CN209279289U - A kind of radiator - Google Patents
A kind of radiator Download PDFInfo
- Publication number
- CN209279289U CN209279289U CN201821048518.2U CN201821048518U CN209279289U CN 209279289 U CN209279289 U CN 209279289U CN 201821048518 U CN201821048518 U CN 201821048518U CN 209279289 U CN209279289 U CN 209279289U
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- China
- Prior art keywords
- radiating fin
- heat
- substrate
- fin
- graphene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims abstract description 59
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 48
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 46
- 239000012530 fluid Substances 0.000 claims abstract description 27
- 239000011248 coating agent Substances 0.000 claims abstract description 12
- 238000000576 coating method Methods 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 14
- 230000017525 heat dissipation Effects 0.000 claims description 11
- 239000002356 single layer Substances 0.000 claims description 9
- 238000004512 die casting Methods 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims description 4
- 230000001680 brushing effect Effects 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 150000001336 alkenes Chemical class 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000004575 stone Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 239000000306 component Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 239000003507 refrigerant Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 230000005855 radiation Effects 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 241000270295 Serpentes Species 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a kind of radiators, and including substrate and the radiating fin being set on the substrate, the radiating fin is set as the internal hollow structure for being filled with fluid media (medium), and the surface of the radiating fin is coated with graphene layer.The radiator of the utility model is by being arranged to hollow structure for radiating fin, and in the internal fill fluid medium of hollow structure, the heat that power component can be transmitted to substrate by fluid media (medium) is transferred quickly to the top of radiating fin, and by coating one layer of graphene layer on radiating fin, utilize the high feature of graphene thermal coefficient, the slin emissivity of radiating fin can be increased, to enhance the heating conduction of radiating fin, and then improve the radiating efficiency of radiator.
Description
Technical field
The utility model relates to air conditioner parts technical field more particularly to a kind of radiators.
Background technique
Frequency changer adjusts corresponding compressor frequency according to different load to meet the different demands of user, is that frequency changer is got over
Carry out the main reason for more universal.Frequency changer core component be frequency-variable controller, frequency-variable controller configured with part heating power compared with
Element that is high, being in the case of hot operation always, such as IPM functional module, IGBT.In order to ensure frequency-variable controller can be transported smoothly
Row is directly contacted using radiator with high power modules such as IPM, IGBT at present, and heat dissipation is to atmosphere after heat transfer area is amplified
Mode reduces the temperature of the high power modules such as IPM, IGBT.
Specifically, in the prior art, the heat dissipating method of frequency-variable controller is mainly: keeping the power component of frequency-variable controller tight
It is attached on one end of radiator, and radiator is placed in the heat exchanging air duct of outdoor unit, power when reducing convertible frequency air-conditioner operation
The temperature of element, to guarantee system reliability of operation.Current radiator is mainly by solid aluminum form-relieved type radiating fin
Composition, and the area by changing radiating fin and shape radiate to strengthen.But such radiator is by the limit in outdoor unit space
System, is difficult area increased, and teeth area is bigger, and the temperature difference at tooth top and tooth root both ends is bigger, the heat dissipation effect of radiator
Rate is lower.
Therefore it provides a kind of radiator that radiating efficiency can be improved becomes those skilled in the art's technology urgently to be solved
Problem.
Utility model content
For the low technical problem of radiating efficiency existing for existing radiator, the utility model provides a kind of heat dissipation dress
It sets, which is situated between by the way that radiating fin is arranged to hollow structure and fills fluid in the radiating fin of hollow structure
Matter, and the graphene coated layer also on radiating fin, the radiating efficiency of radiator is improved with this.
The utility model implements by following technical solution:
According to a preferred embodiment, the radiator of the utility model, including substrate and it is set on the substrate
Radiating fin described in radiating fin be set as the internal hollow structure for being filled with fluid media (medium), and the table of the radiating fin
Face is coated with graphene layer.
Further, the substrate is the structure with hollow cavity, and is provided in the hollow cavity and institute
State the heat-transfer pipe that substrate die casting is an integral structure.
Further, the radiating fin includes at least the first fin and the second fin, and first fin and institute
State the hollow structure that the second fin forms filling fluid media (medium) by welding.
Further, the fluid media (medium) in the radiating fin by free convection by heat from the bottom of the radiating fin
Portion is transferred to the top of the radiating fin.
