CN215418151U - Chip COB with shell through hole convection heat radiation structure - Google Patents
Chip COB with shell through hole convection heat radiation structure Download PDFInfo
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- CN215418151U CN215418151U CN202121840606.8U CN202121840606U CN215418151U CN 215418151 U CN215418151 U CN 215418151U CN 202121840606 U CN202121840606 U CN 202121840606U CN 215418151 U CN215418151 U CN 215418151U
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Abstract
The utility model relates to the technical field of chip COB (chip on Board), and discloses a chip COB with a shell through hole convection heat dissipation structure, which comprises a chip body and a protective shell arranged at the upper end of the chip body, wherein a plurality of components are arranged at the upper end of the chip body, heat conducting fins are arranged at the lower ends of the components, heat conducting fins are arranged at two sides of the chip body, a vent A for heat dissipation is arranged at the middle part of the chip body, vent B is arranged at two sides and the top end of the protective shell, air inlets are arranged at two sides of the protective shell, a thermoelectric generation fin is arranged at the inner side of each air inlet, when the chip body works, if the internal components generate heat, the heat is transmitted to the heat conducting fins through the heat conducting fins, and the thermoelectric generation fin arranged at the upper end works because the temperature difference between the lower end and the upper end is larger, so that a fan in the air inlets works and blows air into the protective shell, the heat is blown out from the vent A and the vent B which are arranged at the upper ends of the protective shell and the chip body.
Description
Technical Field
The utility model relates to the technical field of chip COB, in particular to a chip COB with a shell through hole convection heat dissipation structure.
Background
The COB chip-on-board process comprises the steps of covering a silicon chip mounting point on the surface of a substrate with heat-conducting epoxy resin, directly mounting the silicon chip on the surface of the substrate, carrying out heat treatment until the silicon chip is firmly fixed on the substrate, and then directly establishing electrical connection between the silicon chip and the substrate by using a wire bonding method.
When the chip works, a large amount of heat is easily generated, if the heat cannot be dissipated in time, the internal chip is easily burnt out due to high temperature, the normal use of equipment is influenced, and in the ventilation process, if the air at normal temperature is introduced, the heat dissipation is slow, and the use is inconvenient.
The problems described above are addressed. For this purpose, a chip COB having a through-housing-hole convection heat dissipation structure is proposed.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a chip COB with a shell through hole convection heat dissipation structure, when a chip body works, if internal components generate heat, the heat is transmitted to a heat transfer sheet through a heat conduction sheet, after the heat reaches a certain peak value, a temperature difference power generation sheet arranged at the upper end works because the temperature difference between the lower end and the upper end is large, the temperature difference power generation sheet works, a fan inside an air inlet works to blow air into the protection shell, then convection is formed at the upper end of the chip body, the heat is blown out from a ventilation opening A and a ventilation opening B which are formed at the upper ends of the protection shell and the chip body, heat dissipation is convenient, the heat of the internal components is prevented from being dissipated difficultly, and the chip body is damaged due to continuous high-temperature work, so that the problems in the background technology are solved.
In order to achieve the purpose, the utility model provides the following technical scheme: a chip COB with a shell through hole convection heat dissipation structure comprises a chip body and a protective shell installed at the upper end of the chip body, wherein a plurality of components are arranged at the upper end of the chip body, heat conducting fins are arranged at the lower ends of the components, heat transfer fins are arranged on two sides of the chip body, and a ventilation opening A for heat dissipation is formed in the middle of the chip body;
both sides and the top of protecting crust all are provided with vent B, and the both sides of protecting crust all are provided with the air intake, and the inboard of air intake is provided with thermoelectric generation piece.
Preferably, the heat conducting fins arranged at the lower ends of the components are connected with the heat conducting fins arranged on two sides through connecting pieces arranged inside the chip body.
Preferably, the vent A is matched with the vent B in position.
Preferably, after the chip body and the protective shell are installed, the thermoelectric generation piece and the heat transfer piece are installed in a fitting mode.
Preferably, an exhaust fan a is arranged inside the air inlet, a cooling fin a is arranged on one side of the exhaust fan a, a cooling fin B is arranged on the other side of the cooling fin a, and the exhaust fan B is arranged on one side of the cooling fin B.
Preferably, the semiconductor refrigeration piece is arranged in the middle of the radiating fin A and the radiating fin B.
