CN203633035U - Heat dissipation structure and electronic device - Google Patents
Heat dissipation structure and electronic device Download PDFInfo
- Publication number
- CN203633035U CN203633035U CN201320704539.6U CN201320704539U CN203633035U CN 203633035 U CN203633035 U CN 203633035U CN 201320704539 U CN201320704539 U CN 201320704539U CN 203633035 U CN203633035 U CN 203633035U
- Authority
- CN
- China
- Prior art keywords
- opening
- radiator structure
- device housings
- outlet
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000017525 heat dissipation Effects 0.000 title abstract description 9
- 239000012528 membrane Substances 0.000 claims description 27
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000000243 solution Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 206010020843 Hyperthermia Diseases 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000036461 convulsion Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000036031 hyperthermia Effects 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000011160 research Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a heat dissipation structure and an electronic device. The heat dissipation structure is used for dissipating heat of the electronic device. The electronic device comprises a device shell and a control chip, wherein the control chip is disposed inside the device shell. The heat dissipation structure comprises a housing and a piezoelectric film, wherein the housing is hollow and is provided with a first opening, a second opening and air inlets/outlets, the housing is fixed on the inner surface of the device shell, the device shell covers the first opening, and the piezoelectric film seals and blocks the second opening. The piezoelectric film, the housing and the device shell encircle a cavity. The piezoelectric film is connected with the control chip and can vibrate to cause volume change of the cavity so as to form air flow through the air inlets/outlets to carry out heat dissipation. The heat dissipation structure and the electronic device have the following advantages: the heat dissipation structure can be made thinner, and the piezoelectric film does not produce noise at work and can withstand far more impact than a fan.
Description
Technical field
The utility model relates to a kind of radiator structure and electronic equipment.
Background technology
Current electronic equipment, including notebook and flat computer, heat dissipation problem more and more receives user's concern.
From the market survey of doing for the user of notebook and flat computer, the problem of equipment surface excess Temperature, is subject to many users' complaint.Therefore reduce electronic equipment surface temperature, be very helpful for improving user's experience, thereby improve the satisfaction of user to equipment, the competitiveness of raising equipment itself.
The scheme of existing solution heat dissipation problem comprises:
1, the device such as provided with fan, heat pipe in electronic equipment, uses fan, heat pipe etc. to dispel the heat to equipment.
The shortcoming of this scheme is: 1, be subject to the technogenic influence such as fan thickness, heat pipe thickness, heat radiation module has become an important bottleneck of system thickness; 2,, for neomorph equipment such as flat computers, the noise effect user of fan experiences; 3, fan is a not impact elements, and for equipment such as flat computers, the normal jerk occurring has very big injury useful life to fan.
2, the two piezoelectricity cooling injections of DCJ(that General Corporation proposes) radiator, this radiator is installed two piezoelectric membranes on metal shell, forms Air Flow dispel the heat by the vibrations of two piezoelectric membranes.
The shortcoming of this scheme is; 1, DCJ radiator has used two piezoelectric membranes, forms an individual module, and installing space needs the above thickness of 4mm, in current electronic equipment, is difficult to find correct position to be put; 2, DCJ radiator comprises larger metal shell, can increase system weight.
As can be seen here, above-mentioned existing DCJ radiator, in structure and use, obviously still has inconvenience and defect, and is urgently further improved.Actively research and innovation in addition of the design people, to founding a kind of radiator structure and electronic equipment of new structure, makes it have more practicality.
Utility model content
Main purpose of the present utility model is, a kind of radiator structure and electronic equipment of new structure are provided, technical problem to be solved is effectively to reduce the thickness of radiator structure in electronic equipment, and avoid radiator structure to produce noise, and improve the resistance to impact of radiator structure, thereby be more suitable for practicality.
The purpose of this utility model and solve its technical problem and realize by the following technical solutions.According to a kind of radiator structure the utility model proposes, for electronic equipment is dispelled the heat, described electronic equipment comprises device housings and control chip, described control chip is positioned at the inside of described device housings, radiator structure comprises: housing, and described housing hollow, has the first opening, the second opening and inlet and outlet on described housing, described housing is fixed on the inner surface of described device housings, and described device housings covers described the first opening; Piezoelectric membrane, described piezoelectric membrane shutoff is on described the second opening, described piezoelectric membrane, described housing and described device housings surround and form cavity, described piezoelectric membrane connects described control chip, can there are vibrations and cause described cavity volume to change, form and dispel the heat through the Air Flow of described inlet and outlet.
The purpose of this utility model and solve its technical problem and also can be applied to the following technical measures to achieve further.
