JP5698637B2 - Semiconductor device - Google Patents

Description

  The present invention relates to a semiconductor device, and more particularly, to a semiconductor device that includes a semiconductor module having a semiconductor element and supplies driving power to an electric motor.

  In recent years, electric vehicles equipped with an electric motor as a driving force source have become widespread. In an electric vehicle, the DC power supplied from the battery is converted into an AC power flow and supplied to the electric motor, and the AC power generated by the regenerative mechanism at the time of braking or the like is converted to DC power as necessary. A semiconductor device such as a power control unit (PEU: Power Electronic Unit) that performs control for conversion and storage in a battery is provided.

  Such a power control device includes a power module that converts DC power supplied from a battery into AC power flow, and converts AC power generated by the regenerative mechanism into DC power as necessary. Since a plurality of such power modules are often used, electrical wiring for electrically connecting a plurality of power modules while a plurality of power modules are disposed relatively close to each other, and a plurality of power modules. Electrical wiring that electrically connects the module to other components and external devices is routed around the power module. Further, since a relatively large current is used in the power module, a power semiconductor device such as a power MOSFET (Metal Oxide Field Effect Transistor) or an IGBT (Insulated Gate Bipolar Transistor) can be incorporated as a switching element. Many. When such a power semiconductor element is operated, a large amount of heat is generated. Therefore, a heat sink is attached to the power module in order to secure a heat dissipation path.

  Patent Document 1 relates to a power conversion device, and has a configuration in which a semiconductor module is fixed to a base plate and a conductive bus bar for conducting electrical connection between the semiconductor module and the outside of the device is placed in an upper part of the semiconductor module while being included in an input side terminal block. Disclose. In such a power conversion device, the semiconductor module has a configuration in which a semiconductor chip is molded with resin, and the base plate functions as a heat sink.

JP 2008-259398 A

  However, according to the study of the present inventor, in the configuration disclosed in Patent Document 1, the conductive bus bar for conducting the semiconductor module and the outside of the apparatus is disposed in the upper part of the semiconductor module while being included in the input side terminal block. Although the conductive bus bar is three-dimensionally arranged above the semiconductor module to perform wiring with a small installation area and the wiring structure has been densified, the input side terminal block originally contains the conductive bus bar. Since it is necessary, such a terminal block is made of resin and must be separately provided as an essential component. Furthermore, since it is necessary for such a terminal block to be electrically connected to the outside of the apparatus, it is necessary to integrally form a screw tap inside the terminal block in order to fasten the terminal of the electric wiring from the outside of the apparatus. It is complicated.

Further, according to further studies by the present inventors, particularly from the viewpoint of omitting an additional terminal block, the connection conductor for connecting the input side terminal of the semiconductor module and the connection terminal of a related device such as a capacitor, It is preferable to have a configuration in which these terminals are mechanically supported and electrically connected while exhibiting good mechanical characteristics and electrical characteristics. Here, the mechanical characteristics required for the connection conductor include a strength for mechanically fastening and supporting these terminals. Further, the electrical characteristics required for such a connection conductor include good conductivity obtained without unnecessarily increasing inductance. Furthermore, characteristics required for such a connection conductor include a size capable of forming a fastening hole such as a screw hole for fastening these terminals, and a heat dissipation property that does not unnecessarily retain heat. Here, although patent document 1 discloses the structure arrange | positioned in the upper part of a semiconductor module, including the conduction bus bar which makes conduction | electrical_connection between a semiconductor module and the exterior of an apparatus enclosed in an input side terminal block, additional terminal blocks are disclosed. In order to eliminate the above, there is no teaching about a specific configuration in which the connection conductor connecting the input side terminal of the semiconductor module and the connection terminal of the related device exhibits good mechanical characteristics and electrical characteristics.

  The present invention has been made through the above-described studies, and mechanically fastens and supports the input-side terminal of the semiconductor element and the connection terminal of the related device while omitting an additional terminal block and electrically. An object of the present invention is to provide a semiconductor device that can be connected to a semiconductor device.

In order to achieve the above object, a first aspect of the present invention is a semiconductor device including a semiconductor element and a capacitor electrically connected to the semiconductor element, the input of the semiconductor element A plurality of connection conductors for electrically connecting the terminal and the connection terminal of the capacitor, wherein the plurality of connection conductors are offset from the first connection conductor that is a block structure and the first connection conductor. And a second connecting conductor that is a block structure .

The second aspect of the present invention, in addition to such a first aspect, the multiple connecting conductors are each provided a semiconductor device of the screw fastening portion for fastening the input terminals or said connection terminals.

According to a third aspect of the present invention, in addition to the first or second aspect , the plurality of connection conductors are semiconductor devices made of an aluminum material.

  A semiconductor device according to a first aspect of the present invention is a semiconductor device including a semiconductor element and a capacitor electrically connected to the semiconductor element, and includes an input terminal of the semiconductor element and a connection terminal of the capacitor. A plurality of connection conductors for electrical connection are provided, and the plurality of connection conductors are block structures, so that an input terminal of a semiconductor element and a connection terminal of a related device can be connected while omitting an additional terminal block. It can be mechanically fastened, supported and electrically connected.

In addition, in the semiconductor device according to the first aspect of the present invention, the plurality of connection conductors include a first connection conductor and a second connection conductor arranged so as to be displaced from the first connection conductor. Thus, while omitting an additional terminal block, when the input side terminal of the semiconductor element and the connection terminal of the related device are mechanically fastened and supported and electrically connected, one connection conductor is connected to the other A positional relationship that does not interfere with the connecting tool's fastening tool, etc. can be realized, and the input side terminal of the semiconductor element and the connection terminal of the related device are mechanically fastened and supported without using a special tool or fastening order. And can be electrically connected.

In the semiconductor device according to the second aspect of the present invention, the input terminal of the semiconductor element and the related device can be provided with a simple configuration by providing each of the plurality of connection conductors with an input terminal or a screw fastening portion for fastening the connection terminal. The connection terminals can be securely fastened and supported mechanically and can be securely connected electrically.

In the semiconductor device according to the third aspect of the present invention, since the plurality of connecting conductors are made of an aluminum material, the input of the semiconductor element is balanced while balancing various characteristics such as mechanical characteristics, electrical characteristics, and size of the connecting conductors. The side terminal and the connection terminal of the related device can be securely fastened and supported while being securely connected electrically.

It is a disassembled perspective view which shows the power control apparatus of embodiment in this invention in the state which has one side of the power module in an assembly state. 2A is a front view showing the power control apparatus according to the present embodiment as viewed along the direction of arrow A in FIG. 1, and FIG. 2B is the present embodiment as viewed along the direction of arrow B in FIG. The side view which shows the power control apparatus of a form, and FIG.2 (c) are the reverse views which show the power control apparatus of this embodiment seen from the arrow C direction in FIG. FIG. 3 is an enlarged detailed cross-sectional view showing the power control apparatus of the present embodiment cut along the S3-S3 cutting line in FIGS. 2 (a) and 2 (c). In addition, each fastening member in FIG. 3 shows only the head part for convenience. 4A is an enlarged perspective view showing a related portion of the input side connection conductor of the power control apparatus according to the present embodiment, and FIG. 4B is an input side connection cut along the S4-S4 cutting line in FIG. It is an enlarged vertical sectional view showing a conductor.

  Hereinafter, a semiconductor device according to an embodiment of the present invention will be described in detail with reference to the drawings as appropriate, taking a power control device as an example. In the figure, the x-axis, y-axis, and z-axis form a three-axis orthogonal coordinate system, the z-axis direction is the vertical direction, and the xy plane is the horizontal plane.

[Control system configuration]
First, a configuration of a control system to which a power control device that is a semiconductor device in the present embodiment is applied will be described in detail.

  The power control apparatus 1 according to the present embodiment shown in FIGS. 1 to 4 typically includes an electric motor that is a driving force source and a battery that is a secondary battery, but is not shown. Sometimes mounted on an electric vehicle equipped with a regenerative mechanism for generating regenerative power.

