JP2017163756A - Power conversion device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a power conversion device that can suppress the excess concentration of stress in a connection portion between a control substrate and a signal terminal of a semiconductor module.SOLUTION: A power conversion device 1 includes a semiconductor module 10, a control substrate 20, and a case 40. The semiconductor module 10 includes a semiconductor element 11. The control substrate 20 includes a control circuit that drives and controls the semiconductor module 10. The case 40 houses the semiconductor module 10 and the control substrate 20. The semiconductor module 10 includes a signal terminal 12 to be connected to the control substrate 20. A fixing member 30 is further provided to fix the semiconductor module 10 and the control substrate 20 to each other.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a power conversion device.

  2. Description of the Related Art Conventionally, electric vehicles, hybrid vehicles, and the like are equipped with power conversion devices such as inverters and converters for converting power supply power to drive power for driving a drive motor. As such a power conversion device, Patent Document 1 discloses a semiconductor module having a switching circuit, a control board having a control circuit for driving and controlling the module, a cooling plate for cooling the control board, and these The power converter device provided with the case which accommodates is disclosed. The semiconductor module and the cooling plate are fixed to the case, and the control board is fixed to the cooling plate. The signal terminal of the semiconductor module is connected to the control board.

International Publication No. 2015/025594

  However, in such a power conversion device, the semiconductor module and the control board are only connected to each other via the signal terminals of the semiconductor module, and other configurations for fixing them directly to each other are as follows. Not provided. Therefore, the distance between the semiconductor module and the control board may change when the power conversion device vibrates as the automobile on which the power conversion device is mounted travels. Such a change may cause excessive stress concentration on the connection portion between the signal terminal of the semiconductor module and the control board.

  The present invention has been made in view of such a background, and intends to provide a power conversion device capable of suppressing excessive concentration of stress on a connection portion between a signal terminal of a semiconductor module and a control board. is there.

One aspect of the present invention is a semiconductor module (10) having a semiconductor element (11), a control board (20) having a control circuit for driving and controlling the semiconductor module, and a case for housing the semiconductor module and the control board. A power converter (1) comprising (40),
The semiconductor module has a signal terminal (12) connected to the control board,
The power conversion device includes a fixing member (30, 300, 301, 302, 303) that fixes the semiconductor module and the control board to each other.

  In the power converter, the semiconductor module and the control board are fixed to each other via a fixing member. Thereby, even if the said power converter device vibrates, it is suppressed that the distance of a semiconductor module and a control board changes. As a result, it is possible to suppress excessive stress concentration at the connection portion between the signal terminal of the semiconductor module and the control board.

  As described above, according to the present invention, it is possible to provide a power conversion device capable of suppressing stress from being excessively concentrated on a connection portion between a signal terminal of a semiconductor module and a driver circuit board.

  In addition, the code | symbol in the parenthesis described in the means to solve a claim and a subject shows the correspondence with the specific means as described in embodiment mentioned later, and limits the technical scope of this invention. It is not a thing.

FIG. 3 is a schematic cross-sectional view of the power conversion device according to the first embodiment. The top view of the power converter device in the state which removed the case cover and the control board in Embodiment 1. FIG. 1 is a perspective view of a semiconductor module in Embodiment 1. FIG. FIG. 4 is a partial enlarged view of a section taken along the line IV-IV in a state in which a control board is attached in FIG. The VV line position cross-section partial enlarged view in FIG. FIG. 3 is a top view of a control board in the first embodiment. FIG. 4 is a partially enlarged view of a cross-section corresponding to the position of line IV-IV in FIG. 2 in a modification of the first embodiment. The perspective view of the semiconductor module in Embodiment 2. FIG. IX-IX line position sectional view in FIG. The perspective view of the semiconductor module in the modification of Embodiment 2. FIG. FIG. 5 is a partially enlarged view of a cross-section corresponding to the position of the line V-V in FIG. FIG. 4 is a partially enlarged cross-sectional view corresponding to the position of line IV-IV in FIG. The perspective view of the semiconductor module in Embodiment 4. FIG. FIG. 4 is a partially enlarged cross-sectional view corresponding to the position of the IV-IV line in FIG. FIG. 10 is a perspective view of a semiconductor module according to a fifth embodiment. FIG. 10 is a partially enlarged cross-sectional view corresponding to the position of line V-V in FIG. FIG. 10 is a top view of a control board in the sixth embodiment. FIG. 10 is a top view of a control board in a modification of the sixth embodiment. The top view of the power converter device in the state which removed the case lid and the control board in Embodiment 7. The XX-XX line position sectional view in the state where a case lid and a control board in Drawing 19 were attached. XXI-XXI line position sectional drawing in FIG.