Further, what the radiating fin was in contact with the substrate is integrally formed structures on one side.
Further, card slot is provided on the substrate, the bottom of the radiating fin is provided with and the card slot phase
The buckle matched enables the radiating fin dismountable by the matching of the buckle and the card slot and the substrate
Connection.
Further, the material of the substrate and the radiating fin be aluminium, the heat-transfer pipe be copper pipe, stainless steel tube or
Aluminium-alloy pipe.
Further, the graphene layer is single-layer graphene or the heat conducting film containing graphene.
Further, the single-layer graphene or the heat conducting film containing graphene are by pure graphene coating or to contain graphite
The composite coating of alkene is coated in the cooling fin surfaces by way of spraying or brushing.
Further, the graphene layer with a thickness of 10~20 μm.
Radiator provided by the utility model at least has the advantage that
(1) radiator of the utility model is by being arranged to hollow structure for radiating fin, and in hollow structure
Fluid media (medium) is filled in portion, and the heat that power component can be transmitted to substrate by fluid media (medium) is transferred quickly to the top of radiating fin,
And radiating fin can be increased using the high feature of graphene thermal coefficient by coating one layer of graphene layer on radiating fin
The slin emissivity of piece to enhance the heating conduction of radiating fin, and then improves the radiating efficiency of radiator.
(2) radiator provided by the utility model connect heat-transfer pipe with substrate rheo-die-casting, reduces to other materials
The application of matter so that the connection of heat-transfer pipe and substrate is even closer, with it is existing with heat conductive silica gel connection type compared with, heat transfer
Coefficient is bigger, and heat-conducting effect is more preferable, and heat transfer is faster.On the other hand, by heat-transfer pipe die casting on substrate, can increase heat-transfer pipe with
The contact area of substrate is scattered away so that heat effectively can be transmitted to radiator from power component, guarantees function
Rate component reliability of operation.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of the utility model radiator；
Fig. 2 is a preferred embodiment installation diagram of the utility model heat-transfer pipe and hollow cavity；
Fig. 3 is a preferred embodiment structural schematic diagram of the utility model heat-transfer pipe；
Schematic diagram when Fig. 4 is fluid media (medium) free convection in the utility model radiating fin.
1- substrate in figure；2- radiating fin；3- hollow cavity；4- heat-transfer pipe；5- card slot；6- inlet tube；7- outlet；8-
U-bend pipe.
Specific embodiment
To keep the purpose of this utility model, technical solution and advantage clearer, below by the technology to the utility model
Scheme is described in detail.Obviously, the described embodiments are only a part of the embodiments of the utility model, rather than all
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are not before making creative work
Obtained all other embodiment is put, the range that the utility model is protected is belonged to.
According to a preferred embodiment, the radiator of the utility model including substrate 1 and is set on substrate 1
Radiating fin 2, as shown in Figure 1 or 2.Wherein, for directly contacting the device for needing to radiate, radiating fin 2 has more substrate 1
A, radiating fin 2 is for distributing the heat that device is transmitted on substrate 1.Preferably, radiating fin 2 is set as internal
Hollow structure filled with fluid media (medium), and the surface of radiating fin 2 is coated with graphene layer.
In the prior art, the radiating fin 2 on radiator is solid laminated structure, due to the heat dissipation area of radiating fin 2
Greatly, heat only is transmitted by solid radiating fin 2, heat transference efficiency is low, and heat dissipation effect is poor；On the other hand, frequency-variable controller
The heat dissipation mainly principal element realizing by way of heat loss through radiation, and influence heat loss through radiation be exactly radiator surface
Emissivity, and 2 slin emissivity of existing radiating fin is very low, by taking smooth Aluminium Radiator as an example, slin emissivity is through detecting
Only 0.05 or so, after aluminum material surface oxidation, slin emissivity also only up to 0.3, cause heat dissipation effect compared with
Difference.
The radiator of the utility model is by being arranged to hollow structure for radiating fin 2, and in the inside of hollow structure
Fluid media (medium) is filled, the heat that power component can be transmitted to substrate 1 by fluid media (medium) is transferred quickly to the top of radiating fin, and
And radiating fin can be increased using the high feature of graphene thermal coefficient by coating one layer of graphene layer on radiating fin 2
2 slin emissivity to enhance the heating conduction of radiating fin 2, and then improves the radiating efficiency of radiator.
