed on the body.

In one implementation, the middle frame is connected or directly formed integrally with a back shell.

In one implementation, the inner layer and the outer layer of the body and the frame unit are made of a metal material or a non-metal material, and the heat insulation layer of the frame unit is formed of a heat-insulating material.

In one implementation, the body is a flat-plate heat pipe or a hot plate having a closed chamber therein, and the closed chamber is provided with a capillary structure and a working fluid.

In one implementation, the display module is a touch display module, and the front surface is a touch display surface.

10‧‧‧ middle frame

11‧‧‧Ontology

111‧‧‧First side surface

112‧‧‧Second side surface

1111, 1121‧‧‧ grooves

116‧‧‧Closed chamber

117‧‧‧Capillary structure

118‧‧‧Working fluid

12a‧‧‧Box unit

121a‧‧‧ inside layer

123a‧‧‧Outer layer

122a‧‧‧ Thermal insulation layer

20‧‧‧ front shell

21‧‧‧ window hole

30‧‧‧Display module

31‧‧‧ positive

32‧‧‧Back

40‧‧‧ Back shell

41‧‧‧ motherboard

42‧‧‧Battery

43, 44‧‧‧ front and rear lens modules

The following figures are intended to make the present invention easier to understand, and the drawings are described in detail herein and form part of the specific embodiments. Through the specific embodiments herein and with reference to the corresponding drawings, the specific embodiments of the present invention are explained in detail, and the function of the creation is explained.

1 is a schematic partial block diagram of the present invention; FIG. 2B is a partial cross-sectional view showing another alternative embodiment of the frame of the present invention; FIG. 3 is a partial cross-sectional view of another alternative embodiment of the frame of the present invention; The present invention is applied to an exploded perspective view of an electronic device: FIG. 4 is a partial cross-sectional view of the present invention applied to an electronic device.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

The present invention provides a heat-insulating frame structure, comprising a body and a frame unit disposed on at least opposite sides of the body or on four sides of the body, the frame unit including an inner layer and an outer layer and a frame a thermal insulation layer between the inner layer and the outer layer, the inner layer abutting the body, the outer layer being located at an outermost side of the frame unit.

In the following, various embodiments of the present invention will be described in detail, with reference to the drawings,

1 is a schematic cross-sectional view of a frame of the present invention; FIG. 2B is a schematic cross-sectional view of another middle frame of the present invention. As shown in the figure, the middle frame 10 is applied to an electronic device in addition to the use of supporting various parts in the electronic device, and relates to the structural strength of the electronic device, in the case where the electronic device is pressed or applied. A direct protection can be created for the electronic device. At least a portion of the middle frame 10 is made of metal, however, the middle frame 10 may also be entirely made of a metal material. Since the strength of the metal material is good, the strength of the entire middle frame 10 is better. The aforementioned metal materials are, for example, stainless steel, aluminum, aluminum-magnesium alloy, aluminum-titanium Kim et al.

The middle frame 10 includes a body 11 and a frame unit 12a disposed at an outer edge of the body 11 to form a boundary of the body 11. The frame unit 12a is located on at least opposite sides of the body 11, and is represented in the figure. The four sides of the body 11 include an inner layer 121a and an outer layer 123a and a thermal insulation layer 122a. The thermal insulation layer 122a is interposed between the inner layer 121a and the outer layer 123a. The inner layer 121a is blocked from contacting the outer layer 123a, wherein the inner layer 121a abuts the periphery of the body 11, and the outer layer 123a is located at the outermost side of the frame unit 12a.

The body 11 has a first side surface 111 and a second side surface 112 respectively provided with a plurality of joint structures such as grooves or through holes or buckles or columns or a combination thereof. In the present embodiment, the grooves 1111, 1121 are displayed, and the electronic device The plurality of internal electronic components are mounted on the first side surface 111 and/or the second side surface 112 by the combined construction.

