CN113759480A - Optical module heat abstractor - Google Patents
Optical module heat abstractor Download PDFInfo
- Publication number
- CN113759480A CN113759480A CN202111138063.XA CN202111138063A CN113759480A CN 113759480 A CN113759480 A CN 113759480A CN 202111138063 A CN202111138063 A CN 202111138063A CN 113759480 A CN113759480 A CN 113759480A
- Authority
- CN
- China
- Prior art keywords
- optical module
- heat
- phase
- semiconductor refrigerator
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 65
- 239000004065 semiconductor Substances 0.000 claims abstract description 70
- 230000017525 heat dissipation Effects 0.000 claims abstract description 37
- 239000000919 ceramic Substances 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims description 13
- 238000001816 cooling Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 2
- 230000007704 transition Effects 0.000 description 6
- 238000009434 installation Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000002591 computed tomography Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4271—Cooling with thermo electric cooling
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses an optical module heat dissipation device.A semiconductor refrigerator comprises an inner core formed by connecting a P-type semiconductor and an N-type semiconductor in series, wherein the inner core is clamped between two layers of insulating ceramic plates which are respectively used as a cold end and a hot end; the cold end of the semiconductor refrigerator is in contact with the phase-change heat-conducting plate, the phase-change heat-conducting plate conducts heat generated by the optical module to the semiconductor refrigerator, the hot end of the semiconductor refrigerator is in contact with the radiator, the semiconductor refrigerator further transfers heat to the radiator, and the radiator is provided with fins for radiating, has a large contact area with air, and accelerates radiating. The optical module is cooled by the mutual matching of the semiconductor refrigerator and the phase-change heat conducting plate, and the temperature of the cold end of the semiconductor refrigerator is lower than the air temperature when the semiconductor refrigerator is electrified, so that the active cooling effect is achieved, and the optical module is cooled better.
Description
Technical Field
The invention relates to the field of heat dissipation equipment, in particular to an optical module heat dissipation device.
Background
The optical module is the most commonly used component in IT (Internet Technology) and CT (Computed Tomography) devices, and is generally arranged at the downstream of a single-board air duct, incoming air is heated by a high-power device such as an upstream CPU, and the temperature of the air reaching the optical module is substantially the hottest air in the device, and some air may even exceed 60 ℃.
With the rapid development of the optical module, the speed is from 10G, 25G, 50G to 100G, the power of the optical module is also from 0.8w to 10w of the road sign, and the power is increased by over 1250%, so that the optical module becomes a bottleneck of the existing system heat dissipation design. The general heat dissipation scheme is that heat dissipation fins are mounted on an optical module and are cooled by external air flow, and the general heat dissipation cooling scheme cannot meet the increasing heating power.
For those skilled in the art, how to better cool down the optical module is a technical problem that needs to be solved at present.
Disclosure of Invention
The invention provides an optical module heat dissipation device, which realizes forced heat dissipation and effectively reduces the temperature of an optical module by matching a phase-change heat conduction plate with a semiconductor refrigerator, and the specific scheme is as follows:
an optical module heat dissipation device comprises a phase change heat conduction plate, a semiconductor refrigerator and a radiator; the area of the phase-change heat conducting plate is larger than the contact area of the optical module, and heat is conducted through a phase-change medium in the phase-change heat conducting plate;
the semiconductor refrigerator comprises an inner core formed by connecting a P-type semiconductor and an N-type semiconductor in series, the inner core is clamped between two layers of insulating ceramic sheets, and the two layers of insulating ceramic sheets are respectively used as a cold end and a hot end;
the cold end of the semiconductor refrigerator is in contact with the phase change heat conducting plate, the hot end of the semiconductor refrigerator is in contact with the radiator, and the radiator is provided with fins for radiating.
Optionally, the phase-change heat-conducting plate is provided with a mounting groove, and the mounting groove is used for being connected with the radiator in a matching manner; the radiator is fixed on the semiconductor refrigerator.