(Embodiment 1)
An embodiment of the power conversion device will be described with reference to FIGS.
As shown in FIG. 1, the power conversion device 1 of this embodiment includes a semiconductor module 10, a control board 20, and a case 40.
The semiconductor module 10 includes a semiconductor element 11.
The control board 20 has a control circuit (not shown) that drives and controls the semiconductor module 10.
The case 40 houses the semiconductor module 10 and the control board 20.
The semiconductor module 10 has a signal terminal 12 connected to the control board 20.
And the fixing member 30 which fixes the semiconductor module 10 and the control board 20 mutually is provided.

Hereinafter, the power converter device 1 of this embodiment is explained in full detail.
As shown in FIG. 1, the power conversion device 1 houses a semiconductor module 10, a control board 20, and a cooling plate 50 in a case 40. The case 40 includes a case main body 41 and a case lid 42. The case body 41 includes a bottom 41a having a rectangular shape in plan view, and four side sides 41b, 41c, 41d, and 41e as shown in FIG. As shown in FIG. 1, the case main body 41 has an opening on the side opposite to the bottom 41a, and a case lid 42 is attached thereto.

  As shown in FIG. 1, a coolant channel 45 through which a coolant flows is formed inside the case body 41. As shown in FIG. 2, the refrigerant flow path 45 includes a pair of refrigerant conduits 46 for introducing or leading the refrigerant to the refrigerant flow path 45. In the present embodiment, the pair of refrigerant conduits 46 extend so as to open in different directions, but may extend so as to open in the same direction.

  As shown in FIGS. 1 and 2, module placement portions 47 in which the semiconductor modules 10 are respectively disposed are formed in the refrigerant flow path 45. Each module installation portion 47 has an open top, and adjacent module installation portions 47 communicate with each other via a refrigerant communication passage 48 as shown in FIG. As shown in FIG. 1, each semiconductor module 10 is inserted and arranged in the module installation portion 47. And as shown in FIG. 5, the upper part which the module installation part 47 opened is covered with the flange part 134 with which the module case 13 of the semiconductor module 10 mentioned later is equipped. Thereby, the refrigerant introduced through the refrigerant conduit 46 flows through the refrigerant flow path 45 to cool the semiconductor module 10.

As shown in FIG. 4, the semiconductor module 10 includes a semiconductor element 11. The semiconductor element 11 includes an IGBT and a diode (not shown) and constitutes a switching element. The semiconductor element 11 is fixed to the conductor plates 14 and 15 via a solder material while being sandwiched between the two conductor plates 14 and 15. Thereby, one main surface 11 a of the semiconductor element 11 is in contact with the conductor plate 14, and the other main surface 11 b of the semiconductor element 11 is in contact with the conductor plate 15. In the semiconductor module 10, the conductor plates 14 and 15 are configured to be sealed with a semiconductor sealing resin 16 with a part of the main surface opposite to the side in contact with the semiconductor element 11 exposed.
A direction perpendicular to the main surfaces 11 a and 11 b of the semiconductor element 11 is defined as a thickness direction Y, and a direction perpendicular to the thickness direction Y and the protruding direction Z of the signal terminal 12 is defined as a width direction X of the semiconductor module 10.

