WO2019117119A1 - Inverter, inverter in case, electric motor having built-in inverter, and composite device having built-in inverter - Google Patents

Inverter, inverter in case, electric motor having built-in inverter, and composite device having built-in inverter Download PDF

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Publication number
WO2019117119A1
WO2019117119A1 PCT/JP2018/045424 JP2018045424W WO2019117119A1 WO 2019117119 A1 WO2019117119 A1 WO 2019117119A1 JP 2018045424 W JP2018045424 W JP 2018045424W WO 2019117119 A1 WO2019117119 A1 WO 2019117119A1
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WO
WIPO (PCT)
Prior art keywords
inverter
cooler
frame
fixed
smoothing
Prior art date
Application number
PCT/JP2018/045424
Other languages
French (fr)
Japanese (ja)
Inventor
田島　豊
野村　由利夫
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日本電産株式会社
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Filing date
Publication date
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Publication of WO2019117119A1 publication Critical patent/WO2019117119A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
    • H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
    • H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
    • H02P27/00—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage
    • H02P27/04—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage
    • H02P27/06—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage using dc to ac converters or inverters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to an inverter, a cased inverter, an inverter built-in motor, and an inverter built-in complex device.
  • the conventional inverter comprises a plurality of parts and an inverter case.
  • the plurality of components include a cooler and the like, and are fixed to the inverter case.
  • the inverter case has a box-like shape. Fixing of the component to the inverter case is performed by attaching the component to a boss provided on the inner wall of the inverter case. Alternatively, fixing of the component to the inverter case is performed by fixing a foot provided on the component to the inner wall of the inverter case. In some cases, the foot provided to the first part is fixed to the second part fixed to the inverter case.
  • the first power substrate drives the first motor and the second power substrate drives the second motor (claim 1) ).
  • the first power substrate and the second power substrate include a plurality of switching elements constituting a motor drive circuit (paragraphs 0018 and 0019).
  • the heat generated in the first power substrate is dissipated by the first heat dissipation plate, and the heat generated in the second power substrate is dissipated by the second heat dissipation plate (claim 1).
  • the first power substrate and the first heat sink are integrated, and the second power substrate and the second heat sink are integrated (paragraph 0008).
  • the inverter includes a connector, a smoothing capacitor, a semiconductor power module, a current sensor, a cooler, and the like, and these components are arranged.
  • These parts include parts having different sizes and shapes. For this reason, in the following cases, there is a problem that the gap between parts becomes large. That is, when the component is attached to the boss provided on the inner wall of the inverter case, and the foot provided on the component is fixed to the inner wall of the inverter case, the foot provided on the first component is the inverter For example, when the first part and the second part are stacked and fixed to the second part fixed to the case. In particular, when the gap between a large part and an adjacent part becomes large, dead space is generated around the large part.
  • the present invention is made to solve this problem.
  • the problem to be solved by the present invention is to make it easy to reduce the gap between a plurality of parts and to make the inverter smaller.
  • the inverter is provided with a frame, a semiconductor power module and a cooler.
  • the frame is configured by combining a plurality of frame members including a plurality of rod-like frame members.
  • the semiconductor power module switches direct current and generates alternating current.
  • the cooler is fixed to the frame and cools the semiconductor power module.
  • the restriction on the position at which the part is fixed is reduced, and the restriction on the position at which the part is arranged is reduced. This makes it easy to reduce the gap between the plurality of components, and to miniaturize the inverter.
  • FIG. 5 is a cross-sectional view schematically illustrating a cross section at a position of a cutting line AA in FIG. 4 of the inverter according to the first embodiment.
  • FIG. 5 is a cross-sectional view schematically illustrating a cross-section at the position of cutting line BB in FIG.
  • FIG. 5 is a cross sectional view schematically illustrating a cross section at a position of a cutting line CC in FIG. 4 of the inverter according to the first embodiment.