Optionally, the mounting groove and the optical module are located on the same side of the phase change heat conducting plate; the total height of the semiconductor cooler and the heat sink is lower than the height of the optical module.
Optionally, the length of the mounting groove is greater than the lengths of the two radiators, and at least two radiators can be simultaneously supported and assembled in the mounting groove in a sliding manner.
Optionally, the middle part of the phase change heat conducting plate contacts the optical module, and the semiconductor refrigerator and the heat sink are respectively symmetrically arranged on two sides of the optical module.
Optionally, the heat sink includes a heat dissipation substrate and heat dissipation fins, the heat dissipation substrate is attached to the semiconductor refrigerator, and the heat dissipation fins are vertically fixed to the heat dissipation substrate; and the edges of two opposite sides of the heat dissipation substrate are matched and supported with the mounting groove.
Optionally, the phase change heat conducting plate and the optical module are clamped with each other or fixedly connected through bolts.
The invention provides a heat sink of an optical module, wherein the area of a phase-change heat conducting plate is larger than the contact area of the optical module, and heat is conducted through a phase-change medium in the phase-change heat conducting plate; the semiconductor refrigerator comprises an inner core formed by connecting a P-type semiconductor and an N-type semiconductor in series, the inner core is clamped between two layers of insulating ceramic plates, the two layers of insulating ceramic plates are respectively used as a cold end and a hot end, and when the semiconductor refrigerator is electrified, the temperature of the cold end is low and the temperature of the hot end is high; the cold end of the semiconductor refrigerator is in contact with the phase-change heat-conducting plate, the phase-change heat-conducting plate conducts heat generated by the optical module to the semiconductor refrigerator, the hot end of the semiconductor refrigerator is in contact with the radiator, the semiconductor refrigerator further transfers heat to the radiator, and the radiator is provided with fins for radiating, has a large contact area with air, and accelerates radiating. The optical module is cooled by the mutual matching of the semiconductor refrigerator and the phase-change heat conducting plate, and the temperature of the cold end of the semiconductor refrigerator is lower than the air temperature when the semiconductor refrigerator is electrified, so that the active cooling effect is achieved, and the optical module is cooled better.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is an overall structure front view of an optical module heat sink according to the present invention;
FIG. 2 is a schematic diagram of a semiconductor cooler;
FIG. 3 is a top view of the optical module heat dissipation device of the present invention;
fig. 4 is a side view of an optical module heat sink according to the present invention.
The figure includes:
the phase-change heat conduction plate comprises a phase-change heat conduction plate 1, a mounting groove 11, a semiconductor refrigerator 2, an inner core 21, an insulating ceramic plate 22, a radiator 3, a heat radiation base plate 31 and heat radiation fins 32.
Detailed Description
The core of the invention is to provide an optical module heat dissipation device, which realizes forced heat dissipation through the matching of a phase change heat conduction plate and a semiconductor refrigerator, and effectively reduces the temperature of an optical module.
In order to make those skilled in the art better understand the technical solution of the present invention, the optical module heat sink of the present invention will be described in detail with reference to the accompanying drawings and the specific embodiments.
The invention provides an optical module heat sink, which comprises a phase-change heat conduction plate 1, a semiconductor refrigerator 2, a radiator 3 and other structures, and is an overall structure front view of the optical module heat sink as shown in figure 1, wherein A represents an optical module, and B represents a carrier for mounting the optical module; the area of the phase-change heat-conducting plate 1 is larger than the contact area of the optical module, as shown in fig. 1, the upper surface of the optical module is in contact with the phase-change heat-conducting plate 1, and the contact area between the optical module and the phase-change heat-conducting plate 1 is smaller than the area of the phase-change heat-conducting plate 1. The phase-change heat conduction plate 1 is internally provided with a cavity, the phase-change heat conduction plate internally contains a phase-change medium, the phase-change medium can move inside the phase-change heat conduction plate, the movement path is approximately shown by a dotted arrow in the figure 1, and heat is conducted through the phase-change medium inside the phase-change heat conduction plate; the phase change medium has strong heat conduction capability because of phase change generated in the heat absorption and release processes.