According to a preferred embodiment, radiating fin 2 includes at least the first fin and the second fin, and the first fin
The hollow structure of filling fluid media (medium) is formed by welding with the second fin.Preferably, fluid media (medium) is in the first fin and
It is filled in two fin welding processes.Specifically, first welding the first fin and the second fin, an osculum is stayed, from this
Osculum injects fluid media (medium) into hollow cavity, after having infused, by the osculum welded closure.
According to a preferred embodiment, fluid media (medium) in radiating fin 2 is by free convection by heat from radiating fin
The bottom of piece 2 is transferred to the top of radiating fin 2.Compared with other way, by the way of free convection, not only reduce scattered
The cost of hot device, and the efficiency of heat transfer is higher, further improves the radiating efficiency of radiator.
Free convection specific explanations in the utility model are as follows: being steamed using the fluid media (medium) being filled in radiating fin 2
Hair heat absorption condenses exothermic principle, so that the high/low temperature fluid in radiating fin 2 forms free convection due to density contrast.Wherein,
The flow regime of fluid media (medium) free convection in radiating fin 2 is as shown in Figure 4.Specifically, the stream close to 2 bottom of radiating fin
The heat of body cut-off absorption substrate 1 and evaporate, the steam of formation rises to the top of radiating fin 2, due to 2 top of radiating fin
Temperature is low, and steam condenses heat release at this, and then the heat that substrate 1 absorbs is transferred to the top of radiating fin 2.
According to a preferred embodiment, the fluid media (medium) in the utility model selects one of refrigerant or a variety of.
The fluid media (medium) of the utility model selects refrigerant, can further speed up fluid media (medium) the heat that substrate 1 absorbs is transferred to it is scattered
The efficiency at the top of hot fin 2.Preferably, the utility model fluid media (medium) select R410A refrigerant, R134A refrigerant,
R1234YF refrigerant and R32 refrigerant etc. are common to meet any one of phase transition temperature interval refrigerant.
According to a preferred embodiment, what radiating fin 2 was in contact with substrate 1 is integrally formed structures on one side.It dissipates
Hot fin 2 is also possible to dismountable connection type with substrate 1.Preferably, card slot, the bottom of radiating fin 2 are provided on substrate 1
Portion is provided with the buckle to match with card slot, enables radiating fin 2 removable by the matching of buckle and card slot and substrate 1
The connection unloaded.Radiating fin 2 is preferably integrally formed structures with substrate 1, in this way, not only the appearance of radiator can be made whole
Together, moreover it is possible to improve the stability that radiating fin 2 is connect with substrate 1.
According to a preferred embodiment, substrate 1 is the structure with hollow cavity 3, as shown in Figure 2.Preferably, in
The heat-transfer pipe 4 being an integral structure with 1 die casting of substrate is provided in cavity body 3.Specifically, being previously positioned at heat-transfer pipe 4 is passed
In radiator mold, then again by the disposable die cast of radiator.
Radiator provided by the utility model connect heat-transfer pipe 4 with 1 rheo-die-casting of substrate, reduces to other materials
The application of matter so that heat-transfer pipe 4 and the connection of substrate 1 are even closer, with it is existing with heat conductive silica gel connection type compared with, pass
Hot coefficient is bigger, and heat-conducting effect is more preferable, and heat transfer is faster.On the other hand, 4 die casting of heat-transfer pipe can be increased into heat transfer on substrate 1
The contact area of pipe 4 and substrate 1 is scattered away so that heat effectively can be transmitted to radiator from power component,
Guarantee power component reliability of operation.
According to a preferred embodiment, it is provided with card slot 5 in hollow cavity 3, heat-transfer pipe 4 is enabled to pass through card slot 5
It is removably assemblied in the hollow cavity 3 of substrate 1.Preferably, card slot 5 is set to the inlet tube 6 of heat-transfer pipe 4,7 and of outlet
At U-bend pipe 8.The utility model can play the work of fixed heat-transfer pipe 4 by the card slot 5 being arranged in hollow cavity 3
With, avoid heat-transfer pipe 4 shake.
According to a preferred embodiment, part curved arrangement of the heat-transfer pipe 4 in substrate 1.For example, 4 basis of heat-transfer pipe
Demand carries out more curved designs of snake, can so increase the foundation area of heat-transfer pipe 4 Yu substrate 1, enhances heat dissipation effect, guarantees power
Component reliability of operation.