  As shown in FIGS. 4 and 5, the semiconductor module 10 includes a module case 13 that houses a semiconductor element 11, conductor plates 14 and 15, and a semiconductor sealing resin 16 that seals them. The module case 13 is made of metal and is made of an aluminum alloy in the present embodiment. The module case 13 has an insertion slot 131 into which the semiconductor element 11 is inserted and a holding portion 132 in which the semiconductor module 10 is held. The exposed main surfaces of the conductor plates 14 and 15 are in contact with the inner wall of the holding portion 132.

  As shown in FIG. 4, the heat radiating members 133 are joined to both surfaces of the holding portion 132. The heat radiating member 133 is made of metal, and in the present embodiment, is made of an aluminum alloy like the module case 13. The heat radiating member 133 is a plate-like member having a number of substantially cylindrical protrusions. The heat radiating member 133 is exposed in the module installation portion 47 and is configured so that the refrigerant flowing through the refrigerant flow path 45 comes into contact therewith. Thereby, the heat generated in the semiconductor element 11 is transmitted to the heat radiating member 133 through the conductor plates 14 and 15, and is transmitted from the heat radiating member 133 to the refrigerant flowing through the refrigerant flow path 45.

  As shown in FIGS. 4 and 5, the module case 13 has a flange portion 134 formed so as to surround the outer periphery of the insertion port 131. The flange portion 134 is formed integrally with the holding portion 132. A flange outer wall portion 135 is erected on the entire outer periphery of the flange portion 134. Resin filled portions 171 and 172 filled with resin are formed between the inner wall of the holding portion 132 and the semiconductor module 10 and in a region surrounded by the flange outer wall portion 135. As shown in FIGS. 2 and 3, the flange outer wall portion 135 is formed with a fixing portion 136 including a through hole to which a screw for fixing the module case 13 to the case main body 41 is attached.

  As shown in FIGS. 3 to 5, each semiconductor module 10 has a plurality of signal terminals 12. In the present embodiment, the signal terminal 12 extends in the Z direction parallel to the main surfaces 11 a and 11 b of the semiconductor element 11. As shown in FIG. 5, the plurality of signal terminals 12 are arranged in the width direction X of the semiconductor module 10. A part of the signal terminal 12 is molded in a terminal mold member 19 made of a resin material. As shown in FIGS. 1, 4, and 5, the signal terminal 12 is connected to the terminal connection portion 21 of the control board 20. Thereby, the signal terminal 12 is in a state extending from the control board 20 in the S direction. As shown in FIG. 3, each semiconductor module 10 has a plurality of power terminals 18. The power terminal 18 is electrically connected to the smoothing capacitor 60 and other electronic components (not shown) provided in the power converter 1 via a bus bar (not shown).

  As shown in FIG. 4, the fixing member 30 is formed on the flange outer wall portion 135. In the present embodiment, the fixing member 30 is formed integrally with the flange outer wall portion 135 and is made of an aluminum alloy. Further, the fixing member 30 is formed to project in the Z direction parallel to the main surfaces 11 a and 11 b of the semiconductor element 11. As shown in FIG. 1, the fixing member 30 is connected to the control board 20. Thereby, the fixing member 30 is provided between the semiconductor module 10 and the control board 20, and fixes both the semiconductor module 10 and the control board 20 to each other.

  As shown in FIGS. 3 and 4, the fixing member 30 has a cylindrical shape, and a screw hole 31 a is formed at the tip 31 in the Z direction, which is the protruding direction. As shown in FIGS. 4 and 5, the fixing member 30 and the control board 20 are fastened and fixed to each other by screwing a screw 32 into the screw hole 31 a. Thereby, the fixing member 30 is in a state extending from the control board 20 in the S direction.

  In the present embodiment, as shown in FIGS. 1, 4, and 5, the direction in which the fixing member 30 extends from the control board 20 and the direction in which the signal terminal 12 extends from the control board 20 are both the S direction. It has become. In the present embodiment, as shown in FIG. 4, the S direction is parallel to the main surfaces 11 a and 11 b of the semiconductor element 11.