  • FIG. 5 is a cross-sectional view schematically illustrating a cross section at a position of a cutting line DD in FIG. 4 of the inverter according to the first embodiment.
  • FIG. 5 is a cross sectional view schematically illustrating a cross section at a position of a cutting line EE in FIG. 4 of the inverter according to the first embodiment.
  • FIG. 5 is a cross-sectional view schematically illustrating a cross section at a position of a cutting line FF in FIG. 4 of the inverter according to the first embodiment.
  • FIG. 2 is a cross-sectional view schematically illustrating a cross section of a capacitor group and a frame provided in the inverter of the first embodiment. It is a connection diagram illustrating electric connection in a smoothing capacitor provided in an inverter of a 1st embodiment. It is a top view which illustrates typically the upper surface of the capacitor group provided in the inverter of the 2nd modification of a 1st embodiment, and a frame.
  • FIG. 5 is a cross-sectional view schematically illustrating a structure for cooling a component that is desirably added to the inverter of the first embodiment.
  • FIG. 1 It is sectional drawing which illustrates typically the structure for the heat insulation between the components preferably added to the inverter of 1st Embodiment. It is a sectional view which illustrates a section of an inverter of a 6th modification of a 1st embodiment typically. It is a perspective view which illustrates a cross section of an inverter of a 2nd embodiment typically. It is a perspective view which illustrates a frame provided in an inverter of a 2nd embodiment typically. It is a perspective view which illustrates a cross section of an inverter of a 3rd embodiment typically. It is a sectional view which illustrates a section of an inverter of a 4th embodiment typically.
  • FIG. 1 It is a perspective view which illustrates typically a part of the frame provided in the 1st cooler and the 2nd cooler which were provided in the inverter of a 5th embodiment, and the inverter concerned. It is sectional drawing which illustrates typically the cross section of the 1st cooler and 2nd cooler which were provided in the inverter of 5th Embodiment, and a part of flame
  • the first exemplary embodiment of the present invention relates to an inverter.
  • FIG. 1 is a perspective view schematically illustrating the inverter of the first embodiment.
  • the inverter 1000 illustrated in FIG. 1 comprises an inverter circuit 1010, at least one cooler 1011 and a frame 1012.
  • the inverter 1000 may include components other than these components.
  • the inverter circuit 1010 receives DC and control signals.
  • the inverter circuit 1010 switches the direct current input according to the input signal to generate a three-phase alternating current.
  • the generated three-phase alternating current is output from the inverter circuit 1010.
  • inverter 1000 operates as a power converter that converts direct current into three-phase alternating current.
  • the cooler 1011 dissipates the heat generated by the inverter circuit 1010.
  • the main components provided in the inverter circuit 1010 and the cooler 1011 are fixed to a frame 1012 as a support and supported by the frame 1012.
  • the output three-phase alternating current is supplied to the motor.
  • the generated three-phase alternating current may be supplied to loads other than the motor.
  • the inverter 1000 may generate an alternating current other than the three-phase alternating current. For example, inverter 1000 may generate a single phase alternating current.
  • FIG. 2 is a connection diagram illustrating an electrical connection in the inverter circuit provided in the inverter of the first embodiment.
  • the inverter 1000 configures an inverter circuit 1010, and includes a DC connector 1100, a smoothing capacitor 1110, DC bus bar electrodes 1120, 1121, 1122, 1123, 1124 and 1125, a signal terminal connector 1130, and signal wiring. 1140, a drive circuit board 1150 and 1160, a semiconductor power module 1170, AC bus bar electrodes 1180, 1181 and 1182, AC connectors 1190, 1191 and 1192 and current sensors 1200, 1201 and 1202.
  • the inverter circuit 1010 may include components other than these components.
  • the input terminals 1210 and 1211 of the DC connector 1100 contact the electrodes 1220 and 1221 of the smoothing capacitor 1110, respectively.
  • the input terminals 1210 and 1211 are electrically connected to the electrodes 1220 and 1221, respectively.
