JPS63284896A - Mounting structure of electronic part - Google Patents

Abstract

PURPOSE:To mount a large number of elements having a low calorific value in three dimensions,and to ensure the cooling performance of a high-density integrated element by constructing the circuit of a substrate for a sidewall and a substrate for a ceiling as a rectangular tunnel and mounting the elements having the low calorific value to the substrate for the sidewall and the substrate for the ceiling. CONSTITUTION:Both sides of a high heating element 2, to which a cooling pipe 4 and a cooling path are set up by a spring 4-1, are provided vertically with substrates 12 for sidewalls in parallel, and a substrate 13 for a ceiling is connected to the upper sections of the substrates 12 with solder 16, thus constructing a tunnel. The substrates 12 for the sidewalls and the substrate 13 for the ceiling are connected by flexible printed plates 14, and low heating elements 3 are mounted onto both surfaces of the substrates 12 for the sidewalls and the substrate 13 for the ceiling. Accordingly, the high heating element 2 is cooled by cold air in the tunnel into which the cooling path and the cooling pipe 4 shaped by the spring 4-1 are penetrated, and the low heating elements 3 can be mounted in three dimensions adjacent to the upper section and both side faces of the high heating element 2, thus allowing the miniaturization of a mother board 1 and cooling having excellent efficiency.

Description

[Detailed Description of the Invention] [Summary] Side wall substrates on which connection pads and wiring patterns are formed are vertically disposed in parallel to sandwich a high-density integrated element with a high heat output that is connected to a cooling pipe by a spring with good heat conduction. A ceiling board, which also has connection pads and a wiring pattern formed thereon, is attached to the top of the side wall board via an L-shaped bonding material, and the side wall board and ceiling board are connected using a flexible printed board, for example. Build a rectangular tunnel with a circuit of
An electronic component mounting structure in which a large number of elements are three-dimensionally mounted by mounting low heat generation elements on the side wall substrate and the ceiling substrate [Industrial application field] The present invention is applicable to the configuration of various electronic devices. Widely used′, :j
This is related to the mounting structure of the main board.

A large number of devices are mounted, resulting in a large size, and a liquid cooling method is used for the high-density integrated elements, making the entire device large.

Therefore, there is a need for a new electronic component mounting structure that allows a greater number of various electronic components to be mounted on a single printed circuit board and ensures cooling performance for high-density integrated elements.

[Conventional technology]

As shown in FIG. 3, the mounting structure for electronic components that has been widely used in the past is such that high-density integrated elements 2 (with high calorific value) are mounted on the main surface of a motherboard 1 on which patterns (not shown) for signals and power supplies are formed. A low heat generating element 3 (hereinafter abbreviated as a high heat generating element) and a low heat generating element 3 (hereinafter abbreviated as a low heat generating element) are arranged in the piping direction of the cooling pipe 4 at designated positions.

The high heat generating elements 2 are cooled by installing rectangular cooling pipes 4 having excellent thermal conductivity 9, for example made of copper, on the top of the high heat generating elements 2 mounted on the motherboard 1. A cooling path is formed on the outer surface of the cooling pipe 4 by a spring 4-1 made of phosphor bronze with good thermal conductivity, and a cooling medium is passed through the cooling pipe 4 to cool the high heat generating element 2.

[Problem that the invention seeks to solve]

The problem with the conventional electronic component mounting structure described above is that a large number of electronic components such as high heat generating elements and low heat generating elements are mounted in a flat manner on the main surface of the motherboard, which makes the motherboard large and large. The problem is that the cooling pipe used to cool the high heat generating element also becomes long, which increases the space it occupies.

As a result, the entire device becomes large, causing an increase in manufacturing costs.

In view of the above-mentioned circumstances, the present invention aims to provide a new electronic component mounting structure in which a larger number of electronic components can be mounted on a single printed board and the high heat generating elements can be easily cooled.

[Means for solving problems]

The above problem can be solved by arranging connection pads at a constant pitch on both sides of one side of the insulating plate, as shown in the cross-sectional view of Figure 1(a).
A side wall substrate 12 with a wiring pattern formed on the low heat generation element 3 mounted on both sides from the connection pad, and the side wall substrate 1
The ceiling board 13 has connection bands and wiring patterns formed thereon in the same way as in 2, and means for connecting the side wall board 12 and ceiling board 13, that is, the wiring pattern is parallel to the connection pads of the side wall board 12 at the same pitch. The formed flexible printed board 14 and a bonding material 15 in which female screws for fastening the side wall substrate 12 and the ceiling substrate 13 are arranged in an L-shaped metal fitting are formed.

Then, a cooling pipe 4 is installed at the top to form a cooling path.

That is, the connection pads and the surface wiring pattern of the motherboard 1 are mounted on the side wall substrate 12 by surface mounting method on both sides of each high heat generating element 2 of the motherboard 1 connected by the spring 4-1.
are vertically installed in parallel, and the ceiling board 13 is attached to the vertically installed side wall board 12 via the bonding material 15 to construct a tunnel, and the connection pads of the side wall board 12 and the ceiling board 13 are connected. The pads are connected with the wiring pattern of the flexible printed board 14, and the side wall board 12 is connected as shown in FIG.
This problem is solved by the electronic component mounting structure of the present invention in which the low heat generating body 3 of the surface mount device is mounted on both sides of the ceiling board 13.