As shown in fig. 2, it is a schematic structural view of a semiconductor cooler 2; the semiconductor refrigerator 2 comprises an inner core 21 formed by connecting a P-type semiconductor and an N-type semiconductor in series, a plurality of P-type semiconductors and a plurality of N-type semiconductors are respectively arranged at intervals and are connected end to end, and the series circuit is connected with a direct current power supply and is powered by the direct current power supply; the inner core 21 is clamped between two layers of insulating ceramic plates 22, and the two layers of insulating ceramic plates 22 are respectively used as a cold end and a hot end; when the cold-proof heat exchanger works, one of the insulating ceramic plates 22 serves as a cold end, the other insulating ceramic plate 22 serves as a hot end, cold is concentrated on the cold end, and heat is concentrated on the hot end.
The cold end of semiconductor cooler 2 contacts phase transition heat-conducting plate 1, and the hot junction of semiconductor cooler 2 contacts radiator 3, and radiator 3 sets up the fin that is used for the heat dissipation, and the fin can increase the area of contact with the air to guarantee good heat exchange capacity.
During operation, the optical module produces the heat, conducts to phase transition heat-conducting plate 1, and the phase transition medium heat absorption of phase transition heat-conducting plate 1 inside takes place the phase transition, takes the heat to the position that is close to semiconductor refrigerator 2, and heat conduction is to semiconductor refrigerator 2, and the cold junction through semiconductor refrigerator 2 is to phase transition heat-conducting plate 1 cooling, and semiconductor refrigerator 2's heat further transmits to radiator 3, gives off the external world through the operation of radiator 3.
Because the semiconductor refrigerator 2 is adopted, and the temperature of the cold end is lower than the temperature of air when the semiconductor refrigerator 2 is electrified, the phase-change heat-conducting plate 1 is actively cooled, and then the optical module is cooled.
On the basis of the scheme, the phase-change heat conduction plate 1 is provided with the installation groove 11, the installation groove 11 is used for being matched and connected with the radiator 3, and the radiator 3 is detachably installed on the phase-change heat conduction plate 1. The radiator 3 is fixed on the semiconductor refrigerator 2, and the semiconductor refrigerator 2 and the radiator 3 are synchronously assembled and connected; after being assembled in place, the semiconductor refrigerator 2 is sandwiched between the heat sink 3 and the phase-change heat-conducting plate 1.
The mounting groove 11 and the optical module are positioned on the same side of the phase change heat conducting plate 1; the total height of the semiconductor cooler 2 and the heat sink 3 is lower than the height of the optical module. Referring to fig. 1, the mounting groove 11 and the optical module are located on the lower surface of the phase change heat conducting plate 1, and when the semiconductor refrigerator 2 and the heat sink 3 are mounted in place, a certain gap still exists between the heat sink 3 and a carrier below which the optical module is mounted.
The length of the mounting groove 11 is larger than the lengths of the two radiators 3, and at least two radiators 3 can be simultaneously supported and assembled in the mounting groove 11 in a sliding mode. Referring to fig. 3, a top view of the optical module heat sink of the present invention is shown, and an appropriate number of semiconductor coolers 2 and heat sinks 3 can be selected according to the use requirement.
Referring to fig. 3, the middle portion of the phase-change heat-conducting plate 1 contacts the optical module, and the semiconductor cooler 2 and the heat sink 3 are respectively symmetrically disposed at both sides of the optical module, and the both sides independently dissipate heat, so that the heat dissipation space is more fully utilized.
The heat sink 3 includes a heat dissipation substrate 31 and heat dissipation fins 32, and both the heat dissipation substrate 31 and the heat dissipation fins 32 are flat plate structures; the heat dissipation substrate 31 is attached to the semiconductor cooler 2, the heat dissipation fins 32 are vertically fixed to the heat dissipation substrate 31, and the heat dissipation fins 32 are provided in plural and arranged in parallel to each other. The two opposite side edges of the heat dissipation substrate 31 are matched and supported with the mounting groove 11.
