JPS6089946A - Semiconductor element cooling structure - Google Patents

Abstract

PURPOSE:To obtain uniform cooling efficiency and improve the cooling performance by constituting heat conductive body and heat conductive plane by the one to one manner. CONSTITUTION:A semiconductor element 11 is provided with a heat conductive body 12 at the upper part thereof. A cooling plate 13 is provided with a plurality of hoes at the lower part thereof. At the inner hole, a heat conductive plate 14 which is energized downward by a spring 15 is coupled to the circumference of hole through a bellows 16. In case an element 11 is cooled through contact with the cooling plate 13, the heat conductive plate 14 and heat conductive body 12 in this hole are placed in contact by the one to one manner through a thermal compound 17. The heat conductive plate 14 is expanded or contacted in vertical direction in accordance with height and inclination, etc. of the element 11 and heat conductive body 12 by the spring 15 and bellows 16. Therefore, the compound 17 can be made thin and uniform cooling for each element 11 can be realized.

Description

[Detailed description of the invention] Technical field of a0 invention The present invention relates to a cooling method for semiconductor devices.

b. Background of the Technology In electronic devices that use a large number of semiconductor elements such as ICs and LSIs, it is common to arrange and mount the semiconductor elements on a circuit board. However, in recent years, as the density of semiconductor devices has increased, the heat generation density of semiconductor devices has also been increasing. Therefore, in order to prevent risks such as element destruction due to an increase in the junction temperature of a semiconductor element, a method for cooling a semiconductor element with a large cooling capacity is required.

C0 conventional technology and problems FIG. 1 is a diagram showing a conventional cooling method.

Figure 1 shows the configuration of a circuit board and semiconductor element when using the conduction method, which is one of the conventional cooling methods, where 1 is the semiconductor element, 2 is the thermal compound (hereinafter referred to as compound), and 3 is the circuit board. , 4 indicate cooling plates, respectively.

In such a cooling method, a coolant liquid such as water is flowed inside the cooling plate 4, one surface of the cooling plate 4 is bonded to the semiconductor element 1, and the heat of the semiconductor element 1 is released to the coolant liquid via the bonded surface. In such a conduction method, when the cooling plate 4 and the semiconductor element 1 are brought into contact with each other, it is necessary to efficiently transfer the heat of the semiconductor element 1 to the cooling plate. Therefore, in order to minimize the thermal resistance of the contact surface (in this case, the resistance due to the space created on the contact surface), :I inbount is applied to the contact surface to eliminate the gap between the contact surfaces.

In such a conduction method, in order to improve cooling efficiency, it is important to bring the semiconductor element into close contact with the surface of the semiconductor element or the surface of the cooling plate.

However, mechanical warping of the circuit board and uneven mounting of semiconductor elements onto the circuit board.

Variations occur in the degree of contact between the cooling plate and the surfaces of the plurality of semiconductor elements due to relationships such as height), flatness of the contacting surface of the cooling plate, and flatness of the surface of the semiconductor elements. In other words, there is a variation in the thickness of the contact (variation in the thermal resistance to heat conduction by the compound) of 4;t: :7, and the thickness of the compound becomes large in areas where the contact condition is not good. A uniform cooling effect cannot be obtained for the entire semiconductor device (because the thermal resistance to heat conduction is determined by the thickness of the compound). Accordingly, semiconductor devices have been developed which cause an increase in the junction temperature of the regulator, resulting in a lack of reliability.

69 OBJECTS OF THE INVENTION The present invention solves the above-mentioned problems by reducing the variation in cooling of semiconductor devices ζ, n4 (b) to increase stability and improve reliability. We propose a cooling method for semiconductor devices that increases cooling efficiency.

09 Structure of the Invention Therefore, the present invention provides a cooling structure in which a cooling plate is brought into contact with a plurality of semiconductor elements provided on a substrate, and a coolant is passed through the cooling plate to cool the plurality of semiconductor elements, The semiconductor element has a heat conductor on the side in contact with the cooling plate, and the cooling plate has a plurality of holes on the side in contact with the semiconductor element. A cooling structure for a semiconductor device, characterized in that a conductive plate is joined to the peripheral portion of the hole via an elastic phase, and the thermal conductor is in contact with the thermal conductive plate in the hole via a thermally conductive substance. suggest.

10 Embodiments of the Invention FIG. 2 shows a cooling structure for a semiconductor element according to an embodiment of the invention, in which 11 is a semiconductor element, 12 is a heat conductor, 13 is a cooling plate, 14 is a heat conduction plate, and 15 is a honeycomb. , 16 is herose,
17 indicates a thermal compound)', 1fN; 1 circuit board, respectively.

The semiconductor element 11 has a thermal conductor 12 on the negative side.

A plurality of holes are provided in the lower part of the cooling plate 13. Inside the hole, a heat conductive plate 14 loaded downward by a spring 15 is connected to the peripheral portion of the hole via a bellows 16. The bellows 16 itself also has elasticity and expands and contracts as necessary.

When the semiconductor element 11 is brought into contact with the cooling plate 13 for cooling, the heat conductive plate 14 in the hole and the heat conductor 12 are brought into one-to-one contact with the thermal compound 17 interposed therebetween. The heat conductive plate 14 is connected to the semiconductor element 11 by the bellows 16 at 15 degrees. The heat conductor 12 expands and contracts in the vertical direction depending on its height, tilt, etc. Therefore, the thickness of the thermal compound 17 can be made thin and uniform for each semiconductor element. Cooling can be performed by feeding a refrigerant into the cooling plate 13.

20 Effects of the Invention According to the present invention, since the heat conductor and the heat conduction plate are in one-to-one contact, the height and slant of the semiconductor can be reduced.

Thermal conductive compound 1 without worrying about circuit board precision etc.
It is possible to reduce the thickness of the cooling layer, to obtain uniform cooling, and to improve the cooling capacity.

It is also possible to bring a plurality of heat conductors into contact with one heat conduction plate.

[Brief explanation of drawings]

Fig. 1 shows the configuration of a circuit board and a semiconductor element when performing a conduction method, which is a conventional cooling method, where 1 is a semiconductor element, 2 is a thermal compound, 3 is a circuit board, and 4 is a cooling plate. .

Claims (1)

[Claims] A cooling structure in which a cooling plate is brought into contact with a plurality of semiconductor elements provided on a substrate, and a coolant is passed through the cooling plate to cool the plurality of semiconductor elements, the semiconductor element being on the side in contact with the cooling plate. The cooling plate has a plurality of holes on the side in contact with the semiconductor element, and the heat conduction plate, which is loaded in the direction of contact with the semiconductor element, is elastically connected to the surrounding area of the hole. 1. A cooling structure for a semiconductor device, wherein the thermal conductor is in contact with the large heat conductive plate via a thermally conductive material.