  • the electrodes 1230, 1231, 1232, 1233, 1234 and 1235 of the smoothing capacitor 1110 contact one end of the DC bus bar electrodes 1120, 1121, 1122, 1123, 1124 and 1125 respectively.
  • the other ends of the DC busbar electrodes 1120, 1121, 1122, 1123, 1124 and 1125 contact the DC electrodes 1240, 1241, 1242, 1243, 1244 and 1245 of the semiconductor power module 1170, respectively.
  • the electrodes 1230, 1231, 1232, 1233, 1234 and 1235 are electrically connected to the DC electrodes 1240, 1241, 1242, 1243, 1244 and 1245 through the DC busbar electrodes 1120, 1121, 1122, 1123, 1124 and 1125 respectively. Connected.
  • the DC bus bar electrodes 1120, 1122 and 1124 are P electrode bus bars for U phase, V phase and W phase, respectively.
  • the DC bus bar electrodes 1121, 1123 and 1125 are N electrode bus bars for U phase, V phase and W phase, respectively.
  • the AC electrodes 1250, 1251 and 1252 of the semiconductor power module 1170 are in contact with one ends of the AC busbar electrodes 1180, 1181 and 1182, respectively.
  • the other ends of the AC bus bar electrodes 1180, 1181 and 1182 contact the output terminal 1260 of the AC connector 1190, the output terminal 1261 of the AC connector 1191, and the output terminal 1262 of the AC connector 1192, respectively.
  • the AC electrodes 1250, 1251 and 1252 are electrically connected to the output terminals 1260, 1261 and 1262 through the AC busbar electrodes 1180, 1181 and 1182, respectively.
  • the DC electrodes 1240, 1241, 1242, 1243, 1244 and 1245 of the semiconductor power module 1170 serve as DC input terminals.
  • the AC electrodes 1250, 1251 and 1252 of the semiconductor power module 1170 become an AC output terminal.
  • the plurality of terminals 1270 of the signal terminal connector 1130 are in contact with one ends of the plurality of signal wirings 1140, respectively.
  • the other ends of the plurality of signal wirings 1140 contact the plurality of electrodes 1280 of the drive circuit boards 1150 and 1160, respectively.
  • the plurality of terminals 1270 are electrically connected to the plurality of electrodes 1280 via the plurality of signal wirings 1140, respectively.
  • a direct current before high voltage smoothing is input from the outside to the input terminals 1210 and 1211 of the DC connector 1100.
  • the direct current before smoothing input from the outside to the DC connector 1100 is input to the electrodes 1220 and 1221 of the smoothing capacitor 1110 and smoothed by the smoothing capacitor 1110.
  • the smoothing capacitor 1110 generates a smoothed direct current.
  • the smoothed direct current is output from the electrodes 1230 and 1231 of the smoothing capacitor 1110, is output from the electrodes 1232 and 1233 of the smoothing capacitor 1110, and is output from the electrodes 1234 and 1235 of the smoothing capacitor 1110.
  • the smoothed direct current output from the electrodes 1230 and 1231 is transmitted by the DC bus bar electrodes 1120 and 1121, and input to the DC electrodes 1240 and 1241 of the semiconductor power module 1170.
  • the smoothed direct current output from the electrodes 1232 and 1233 is transmitted by the DC bus bar electrodes 1122 and 1123 and input to the DC electrodes 1242 and 1243 of the semiconductor power module 1170.
  • the smoothed direct current output from the electrodes 1234 and 1235 is transmitted by the DC bus bar electrodes 1124 and 1125 and input to the DC electrodes 1244 and 1245 of the semiconductor power module 1170. Thereby, the direct current switched by the semiconductor power module 1170 becomes the smoothed direct current.
  • a control signal is input from the outside to the terminal 1270 of the signal terminal connector 1130.
  • the signal input to the signal terminal connector 1130 is transmitted by the signal wiring 1140 and input to the electrodes 1280 of the drive circuit boards 1150 and 1160.