Fig. 4 is a side view of the optical module heat sink according to the present invention; two groups of mounting grooves 11 are arranged and are respectively positioned at two opposite side edges of the phase-change heat-conducting plate 1, the cross section of each mounting groove 11 is of an L-shaped structure, and a step surface formed by a bending part can play a role in supporting the radiator 3; when the radiator 3 and the semiconductor refrigerator 2 are installed, the radiator and the semiconductor refrigerator are pushed into the installation groove 11 along the transverse direction, and the installation steps are simplified.
Specifically, the phase change heat conducting plate 1 and the optical module are clamped or fixedly connected through bolts, and only tight and stable contact is ensured.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. An optical module heat dissipation device is characterized by comprising a phase change heat conduction plate (1), a semiconductor refrigerator (2) and a radiator (3); the area of the phase-change heat conduction plate (1) is larger than the contact area of the optical module, and heat is conducted through a phase-change medium in the phase-change heat conduction plate;
the semiconductor refrigerator (2) comprises an inner core (21) formed by connecting a P-type semiconductor and an N-type semiconductor in series, the inner core (21) is clamped between two layers of insulating ceramic sheets (22), and the two layers of insulating ceramic sheets (22) are respectively used as a cold end and a hot end;
the cold end of the semiconductor refrigerator (2) is in contact with the phase-change heat-conducting plate (1), the hot end of the semiconductor refrigerator (2) is in contact with the radiator (3), and the radiator (3) is provided with fins for radiating.
2. The optical module heat sink according to claim 1, wherein the phase-change heat-conducting plate (1) is provided with a mounting groove (11), the mounting groove (11) is used for matching and connecting the heat sink (3); the radiator (3) is fixed on the semiconductor refrigerator (2).
3. The optical module heat sink according to claim 2, wherein the mounting groove (11) and the optical module are located on the same side of the phase-change heat-conducting plate (1); the total height of the semiconductor cooler (2) and the heat sink (3) is lower than the height of the optical module.
4. The optical module heat sink according to claim 3, characterized in that the length of the mounting groove (11) is greater than the length of two heat sinks (3), and at least two heat sinks (3) can be simultaneously and slidably mounted in the mounting groove (11).
5. The optical module heat sink according to claim 4, wherein the middle of the phase change thermal conductive plate (1) contacts the optical module, and the semiconductor cooler (2) and the heat sink (3) are symmetrically disposed on both sides of the optical module.
6. The optical module heat sink according to claim 5, wherein the heat sink (3) comprises a heat dissipation substrate (31) and heat dissipation fins (32), the heat dissipation substrate (31) is attached to the semiconductor cooler (2), and the heat dissipation fins (32) are vertically fixed to the heat dissipation substrate (31); the edges of two opposite sides of the heat dissipation substrate (31) are matched and supported with the mounting groove (11).