  The power control device 1 supplies driving power from the battery to the electric motor in the electric vehicle alone or under the control of a control device (not shown) that comprehensively controls the electric motor, the battery, and the regeneration mechanism. In addition to being controllable, it is possible to control the supply of regenerative power from the regenerative mechanism to the battery. For example, when a three-phase AC current is used as the drive current of the electric motor, the power control device 1 stably converts the DC current supplied from the battery into a U-phase, V-phase, and W-phase three-phase AC current. The function of the DC / AC converter that supplies the alternating current to the electric motor and the AC / DC that stably converts the regenerative alternating current generated from the regenerative mechanism into a direct current and supplies the direct current to the battery. Combined with converter functions. The power control device 1 has only a DC / AC converter function that stably converts a direct current supplied from a battery into an alternating current and supplies the alternating current to the electric motor as necessary. May be.

  The electric motor is, for example, a three-phase brushless electric motor that operates by supplying three-phase AC power, and supplies a driving force for driving an electric vehicle.

  The battery is typically a nickel metal hydride or lithium ion secondary battery, supplies electric power necessary for an electric motor and other auxiliary machines, and stores regenerative power generated from a regenerative mechanism.

  Note that the power control apparatus 1 can also be applied to a hybrid vehicle equipped with an engine such as an internal combustion engine in addition to an electric motor, and a fuel cell vehicle equipped with a fuel cell. When the power control apparatus 1 is applied to a hybrid vehicle, the power control apparatus 1 can control the supply of drive power from the battery to the electric motor, and can supply the regenerative power from the regenerative mechanism to the battery and the engine. It is possible to control the supply of generated power from the generator, which is an auxiliary machine, to the battery. When the power control device 1 is applied to a fuel cell vehicle, the power control device 1 can control the supply of drive power from the fuel cell to the electric motor, and the regenerative power from the regenerative mechanism to the battery can be controlled. The supply can be controlled. In addition, when the power control device 1 is applied to any of an electric vehicle, a hybrid vehicle, and a fuel cell vehicle, the power control device 1 supplies regenerative power from the electric motor to the battery during braking or the like as necessary. It is also possible to control.

[Entire configuration of power control device]
Next, the overall configuration of the power control apparatus 1 according to the present embodiment will be described in detail with reference to an example in which a direct current from a battery is converted into a three-phase alternating current and supplied to an electric motor.

  As shown in FIGS. 1 to 4, the power control device 1 includes first semiconductor elements 23 (U) and 24 (24) having a switching function on one surface 21 </ b> A as an inner surface of the first cooling member 21. V) and 25 (W) are mounted adjacently juxtaposed in the x-axis direction, and a second having a switching function on one surface 31A as the inner surface of the second cooling member 31. Of the semiconductor elements 33 (U), 34 (V), and 35 (W) are mounted adjacently in parallel in the x-axis direction, and typically a rectangular cylindrical shape extending in the vertical direction. A first internal space S having a side wall 71 and surrounded by the side wall 71 is defined at both ends in the vertical direction of the side wall 71 and opens to the outside while facing each other. It has an opening 7H1 and a second opening 7H2. And a control IC (Integrated Circuit) 551 for controlling the switching operation of the first semiconductor elements 23 (U) to 25 (W) and the second semiconductor elements 33 (U) to 35 (W). A control circuit board that is typically a rectangular flat circuit board 55. These components are stacked substantially coaxially in the vertical direction.

  In the power control device 1, the first semiconductor elements 23 (U) to 25 (W) are inserted into the internal space S of the case 7 through the first opening 7 </ b> H <b> 1 of the case 7. 7, and one surface 21 </ b> A of the first cooling member 21 is brought into contact with the lower end of the case 7 while the other surface 21 </ b> B that is the outer surface of the first cooling member 21 is exposed to the outside of the case 7. Thus, the first semiconductor module 2 is mounted on the case 7 with the first opening 7H1 closed by the first cooling member 21.

  Similarly, in the power control device 1, the second semiconductor elements 33 (U) to 35 (W) are caused to enter the internal space S of the case 7 through the second opening 7 </ b> H <b> 2 of the case 7. The other surface 31B, which is the outer surface of the second cooling member 31, is exposed to the outside of the case 7, and the one surface 31A of the second cooling member 31 is removed from the case 7 while being stored in the case 7 in a state. The second semiconductor module 3 is mounted on the case 7 with the second cooling member 31 closing the second opening 7H2.

The circuit board 55 is typically a PCB (Printed Circuit Board).
In addition to the control IC 551, various elements such as a resistor element and a capacitor (not shown) are mounted on the front surface (upper side surface) while being electrically connected to the printed wiring, and a total of 3 This is a control circuit board on which a total of three current sensors 552 are mounted so as to correspond to the front surfaces of the individual overhang portions 553. The control IC 551 controls the switching operation of the first semiconductor elements 23 (U) to 25 (W) and the second semiconductor elements 33 (U) to 35 (W). Further, each of the current sensors 552 is a non-contact type current sensor, typically a coreless type current sensor having a Hall element, and is based on a U-phase AC current, a V-phase AC current, and a W-phase AC current, respectively. The generated magnetic field is detected and converted into a current signal.

  The circuit board 55 is disposed between the first semiconductor module 2 and the second semiconductor module 3 in the internal space S of the case 7, and the first semiconductor elements 23 (U) to 25 (W) and The second semiconductor elements 33 (U) to 35 (W) are mounted on the case 7 so as to be parallel to the horizontal plane in a state of being appropriately separated from the second semiconductor elements 33 (U) to 35 (W).

  Specifically, the circuit board 55 is between the first opening 7H1 and the second opening 7H2 of the case 7, and the back surface (lower side surface) of the circuit board 55 is one surface 21 </ b> A of the first cooling member 21. In addition, the first cooling member 21 and the second cooling member 31 are juxtaposed in the vertical direction with the front surface facing one surface 31A of the second cooling member 31. Installed. With this configuration, the circuit board 55 is required from the first semiconductor elements 23 (U) to 25 (W) and the second semiconductor elements 33 (U) to 35 (W) while effectively using the internal space S. It will be arranged at a suitable distance with a certain distance. Therefore, the first semiconductor elements 23 (U) to 25 (W) and the second semiconductor elements 33 (U) to 35 (W) themselves and a current path through which a relatively large current flows during their operation, the circuit board. 55, the control IC 551 and its control current path can be moved away to reduce the influence of unnecessary heat and electromagnetic waves on the circuit board 55 and the like, and improve their durability.

  Here, if the circuit board 55 is disposed between the first opening 7H1 and the second opening 7H2 of the case 7, that is, between the first semiconductor module 2 and the second semiconductor module 3, The entire configuration of the power control device 1 is configured while the circuit board 55 is separated from the first semiconductor elements 23 (U) to 25 (W) and the second semiconductor elements 33 (U) to 35 (W) in an appropriate balance. Since it can be made more compact, it is more preferable.

  Further, the power control device 1 includes one first connection conductor 81 (N) and one second connection conductor 82 (P), all of which are attached to the case 7, for a total of three first connection conductors 81 (N). 3 connection conductors 83 (U), 84 (V), and 85 (W).

  When the first connecting conductor 81 (N) and the second connecting conductor 82 (P) supply power to the electric motor, they are electrically connected to the battery and the power is supplied from the battery. Functions as input wiring. Specifically, the first connection conductor 81 (N) is electrically connected to the negative terminal of the battery, and the second connection conductor 82 (P) is electrically connected to the positive terminal of the battery. When charging the battery, the first connection conductor 81 (N) and the second connection conductor 82 (P) function as output wiring.

  The third connection conductors 83 (U), 84 (V), and 85 (W) function as output wiring for a three-phase alternating current when electrically connected to the electric motor to supply power to the electric motor. Specifically, the third connection conductor 83 (U) is electrically connected to the U-phase drive current input terminal of the electric motor, and the third connection conductor 84 (V) is connected to the V-phase of the electric motor. The third connecting conductor 85 (W) is electrically connected to the drive current input terminal, and is electrically connected to the W-phase drive current input terminal of the electric motor. When regenerative power is input from the regenerative mechanism, the third connection conductors 83 (U), 84 (V), and 85 (W) function as input wiring.

  Furthermore, the power control apparatus 1 includes a total of two first capacitors 91 and second capacitors 92 that are attached to the case 7 and accommodated in the internal space S thereof.