Furthermore, the inner layer and the outer layer of the main body 11 and the frame unit 12 are made of a metal material and/or a non-metal material, respectively.

As shown in FIG. 2B, in another alternative embodiment, the body 11 is a flat heat pipe or a hot plate or a temperature equalizing plate having a closed chamber 116 therein, and the closed chamber 116 is provided with a capillary structure 117 and working. Fluid 118. The vapor-liquid circulation is generated in the closed chamber 111 by the working fluid 118 to uniformly distribute the heat on the body 11.

In a specific implementation, the thermal insulation layer 122a described in the present invention is formed by a thermal insulation material, which is also referred to as a thermal insulation material. The heat-insulating material is, for example, a polyurethane foam, a glass fiber, an asbestos, an ethylene propylene rubber (EPDM) or an aromatic polyamide fiber. Preferably, the heat insulation layer 122a is composed of ethylene propylene rubber (EPDM) and aromatic polyamide fibers, or is composed of ethylene propylene rubber (EPDM) and asbestos. Since the thermal insulation layer 122a is broken by heat The material is formed so that the heat absorbed by the body 11 from the internal electronic parts is not transferred to the frame unit 12a.

The application implementation of the aforementioned middle frame will be exemplified below.

3 is a schematic exploded perspective view of the present invention applied to an electronic device: FIG. 4 is a partial cross-sectional view of the present invention applied to an electronic device. The electronic device includes a middle frame 10, a front case 20 and a display module 30 as shown.

The middle frame 10 has been shown in Figures 1, 2A, 2B, and 3, and the middle frame 10 includes a body 11 and a frame unit 12a disposed on the periphery of the body 11. The frame unit 12a includes an inner layer. 121a and an outer layer 123a and a thermal insulation layer 122a. The thermal insulation layer 122a is located between the inner layer 121a and the outer layer 123a. The inner layer 121a is adjacent to the periphery of the body 11. The outer layer 123a is located in the frame unit 12a. The outermost side. The middle frame 10 is connected to the front case 20, and the front case 20 is located on the first side 111 of the middle frame 10, and an accommodation space (not shown) is formed between the front case 20 and the middle frame 10. A window 21 is provided on the front case 20.

The display module 30 is fixedly disposed in the accommodating space. The display module 30 includes a front surface 31 and a rear surface 32 opposite to the front surface 31. The front surface 31 is a display portion of the display module 30. As shown in FIG. 3, when the display module 30 is installed in the accommodating space, The front side 31 of the display module 30 is exposed through the aperture 21. The display module 30 can be a liquid crystal display (LCD) or a touch display or other alternative components. When the display module 30 is a touch display panel, the front surface 31 provides a touch operation as a touch surface in addition to the display image.

The middle frame 10 is further connected to a back shell 40. The back shell 40 is located on the second side 112 of the middle frame 10. The front shell 20 and the back shell 40 form an overall shape of the electronic device. The outer layer 123a of the frame unit 12a of the middle frame 10 forms at least two opposite sides or four sides of the electronic device exposed to the outside as a contact area for providing hand grip.

A plurality of internal electronic components of the electronic device are disposed on the body 11 of the middle frame 10, and the like The electronic components include a main board 41 and a battery 42 and front and rear lens modules 43, 44. The main board 41 is provided with various components such as a processor, a power supply chip, and a sound image chip. In the figure, the main plate 41 and the battery 42 are respectively disposed on the first side 111 and the second side 112 of the main body 11 of the middle frame 10, and the grooves 1111 and 1121 are formed. The display module 30 and the battery 42 and the front and rear lens modules 43 and 44 are electrically connected to the main board 41. In another alternative implementation, the back shell 40 is integrally formed with the middle frame 10, and the plurality of electronic components are disposed on the first side 111 of the body 11 of the middle frame 10.