The bending part of heat-transfer pipe 4 is more, bigger with the contact area of substrate 1, but cost can also increase accordingly,
The contact area of heat-transfer pipe 4 and substrate 1 can be adjusted according to the heat of power component, then adjust the bending section of heat-transfer pipe 4
Point.
According to a preferred embodiment, heat-transfer pipe 4 includes an inlet tube 6 and an outlet 7, inlet tube 6 and outlet 7
Between have at least one U-bend pipe 8.Warp architecture between inlet tube 6 and outlet 7 is not limited to U-bend pipe 8,
It can also be remaining warp architecture.4 internal circulation of heat-transfer pipe is refrigerant, plays the role of heat transfer heat exchange.
Preferably, inlet tube 6 and outlet 7 are arranged on the same end face of substrate 1 or on different end faces.More preferably
, inlet tube 6, outlet 7 and U-bend pipe 8 are integrally formed.Fig. 3 shows one of the utility model heat-transfer pipe preferably in fact
Apply mode structural schematic diagram.As shown in figure 3, heat dissipation effect and production cost in order to balance, among the heat-transfer pipe 4 of the utility model
With 3 U-bend pipes 8.
According to a preferred embodiment, heat-storing material is also filled in hollow cavity 3.Preferably, heat-storing material is filled
Between substrate 1 and heat-transfer pipe 4, for absorptive substrate 1 heat and transfer heat to heat-transfer pipe 4.It is furthermore preferred that accumulation of heat material
Material is graphite, paraffin or polyethylene glycol.
It is inadequate for relying solely on heat-transfer pipe 4 in the prior art and transmitting the heat of radiator, and radiator is not
It is big with the own temperature difference under operating condition, cause to being only that the absorption thermal difference that heat-transfer pipe 4 exchanges heat is big, which does not have
Concentrate effective collect.The radiator of the utility model is inhaled by the heat-storing material being filled between substrate 1 and heat-transfer pipe 4
The heat that high power module such as IPM, IGBT of frequency-variable controller etc. is issued and be transmitted to substrate 1 is received, heat-storing material can be to scattered
The heat of thermal plays centralized processing；In addition, heat-transfer pipe 4 conducts heat in the substrate 1 containing heat-storing material, so that heat transfer is equal
Even, rate of heat transfer is high.
According to a preferred embodiment, the material of substrate 1 and radiating fin 2 is aluminium, and heat-transfer pipe 4 is copper pipe, stainless steel
Pipe or aluminium-alloy pipe.Preferably, the fusing point of the utility model heat-transfer pipe 4 is higher than the fusing point of substrate 1, so may make heat-transfer pipe 3
It constantly absorbs frequency-variable controller and issues and be transmitted to the heat of substrate 1, so that the heat dissipation effect of radiator is more preferable.
According to a preferred embodiment, graphene layer is single-layer graphene or the heat conducting film containing graphene.Adulterate stone
The coating of black alkene, with biggish slin emissivity and higher thermal coefficient.Therefore, graphene layer can be pure graphene
Coating is also possible to the composite coating containing graphene.Specifically, the slin emissivity of graphene layer is 0.95 or more, preferably
It is 0.98 or more, the cooling requirements of air-conditioner controller chip can be met.
According to a preferred embodiment, single-layer graphene or the heat conducting film containing graphene be by pure graphene coating or
Composite coating containing graphene is coated in 2 surface of radiating fin by way of spraying or brushing.By spraying or brushing
Mode coat single-layer graphene on 2 surface of radiating fin or contain the heat conducting film of graphene, it is ensured that single-layer graphene or
The adhesive strength of heat conducting film containing graphene makes single-layer graphene or the heat conducting film containing graphene firmly be attached to radiating fin
The surface of piece 2.
According to a preferred embodiment, graphene layer with a thickness of 10~20 μm.Preferably, the thickness master of graphene layer
If being arranged according to the distance between adjacent heat radiation fin 2.If the thickness of graphene layer is blocked up, so that adjacent heat radiation wing
The distance between piece 2 is smaller, influences the radiating efficiency of radiator instead.It is furthermore preferred that the thickness of the utility model graphene layer
Degree is 10~15 μm.
Above description is only a specific implementation of the present invention, but the protection scope of the utility model is not limited to
In this, anyone skilled in the art within the technical scope disclosed by the utility model, can readily occur in variation
Or replacement, it should be covered within the scope of the utility model.Therefore, the protection scope of the utility model should be with the power
Subject to the protection scope that benefit requires.