  The first capacitor 91 and the second capacitor 92 are electrically connected in parallel with each other between the first connection conductor 81 (N) and the second connection conductor 82 (P), respectively, When electric power is supplied to an electric motor that is electrically connected in parallel to one semiconductor element 23 (U) to 25 (W) and second semiconductor element 33 (U) to 35 (W) Functions as a smoothing capacitor that smoothes the direct current from the battery. When the battery is charged, the first capacitor 91 and the second capacitor 92 are connected to the first semiconductor elements 23 (U) to 25 (W) and the second semiconductor elements 33 (U) to 35 ( W) functions as a smoothing capacitor that smoothes the direct current from

  As described above, first, in the power control device 1, the first semiconductor module 2 and the second semiconductor module 3 are correspondingly mounted on the upper and lower ends of the cylindrical case 7, and the internal space of the case 7 is set. The multi-layer structure in which the circuit board 55 is disposed between the first semiconductor module 2 and the second semiconductor module 3 in S is adopted, and the first connection conductor 81 (N) and the second connection conductor 82 (P ), The negative terminal of the battery is electrically connected to the first connection conductor 81 (N) while the internal space S is effectively used and the overall configuration of the apparatus is reduced in size and size. The positive terminal of the battery is electrically connected to the second connection conductor 82 (P), while the first capacitor 91 and the second capacitor 92 are respectively connected to the first connection conductor 81 (N). And second The first semiconductor elements 23 (U) to 25 (W) and the second semiconductor elements 33 (U) to 35 (W) are electrically connected in parallel with each other to the connection conductor 82 (P). Are electrically connected in parallel.

  Hereinafter, each component of the power control apparatus 1 will be described in detail.

[Configuration of semiconductor module]
As shown in FIGS. 1 to 4, the first semiconductor module 2 includes a first cooling member 21 and first semiconductor elements 23 (U), 24 (V), and 25 (W), and further The frame 41, the pressing member 42, and the circuit board 51 are provided.

  The first cooling member 21 is typically made of an aluminum alloy and is fixed to the case 7, and receives heat generated during operation of the first semiconductor elements 23 (U) to 25 (W) and dissipates the heat to the outside. A function as a mounting member for mounting the first semiconductor elements 23 (U) to 25 (W), and a function as a lid for closing the first opening 7H1 of the case 7, It constitutes a part of the structure of the power control device 1.

  One surface 21A of the first cooling member 21 is configured as a flat plane without a step, and the other surface 21B on the opposite side is regularly provided with a plurality of radiating fins 215 in order to increase the heat radiation efficiency. Arranged in an arranged manner. The first cooling member 21 is provided with various mounting through-holes 211 and fastening holes having internal threads, which are plugged with plugs or the like not shown for waterproofing and dustproofing as necessary. It is preferable to remove. The size of the first cooling member 21 in the horizontal direction is larger than the size of each of the first semiconductor module 2, the second semiconductor module 3, and the circuit board 55 in the horizontal direction.

The first semiconductor element 23 (U) of the first semiconductor module 2 has a low-side switching function for generating a U-phase low-potential-side AC current of the three-phase AC current. The first semiconductor element 23 (U) includes a semiconductor chip (not shown), a sealing body for sealing the semiconductor chip, the reference numeral being omitted, and one end of the sealing body (the positive end of the y axis) ) And a first power input terminal 231 in the shape of a gull wing extending from), and a first output terminal 232 in the shape of a gull wing extending from the other end (the negative direction end of the y-axis) of the sealing body. And a connection lead that extends upward from one end and the other end of the sealing body and omits the reference numerals.

  For semiconductor chips, power semiconductor elements such as IGBTs and power MOSFETs having high breakdown voltage characteristics are used. As the sealing body, a resin sealing body such as an epoxy resin sealing body is typically used. The inner side of the first power input terminal 231 is electrically connected to the input terminal of the semiconductor chip in the sealed body, and the outer side of the first power input terminal 231 is connected to the first connecting conductor 81 (N). Electrically connected. The inner side of the first output terminal 232 is electrically connected to the output terminal of the semiconductor chip in the sealed body, and the outer side of the first output terminal 232 is electrically connected to the third connection conductor 83 (U). Connected to.

  Since the other first semiconductor element 24 (V) and the first semiconductor element 25 (W) of the first semiconductor module 2 have the same configuration as the first semiconductor element 23 (U), The description of the same configuration is simplified or omitted as appropriate. Specifically, the first semiconductor element 24 (V) and the first semiconductor element 25 (W) include products of the same type as the first semiconductor element 23 (U), typically products of the same model number. Used, the first semiconductor elements 23 (U) to 25 (W) are compatible.

  That is, the first semiconductor element 24 (V) has a low-side switching function that generates a V-phase low-potential-side AC current of the three-phase AC current, and is the same as the first semiconductor element 23 (U). Includes a first power input terminal 241 and a first output terminal 242, which are electrically connected to correspond to the first connection conductor 81 (N), the third connection conductor 84 (V), and the like. Is done. In addition, the first semiconductor element 25 (W) has a low-side switching function that generates a W-phase low-potential-side AC current among the three-phase AC currents, and is the same as the first semiconductor element 23 (U). Includes a first power input terminal 251 and a first output terminal 252, which are electrically connected to correspond to the first connection conductor 81 (N), the third connection conductor 85 (W), and the like. Is done. If necessary, the first semiconductor elements 23 (U) to 25 (W) may be integrated to adopt a single semiconductor element.

  Here, in particular, as shown in FIGS. 1, 3, and 4, the three first semiconductor elements 23 (U) to 25 (W) are attached to the frame 41 and attached to the frame 41. The first cooling member 21 is mounted on one surface 21A. The frame 41 includes a frame body 411 and a total of two positioning pins 412 and 413 erected on the frame body 411. In FIG. 3, since the positioning pin 413 is in front, it is virtually indicated by a chain line.

  The frame body 411 holds the first semiconductor elements 23 (U) to 25 (W) adjacent to each other in the x-axis direction in parallel to the horizontal plane, and the first power input terminals 231 to 251 are parallel to each other. Are aligned in the x-axis direction, and the first output terminals 232 to 252 are aligned in the x-axis direction in parallel with each other on the opposite side of the first power input terminals 231 to 251. Deploy. As the frame body 411, a resin frame body manufactured by injection molding is typically used. The positioning pins 412 and 413 are typically integrally formed with the frame body 411 and extend in the vertical direction. Note that the frame body 411 and the positioning pins 412 and 413 may be made of metal if an increase in weight or the like is allowed, or may be separated if the complexity of the configuration is allowed.

In particular, as shown in FIGS. 1 and 3, the pressing member 42 is fixedly attached to the frame body 411 of the frame 41. The pressing member 42 is in a state where the first semiconductor elements 23 (U) to 25 (W) are pressed against the frame body 411 with an appropriate pressing force, and one surface 21 </ b> A of the frame body 411 and the first cooling member 21. The first semiconductor elements 23 (U) to 25 (W) are interposed therebetween. The pressing member 42 is fixed to the frame body 411 using a fastening member such as a screw whose symbol is omitted. The holding member 42 is typically made of a metal material such as stainless steel that has elasticity and is excellent in workability such as machining. The holding member 42 has a U-shaped cross-section for providing a desired spring constant between a portion attached to the frame body 411 and a holding portion of the first semiconductor elements 23 (U) to 25 (W). The rib which has is arrange | positioned.

  In particular, as shown in FIGS. 1 and 3, the frame 41 has an insulating structure in which the first semiconductor elements 23 (U) to 25 (W) are placed on one surface 21 </ b> A of the first cooling member 21. In a state of being in contact with the sheet 22, the fixing member 42 and a fastening member such as a screw whose reference numerals are omitted for the circuit board 51 are shared and fixed on the one surface 21 </ b> A of the first cooling member 21. The insulating sheet 22 secures electrical insulation between the first cooling member 21 and the first semiconductor elements 23 (U) to 25 (W), while the first semiconductor elements 23 (U) to The heat generated by the operation of 25 (W) can be efficiently transferred to the first cooling member 21. For the insulating sheet 22, a silicone rubber-based sheet is typically used.

  In particular, as shown in FIGS. 1 and 3, the circuit board 51 is typically a rectangular flat plate, and in the internal space S of the case 7, the first semiconductor elements 23 (U) to 25 ( W) and the circuit board 55 are attached to the case 7. The circuit board 51 is based on a control signal sent from the control IC 551 of the circuit board 55 in order to control the switching operation of the first semiconductor elements 23 (U) to 25 (W). ) To 25 (W) is a drive circuit board on which a drive IC 511 for switching operation is mounted. Note that the driving IC 511 may be divided into a plurality of driving ICs for driving the first semiconductor elements 23 (U) to 25 (W).