When the electronic device is in operation, internal electronic components, such as the main board 41 and the battery 42 and the front and rear lens modules 43, 44 (as shown in FIG. 3) generate heat transfer to the body 11 of the middle frame 10, and by the frame The heat-dissipating layer 122a of the unit 12a is located between the inner layer 121a and the outer layer 123a to block the heat transfer from the body 11 to the outer layer 123a of the frame unit 12a, so that the heat generated by the internal electronic components is distributed on the body 11 of the middle frame 10. . Moreover, since the heat of the body 11 cannot be transmitted to the outer layer 123a of the frame unit 12a, the outer layer 123a, which is at least the opposite side edges or the four sides of the electronic device, can provide a comfortable grip of the hand, and is not hot. Causes inconvenience and troubles in use.

In an embodiment, the electronic device in the present disclosure may be a mobile phone or a tablet computer, etc., and those skilled in the art should understand that the mobile phone or the tablet computer is only an example, and is not used to limit the technical solutions of the embodiment, and other types of electronic devices. The device is also suitable.

According to the above embodiments, the present invention has at least the following advantages: the present invention is disposed between the inner layer 121a and the outer layer 123a of the frame unit 12a of the middle frame 10a by the heat insulation layer 122a to block the heat of the body 11. Passed to the outer layer 123a of the frame unit 12a, and since the outer layer 123a of the frame unit 12a forms at least two opposite sides or four sides of the electronic device are exposed to the outside, and the opposite sides thereof (for example, but not limited to The long side) serves as a contact area for hand grip, thereby providing hand gripping electronic devices.

However, the above is only a preferred embodiment of the present invention, and the present invention is utilized. Changes in the methods, shapes, structures, and devices described above are intended to be included within the scope of the present invention.

10‧‧‧ middle frame

11‧‧‧Ontology

111‧‧‧First side surface

112‧‧‧Second side surface

1111, 1121‧‧‧ grooves

12a‧‧‧Box unit

121a‧‧‧ inside layer

123a‧‧‧Outer layer

122a‧‧‧ Thermal insulation layer

Claims (8)

A frame structure with heat insulation is applied to an electronic device for supporting other parts, the middle frame structure includes: a body; and a frame unit disposed at an outer edge of the body to form a boundary of the body, the frame unit The inner layer and the outer layer and the thermal insulation layer are located between the inner layer and the outer layer, the inner layer is adjacent to the body, and the outer layer is located at the outermost side of the frame unit to block the body The heat is transferred to the outer layer of the frame unit, and the outer layer forms at least two opposite sides or four sides of the electronic device exposed to the outside. The frame structure having a heat-breaking structure according to claim 1, wherein the inner layer and the outer layer of the body and the frame unit are made of a metal material or a non-metal material, and the heat-dissipating layer of the frame unit is formed of a heat-breaking material. . The heat-insulating middle frame structure according to claim 1, wherein the body is a flat heat pipe or a hot plate or a temperature equalizing plate, and has a closed chamber therein, and the closed chamber is provided with a capillary structure and a working fluid. An electronic device includes: a display module having a front surface; a front case connecting the display module, the front case being provided with a window, the front surface of the display module being exposed at the window; a middle frame, connecting The front case, the middle frame includes a body and a frame unit, the frame unit includes an inner layer and an outer layer and a thermal insulation layer, the thermal insulation layer is located between the inner layer and the outer layer, the inner layer Adjacent to the body, the outer layer is located at the outermost side of the frame unit, and the plurality of interiors Electronic components are placed on the body. The electronic device of claim 4, wherein the middle frame is connected or formed with a back shell. The electronic device of claim 4, wherein the inner layer and the outer layer of the body and the frame unit are made of a metal material or a non-metal material, and the heat insulation layer of the frame unit is formed of a heat-insulating material. The electronic device of claim 4, wherein the body is a flat heat pipe or a hot plate having a closed chamber therein, the capillary chamber being provided with a capillary structure and a working fluid. The electronic device of claim 4, wherein the display module is a touch display module, and the front surface is a touch display surface.