Claims (7)
1. a kind of radiator, including substrate (1) and the radiating fin (2) being set on the substrate (1), which is characterized in that
The substrate (1) is the structure with hollow cavity (3), and is provided with and the substrate (1) in the hollow cavity (3)
The heat-transfer pipe (4) that die casting is an integral structure, the hollow cavity (3) is interior to be also filled with heat-storing material；
The radiating fin (2) is set as the internal hollow structure for being filled with fluid media (medium), and the table of the radiating fin (2)
Face is coated with graphene layer, wherein
The radiating fin (2) includes at least the first fin and the second fin, and first fin and second fin
The hollow structure of filling fluid media (medium) is formed by welding,
Fluid media (medium) in the radiating fin (2) is shifted heat from the bottom of the radiating fin (2) by free convection
To the top of the radiating fin (2).
2. radiator according to claim 1, which is characterized in that the radiating fin (2) connects with the substrate (1)
Touching is integrally formed structures on one side.
3. radiator according to claim 1, which is characterized in that be provided with card slot, the heat dissipation on the substrate (1)
The bottom of fin (2) is provided with the buckle to match with the card slot, so that the radiating fin (2) can pass through the buckle
Matching with the card slot and removably connect with the substrate (1).
4. radiator according to claim 2 or 3, which is characterized in that the substrate (1) and the radiating fin (2)
Material be aluminium, the heat-transfer pipe (4) be copper pipe, stainless steel tube or aluminium-alloy pipe.
5. radiator according to claim 4, which is characterized in that the graphene layer is single-layer graphene or contains stone
The heat conducting film of black alkene.
6. radiator according to claim 5, which is characterized in that the single-layer graphene contains the thermally conductive of graphene
Film is to be coated in the radiating fin by way of spraying or brushing by pure graphene coating or the composite coating containing graphene
Piece (2) surface.
7. radiator according to claim 6, which is characterized in that the graphene layer with a thickness of 10~20 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821048518.2U CN209279289U (en) | 2018-07-03 | 2018-07-03 | A kind of radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821048518.2U CN209279289U (en) | 2018-07-03 | 2018-07-03 | A kind of radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209279289U true CN209279289U (en) | 2019-08-20 |
Family
ID=67597918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821048518.2U Active CN209279289U (en) | 2018-07-03 | 2018-07-03 | A kind of radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209279289U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112413761A (en) * | 2020-11-23 | 2021-02-26 | 杭州森乐实业有限公司 | Ice cold storage air conditioning equipment and cold storage method thereof |
| CN113543575A (en) * | 2020-04-21 | 2021-10-22 | 深圳市英维克科技股份有限公司 | Radiator and communication equipment |
| CN114096108A (en) * | 2020-08-24 | 2022-02-25 | 华为技术有限公司 | Heat sink and method for manufacturing the same |
| CN114838337A (en) * | 2022-05-16 | 2022-08-02 | 江苏大学 | High-efficient liquid cooling device of LED |
-
2018
- 2018-07-03 CN CN201821048518.2U patent/CN209279289U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113543575A (en) * | 2020-04-21 | 2021-10-22 | 深圳市英维克科技股份有限公司 | Radiator and communication equipment |
| CN114096108A (en) * | 2020-08-24 | 2022-02-25 | 华为技术有限公司 | Heat sink and method for manufacturing the same |
| CN112413761A (en) * | 2020-11-23 | 2021-02-26 | 杭州森乐实业有限公司 | Ice cold storage air conditioning equipment and cold storage method thereof |
| CN114838337A (en) * | 2022-05-16 | 2022-08-02 | 江苏大学 | High-efficient liquid cooling device of LED |
| CN114838337B (en) * | 2022-05-16 | 2023-11-10 | 江苏大学 | LED efficient water-cooling heat dissipation device |
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| TR01 | Transfer of patent right |
Effective date of registration: 20240122 Address after: Room 402, Building 1, Changjiang Bay Commercial Plaza, High tech Zone, Suzhou City, Jiangsu Province, 215000 Patentee after: Zhongxi Soft Network Technology (Jiangsu) Co.,Ltd. Country or region after: China Address before: No.14 Liangxiang West Road, Liangxiang Township, Fangshan District, Beijing, 102400 Patentee before: Kong Junmin Country or region before: China |