  Specifically, the circuit board 51 has a pair of positioning holes 512 that match the positioning pins 412 and 413 of the frame 41, and is positioned on the frame 41 by inserting the positioning pins 412 and 413 into the corresponding positioning holes 512. In this state, the frame 41 is mounted in parallel with the horizontal plane using a fastening member such as a screw whose symbol is omitted. At this time, the back surface of the circuit board 55 and the front surface (upper side surface) of the circuit board 51 face each other in parallel.

  The circuit board 51 is typically a PCB, and in addition to the driving IC 511, various elements such as a resistor element and a capacitor (not shown) are connected to the printed wiring while being electrically connected to the printed wiring. And a connection lead that is drawn upward from the wiring board and has a kink shape omitted. The circuit board 51 is electrically connected to the circuit board 55 via a connector (not shown) mounted on the front surface of the circuit board 55 and the first semiconductor element 23 (U) to the circuit board 51. Electrical connection to 25 (W) connection leads. That is, the circuit board 51 receives a control signal sent from the control IC 551 of the circuit board 55 via the connection lead, and sends the drive signal from the drive IC 511 that operates based on the control signal to the first semiconductor element. The first semiconductor elements 23 (U) to 25 (W) are sent to the first semiconductor elements 23 (U) to 25 (W) via the connection leads 23 (U) to 25 (W). Is for switching operation.

  On the other hand, as shown in FIGS. 1 to 4, the second semiconductor module 3 is mounted at a position higher than the first semiconductor module 2, and the mounting posture of the second semiconductor module 3 is different from that of the first semiconductor module 2. However, since the usage pattern is different from that of the first semiconductor module 2, the configuration is the same as that of the first semiconductor module 2. Omitted. Specifically, the second semiconductor module 3 includes a second cooling member 31 and second semiconductor elements 33 (U), 34 (V), and 35 (W), and further includes a frame 43. The holding member 44 and the circuit board 52 are provided.

In other words, the second cooling member 31 has the same configuration as the first cooling member 21, and similarly to the first cooling member 21, one surface 31 </ b> A that is a flat plane and the radiation fins 315 are disposed. The other surface 31B, the through hole 311 and the like. The second semiconductor element 33 (U) has the same configuration as that of the first semiconductor element 23 (U), but generates a U-phase high-potential-side AC current among the three-phase AC currents. The second power input terminal 331, the second output terminal 332, and the like are provided in the same manner as the first semiconductor element 23 (U), and the second connection conductor 82 ( P) and the third connection conductor 83 (U) and the like are electrically connected. The second semiconductor element 34 (V) has the same configuration as the second semiconductor element 33 (U), but has a high-side switching function for generating a V-phase high-potential-side alternating current. The second power supply input terminal 341 and the second output terminal 342 are provided in the same manner as the second semiconductor element 33 (U), and these include the second connection conductor 82 (P) and the third connection. Electrical connection is made corresponding to the conductor 84 (V) and the like. The second semiconductor element 35 (W) has the same configuration as the second semiconductor element 33 (U), but generates a W-phase high-potential-side AC current out of the three-phase AC current. Similar to the first semiconductor element 23 (U), it has a second power input terminal 351, a second output terminal 352, etc., which are connected to the second connection conductor 82 ( P) and the third connection conductor 85 (W) and the like are electrically connected.

  The frame 43 has the same configuration as that of the frame 41 and includes a frame body 431 and a total of two positioning pins 432 and 433 erected on the frame body 431. The pressing member 44 has the same configuration as the pressing member 42 and is fixedly attached to the frame body 431 of the frame 43. To do. The insulating sheet 32 has the same configuration as the insulating sheet 22 and is placed on one surface 31 </ b> A of the second cooling member 31. The circuit board 52 has the same configuration as the circuit board 51, and is a drive circuit board on which a driving IC 521 that drives the second semiconductor elements 33 (U) to 35 (W) to perform a switching operation is mounted. A pair of positioning holes 522 and the like that match the positioning pins 432 and 433 of the frame 43 are disposed.

  Here, the circuit board 55 disposed between the circuit boards 51 and 52 corresponds to a total of four positioning holes 555 that match the positioning pins 412 and 413 of the frame 41 and the positioning pins 432 and 433 of the frame 43. Have.

  That is, the circuit board 55 is positioned on the frame 41 by inserting the positioning pins 412, 413, 432, and 432 into the positioning holes 555 by inserting the positioning pins 412, 413, 432, and 432 into the positioning holes 512. The circuit board 51 and the circuit board 52 positioned in the frame 43 by inserting the positioning pins 432 and 433 through the positioning holes 522 and the frame 41 and 43 are positioned in the same state. Then, it is attached to the case 7 using a fastening member such as a screw whose symbol is omitted.

  As described above, in the power control apparatus 1, the semiconductor module is further divided into two first semiconductor modules 2 and 3 that have the same configuration and are compatible. Since the first connecting conductor 81 (N) and the second connecting conductor 82 (P) are employed so as to be opposed to the upper and lower ends of the case 7, the first connecting conductor 81 (N) and the second connecting conductor 82 (P) are used. The first input terminals 231 to 251 of the first semiconductor elements 23 (U) to 25 (W) are electrically connected to the first connection conductor 81 (N) and the second semiconductor element 33. The first input terminals 331 to 351 (U) to 35 (W) are electrically connected to the second connection conductor 82 (P).

[Case configuration]
As shown in FIGS. 1 to 4, the case 7 is typically an integrally molded product made of resin such as PPS (polyphenylene sulfide) resin. That is, the side wall 71 of the case 7 is obtained by being integrally formed as a typically rectangular cylindrical member extending in the vertical direction, and defines the internal space S therein, and the vertical direction of the side wall 71. A second opening 7H2 and a first opening 7H1 that open the internal space S to the outside while facing each other at both ends are defined at both ends.

  Although not shown in FIGS. 1 and 4, fastening holes having female screws are provided at the four corners of the upper end of the side wall 71, and fastening members such as screws and the like whose reference numerals are omitted in these fastening holes. Is used to fix the second cooling member 31 of the second semiconductor module 3 and close the second opening 7H2. Although not shown, fastening holes having female screws are also provided at the four corners of the lower end of the side wall 71, and a first member such as a screw whose reference numeral is omitted is used for these fastening holes. The first cooling member 21 of the semiconductor module 2 is fixed and closes the first opening 7H1. In this case, in order to improve the positioning at the time of mounting the first cooling member 21 and the second cooling member 31, the upper and lower ends of the side wall 71, the first cooling member 21 and the second cooling member 31, and Correspondingly, a fitting structure such as a concavo-convex shape such as a combination of a groove and a protrusion may be provided.

  The case 7 is provided with a first connection conductor 81 (N), a second connection conductor 82 (P), and third connection conductors 83 (U) to 85 (W). The case 7 extends outward through the corresponding one through-hole 711, one through-hole 712, and a total of three through-holes 713. In the gaps between the first connection conductor 81 (N), the second connection conductor 82 (P), and the third connection conductors 83 (U) to 85 (W) and the corresponding through holes 711, 712, and 713 Is provided with a sealing member to seal the internal space S.

  Specifically, as shown in FIGS. 1 and 2 (a) to 2 (c), the side wall 71 parallel to the yz plane and passing through the side wall 71 on the positive direction side of the x axis passes through the through hole 712. The second connection conductor 82 (P) extends outward to form a protruding end, and this protruding end functions as the second power input terminal 73 of the power control device 1. Specifically, the second power input terminal 73 is electrically connected to the positive terminal of the battery. Further, a control connector 75 having a control terminal electrically connected to the circuit board 55 is disposed on the side wall 71 parallel to the yz plane and on the positive side of the x axis.

  As shown in FIG. 1, FIG. 2A and FIG. 2C, a side wall 71 parallel to the yz plane and on the negative side of the x axis passes through a through hole 711 and is first exposed to the outside. The connecting conductor 81 (N) extends to form a protruding end, and this protruding end functions as the first power input terminal 72 of the power control device 1. Specifically, the first power input terminal 72 is electrically connected to the negative terminal of the battery.