  A control circuit (not shown) is formed on the control board 20. The control circuit is configured to control the driving state of the semiconductor module 10. As shown in FIGS. 1 and 6, the control board 20 has a terminal connection portion 21 to which the signal terminal 12 of the semiconductor module 10 is connected. In the present embodiment, as shown in FIG. 1, the terminal connection portion 21 is a through hole, and the tip 12 a of the signal terminal 12 is inserted therethrough. A fixing member connecting portion 22 for fixing the fixing member 30 is formed. As shown in FIG. 6, the fixing member 30 is formed on one end side X <b> 1 in the width direction X of the semiconductor module 10, and the fixing member connecting portion 22 is a position close to the end portion 20 a on the one end side X <b> 1 of the control board 20. Is formed. In the present embodiment, as shown in FIG. 5, the fixing member connecting portion 22 is a through hole through which the screw 32 is inserted. As shown in FIG. 6, the control board 20 is formed with a power supply unit 23 for controlling input power at a position close to the end 20b on the other end side X2 opposite to the end 20a.

  In the present embodiment, the cooling plate 50 is fixed to the case body 41 as shown in FIG. The cooling plate 50 is located between the control board 20 and the semiconductor module 10. The cooling plate 50 is formed with a hole 51 through which the fixing member 30 and the signal terminal 12 are disposed. Heat is drawn to the case main body 41 via the cooling plate 50, and cooling of the entire power conversion device 1 is promoted.

Next, the effect in the power converter device 1 of this embodiment is explained in full detail.
According to the power conversion device 1 of the present embodiment, the semiconductor module 10 and the control board 20 are fixed to each other via the fixing member 30. Thereby, even if a vibration arises in the power converter 1, it is suppressed that the distance of the semiconductor module 10 and the control board 20 changes. As a result, it is possible to prevent stress from being excessively concentrated on the terminal connection portion 21 that is a connection portion between the signal terminal 12 of the semiconductor module 10 and the control board 20.

  In the present embodiment, the direction in which the fixing member 30 extends from the control board 20 and the direction in which the signal terminal 12 extends from the control board 20 are the same S direction. Thereby, even if a vibration arises in the power converter 1, it is further suppressed that the distance between the semiconductor module 10 and the control board 20 changes. As a result, it is possible to prevent stress from being excessively concentrated on the terminal connection portion 21 that is a connection portion between the signal terminal 12 of the semiconductor module 10 and the control board 20. In addition, the same here includes not only the case where the extending direction of both is exactly the same, but also the case where it is recognized that they are substantially the same within the range where the above-mentioned effects are exhibited, even if they are not exactly the same.

  In the present embodiment, the semiconductor module 10 has a metal module case 13 that houses the semiconductor element 11, and the fixing member 30 is formed integrally with the module case 13. As a result, the heat of the control board 20 can be transmitted to the module case 13 via the fixing member 30, so that the cooling of the control board 20 is promoted together with the cooling of the semiconductor module 10 by the refrigerant flowing through the refrigerant flow path 45. And the heat dissipation of the entire apparatus can be improved. Further, since the fixing member 30 is integrated with the module case 13, the module case 13 can be grounded via the fixing member 30, and noise resistance is improved. Since the fixing member 30 is integrated with the module case 13, workability when the semiconductor module 10 and the control board 20 are assembled is improved.

  Moreover, in this embodiment, since the fixing member 30 is metal, it contributes to the improvement of the noise tolerance of the semiconductor module 10.

  In the present embodiment, the fixing member 30 has a cylindrical shape, but is not limited thereto, and may be a polygonal columnar shape such as a square columnar shape, an elliptical columnar shape, or a combination thereof.

  In the present embodiment, a plurality of fixing members 30 are provided, and all of them are connected to the control board 20 via the screws 32. However, the present invention is not limited to this. Among the plurality of fixing members 30, some of the fixing members 30 are not attached with the screws 32, and the distal end portion 31 of the fixing member 30 may be in contact with the control board 20. . Among the plurality of fixing members 30, the fixing member 30 to which the screw 32 is not attached can be appropriately selected in consideration of the shape of the control board 20, the printed wiring on the control board 20, the arrangement of mounted components, and the like.

  In this embodiment, the fixing member 30 and the control board 20 are joined via the screw 32. However, the present invention is not limited to this, and a known joining method such as bonding the two using an adhesive is adopted. Can do.

