JPS63284896A - Mounting structure of electronic part - Google Patents

Mounting structure of electronic part

Info

Publication number
JPS63284896A
JPS63284896A JP11976487A JP11976487A JPS63284896A JP S63284896 A JPS63284896 A JP S63284896A JP 11976487 A JP11976487 A JP 11976487A JP 11976487 A JP11976487 A JP 11976487A JP S63284896 A JPS63284896 A JP S63284896A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
substrate
ceiling
substrates
cooling
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11976487A
Inventor
Yoshinobu Maeno
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters

Abstract

PURPOSE: To mount a large number of elements having a low calorific value in three dimensions,and to ensure the cooling performance of a high-density integrated element by constructing the circuit of a substrate for a sidewall and a substrate for a ceiling as a rectangular tunnel and mounting the elements having the low calorific value to the substrate for the sidewall and the substrate for the ceiling.
CONSTITUTION: Both sides of a high heating element 2, to which a cooling pipe 4 and a cooling path are set up by a spring 4-1, are provided vertically with substrates 12 for sidewalls in parallel, and a substrate 13 for a ceiling is connected to the upper sections of the substrates 12 with solder 16, thus constructing a tunnel. The substrates 12 for the sidewalls and the substrate 13 for the ceiling are connected by flexible printed plates 14, and low heating elements 3 are mounted onto both surfaces of the substrates 12 for the sidewalls and the substrate 13 for the ceiling. Accordingly, the high heating element 2 is cooled by cold air in the tunnel into which the cooling path and the cooling pipe 4 shaped by the spring 4-1 are penetrated, and the low heating elements 3 can be mounted in three dimensions adjacent to the upper section and both side faces of the high heating element 2, thus allowing the miniaturization of a mother board 1 and cooling having excellent efficiency.
COPYRIGHT: (C)1988,JPO&Japio
JP11976487A 1987-05-15 1987-05-15 Mounting structure of electronic part Pending JPS63284896A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11976487A JPS63284896A (en) 1987-05-15 1987-05-15 Mounting structure of electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11976487A JPS63284896A (en) 1987-05-15 1987-05-15 Mounting structure of electronic part

Publications (1)

Publication Number Publication Date
JPS63284896A true true JPS63284896A (en) 1988-11-22

Family

ID=14769603

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11976487A Pending JPS63284896A (en) 1987-05-15 1987-05-15 Mounting structure of electronic part

Country Status (1)

Country Link
JP (1) JPS63284896A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0903969A2 (en) * 1997-09-18 1999-03-24 Marquardt GmbH Electronic printed circuit board
US6771509B2 (en) 1992-05-20 2004-08-03 Seiko Epson Corporation Cartridge for electronic devices
JP2015222747A (en) * 2014-05-22 2015-12-10 ダイキン工業株式会社 Cooling jacket

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6771509B2 (en) 1992-05-20 2004-08-03 Seiko Epson Corporation Cartridge for electronic devices
US7035108B2 (en) 1992-05-20 2006-04-25 Seiko Epson Corporation Information processing device
US7345883B2 (en) 1992-05-20 2008-03-18 Seiko Epson Corporation Processing device
US7359202B2 (en) 1992-05-20 2008-04-15 Seiko Epson Corporation Printer apparatus
EP0903969A2 (en) * 1997-09-18 1999-03-24 Marquardt GmbH Electronic printed circuit board
EP0903969A3 (en) * 1997-09-18 1999-10-27 Marquardt GmbH Electronic printed circuit board
JP2015222747A (en) * 2014-05-22 2015-12-10 ダイキン工業株式会社 Cooling jacket

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