  As shown in FIG. 1, FIG. 2B and FIG. 3, the third side wall 71 is parallel to the xz plane and penetrates the side wall 71 on the negative direction side of the y-axis through the corresponding through hole 713, and the third side. Connecting conductors 83 (U) to 85 (W) extend to form protruding ends juxtaposed in the x-axis direction, and these protruding ends function as output terminals 74 of the power control device 1. Specifically, the output terminal 74 corresponding to the third connection conductor 83 (U) is electrically connected to the U-phase drive current input terminal of the electric motor and corresponds to the third connection conductor 84 (V). The output terminal 74 is electrically connected to the V-phase drive current input terminal of the electric motor, and the output terminal 74 corresponding to the third connection conductor 85 (W) is the W-phase drive current of the electric motor. Electrically connected to the input terminal. Note that only one through hole 713 may be provided so that all of the third connection conductors 83 (U) to 85 (W) can be inserted.

  As described above, in the power control device 1, the first connecting conductor 81 (the first connecting conductor 81 (the second semiconductor module 3 is mounted on the upper and lower ends of the cylindrical case 7 correspondingly). N), since the second connection conductor 82 (P) and the third connection conductors 83 (U) to 85 (W) extend corresponding to the outside of the case 7 without interfering with each other, additional terminals are provided. While omitting the base, in particular, the extended ends of the first connection conductor 81 (N) and the second connection conductor 82 (P) correspond to the first power input terminal 72 and the second power input terminal. 73, which can be electrically connected to the battery.

[Configuration of connection conductor]
As shown in FIGS. 1, 3, and 4, the first connection conductor 81 (N) is a current path through which a relatively large current flows, and effectively uses the gap in the internal space S of the case 7. The gap portion extends in the x-axis direction, and extends from the side wall 71 of the case 7 through the through hole 711, and the protruding end is used as the first power input terminal 72. The first power input terminal 72 is provided with a fastening hole 815 having a female screw that fastens and supports and electrically connects a connection terminal of an electrical wiring from the negative terminal of the battery.

  Specifically, as shown in FIG. 3 in particular, the first connection conductor 81 (N) is a control IC 551 mounted on the circuit board 55 or a control that is a relative small current path in the internal space S. While being appropriately separated from the current path, the portion in the vertical direction is lower than the circuit board 55 and in the horizontal direction, the portion in the internal space S of the first semiconductor module 2 and the first capacitor 91 and the second capacitor This is a block structure having a horizontal block portion extending in the x-axis direction at a gap portion between the capacitor 92 and the capacitor 92.

  That is, the first connection conductor 81 (N) is not a member such as a thin wire or a plate, but is formed of a rectangular columnar and straight conductive block structure whose longitudinal section in the yz plane is substantially rectangular. In itself, the corresponding power input terminals of the first semiconductor elements 23 (U) to 25 (W) and the corresponding connection terminals of the first capacitor 91 and the second capacitor 92 are placed and fastened. However, it is a block structure having a sufficient volume and strength as a supporting member to be supported. Specifically, the first connection conductor 81 (N) is typically made of an aluminum alloy, and an aspect that is a ratio of a width dimension in the y-axis direction and a thickness dimension in the z-axis direction in the longitudinal section thereof. The ratio is set in the range of about 1: 5 to 5: 1, depending on the size and arrangement of the fastening holes.

  Since the first connection conductor 81 (N) is a conductive block structure and can secure a sufficient size of the fastening portion, a total of three fastening holes 813 each having an internal thread are provided above the lower surface. A total of two fastening holes 814 each having an internal thread are arranged as fastening holes facing downward from the upper surface and fastening holes facing upward from the lower surface. The first power input terminal 251 of the first semiconductor element 25 (W) is mechanically connected to the lower surface of the first connection conductor 81 (N) via a fastening hole 813 using a fastening member 811 such as a screw. It is electrically connected while being fastened and supported. Similarly, the first power supply input terminal 231 of the first semiconductor element 23 (U) and the first power supply input terminal 241 of the first semiconductor element 24 (V) are each shown by the fastening members 811 illustrated with the same reference numerals. , The first connection conductor 81 (N) is electrically connected to the lower surface of the first connection conductor 81 (N) while being mechanically fastened and supported through a fastening hole 813 shown by the same reference numeral. Here, the fastening member 811 is fastened by allowing a fastening tool such as a screwdriver having a straight pattern not shown to enter the internal space S from the through hole 211 of the first cooling member 21.

  Here, when the first connecting conductor 81 (N) is a block structure, it is preferable to use an aluminum alloy instead of a copper alloy or an iron alloy which is usually considered.

This is because when the first connecting conductor 81 (N) is made of a copper alloy, the copper alloy has a relatively high cross-sectional area in a cross section perpendicular to the direction in which the current flows because it is relatively excellent in conductivity. Due to the fact that it can be set small and is expensive in the first place, a cable-like configuration consisting of a plurality of thin wires or a simple bus bar-like configuration is adopted, and there is no necessity of adopting a block structure configuration. In such a case, the strength of the first connection conductor 81 (N) itself is insufficient, and the first power input terminals 231 to 251 of the first semiconductor elements 23 (U) to 25 (W) are first capacitors 91. In addition, the corresponding connection terminals of the second capacitor 92 cannot be sufficiently supported, and it is difficult to directly provide the fastening holes 813 and 814 themselves. Furthermore, in such a case, since the outer circumference and the outer surface area are also small due to the small cross-sectional area, there is a possibility that the inductance with respect to the current flowing therethrough will increase and unnecessary influences will be exerted on the surrounding elements. Also, the heat dissipation of heat generated by the current flowing there is inferior.

  On the other hand, when the first connecting conductor 81 (N) is made of an iron alloy, the iron alloy is relatively inferior in conductivity, so the cross-sectional area in the cross section perpendicular to the direction in which the current flows is increased. Due to the fact that it must be set, a configuration having a large cross-sectional area is adopted. In such a case, since the size of the first connecting conductor 81 (N) itself becomes too large, it is difficult to extend the gap portion in the internal space S, and let it be assumed that the gap portion is extended. Then, it is necessary to increase the size of the case 7 itself.

  Therefore, in order to ensure sufficient performance while optimizing various characteristics such as electrical characteristics, mechanical characteristics and size of the first connection conductor 81 (N), the first connection conductor 81 (N) is used as a block structure. For this purpose, the conductive material is preferably made of an aluminum alloy. The reason is the same for the other second connection conductors 82 (P) and the third connection conductors 83 (U) to 85 (W). In particular, in the first connection conductor 81 (N) and the second connection conductor 82 (P), the first input terminals 231 to 251 and the second input terminals 231 to 251 of the first semiconductor elements 23 (U) to 25 (W). The second input terminals 331 to 351 of the semiconductor elements 33 (U) to 35 (W), the corresponding connection terminals of the first capacitor 91 and the second capacitor 92, and the connection terminals of the electrical wiring from the negative terminal of the battery , And the connecting terminal of the electric wiring from the positive terminal of the battery is directly connected and mechanically supported and electrically connected to the first connecting conductor 81 (N) and the second connecting conductor 82 (P). Since it can be connected to, an additional terminal block can be omitted.

  As shown in FIG. 1, FIG. 3 and FIG. 4, the second connection conductor 82 (P) is a current path through which a relatively large current flows, and its attachment position is from the first connection conductor 81 (N). Is the same member as the first connection conductor 81 (N) except that the mounting posture is opposite to that of the first connection conductor 81 (N). That is, the second connection conductor 82 (P) is provided with the fastening holes 823, 824, 825, and the like in the same manner as the first connection conductor 81 (N). Here, the second power input terminal 331 of the second semiconductor element 33 (U), the second power input terminal 341 of the second semiconductor element 34 (V), and the second power input terminal 341 of the second semiconductor element 35 (W). The two power input terminals 351 are each mechanically fastened to the upper surface of the second connection conductor 82 (P) through the fastening holes 823 shown by the same reference numerals using the fastening members 821 shown by the same reference numerals. Are electrically connected while being supported. Further, the connection terminal of the electrical wiring from the positive terminal of the battery is electrically connected while being fastened and supported by the fastening hole 825.