Preferably, the refrigerating surface of the semiconductor refrigerating sheet is arranged on one side of the inner cavity of the protective shell, and the radiating surface is arranged on the outer side of the protective shell.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the chip COB with the shell through hole convection heat dissipation structure, when a chip body works, if internal components generate heat, the heat is transmitted to the heat transfer sheet through the heat conduction sheet, after the heat reaches a certain peak value, the temperature difference power generation sheet arranged at the upper end works because the temperature difference between the lower end and the upper end is large, so that a fan inside an air inlet works to blow air into the protection shell, convection is formed at the upper end of the chip body, the heat is blown out from the protection shell and the vent A and the vent B arranged at the upper end of the chip body, heat dissipation is facilitated, the heat of the internal components is prevented from being dissipated poorly, and the chip body is damaged due to continuous high-temperature work.
2. According to the chip COB with the shell through hole convection heat dissipation structure, when air enters an air inlet, the semiconductor refrigeration piece works, cold air is volatilized inwards by the cooling fins B, then the cold air is diffused into the protective shell by the exhaust fan B, blown air is changed into cold air from normal-temperature air, the heat dissipation effect of components is better, and the components can be cooled quickly.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic diagram of a chip body structure according to the present invention;
FIG. 3 is a schematic view of the structure of the protective shell of the present invention;
fig. 4 is a schematic view of the internal structure of the air inlet according to the present invention.
In the figure: 1. a chip body; 11. a component; 12. a heat conductive sheet; 13. a heat transfer sheet; 14. a vent A; 2. a protective shell; 21. a vent B; 22. an air inlet; 221. an exhaust fan A; 222. a heat sink A; 223. a heat sink B; 224. an exhaust fan B; 225. a semiconductor refrigeration sheet; 23. thermoelectric power generation piece.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, a chip COB with a shell through-hole convection heat dissipation structure includes a chip body 1 and a protective shell 2 installed on the upper end of the chip body 1, the upper end of the chip body 1 is provided with a plurality of components 11, the lower end of each component 11 is provided with a heat conduction fin 12, two sides of the chip body 1 are provided with heat transfer fins 13, the heat conduction fins 12 installed on the lower ends of the components 11 are connected with the heat transfer fins 13 arranged on two sides through connection sheets arranged inside the chip body 1, and the middle of the chip body 1 is provided with a vent a14 for heat dissipation.
Both sides and the top end of the protective shell 2 are provided with vent holes B21, the vent hole A14 is matched with the position of the vent hole B21, both sides of the protective shell 2 are provided with air inlets 22, the inner side of the air inlets 22 is provided with a thermoelectric generation piece 23, after the chip body 1 and the protective shell 2 are installed, the thermoelectric generation piece 23 is attached to the heat transfer piece 13, when the chip body 1 works, if the internal components 11 generate heat, the heat is transferred to the heat transfer piece 13 through the heat transfer piece 12, after the heat reaches a certain peak value, the thermoelectric generation piece 23 installed at the upper end works because the temperature difference between the lower end and the upper end is large, the thermoelectric generation piece 23 works, so that a fan inside the air inlets 22 works, blows air into the protective shell 2, further, convection is formed at the upper end of the chip body 1, the heat blows out from the vent holes A14 and the vent holes B21 which are arranged at the upper ends of the protective shell 2 and the chip body 1, conveniently dispel the heat, avoid 11 heats of internal components and parts not well to dispel, the work of lasting high temperature leads to chip body 1 to damage.
Referring to fig. 2 and 4, an exhaust fan a221 is disposed inside the air inlet 22, a heat sink a222 is disposed on one side of the exhaust fan a221, a heat sink B223 is disposed on the other side of the heat sink a222, an exhaust fan B224 is disposed on one side of the heat sink B223, a semiconductor cooling plate 225 is mounted in the middle of the heat sink a222 and the heat sink B223, a cooling surface of the semiconductor cooling plate 225 is disposed on one side of an inner cavity of the protective shell 2, and a heat sink surface is disposed on the outer side of the protective shell 2.
The working principle is as follows: when the chip body 1 is working, if the internal components 11 generate heat, the heat is transmitted to the heat transfer sheet 13 through the heat conduction sheet 12, after the heat reaches a certain peak value, the temperature difference power generation sheet 23 installed at the upper end works because the temperature difference between the lower end and the upper end is large, the temperature difference power generation sheet 23 works, so that the fan inside the air inlet 22 works to blow air into the protection shell 2, further the upper end of the chip body 1 forms convection, the heat is blown out from the vent A14 and the vent B21 formed at the upper ends of the protection shell 2 and the chip body 1, heat dissipation is convenient, the heat of the internal components 11 is prevented from being well dissipated, the chip body 1 is damaged due to continuous high-temperature work, when the air enters the air inlet 22, the semiconductor refrigeration sheet 225 works, the cold air is volatilized inwards by the heat dissipation sheet B223, then the cold air is diffused into the shell 2 by the protection fan B224, and the blown air is changed from normal-temperature air into cold air, the heat dissipation effect of the components 11 is better, and the components 11 can be cooled quickly.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a chip COB with casing through-hole convection heat radiation structure, includes chip body (1) and installs protecting crust (2) in chip body (1) upper end, its characterized in that: the chip comprises a chip body (1), wherein the upper end of the chip body (1) is provided with a plurality of components (11), the lower end of each component (11) is provided with a heat conducting fin (12), two sides of the chip body (1) are provided with heat conducting fins (13), and the middle part of the chip body (1) is provided with a vent A (14) for heat dissipation;
both sides and the top of protecting crust (2) all are provided with vent B (21), and the both sides of protecting crust (2) all are provided with air intake (22), and the inboard of air intake (22) is provided with thermoelectric generation piece (23).