  • the drive circuit boards 1150 and 1160 drive the semiconductor power module 1170 based on the input signal.
  • the semiconductor power module 1170 switches direct current input to the DC electrodes 1240 and 1241 and switches direct current input to the DC electrodes 1242 and 1243 according to driving by the drive circuit boards 1150 and 1160, and DC electrodes 1244 and 1245. Switch the direct current input to.
  • the semiconductor power module 1170 generates a three-phase alternating current.
  • the generated three-phase alternating current is output from the AC electrodes 1250, 1251 and 1252 of the semiconductor power module 1170.
  • the output three-phase alternating current is transmitted by the AC bus bar electrodes 1180, 1181, and 1182, and is input to the output terminal 1260 of the AC connector 1190, the output terminal 1261 of the AC connector 1191, and the output terminal 1262 of the AC connector 1192.
  • the input three-phase alternating current is output from the output terminals 1260, 1261 and 1262 to the outside.
  • the inverter 1000 When the inverter 1000 generates a single-phase alternating current, the inverter 1000 is a semiconductor power module that switches direct current to generate a single-phase alternating current, an AC bus bar electrode that transmits the generated single-phase alternating current, and the transmitted single-phase alternating current It has an output terminal for outputting alternating current to the outside. More generally, the inverter 1000 includes a semiconductor power module that switches direct current and generates alternating current, an AC bus bar electrode that transmits the generated alternating current, and an AC connector that outputs the transmitted alternating current to the outside.
  • Current sensors 1200, 1201 and 1202 are disposed above or below AC busbar electrodes 1180, 1181 and 1182, respectively, and detect the magnitude of the current flowing through AC busbar electrodes 1180, 1181 and 1182. The magnitude of the detected current is used to control the current flowing to the motor.
  • the electrode 1220 of the smoothing capacitor 1110 constitutes one DC bus bar that transmits direct current before smoothing.
  • the electrode 1221 of the smoothing capacitor 1110 constitutes one DC bus bar that transmits direct current before smoothing.
  • the electrode 1230 of the smoothing capacitor 1110, the bus bar electrode 1120, and the DC electrode 1240 of the semiconductor power module 1170 constitute one DC bus bar that transmits the smoothed direct current.
  • the electrode 1231 of the smoothing capacitor 1110, the bus bar electrode 1121, and the DC electrode 1241 of the semiconductor power module 1170 constitute one DC bus bar that transmits the smoothed direct current.
  • the electrode 1232 of the smoothing capacitor 1110, the bus bar electrode 1122, and the DC electrode 1242 of the semiconductor power module 1170 constitute one DC bus bar that transmits the smoothed direct current.
  • the electrode 1233 of the smoothing capacitor 1110, the bus bar electrode 1123, and the DC electrode 1243 of the semiconductor power module 1170 constitute one DC bus bar that transmits the smoothed direct current.
  • the electrode 1234 of the smoothing capacitor 1110, the bus bar electrode 1124, and the DC electrode 1244 of the semiconductor power module 1170 constitute one DC bus bar that transmits the smoothed direct current.
  • the electrode 1235 of the smoothing capacitor 1110, the bus bar electrode 1125, and the DC electrode 1245 of the semiconductor power module 1170 constitute one DC bus bar that transmits the smoothed direct current.
  • the AC electrode 1250 and the AC bus bar electrode 1180 of the semiconductor power module 1170 constitute one AC bus bar transmitting an alternating current.
  • the AC electrode 1251 and the AC bus bar electrode 1181 of the semiconductor power module 1170 constitute one AC bus bar transmitting an alternating current.
  • the AC electrode 1252 and the AC bus bar electrode 1182 of the semiconductor power module 1170 constitute one AC bus bar transmitting an alternating current.
  • FIG. 3 is a perspective view schematically illustrating a frame provided in the inverter of the first embodiment.