  As shown in FIGS. 1, 3, and 4, the third connection conductor 85 (W) is a current path through which a relatively large current flows, and the first connection conductor 81 (N) and the second connection are connected. With respect to the conductor 82 (P), a portion located in the internal space S of the first semiconductor module 2, a portion located in the internal space S of the circuit board 55 and the second semiconductor module 3 are interposed, and the y axis The gap portion in the inner space S of the case 7 is effectively used, and the gap portion extends in the y-axis direction, and the corresponding through hole 713 is formed from the side wall 71 of the case 7. The protruding end is used as the output terminal 74. The output terminal 74 of the third connection conductor 85 (W) is provided with a fastening hole 852 having a female screw that mechanically fastens and supports the W-phase drive current input terminal of the electric motor.

Specifically, as shown in FIG. 3 in particular, the third connection conductor 85 (W) is connected to the control IC 551 mounted on the circuit board 55 and its relative small current path in the internal space S of the case 7. In the horizontal direction, a gap from the side wall 71 to a portion located in the internal space S of the first semiconductor module 2 extends in the y-axis direction while being appropriately spaced from the control current path. It has a prismatic and straight horizontal block portion whose longitudinal section in the z plane is substantially rectangular, and rises upward from the vicinity of the portion located in the internal space S of the first semiconductor module 2 in the vertical direction. Between the first output terminal 252 of the first semiconductor element 25 (W) and the second output terminal 352 of the second semiconductor element 35 (W) while passing through the corresponding through hole 554 of the circuit board 55. The first semiconductor module The gap between the part located in the internal space S of the module 2, the part located in the internal space S of the circuit board 55 and the second semiconductor module 3, and the current sensor 552 extends in the z-axis direction. The block structure has a prismatic and straight upright block portion integrally formed with the horizontal block portion and having a substantially rectangular cross section in the xy plane. Note that only one through hole 554 may be provided so that all of the third connection conductors 83 (U) to 85 (W) can be inserted.

  In other words, the third connection conductor 85 (W) is L-shaped when viewed in the x-axis direction, but is similar to the first connection conductor 81 (N) and the second connection conductor 82 (P). An aspect which is a ratio of a width dimension in the x-axis direction and a thickness dimension in the z-axis direction of a longitudinal section in the xz plane of a portion extending in the y-axis direction, which is configured by an alloy conductive block structure. The aspect ratio, which is the ratio of the width dimension in the x-axis direction and the depth dimension in the y-axis direction of the cross section in the xy plane of the portion extending in the z-axis direction, is 1: 5 to 5: 1, respectively. It is set to a range of about.

  The third connection conductor 85 (W) is a conductive block structure, can secure a sufficient fastening portion dimension, and can be secured from the second semiconductor element 35 (W) to the first semiconductor element 25. Since a sufficient length can be ensured over (W), a pair of upper and lower fastening holes 851 each having an internal thread can be disposed facing each other on the third connection conductor 85 (W). . In particular, as shown in FIG. 3, the second output terminal 352 of the second semiconductor element 35 (W) is connected to the standing block portion of the third connection conductor 85 (W) using the fastening member 855 and the fastening hole 851. It is electrically connected to the upper end surface while being mechanically fastened and supported. Similarly, the first output terminal 252 of the first semiconductor element 25 (W) is a standing block portion of the third connection conductor 85 (W) using a fastening member 855 and a fastening hole 851 that are respectively illustrated by the same reference numerals. It is electrically connected to the lower end surface of the plate while being mechanically fastened and supported. Here, the fastening member 855 is a fastening tool such as a screwdriver having a straight pattern not shown, and the corresponding through hole 211 of the first cooling member 21 or the corresponding through hole 311 of the second cooling member 31. Is entered into the internal space S and fastened.

The third connection conductor 84 (V) adjacently juxtaposed on the negative direction side of the x-axis with respect to the third connection conductor 85 (W), and the negative of the x-axis with respect to the third connection conductor 84 (V) The third connection conductors 83 (U) adjacent to each other on the direction side are current paths through which a relatively large current flows, and their attachment positions are different from those of the third connection conductor 85 (W). Other than this, the members are the same as the third connection conductor 85 (W). That is, the third connection conductor 83 (U) and the third connection conductor 84 (V) effectively use the gap in the internal space S of the case 7, similarly to the third connection conductor 85 (W). The gap extends in the y-axis direction and extends from the side wall 71 of the case 7 so that the protruding end is used as the output terminal 74. The output terminals 74 of the third connection conductors 83 (U) and 84 (V) have internal threads that mechanically fasten and support the U-phase and V-phase drive current input terminals of the electric motor. Fastening holes 832 and 842 are provided correspondingly. Here, the second output terminal 332 of the second semiconductor element 33 (U) is the upper end surface of the standing block portion of the third connection conductor 83 (U) by using the fastening member 835 and the fastening hole 831 having the female screw. The first output terminal 232 of the first semiconductor element 23 (U) is a fastening member having a fastening member 835 and a female screw, which are respectively indicated by the same reference numerals. The hole 831 is used to electrically connect to the lower end surface of the standing block portion of the third connection conductor 83 (U) while being mechanically fastened and supported. Further, the second output terminal 342 of the second semiconductor element 34 (V) is connected to the upper end surface of the standing block portion of the third connection conductor 84 (V) by using the fastening member 845 and the fastening hole 841 having the female screw. The first output terminal 242 of the first semiconductor element 24 (V) is electrically connected while being mechanically fastened and supported, and the first output terminal 242 of the first semiconductor element 24 (V) is a fastening hole having a fastening member 845 and a female screw, which are respectively indicated by the same reference numerals. 841 is used to be electrically connected to the lower end surface of the standing block portion of the third connection conductor 84 (V) while being mechanically fastened and supported.
The U-phase drive current input terminal of the electric motor is electrically supported while being mechanically fastened and supported through a fastening hole 832 provided in the output terminal 74 of the third connection conductor 83 (U). The V-phase drive current input terminal of the electric motor is mechanically fastened and supported via a fastening hole 842 provided in the output terminal 74 of the third connection conductor 84 (V). Electrically connected.

  Here, the first connection conductor 81 (N), the second connection conductor 82 (P), and the third connection conductors 83 (U) to 85 (W) extend the corresponding gaps in the internal space S. Existing through the side wall 71 and projecting outward from the case 7, and having sufficient strength and volume as a support member for supporting the corresponding counterpart terminal while placing and mechanically fastening the counterpart terminal. Any block structure having sufficient conductivity for conducting the terminals may be used. Therefore, such a block structure may include a single block part, or may be a combination of a plurality of block parts. By appropriately combining similar block parts, the shape and current path of the block structure may be included. It can be said that the length can be easily extended. In addition, as long as the block portion has a cross-sectional area that does not generate excessive inductance or heat generation, the block portion is not limited to one having a substantially rectangular cross-section, and other cross-sections such as a square shape or an elliptical shape. It may have. Of course, such a block portion does not extend as a straight block portion but may extend as a curved block portion, or does not have a fastening portion on a horizontal plane, but fastens on an inclined surface. It may have a part.

  As described above, in the power control device 1, the first connection conductor 81 (N), the second connection conductor 82 (P), and the third connection conductor 83 (U) through which a relatively large current flows. The first connection conductor 81 (N), the second connection conductor 82 (P), and the third connection conductor 85 (W) and the control current path through which a relatively small current flows are separated and efficiently distributed. The connection conductors 83 (U) to 85 (W) extend correspondingly into the gap portion of the internal space S, and the first connection conductor 81 (N), the second connection conductor 82 (P), and the second Since the connection conductors 83 (U) to 85 (W) of FIG. 3 have a block structure, the internal space S can be effectively used to make the entire apparatus compact, and the additional terminal block can be omitted. The first input terminals 231 to 251 of one semiconductor element 23 (U) to 25 (W) The second input terminals 331 to 351 of the second semiconductor elements 33 (U) to 35 (W) are electrically connected while being mechanically fastened and supported to the connection conductor 81 (N). The second connection conductor 82 (P) is electrically connected while being mechanically fastened and supported, and the corresponding connection terminals of the first capacitor 91 and the second capacitor 92 are connected to the first connection conductor 82 (P). The connection conductor 81 (N) and the second connection conductor 82 (P) are electrically connected while being mechanically fastened and supported, while the connection terminal of the electrical wiring from the negative terminal of the battery is The first connection conductor 81 (N) is electrically connected while being mechanically fastened and supported, and the connection terminal of the electric wiring from the positive terminal of the battery is connected to the second connection conductor 82 ( P) mechanically fastened and not supported It is electrically connected to each other.