7. The optical module heat sink according to claim 6, wherein the phase-change heat conducting plate (1) and the optical module are connected by clamping or bolting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111138063.XA CN113759480A (en) | 2021-09-27 | 2021-09-27 | Optical module heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111138063.XA CN113759480A (en) | 2021-09-27 | 2021-09-27 | Optical module heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113759480A true CN113759480A (en) | 2021-12-07 |
Family
ID=78797771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111138063.XA Pending CN113759480A (en) | 2021-09-27 | 2021-09-27 | Optical module heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113759480A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101328503A (en) * | 2008-07-18 | 2008-12-24 | 杭州博日科技有限公司 | Fluorescent quantitative PCR detection system based on bottom scan detection |
| CN201388357Y (en) * | 2009-03-03 | 2010-01-20 | 赵继永 | Phase-change energy-storage temperature control apparatus of sealing equipment |
| CN107479151A (en) * | 2017-09-22 | 2017-12-15 | 比赫电气（太仓）有限公司 | A kind of heat pipe semiconductor temperature control module for All-in-One optical module |
| CN108592244A (en) * | 2018-06-13 | 2018-09-28 | 珠海格力电器股份有限公司 | Radiator, air-conditioner controller and air-conditioning |
| CN208805597U (en) * | 2018-10-16 | 2019-04-30 | 上海欣诺通信技术股份有限公司 | Optical transmission device with radiator structure |
| CN111061018A (en) * | 2018-10-16 | 2020-04-24 | 上海欣诺通信技术股份有限公司 | Optical transmission apparatus |
| CN112130644A (en) * | 2020-08-21 | 2020-12-25 | 苏州浪潮智能科技有限公司 | Optical module heat dissipation equipment and server |
| CN113126216A (en) * | 2019-12-31 | 2021-07-16 | 华为技术有限公司 | Heat dissipation shell, optical module with heat dissipation shell and communication equipment |
-
2021
- 2021-09-27 CN CN202111138063.XA patent/CN113759480A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101328503A (en) * | 2008-07-18 | 2008-12-24 | 杭州博日科技有限公司 | Fluorescent quantitative PCR detection system based on bottom scan detection |
| CN201388357Y (en) * | 2009-03-03 | 2010-01-20 | 赵继永 | Phase-change energy-storage temperature control apparatus of sealing equipment |
| CN107479151A (en) * | 2017-09-22 | 2017-12-15 | 比赫电气（太仓）有限公司 | A kind of heat pipe semiconductor temperature control module for All-in-One optical module |
| CN108592244A (en) * | 2018-06-13 | 2018-09-28 | 珠海格力电器股份有限公司 | Radiator, air-conditioner controller and air-conditioning |
| CN208805597U (en) * | 2018-10-16 | 2019-04-30 | 上海欣诺通信技术股份有限公司 | Optical transmission device with radiator structure |
| CN111061018A (en) * | 2018-10-16 | 2020-04-24 | 上海欣诺通信技术股份有限公司 | Optical transmission apparatus |
| CN113126216A (en) * | 2019-12-31 | 2021-07-16 | 华为技术有限公司 | Heat dissipation shell, optical module with heat dissipation shell and communication equipment |
| CN112130644A (en) * | 2020-08-21 | 2020-12-25 | 苏州浪潮智能科技有限公司 | Optical module heat dissipation equipment and server |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108766946B (en) | Liquid cooling heat abstractor and motor controller | |
| JPH06151979A (en) | Thermoelectric device | |
| KR20100060756A (en) | A thermoelectric cooling device for liqiid type | |
| CN113759480A (en) | Optical module heat abstractor | |
| CN215646842U (en) | Heat dissipation exchanger shell | |
| JP2563524B2 (en) | Thermoelectric device | |
| CN212970604U (en) | Servo driver with high-efficiency heat dissipation | |
| KR101177266B1 (en) | Heat Exchanger using Thermoelectric Modules | |
| CN112130644A (en) | Optical module heat dissipation equipment and server | |
| CN209845583U (en) | Double-sided heat dissipation device and inverter | |
| CN212011585U (en) | A radiator fan for laser generator | |
| CN218770826U (en) | Cooling system for internal ring temperature of power supply equipment | |
| CN110769657A (en) | Integrated uniform temperature plate radiator | |
| CN217685509U (en) | Radiator and air condensing units | |
| CN216357883U (en) | Heat dissipation module used in sealed cavity | |
| CN220493447U (en) | Fin type radiator | |
| CN218851204U (en) | Heat dissipation module and refrigerating device | |
| CN219741019U (en) | Radiator module and equipment cabinet | |
| KR101619626B1 (en) | Water cooling type and Air cooling type Thermoelectric devices | |
| CN217214595U (en) | High-efficient radiating high voltage direct current contactor | |
| CN212005245U (en) | Thermoelectric isolation type LED module | |
| CN218499500U (en) | Heat dissipation device | |
| CN220821549U (en) | Chip liquid cooling radiator | |
| US20240125563A1 (en) | Fin structure | |
| CN214891556U (en) | Radiating assembly, radiator and air conditioner outdoor unit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20211207 |