  In the present embodiment, the fixing member 30 is formed so as to protrude from the module case 13 in the Z direction, but instead, the fixing member 30 is orthogonal to the Z direction from the module case 13 as in the modification shown in FIG. After projecting in the thickness direction Y, it may extend in the Z direction. Also in this modification, the direction in which the fixing member 30 extends from the control board 20 is the S direction, which is the same as the direction in which the signal terminal 12 extends from the control board 20. Even in this case, the same effects as those of the present embodiment can be obtained.

  In this embodiment, the cooling plate 50 is provided. However, the cooling plate 50 is not provided as long as the control board 20 can be sufficiently cooled and the necessary heat dissipation can be ensured in the entire apparatus. May be.

  As described above, according to the present embodiment, the power conversion device 1 that can suppress excessive stress concentration on the terminal connection portion 21 that is a connection portion between the signal terminal 12 of the semiconductor module 10 and the control board 20. Can be provided.

(Embodiment 2)
The power conversion device 1 of this embodiment includes a fixing member 300 shown in FIGS. 8 and 9 instead of the fixing member 30 shown in FIG. 1 in the first embodiment. Other components are the same as those in the first embodiment, and the same reference numerals as those in the first embodiment are used in this embodiment, and the description thereof is omitted.

  The fixing member 300 in the present embodiment is made of a resin material, and is integrally formed with a resin filling portion 172 that is filled in a region surrounded by the flange outer wall portion 135 as shown in FIGS. In the fixing member 300, a screw hole 31a is formed in the distal end portion 31 as in the fixing member 30 of the first embodiment shown in FIG. As shown in FIG. 9, the fixing member 300 is fastened and fixed to the control board 20 via screws 32, similarly to the fixing member 30 of the first embodiment. As a result, the semiconductor module 10 and the control board 20 are fixed to each other via the fixing member 300. Furthermore, since the fixing member 300 is made of resin, the insulating property of the fixing member 300 is ensured. In addition, since the fixing member 300 is integrated with the semiconductor module 10 via the resin filling portion 172, workability when the semiconductor module 10 and the control board 20 are assembled is improved.

  Furthermore, also in the power converter device 1 of this embodiment, in the case of Embodiment 1, there exists an effect equivalent to Embodiment 1 except the effect by the fixing member 30 being metal.

  Note that, like the power conversion device 1 in the modification shown in FIGS. 10 and 11, the fixing member 300 includes the signal terminals 12 at both ends in the width direction X of the semiconductor module 10, that is, in the arrangement direction of the plurality of signal terminals 12. It may be located in between. In this case, the change in the distance between the semiconductor module 10 and the control board 20 when vibration is generated in the power conversion device 1 can be further reduced.

(Embodiment 3)
The power conversion device 1 of the present embodiment includes a fixing member 301 shown in FIG. 12 instead of the fixing member 30 shown in FIG. Other components are the same as those in the first embodiment, and the same reference numerals as those in the first embodiment are used in this embodiment, and the description thereof is omitted.

  In the power conversion device 1 of the present embodiment, as shown in FIG. 12, the heat dissipation member 133 has an upper side of the resin filling portion 172, that is, a protruding side of the signal terminal 12 along the flange portion 134 and the flange outer wall portion 135. An extending portion 133a is provided that extends to the end. The fixing member 301 is made of an aluminum alloy like the heat radiating member 133, and is joined to the extended portion 133 a of the heat radiating member 133. The fixing member 301 has the same configuration as the fixing member 30 shown in FIG.

  That is, in this embodiment, the semiconductor module 10 has a refrigerant flow path 45 for circulating a refrigerant for cooling the semiconductor module 10, and the semiconductor module 10 is configured to contact the refrigerant flowing through the refrigerant flow path 45. A heat radiating member 133 is provided. The fixing member 301 is formed integrally with the heat radiating member 133. Thereby, the heat of the control board 20 is transmitted to the heat radiating member 133 via the fixing member 301, and is released to the outside from the heat radiating member 133 by the refrigerant flowing through the refrigerant flow path 45. Thereby, the heat dissipation of the control board 20 can be improved. In addition, also in the power converter device 1 of this embodiment, there exists an effect equivalent to Embodiment 1. FIG.