  • the frame 1012 includes pillars 1300, 1301, 1302 and 1303, beams 1310, 1311, 1312, 1313, 1314, 1316 and 1317, side plates 1320 and 1321, and bottom plates 1330 and 1331, as shown in FIG. It has a plurality of frame members.
  • the frame 1012 is configured by combining the plurality of frame members.
  • the plurality of frame members includes a plurality of rod-like frame members including pillars 1300, 1301, 1302 and 1303 and beams 1310, 1311, 1312, 1313, 1314, 1315, 1316 and 1317.
  • the pillars 1300, 1301, 1302, and 1303 are first rod-like frame members extending in the first direction D1. Although the number of columns is four in the present embodiment, the number of columns may be increased or decreased.
  • Beams 1310, 1311, 1312, 1313, 1314, 1315, 1316 and 1317 are second rod-like frame members extending in the second direction D2.
  • the second direction D2 is a direction different from the first direction D1, and is, for example, a direction perpendicular to the first direction D1.
  • the number of beams is eight in the present embodiment, the number of beams may be increased or decreased.
  • the side plates 1320 and 1321 are plate-like frame members having surfaces extending in the first direction D1 and the third direction D3 which are the spreading directions.
  • the third direction D3 is a direction different from the first direction D1 and the second direction D2, and is, for example, a direction perpendicular to the first direction D1 and the second direction D2.
  • the said surface is a main surface.
  • the bottom plates 1330 and 1331 are plate-like frame members having surfaces extending in the second direction D2 and the third direction D3 which are the spreading directions.
  • the said surface is a main surface.
  • the number of bottom plates may be increased or decreased.
  • the side plate 1320 is at a first position in the second direction D2.
  • the pillars 1300 and 1302 are in the second position in the second direction D2.
  • the pillars 1301 and 1303 are at a third position in the second direction D2.
  • the side plate 1321 is at a fourth position in the second direction D2.
  • the first position, the second position, the third position and the fourth position in the second direction D2 are different from each other.
  • the pillars 1300 and 1301 are in the first position in the third direction D3.
  • the pillars 1302 and 1303 are in the second position in the third direction D3.
  • the first position and the second position in the third direction D3 are different from each other.
  • the beams 1310 and 1311 and the bottom plates 1330 and 1331 are at a first position in the first direction D1.
  • Beams 1312 and 1313 are at a second position in a first direction D1.
  • Beams 1314 and 1315 are at a third position in the first direction D1.
  • Beams 1316 and 1317 are at a fourth position in the first direction D1.
  • the first position, the second position, the third position and the fourth position in the first direction D1 are different from each other.
  • Beams 1310, 1312, 1314 and 1316 are in a first position in a third direction D3.
  • Beams 1311, 1313, 1315 and 1317 are at a second position in the third direction D3.
  • the beam 1310 is fixed to the columns 1300 and 1301 and the side plates 1320 and 1321, and is supported by the columns 1300 and 1301 and the side plates 1320 and 1321.
  • the beam 1311 is fixed to the columns 1302 and 1303 and the side plates 1320 and 1321, and is supported by the columns 1302 and 1303 and the side plates 1320 and 1321.
  • the bottom plate 1330 extends in the third direction D3, and one end and the other end of the bottom plate 1330 in the third direction D3 are fixed to beams 1310 and 1311 on the outer periphery of the frame 1012, respectively. Thus, the bottom plate 1330 is supported by the beams 1310 and 1311.
  • the bottom plate 1330 may be fixed to the pillars 1300 and 1302 and the side plate 1320 without the beams 1310 and 1311.
  • the bottom plate 1331 extends in the third direction D3, and one end and the other end of the bottom plate 1331 in the third direction D3 are fixed to beams 1310 and 1311 on the outer periphery of the frame 1012, respectively. Thus, the bottom plate 1331 is supported by the beams 1310 and 1311.
  • the bottom plate 1331 may be fixed to the columns 1300, 1301, 1302 and 1303 and the side plate 1321 without the beams 1310 and 1311.