[Configuration of capacitor]
As shown in FIGS. 1 and 3, the first capacitor 91 and the second capacitor 92 are provided in the internal space S of the case 7 with a first connection conductor 81 (N) and a second connection conductor 82 (P ) Along the x-axis direction, and disposed in the gap between the first connection conductor 81 (N) and the second connection conductor 82 (P) and the side wall 71. The first capacitor 91 is located in the negative direction of the x axis with respect to the second capacitor 92. If necessary, the first capacitor 91 and the second capacitor 92 may be integrated to adopt a single capacitor, or the number of capacitors may be increased to employ three or more capacitors. May be.

Specifically, each of the first capacitor 91 and the second capacitor 92 is a film capacitor, and has a capacitance for functioning as a smoothing capacitor in cooperation with each other. The first capacitor 91 has connection terminals 911 and 912, and the second capacitor 92 has connection terminals 921 and 922.

  In particular, as shown in FIG. 1, in the vertical wall parallel to the xz plane facing the first connection conductor 81 (N) and the second connection conductor 82 (P) of the first capacitor 91, the connection terminal 911 extends toward the second connection conductor 82 (P) above the vertical wall displaced in the positive direction of the x-axis, and the connection terminal 912 extends to the connection terminal 911 with respect to the x-axis of the vertical wall. It extends toward the first connecting conductor 81 (N) obliquely downwardly displaced in the negative direction. In the vertical wall parallel to the xz plane facing the first connection conductor 81 (N) and the second connection conductor 82 (P) of the second capacitor 92, the connection terminal 921 is the x-axis of the vertical wall. The upper terminal is displaced toward the second connection conductor 82 (P) and is obliquely displaced in the negative direction of the vertical axis of the vertical wall with respect to the connection terminal 921. It extends downward toward the first connection conductor 81 (N). The first capacitor 91 and the second capacitor 92 have the same capacitance and shape except that the arrangement positions of the connection terminals 911 and 912 and the arrangement positions of the connection terminals 921 and 922 are different in the vertical direction. Including the same configuration.

  In the first capacitor 91, the connection terminal 911 is electrically connected to the upper surface of the second connection conductor 82 (P) using the fastening member 822 and the fastening hole 824 and is electrically connected while being supported. The connection terminal 912 is electrically connected to the upper surface of the first connection conductor 81 (N) using the fastening member 812 and the fastening hole 814 while being mechanically fastened and supported. In the second capacitor 92, the connection terminals 921 are mechanically attached to the lower surface of the second connection conductor 82 (P) by using fastening members 822 and fastening holes 824, which are shown by the same reference numerals as those related to the first capacitor 91. The connection terminal 922 is electrically connected to the first connection conductor 81 (using the fastening member 812 and the fastening hole 814 shown by the same reference numerals as those relating to the first capacitor 91. N) is mechanically fastened to the lower surface and electrically connected while being supported. In FIG. 3, since the connection terminal 921 is in front, it is virtually indicated by a chain line.

  That is, the first capacitor 91 and the second capacitor 92 are electrically connected in parallel to each other via the first connection conductor 81 (N) and the second connection conductor 82 (P), and The first semiconductor elements 23 (U) to 25 (W) and the second semiconductor elements 33 (U) to 35 (W) are electrically connected in parallel.

  At this time, regarding the relative positional relationship in the x-axis direction of the first connection conductor 81 (N) and the second connection conductor 82 (P), the second connection conductor 82 (P) is connected to the first connection conductor 82 (P). The fastening hole 814 located above the conductor 81 (N) and on the upper surface side of the first connection conductor 81 (N) is the end of the second connection conductor 82 (P) on the negative side in the x-axis direction. Since the first connecting conductor 81 (N) and the second connecting conductor 82 (P) are fixed to the case 7, the first connecting conductor 81 (N) and the second connecting conductor 82 (P) are disposed so as to be displaced from the negative direction side of the x axis. The fastening member 812 corresponding to the fastening hole 814 can be fastened from above using a fastening tool such as a screwdriver having a straight pattern not shown. At the same time, similarly, the fastening hole 824 on the lower surface side of the second connection conductor 82 (P) is located on the positive side of the x-axis with respect to the positive-direction end of the first connection conductor 81 (N). Therefore, even after the first connection conductor 81 (N) and the second connection conductor 82 (P) are fixed to the case 7, the fastening member corresponding to the fastening hole 824 is disposed. 822 can be fastened from below using a fastening tool such as a screwdriver having a straight pattern not shown.

  In addition, the first capacitor 91 and the second capacitor 92 are respectively connected to the first semiconductor elements 23 (U) to 25 (W) and the second semiconductor elements 33 (U) to 35 (W). The first capacitor 91 and the second capacitor 92 are electrically connected so that the total connection path from the first capacitor 91 and the second capacitor 92 is equivalent.

  Specifically, the distance from the first capacitor 91 to the second semiconductor element 33 (U) via the connection terminal 911, the second connection conductor 82 (P), and the second power input terminal 331, and the second The sum of the distance from the capacitor 92 to the connection terminal 921, the second connection conductor 82 (P) and the second semiconductor element 33 (U) via the second power input terminal 331, the first capacitor 91 to the connection terminal 911, the distance from the second capacitor 92 to the second semiconductor element 34 (V) via the second connection conductor 82 (P) and the second power input terminal 341, and the connection terminal 921, second connection conductor 82 from the second capacitor 92. (P) and the distance to the second semiconductor element 34 (V) via the second power input terminal 341, the first capacitor 91 to the connection terminal 911, the second connection conductor 82 (P) and the second Two power input terminals 35 The distance from the second capacitor 92 to the second semiconductor element 35 (W) and the second semiconductor element 35 from the second capacitor 92 via the connection terminal 921, the second connection conductor 82 (P), and the second power input terminal 351. (W), the distance from the first capacitor 91 to the first semiconductor element 23 (U) via the connection terminal 912, the first connection conductor 81 (N), and the first power supply input terminal 231. The sum of the distance and the distance from the second capacitor 92 to the first semiconductor element 23 (U) via the connection terminal 922, the first connection conductor 81 (N) and the first power input terminal 231, the first The distance from the capacitor 91 to the connection terminal 912, the first connection conductor 81 (N) and the first semiconductor element 24 (V) via the first power supply input terminal 241, and the second capacitor 92 to the connection terminal 922, 1 connection conductor 1 (N) and the sum of the distance from the first power supply input terminal 241 to the first semiconductor element 24 (V), the first capacitor 91 to the connection terminal 912, and the first connection conductor 81 (N). And the distance from the second capacitor 92 to the connection terminal 922, the first connection conductor 81 (N), and the first power supply input terminal 251 through the distance from the first power supply input terminal 251 to the first semiconductor element 25 (W). The sum to the distance to the first semiconductor element 25 (W) via the is set to be equal to each other.

  As described above, in the power control apparatus 1, the first capacitor 91 and the second capacitor 92 are respectively provided between the first connection conductor 81 (N) and the second connection conductor 82 (P). Are connected in parallel with each other, and the fastening hole 814 on the upper surface side of the first connection conductor 81 (N) is more than the end of the second connection conductor 82 (P) on the negative side in the x-axis direction. The fastening hole 824 arranged on the negative side of the x-axis and displaced on the lower surface side of the second connection conductor 82 (P) is in the positive direction of the x-axis of the first connection conductor 81 (N). Since the first connecting conductor 81 (N) and the second connecting conductor 82 (P) are fixed to the case 7 because the first connecting conductor 81 (N) and the second connecting conductor 82 (P) are fixed to the case 7 because they are arranged to be deviated from the side end portion in the positive direction of the x axis. However, the fastening members 812 and 822 corresponding to the fastening holes 814 and 824 can be easily fastened. In addition, the first capacitor 91 and the second capacitor 92 are connected to the first semiconductor element 23 (U) via the first connection conductor 81 (N) and the second connection conductor 82 (P), respectively. To 25 (W) and the second semiconductor elements 33 (U) to 35 (W) are electrically connected in parallel so that the total connection paths to these are equivalent to each other. The first capacitor 91 and the second capacitor 92 contribute equally to the first semiconductor elements 23 (U) to 25 (W) and the second semiconductor elements 33 (U) to 35 (W). To smooth the DC current from the battery evenly.