(Embodiment 4)
The power conversion device 1 of the present embodiment includes a fixing member 302 shown in FIGS. 13 and 14 instead of the fixing member 30 shown in FIG. 1 in the first embodiment. Other components are the same as those in the first embodiment, and the same reference numerals as those in the first embodiment are used in this embodiment, and the description thereof is omitted.

  The fixing member 302 in the power conversion device 1 of the present embodiment is made of a resin material. As shown in FIGS. 13 and 14, the fixing member 302 is integrally formed with the terminal molding member 19 that molds a part of the signal terminal 12. Since the fixing member 302 is made of resin, insulation of the fixing member 302 is ensured. Furthermore, as shown in FIG. 14, in the control board 20, the terminal connection portion 21 to which the signal terminal 12 is connected and the fixing member connection portion 22 to which the fixing member 302 is connected can be brought close to each other. The influence of vibration on the portion 21 can be further reduced, and vibration resistance is improved. In addition, also in the power converter device 1 of this embodiment, there exists an effect equivalent to Embodiment 1 except the effect by the fixing member 30 being metal in the case of Embodiment 1. FIG.

(Embodiment 5)
The power conversion device 1 of this embodiment includes a fixing member 303 shown in FIGS. 15 and 16 instead of the fixing member 30 shown in FIG. 1 in the first embodiment. Other components are the same as those in the first embodiment, and the same reference numerals as those in the first embodiment are used in this embodiment, and the description thereof is omitted.

  The fixing member 303 in the power conversion device 1 of the present embodiment is made of a metal material. As shown in FIGS. 15 and 16, the fixing member 303 has a cylindrical shape and has a through hole 313 a. The fixing member 303 is disposed at an overlapping position so that the axis L1 of the through hole of the fixing portion 136 provided in the module case 13 and the axis L2 of the through hole 313a coincide. Then, by inserting a screw 320 longer than the length of the fixing member 303 in the longitudinal direction into the fixing member connecting portion 22, the fixing member 303 and the fixing portion 136 of the control board 20, the control board 20 is fixed via the screw 320. The member 303 and the module case 13 are collectively fastened and fixed to the case body 41.

  In the power conversion device 1 of the present embodiment, since the control board 20, the fixing member 303, and the module case 13 are collectively fixed to the case body 41 as described above, the control board 20 and the module case 13 are individually attached to the case body. It is not necessary to fix to 41, and a structure can be simplified. In addition, also in the power converter device 1 of this embodiment, there exists an effect equivalent to Embodiment 1. FIG.

(Embodiment 6)
In the first embodiment, as shown in FIG. 6, the fixing member 30 is formed on one end side X <b> 1 in the width direction X of the semiconductor module 10, and is formed at a position close to the end 20 a on one end side X <b> 1 of the control board 20. The fixed member connecting portion 22 is fixed. Instead, in the power conversion device 1 of the present embodiment, as illustrated in FIG. 17, the fixing member 30 is formed on the other end side X <b> 2 opposite to the one end side X <b> 1 in the width direction X in the semiconductor module 10. Yes. The control board 20 is formed with a power supply unit 23 that controls input power, and the fixing member connection unit 22 to which the fixing member 30 is connected is formed between the power supply unit 23 and the terminal connection unit 21. ing.

  According to the power conversion device 1 of the present embodiment, the fixing member connecting portion 22 is located in a region near the center of the control board 20. Therefore, the effect of suppressing the vibration of the control board 20 is improved, and the change in the distance between the semiconductor module 10 and the control board 20 is further suppressed. In addition, also in the power converter device 1 of this embodiment, there exists an effect equivalent to Embodiment 1. FIG.

  In addition, as shown in FIG. 18, fixing members 30 may be provided on both sides of the semiconductor module 10 in the width direction. Further, as shown in FIG. 18, the fixing member connecting portions 22 may be arranged along the longitudinal direction of the control board 20.