  • Beams 1312 and 1314 are fixed to pillars 1300 and 1301 and side plate 1321 and supported by pillars 1300 and 1301 and side plate 1321.
  • Beams 1313 and 1315 are fixed to columns 1302 and 1303 and side plate 1321 and supported by columns 1302 and 1303 and side plate 1321.
  • the beam 1316 is fixed to the pillars 1300 and 1301 and the side plates 1320 and 1321, and is supported by the pillars 1300 and 1301 and the side plates 1320 and 1321.
  • the beam 1317 is fixed to the columns 1302 and 1303 and the side plates 1320 and 1321, and is supported by the columns 1302 and 1303 and the side plates 1320 and 1321.
  • the frame 1012 comprises a plurality of rod-like frame members including pillars 1300, 1301, 1302 and 1303 and beams 1310, 1311, 1312, 1313, 1314, 1315, 1316 and 1317.
  • the frame 1012 is formed with an opening 1340 surrounded by a plurality of frame members including rod-like frame members.
  • the opening 1340 makes it easy to reach the inside of the frame 1012 from the outside of the frame 1012 via the opening 1340 and to reach the outside of the frame 1012 from the inside of the frame 1012 via the opening 1340. Become. This makes it easy to insert a tool or the like from the outside of the frame 1012 through the opening 1340 into the interior of the frame 1012 when assembling the inverter 1000, and allows wiring etc. to be opened from the inside of the frame 1012 as necessary. It is easy to pull it out of the frame 1012 via 1340.
  • the first direction D1 is, for example, the vertical direction
  • the second direction D2 and the third direction D3 are, for example, the horizontal direction.
  • the first direction D1, the second direction D2, and the third direction D3 may be different from these directions.
  • FIG. 4 is a top view schematically illustrating the top of the inverter according to the first embodiment.
  • 5, 6, 7, 8, 9, and 10 are cross-sectional views schematically showing cross sections of the inverter of the first embodiment.
  • the cross sections shown in FIG. 5, FIG. 6, FIG. 7, FIG. 8, FIG. 9, and FIG. 10 respectively correspond to the cutting lines AA, BB, CC, DD, EE and FIG. It is a cross section in the position of FF.
  • the semiconductor power module 1170 is plate-shaped and has a surface to be cooled 1400 as shown in FIGS. 7, 8 and 10.
  • the cooled surface 1400 is a back surface to be one main surface of the semiconductor power module 1170.
  • At least one cooler 1011 is a single cooler.
  • the cooler 1011 is attached to the surface to be cooled 1400 of the semiconductor power module 1170 and cools the surface to be cooled 1400. Accordingly, at least one cooler 1011 cools the semiconductor power module 1170.
  • the surface to be cooled 1400 may be the other main surface of the semiconductor power module 1170.
  • the plate-shaped semiconductor power module 1170 may be replaced with a non-plate-shaped semiconductor power module, and the cooler 1011 may cool the non-plate-shaped semiconductor power module.
  • the number of coolers may be increased.
  • components that can be embedded in the frame 1012 such as the signal wiring 1140 and the AC bus bar electrodes 1180, 1181 and 1182 may be embedded in the frame 1012. Therefore, DC connector 1100, smoothing capacitor 1110, DC bus bar electrodes 1120, 1121, 1122, 1123, 1124 and 1125, signal terminal connector 1130, signal wiring 1140, drive circuit boards 1150 and 1160, semiconductor power module 1170, AC bus bar electrode 1180 , 1181 and 1182, AC connectors 1190, 1191 and 1192 and current sensors 1200, 1201 and 1202 are at least one component selected or fixed to the frame 1012.
  • the cooler 1011 on which the semiconductor power module 1170 is mounted is also fixed to the frame 1012 and supported by the frame 1012 as illustrated in FIGS. 7, 8 and 10.