Preferably, aforesaid radiator structure, described housing comprises: retainer ring, the both ends open of described retainer ring is respectively the first opening and the second opening.
Preferably, aforesaid radiator structure, described inlet and outlet forms the breach on the edge of described the first opening.
Preferably, aforesaid radiator structure, described housing comprises: top board, described top board offers the second opening; Side plate, described side plate surrounds the edge of described top board, forms groove structure, and the opening of described groove structure forms described the first opening, also offers described inlet and outlet on described side plate.
Preferably, aforesaid radiator structure, has thermal component in described device housings, and described thermal component heating forms focus on described device housings, and the air-out direction of described inlet and outlet is aimed at described focus.
Preferably, aforesaid radiator structure, has exhaust outlet on described device housings, and the air-out direction of described inlet and outlet is aimed at described exhaust outlet.
Preferably, aforesaid radiator structure, the quantity of described inlet and outlet is multiple.
The purpose of this utility model and solve that its technical problem also realizes by the following technical solutions.According to a kind of electronic equipment the utility model proposes, comprise; Device housings; Control chip, described control chip is positioned at the inside of described device housings; According to aforesaid radiator structure.
The purpose of this utility model and solve its technical problem and also can be applied to the following technical measures to achieve further.
Preferably, aforesaid electronic equipment, described electronic equipment is mobile phone, flat computer or notebook.
By technique scheme, radiator structure of the present utility model and electronic equipment at least have following advantages:
Than the independent heat radiation piezoelectric membrane of module and the structure of metal shell, piezoelectric membrane, the housing formation cavity structure that combines with electronic equipment casing in the utility model, electronic equipment casing plays the effect that substitutes part metals housing in traditional DCJ radiator individual module, what radiator structure of the present utility model can do is thinner, piezoelectric membrane does not produce noise in the time of work simultaneously, and the impact that can bear also far exceedes fan.
Above-mentioned explanation is only the general introduction of technical solutions of the utility model, in order to better understand technological means of the present utility model, and can be implemented according to the content of specification, below with preferred embodiment of the present utility model and coordinate accompanying drawing to be described in detail as follows.
Accompanying drawing explanation
Fig. 1 is according to the schematic diagram of the radiator structure of an embodiment of the present utility model;
Fig. 2 is according to the schematic diagram of the radiator structure of an embodiment of the present utility model;
Fig. 3 is according to the schematic diagram of the radiator structure of an embodiment of the present utility model;
Fig. 4 is according to the schematic diagram of the radiator structure of an embodiment of the present utility model;
Fig. 5 is according to the schematic diagram of the radiator structure of an embodiment of the present utility model;
Fig. 6 is according to the schematic diagram of the radiator structure of an embodiment of the present utility model.
Embodiment
Technological means and effect of taking for reaching predetermined utility model object for further setting forth the utility model, below in conjunction with accompanying drawing and preferred embodiment, to radiator structure and its embodiment of electronic equipment, structure, feature and effect thereof according to the utility model proposes, be described in detail as follows.In following explanation, the not necessarily same embodiment that different " embodiment " or " embodiment " refer to.In addition, special characteristic, structure or the feature in one or more embodiment can be combined by any suitable form.
As shown in Figure 1, a kind of radiator structure that an embodiment of the present utility model proposes, for electronic equipment is dispelled the heat, the inside of electronic equipment comprises device housings 1 and control chip 2, control chip 2 is positioned at the inside of device housings 1, and the radiator structure of the present embodiment specifically comprises:
Preferably, as shown in Figure 2, another embodiment of the present utility model proposes a kind of radiator structure, compared with above-described embodiment, the radiator structure of the present embodiment, the concrete structure of housing 3 can be: retainer ring 8, the both ends open of retainer ring 8 is respectively the first opening 4 and the second opening 5(is blocked in the drawings), circulus simple and stable, is easy to manufacture.
Preferably, as shown in Figure 2, another embodiment of the present utility model proposes a kind of radiator structure, compared with above-described embodiment, the radiator structure of the present embodiment, inlet and outlet 6 forms the breach on the first opening 4 edges of retainer ring 8, and the design of gap type is easy to production and processing on the one hand, can guarantee that on the other hand inlet and outlet 6 is close to device housings 1, the heat on abatement apparatus shell 1 effectively.
Preferably, as shown in Figure 3, another embodiment of the present utility model proposes a kind of radiator structure, compared with above-described embodiment, and the radiator structure of the present embodiment, the structure of housing 3 also can comprise: top board 9, top board 9 offers the second opening 6; Side plate 10, side plate 10 surrounds the edge of top board 9, forms groove structure, the opening of groove structure forms the first opening 4, also offers inlet and outlet 6 on side plate 10, and the structure of the present embodiment middle shell 3 is different from previous embodiment structure, have equally simple in structurely, be easy to the feature of production and processing.