[Effect]

That is, in the present invention, side wall substrates 12 are hung in parallel on both sides of the high heat generating element 2 in which cooling pipes 4 and cooling paths are provided by springs 4-1, and a ceiling substrate 13 is mounted on top of the side wall substrates 12 with solder 16. A tunnel is constructed by connecting the side wall substrate 12 and the ceiling substrate 13 to the flexible printed board 1.
4 and mounting the low heat generating element 3 on both sides of the side wall board 12 and the ceiling board 13, the high heat generating element 2 is penetrated by the cooling path formed by the spring 4-1 and the cooling pipe 4. It is cooled by the cold air in the tunnel, and the low heat generation element 3 can be three-dimensionally mounted close to the top and both sides of the high heat generation element 2, so that the motherboard 1 can be downsized and efficiently cooled.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. FIG.

FIG. 1 shows a cross-sectional view of the electronic component mounting structure according to this embodiment. In the figure, the same members as in FIG. A side wall substrate 13 serves as the side wall of the tunnel to be constructed and mounts the elements, a ceiling substrate 13 serves as the ceiling of the tunnel and mounts the elements, and 14 a flexible board that connects the circuit of the side wall substrate and the circuit of the ceiling substrate. The printed board 15 is a bonding material for attaching the ceiling board to the side wall board.

The side wall substrate 12 is constructed by arranging connection pads (not shown) at a constant pitch on both sides of one side of a strip-shaped insulating plate having a length shorter than that of the motherboard 1 as shown in the side view of (bl). This is a printed wiring board made of ceramic, on which a wiring pattern is formed on both sides on which the low heat generating element 3 shown in the cross-sectional view is mounted, and holes for fastening (not shown) are provided on the upper side edge.

The ceiling board 13 has connection pads on both sides of one side of a rectangular insulating plate having the same length as the side wall board 12.
This is a ceramic substrate on which wiring patterns are arranged at the same pitch as No. 2, and holes for fastening are provided on both side edges.

The flexible printed board 14 is a printed board in which parallel wiring patterns are formed at the same pitch as the connection pads of the side wall substrate 12 on one side of a film-like insulating board.

The bonding material 15 is formed by forming a rectangular thin metal plate having the same length as the side wall substrate 12 into an L shape, and inserting a female screw for fastening on the lower side thereof facing the hole for fastening in the side wall substrate 12. A hole is formed at the position where the ceiling board 13 is fastened, and female screws for fastening the ceiling board 13 are arranged on the other side.

The method for mounting and cooling electronic components using the above members is as follows:
A cooling vibe 4 is piped to the top of the high heat generating element 2 mounted on the motherboard 1, and a cooling path is provided by connecting the top surface of the high heat generating element 2 and the outer surface of the cooling vibe 4 with a spring 4-1. On both sides of the body 2, the connection pads of the side wall substrate 12, on which the low heat generation elements 3 of surface mount devices are mounted, and the surface wiring pattern of the motherboard 1 are connected and fixed with solder 16 by a surface mounting method to form the motherboard 1. Side wall board 1
2 are installed in parallel.

Then, a tunnel is constructed by attaching the ceiling substrate 13 on which the low heat generating elements 3 are similarly mounted on both sides via the bonding material 15 to the side wall substrate 12, and connects the connection pad of each side wall substrate 12 with the ceiling substrate 13. Connect the connection pads to the flexible printed board 14
By connecting with the wiring pattern, the low heat generation element 3 can be mounted three-dimensionally, the motherboard 1 can be downsized, and the high heat generation element 2 can be efficiently cooled.

In addition, as shown in FIG. 2, a high heat generating element 2 is mounted on the inner surface of the side wall substrate 12 vertically installed, and a low heat generating element 3 is mounted on the outer surface, and the high heat generating element 2 and the cooling vibrator 4 are connected to each other. The same effect as described above can be obtained in other electronic component mounting structures in which the spring 4-1 is disposed between the spring 4-1 and the outer surface to provide a cooling path.

〔Effect of the invention〕

As explained above, according to the present invention, elements can be mounted three-dimensionally with an extremely simple configuration, the motherboard can be miniaturized, and a high heat generating element can be efficiently cooled. It is expected to be economically effective and improve reliability, and is extremely useful industrially.

[Brief explanation of drawings]

FIG. 1 is a diagram showing an electronic component mounting structure according to one embodiment of the present invention, FIG. 2 is a sectional view showing an electronic component mounting structure according to another embodiment, and FIG. 3 is a conventional electronic component mounting structure. FIG. In the figure, 1 is a motherboard, 2 is a high heat generating element, 3 is a low heat generating element, 4 is a cooling pipe, 4-1 is a spring, 12 is a side wall board, 13 is a ceiling board, 14 is a flexible printed board, and 15 is a Binding material, 16 is solder, 13 ceiling...] # and (Ql (b) Doubairou Burning 'Jt=Js Den-Rohjin μfill Fig. 1

Claims (1)

[Claims] A method for mounting various electronic components on a motherboard with high density, comprising: a side wall substrate (12) in which connection pads are arranged at a constant pitch on both sides of one side and wiring patterns are formed on both sides;
and a ceiling board (13) in which connection pads are arranged on one side at the same pitch as the side wall board (12) and wiring patterns are formed on both sides, and the connection pads of the side wall board (12) and the ceiling board. (1
3) and a bonding material (15) for the ceiling substrate 13, the side wall substrate (12) and the ceiling substrate (13) are connected to the bonding material (15). ), the side wall board (12) is connected to the connection pad of the ceiling board (13) through the connection means (14), and the side wall board (12) is connected to the cooling pipe (4) and the cooling path ( 4-1)
A tunnel is formed in the motherboard (1) by being vertically disposed on both sides of the integrated element (2) coupled with the side wall substrate (12).
) and the above electronic component mounted on the ceiling board (13).