2. The COB with the shell through hole convection heat dissipation structure of claim 1, wherein: the heat conducting fins (12) arranged at the lower end of the component (11) are connected with the heat transfer fins (13) arranged on the two sides through connecting pieces arranged inside the chip body (1).
3. The COB with the shell through hole convection heat dissipation structure of claim 1, wherein: the vent A (14) is matched with the vent B (21) in position.
4. The COB with the shell through hole convection heat dissipation structure of claim 1, wherein: after the chip body (1) and the protective shell (2) are installed, the thermoelectric generation piece (23) and the heat transfer piece (13) are installed in an attaching mode.
5. The COB with the shell through hole convection heat dissipation structure of claim 1, wherein: the air conditioner is characterized in that an exhaust fan A (221) is arranged inside the air inlet (22), a cooling fin A (222) is arranged on one side of the exhaust fan A (221), a cooling fin B (223) is arranged on the other side of the cooling fin A (222), and an exhaust fan B (224) is arranged on one side of the cooling fin B (223).
6. Chip COB with shell through-hole convection heat dissipation structure of claim 5, characterized in that: and the middle parts of the radiating fins A (222) and the radiating fins B (223) are provided with semiconductor refrigerating fins (225).
7. Chip COB with shell through-hole convection heat dissipation structure of claim 6, characterized in that: the refrigerating surface of the semiconductor refrigerating sheet (225) is arranged on one side of the inner cavity of the protective shell (2), and the radiating surface is arranged on the outer side of the protective shell (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121840606.8U CN215418151U (en) | 2021-08-09 | 2021-08-09 | Chip COB with shell through hole convection heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121840606.8U CN215418151U (en) | 2021-08-09 | 2021-08-09 | Chip COB with shell through hole convection heat radiation structure |
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| Publication Number | Publication Date |
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| CN215418151U true CN215418151U (en) | 2022-01-04 |
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| CN202121840606.8U Active CN215418151U (en) | 2021-08-09 | 2021-08-09 | Chip COB with shell through hole convection heat radiation structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2796631C1 (en) * | 2023-01-31 | 2023-05-29 | Общество с ограниченной ответственностью "Ботлихский радиозавод" | Thermoelectric device for heat removal from electronic equipment elements |
-
2021
- 2021-08-09 CN CN202121840606.8U patent/CN215418151U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2796631C1 (en) * | 2023-01-31 | 2023-05-29 | Общество с ограниченной ответственностью "Ботлихский радиозавод" | Thermoelectric device for heat removal from electronic equipment elements |
| RU2797034C1 (en) * | 2023-01-31 | 2023-05-31 | Общество с ограниченной ответственностью "Ботлихский радиозавод" | Thermoelectric device for heat removal from electronic equipment elements |
| RU2797712C1 (en) * | 2023-01-31 | 2023-06-08 | Общество с ограниченной ответственностью "Ботлихский радиозавод" | Thermoelectric device for heat removal from electronic equipment elements |
| RU2797714C1 (en) * | 2023-01-31 | 2023-06-08 | Общество с ограниченной ответственностью "Ботлихский радиозавод" | Thermoelectric device for heat removal from electronic equipment elements |
| RU2800004C1 (en) * | 2023-01-31 | 2023-07-14 | Общество с ограниченной ответственностью "Ботлихский радиозавод" | Thermoelectric device for heat removal from electronic equipment elements |
| RU2800231C1 (en) * | 2023-01-31 | 2023-07-19 | Общество с ограниченной ответственностью "Ботлихский радиозавод" | Thermoelectric device for heat removal from radioelectronic equipment elements |
| RU2805978C1 (en) * | 2023-05-12 | 2023-10-24 | Общество ограниченной ответственностью "Ботлихский радиозавод" | Thermoelectric device for heat removal from rea elements |
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