(Embodiment 7)
In the first embodiment described above, as shown in FIG. 1, the refrigerant flow path 45 is directly formed in the case body 41, but the power conversion device 1 of the present embodiment is replaced with FIG. As shown in FIG. 20, a cooling device 450 having a coolant channel 45 is provided inside the case 40. Other components are the same as those in the first embodiment, and the same reference numerals as those in the first embodiment are used in this embodiment, and the description thereof is omitted.

As shown in FIG. 19, the power conversion device 1 of this embodiment includes a cooling device 450 in the case 40. The cooling device 450 includes a plurality of cooling pipes 451 and a plurality of connection pipes 452.
As shown in FIG. 21, a plurality of refrigerant channels 45 are formed inside the cooling pipe 451. The connection pipe 452 is connected in a state where a plurality of cooling pipes 451 are stacked so that the refrigerant flow path 45 communicates. The semiconductor modules 10 are inserted and arranged between the adjacent cooling pipes 451. Thereby, the semiconductor module 10 and the cooling pipe 451 form the stacked body 100.

  In this embodiment, the semiconductor module 10 does not have the module case 13, and the fixing member 30 is made of resin and is integrally formed with the semiconductor sealing resin 16 that seals the semiconductor element 11. As shown in FIG. 20, the power terminal 18 of the semiconductor module 10 projects in a direction opposite to the projecting direction Z of the signal terminal 12. The power terminal 18 is electrically connected to a snubber capacitor 63, a filter capacitor 64, and a smoothing capacitor 60 provided in the case 40 via a bus bar 61. A reactor 62 is disposed in the case 40.

  As shown in FIG. 21, the control board 20 is fixed to the semiconductor module 10 via a fixing member 30 provided in the semiconductor module 10. And also in the power converter device 1 of this embodiment which has the resin-made fixing members 30, there exists an effect equivalent to the case of Embodiment 2. FIG.

  The present invention is not limited to the above embodiments, and can be applied to various embodiments without departing from the scope of the invention. For example, in each embodiment, a plurality of fixing members 30, 300, 301, 302, and 303 may be provided, or any of these may be arbitrarily combined.

DESCRIPTION OF SYMBOLS 1 Power converter 10 Semiconductor module 11 Semiconductor element 12 Signal terminal 13 Module case 19 Terminal mold member 20 Control board 21 Terminal connection part 22 Fixing member connection part 23 Power supply part 30,300,301,302,303 Fixing member 40 Case 50 Cooling Board

Claims (6)

Electric power comprising a semiconductor module (10) having a semiconductor element (11), a control board (20) having a control circuit for driving and controlling the semiconductor module, and a case (40) for housing the semiconductor module and the control board. A conversion device (1) comprising:
The semiconductor module has a signal terminal (12) connected to the control board,
A power conversion device provided with a fixing member (30, 300, 301, 302, 303) for fixing the semiconductor module and the control board to each other.   The power conversion device according to claim 1, wherein a direction in which the fixing member extends from the control board is the same as a direction in which the signal terminal extends from the control board.   The said semiconductor module has a metal module case (13) which accommodates the said semiconductor element, The said fixing member (30) is integrally formed in the said module case. The power converter device described in 1. A coolant channel (45) for circulating a coolant for cooling the semiconductor module;
The semiconductor module has a heat dissipating member (133) configured to come into contact with the refrigerant flowing through the refrigerant flow path,
The power converter according to claim 1 or 2, wherein the fixing member (301) is formed integrally with the heat radiating member or joined to the heat radiating member.   The said semiconductor module has a terminal mold member (19) which molds a part of said signal terminal, and the said fixing member (302) is formed integrally with the said terminal mold member. The power converter device described in 1.   The control board includes a power supply unit (23) for controlling input power and a terminal connection unit (21) to which the signal terminal is connected, and the control board includes the power supply unit and the terminal connection unit. The power converter according to any one of claims 1 to 5, wherein a fixing member connecting portion (22) to which the fixing member is connected is formed.

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