Preferably, as shown in Figure 4, another embodiment of the present utility model proposes a kind of radiator structure, compared with above-described embodiment, the radiator structure of the present embodiment, in device housings 1, there is thermal component 11, the heat that thermal component 11 sends impacts the temperature of device housings 1, the focus 12 that formation temperature is higher on device housings 1, position described in the air-out direction of inlet and outlet 6 in focus 12(dashed circle), thermal component 11 comprises CPU(central processing unit), GPU(graphic process unit) and PSU(power supply), these parts send a large amount of heats, cause the localized hyperthermia of device housings 1---form focus 12, the air-out direction of inlet and outlet 6 (as the direction of arrow in figure) is aimed at this focus 12, can effectively reduce the temperature at focus 12 places.
Preferably, as shown in Figure 5, another embodiment of the present utility model proposes a kind of radiator structure, compared with above-described embodiment, the radiator structure of the present embodiment, has exhaust outlet 13 on device housings 1, the air-out direction (as shown by arrows in FIG.) of inlet and outlet 6 is aimed at exhaust outlet 13, can in time the heat of device housings 1 inside be discharged to outside device housings 1, reduce the temperature of electronic equipment.
Preferably, another embodiment of the present utility model proposes a kind of radiator structure, compared with above-described embodiment, the radiator structure of the present embodiment, the quantity of inlet and outlet 6 is multiple, guarantees to produce the Air Flow of different directions, strengthens the radiating effect of device housings 1 inside.
As shown in Figure 6, a kind of electronic equipment that an embodiment of the present utility model proposes, specifically comprises; Device housings 1, can adopt metal shell or plastic shell; Control chip 2, control chip 2 is positioned at the inside of device housings 1; According to the radiator structure 14 of previous embodiment, control chip 2 can be connected on the piezoelectric membrane of radiator structure 14, controlling piezoelectric membrane vibrations causes Air Flow with heat radiation, known according to previous embodiment, than the DCJ of existing use metal shell and the piezoelectric membrane combining structure module that independently dispels the heat, radiator structure has utilized device housings, thereby also save the material of housing, this is conducive to reduce the thickness of radiator structure, simultaneously, than fan, piezoelectric membrane can not produce noise in the time of work, and its impact-resistant ability also far exceedes fan.
Preferably, another embodiment of the present utility model proposes a kind of electronic equipment, compared with above-described embodiment, the electronic equipment of the present embodiment, electronic equipment is mobile phone, flat computer or notebook, and the technical scheme of this area should be appreciated that mobile phone, flat computer and notebook only make example, technical scheme is not limited, the various electronic of other types is also all applicable to the technical scheme of the present embodiment.
According to above embodiment, radiator structure of the present utility model and electronic equipment at least have following advantages:
Than the independent heat radiation piezoelectric membrane of module and the structure of metal shell, piezoelectric membrane, the housing formation cavity structure that combines with electronic equipment casing in the utility model, electronic equipment casing plays the effect that substitutes part metals housing in traditional DCJ radiator individual module, what radiator structure of the present utility model can do is thinner, piezoelectric membrane does not produce noise in the time of work simultaneously, and the impact that can bear also far exceedes fan.
The above, it is only preferred embodiment of the present utility model, not the utility model is done to any pro forma restriction, although the utility model discloses as above with preferred embodiment, but not in order to limit the utility model, any those skilled in the art, do not departing within the scope of technical solutions of the utility model, when can utilizing the technology contents of above-mentioned announcement to make a little change or being modified to the equivalent embodiment of equivalent variations, in every case be the content that does not depart from technical solutions of the utility model, any simple modification of above embodiment being done according to technical spirit of the present utility model, equivalent variations and modification, all still belong in the scope of technical solutions of the utility model.
Claims (9)
1. a radiator structure, for electronic equipment is dispelled the heat, described electronic equipment comprises device housings and control chip, and described control chip is positioned at the inside of described device housings, it is characterized in that, and radiator structure comprises:
Housing, described housing hollow, has the first opening, the second opening and inlet and outlet on described housing, and described housing is fixed on the inner surface of described device housings, and described device housings covers described the first opening;
Piezoelectric membrane, described piezoelectric membrane shutoff is on described the second opening, described piezoelectric membrane, described housing and described device housings surround and form cavity, described piezoelectric membrane connects described control chip, can there are vibrations and cause described cavity volume to change, form and dispel the heat through the Air Flow of described inlet and outlet.