[Assembly of power control device]
The assembly method of the power control apparatus 1 having the above configuration will be described in detail below.

  First, while the insulating sheet 22 is disposed on the one surface 21A of the first cooling member 21, the pressing member 42 against the frame 41 housing the first semiconductor elements 23 (U) to 25 (W). And the circuit board 51 on which the driving IC 511 and the like are mounted is attached, and the frame 41 in this state is fastened to the one surface 21A of the first cooling member 21 via the insulating sheet 22 and attached. Then, the first semiconductor module 2 is assembled.

At this time, a total of two positioning pins 412 and 413 erected on the frame 411 of the frame 41 are inserted into the pair of positioning holes 512 of the circuit board 51 so that the circuit board 51 Positioned with respect to 41, the first semiconductor module 2 is attached at a predetermined position.

  Similarly, while the insulating sheet 32 is disposed on the one surface 31A of the second cooling member 31, a pressing member against the frame 43 containing the second semiconductor elements 33 (U) to 35 (W). 44 and the circuit board 52 on which the drive IC 521 and the like are mounted are attached, and the frame 43 in this state is attached to the one surface 31A of the third cooling member 31 via the insulating sheet 32. Thus, the second semiconductor module 3 is assembled.

  At this time, a total of two positioning pins 432 and 433 erected on the frame body 431 of the frame 43 are inserted into the pair of positioning holes 522 of the circuit board 52 so that the circuit board 52 Positioned with respect to 43, the second semiconductor module 3 is attached at a predetermined position.

  In addition, the first connection conductor 81 (N) in a state where the through hole 711 is passed through the seal member, and the second connection conductor in a state where the through hole 712 is passed through the seal member 82 (P) and corresponding through-holes 713 are provided on the side wall 71 of the case 7 with the third connection conductors 83 (U) to 85 (W) in a state of passing through the seal member. It attaches corresponding to the fixing | fixed part which abbreviate | omits illustration.

  Further, the first connecting conductor 81 (N) and the second connecting conductor 82 (P) in such a state are respectively connected to the first connecting members 812 and 822 and the fastening holes 814 and 824 using the first connecting conductor 81 (N) and the second connecting conductor 82 (P). By fastening the connection terminals 911 and 912 of the capacitor 91 and the connection terminals 921 and 922 of the second capacitor 92, the first capacitor 91 and the second capacitor 92 are accommodated in the internal space S of the case 7. In this state, the first connection conductor 81 (N) and the second connection conductor 82 (P) are attached.

  At this time, the fastening hole 814 on the upper surface side of the first connection conductor 81 (N) is displaced to the negative direction side of the x axis from the end portion of the second connection conductor 82 (P) on the negative direction side of the x axis. And the fastening hole 824 on the lower surface side of the second connection conductor 82 (P) is more positive in the x-axis than the end in the positive direction side of the x-axis of the first connection conductor 81 (N). Since it is arranged to be displaced in the direction side, the fastening members 812 and 822 corresponding to all of the fastening holes 814 and 824 are fastened by using a fastening tool such as a screwdriver having a straight pattern not shown. To do.

  Next, with respect to the case 7 in such a state, the first semiconductor module 2 and the first semiconductor elements 23 (U) to 25 (W) are arranged in the internal space S through the first opening 7H1. At the same time, the other surface 21B of the first cooling member 21 is attached so as to be exposed to the outside of the case 7, and the first opening 7H1 is closed by the first cooling member 21.

  At this time, by inserting the positioning pins 412 and 413 of the first semiconductor module 2 in correspondence with the pair of positioning holes 555 of the circuit board 55, the circuit board 55 is placed above the circuit board 51 and on the side wall of the case 7. Positioning is performed with respect to the first semiconductor module 2 attached to the case 7, while being placed on a fixing portion that omits the reference numerals provided in 71.

  Next, with respect to the case 7 in such a state, the second semiconductor module 3 and the second semiconductor elements 33 (U) to 35 (W) are arranged in the internal space S through the second opening 7H2. At the same time, the other surface 31B of the second cooling member 21 is attached so as to be exposed to the outside of the case 7, and the second opening 7H2 is closed by the second cooling member 31.

At this time, the positioning pins 432 and 433 of the second semiconductor module 3 are connected to the circuit board 55.
The circuit board 55 is attached to the fixing portion of the case 7 while the circuit board 55 and the second semiconductor module 3 are positioned by being inserted into the remaining pair of positioning holes 555.

  Next, by tightening the fastening member 811 into the corresponding fastening hole 813 while sequentially inserting a fastening tool (not shown) from the through hole 211 of the first cooling member 21 into the internal space S, the first semiconductor The first power input terminals 231 to 251 of the elements 23 (U) to 25 (W) are fastened to the first connection conductor 81 (N), and the fastening members 835 to 855 are connected to the corresponding fastening holes 831. By tightening to ˜851, the first output terminals 232 to 252 of the first semiconductor elements 23 (U) to 25 (W) are connected to the third connection conductors 83 (U) to 85 (W). It is concluded.

  Next, a fastening tool (not shown) is inserted into the internal space S from the through hole 311 of the second cooling member 31 in turn, and the fastening member 821 is fastened into the corresponding fastening hole 823, thereby the second semiconductor. The second power input terminals 331 to 351 of the elements 33 (U) to 35 (W) are fastened to the second connection conductor 82 (P), and the fastening members 835 to 855 are connected to the corresponding fastening holes 831. By tightening to ˜851, the second output terminals 332 to 352 of the second semiconductor elements 33 (U) to 35 (W) are connected to the third connection conductors 83 (U) to 85 (W). It is concluded.

  And the assembly of the electric power control apparatus 1 is completed by closing the through-hole 211 of the 1st cooling member 21 and the through-hole 311 of the 2nd cooling member 31 with the grommet which abbreviate | omits illustration as needed.

  In the present invention, the shape, arrangement, number, and the like of the members are not limited to the above-described embodiments, and the constituent elements thereof are appropriately replaced with those having the same operational effects, and the gist of the invention is not deviated. Of course, it can be appropriately changed within the range.

  As described above, in the present invention, the input terminal of the semiconductor element and the connection terminal of the related device can be mechanically fastened and supported and electrically connected while omitting an additional terminal block. Therefore, it is expected that the semiconductor device can be widely applied to the field of semiconductor devices such as power control devices because of its universality.

DESCRIPTION OF SYMBOLS 1 ... Power control device 2, 3 ... Semiconductor module 21, 31 ... Cooling member 211, 311 ... Through-hole 215, 315 ... Radiation fin 21A, 21B, 31A, 31B ... Surface 22, 32 ... Insulation sheet 23, 24, 25, 33, 34, 35 ... Semiconductor elements 231, 241, 251, 331, 341, 351 ... Power input terminals 232, 242, 252, 332, 342, 352 ... Output terminals 41, 43 ... Frames 411, 431 ... Frame body 412, 413, 432, 433 ... positioning pins 42, 44 ... pressing members 51, 52, 55 ... circuit boards 511, 521 ... drive ICs
512, 522, 555 ... positioning hole 551 ... control IC
552 ... Current sensor 553 ... Overhang portion 554 ... Through hole 7 ... Case 71 ... Side walls 711, 712, 713 ... Through holes 7H1, 7H2 ... Openings 72, 73 ... Power input terminal 74 ... Output terminal 75 ... Control connectors 81, 82 , 83, 84, 85 ... connecting conductors 811, 812, 821, 822, 835, 845, 855 ... fastening members 813, 814, 815, 823, 824, 825, 831, 832, 841, 842, 851, 852 ... fastening. Holes 91, 92 ... capacitors 911, 912, 921, 922 ... connection terminals

Claims (3)

A semiconductor device comprising: a semiconductor element; and a capacitor electrically connected to the semiconductor element,
A plurality of connection conductors for electrically connecting the input terminal of the semiconductor element and the connection terminal of the capacitor;
The plurality of connection conductors include a first connection conductor that is a block structure, and a second connection conductor that is disposed offset from the first connection conductor and is a block structure. A semiconductor device. The semiconductor device according to claim 1, characterized in that the multiple connecting conductors are provided each screw fastening portion for fastening the input terminals or said connection terminals. Wherein the plurality of connecting conductors, the semiconductor device according to claim 1 or 2, characterized in that it consists of an aluminum material.

Images