2. radiator structure according to claim 1, is characterized in that, described housing comprises:
Retainer ring, the both ends open of described retainer ring is respectively the first opening and the second opening.
3. radiator structure according to claim 2, is characterized in that,
Described inlet and outlet forms the breach on the edge of described the first opening.
4. radiator structure according to claim 1, is characterized in that, described housing comprises:
Top board, described top board offers the second opening;
Side plate, described side plate surrounds the edge of described top board, forms groove structure, and the opening of described groove structure forms described the first opening, also offers described inlet and outlet on described side plate.
5. radiator structure according to claim 1, is characterized in that,
In described device housings, have thermal component, described thermal component heating forms focus on described device housings, and the air-out direction of described inlet and outlet is aimed at described focus.
6. radiator structure according to claim 1, is characterized in that,
On described device housings, have exhaust outlet, the air-out direction of described inlet and outlet is aimed at described exhaust outlet.
7. according to the radiator structure described in any one in claim 1 to 6, it is characterized in that,
The quantity of described inlet and outlet is multiple.
8. an electronic equipment, is characterized in that, comprises;
Device housings;
Control chip, described control chip is positioned at the inside of described device housings;
According to the radiator structure described in claim 1 to 7 any one.
9. electronic equipment according to claim 8, is characterized in that,
Described electronic equipment is mobile phone, flat computer or notebook.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320704539.6U CN203633035U (en) | 2013-11-08 | 2013-11-08 | Heat dissipation structure and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320704539.6U CN203633035U (en) | 2013-11-08 | 2013-11-08 | Heat dissipation structure and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203633035U true CN203633035U (en) | 2014-06-04 |
Family
ID=50819470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320704539.6U Expired - Lifetime CN203633035U (en) | 2013-11-08 | 2013-11-08 | Heat dissipation structure and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203633035U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105828568A (en) * | 2015-01-06 | 2016-08-03 | 李明烈 | Piezoelectric radiator |
| CN113597192A (en) * | 2020-04-30 | 2021-11-02 | 维沃移动通信有限公司 | Electronic equipment |
-
2013
- 2013-11-08 CN CN201320704539.6U patent/CN203633035U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105828568A (en) * | 2015-01-06 | 2016-08-03 | 李明烈 | Piezoelectric radiator |
| CN105828568B (en) * | 2015-01-06 | 2018-05-22 | 李明烈 | piezoelectric type radiator |
| CN113597192A (en) * | 2020-04-30 | 2021-11-02 | 维沃移动通信有限公司 | Electronic equipment |
| CN113597192B (en) * | 2020-04-30 | 2024-02-02 | 维沃移动通信有限公司 | Electronic equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109729689B (en) | Wireless charging equipment | |
| US7957140B2 (en) | Air mover for device surface cooling | |
| CN202353644U (en) | Cell phone capable of radiating and cooling intelligently | |
| CN103327787A (en) | Electronic device | |
| CN104797120A (en) | Electronic device | |
| CN102926979A (en) | Vibrating diaphragm fan, mobile phone applying same and diaphragm vibrating and ventilating method | |
| CN205912387U (en) | Electronic equipment | |
| CN203633035U (en) | Heat dissipation structure and electronic device | |
| US8356656B2 (en) | Heat dissipation device and method | |
| CN105700649A (en) | Cooling system and electronic equipment | |
| CN202354003U (en) | Portable electronic device | |
| CN209693333U (en) | A kind of high-efficiency heat radiation structure of cell phone mainboard | |
| EP3117174B1 (en) | Skin material design to reduce touch temperature | |
| CN203691844U (en) | Electronic device | |
| TWM538689U (en) | Portable heat dissipation device and handheld electronic device provided with the same | |
| CN203773463U (en) | Computer case convenient for dissipating heat | |
| CN203788632U (en) | Novel server heat transfer casing | |
| CN204651398U (en) | A kind of synthesizing jet-flow cooling battery | |
| CN203689295U (en) | Server case | |
| CN203239538U (en) | Vibrating diaphragm fan and cell phone using same | |
| CN210042634U (en) | Wireless charging seat adopting phase change inhibition heat transfer material and piezoelectric ceramic fan | |
| CN207352542U (en) | A kind of dust-proof radiating industrial control mainboard | |
| CN204231078U (en) | A kind of heat radiation voice coil motor shell | |
| CN201673450U (en) | Computer power supply | |
| CN205375347U (en) | Computer motherboard convenient to installation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140604 |
|
| CX01 | Expiry of patent term |