  • the DC connector 1100 is inserted into the opening 1410 formed in the side plate 1320 as illustrated in FIGS. 7 and 8. Thus, the DC connector 1100 is fixed to the side plate 1320 and supported by the side plate 1320.
  • the smoothing capacitor 1110 is fixed to the upper surface of the bottom plate 1330 as illustrated in FIGS. 6, 7, 8 and 9. Thereby, the smoothing capacitor 1110 is fixed to the bottom plate 1330 and supported by the bottom plate 1330.
  • the AC bus bar electrode 1181 is fixed to the tip of a protrusion 1420 provided on the side plate 1321 as illustrated in FIG.
  • the AC bus bar electrode 1181 is fixed to the side plate 1321 and supported by the side plate 1321.
  • AC bus bar electrodes 1180 and 1182 are also fixed to the tips of the projections provided on the side plate 1321.
  • the AC bus bar electrodes 1180 and 1182 are also fixed to the side plate 1321 and supported by the side plate 1321.
  • the AC bus bar electrodes 1180, 1181, and 1182 may be fixed to the beam.
  • the AC connector 1191 is inserted into an opening 1431 formed in the side plate 1321 as illustrated in FIGS. 7 and 8. Thus, the AC connector 1191 is fixed to the side plate 1321 and supported by the side plate 1321.
  • AC connectors 1190 and 1192 are also inserted into openings 1430 and 1432 formed in side plate 1321, respectively, as illustrated in FIG. Thus, the AC connectors 1190 and 1192 are fixed to the side plate 1321 and supported by the side plate 1321.
  • the signal terminal connector 1130 is fixed to the top surface of the beam 1317 as illustrated in FIGS. 5 and 10. Thus, the signal terminal connector 1130 is fixed to the beam 1317 and supported by the beam 1317.
  • the signal wires 1140 pass through the beams 1317 as illustrated in FIGS. Thus, the signal wiring 1140 is fixed to the beam 1317 and supported by the beam 1317.
  • Magnetic powder or metal powder may be mixed in the frame 1012.
  • the signal wire 1140 may be surrounded by magnetic foil or metal foil wound around the frame 1012.
  • an electric shielding effect is generated, and the electromagnetic field is shielded (at the inside and the outside of the frame) by the magnetic powder or the like, and the noise ingress to the signal wiring 1140 is restricted, and the electrical operation of the inverter 1000 is stabilized.
  • the current sensor 1201 is fixed to the tip of a protrusion 1420 provided on the side plate 1321 as illustrated in FIG.
  • the current sensor 1201 is fixed to the side plate 1321 and supported by the side plate 1321.
  • the current sensors 1200 and 1202 are also fixed to the tips of the protrusions provided on the side plate 1321.
  • the current sensors 1200 and 1202 are also fixed to the side plate 1321 and supported by the side plate 1321.
  • Current sensors 1200, 1201 and 1202 may be fixed to the beam.
  • One end and the other end of the drive circuit board 1150 are fixed to the top surfaces of beams 1314 and 1315, respectively, as illustrated in FIG.
  • the drive circuit board 1150 is fixed to the beams 1314 and 1315 and supported by the beams 1314 and 1315.
  • One end and the other end of the drive circuit board 1160 are fixed to the top surfaces of beams 1312 and 1313, respectively, as shown in FIG.
  • the drive circuit board 1160 is fixed to the beams 1312 and 1313 and supported by the beams 1312 and 1313.
  • the cooler 1011 is fixed to the upper surface of the bottom plate 1331 as illustrated in FIG. 6, FIG. 7, FIG. 8 and FIG. Thus, the cooler 1011 is fixed to the bottom plate 1331 and supported by the bottom plate 1331.
  • the bottom plates 1330 and 1331 separated from each other may be replaced with an integrated bottom plate, and the smoothing capacitor 1110 and the cooler 1011 may be fixed to the integrated bottom plate.
  • the semiconductor power module 1170 is fixed to the upper surface of the cooler 1011 as illustrated in FIGS. 7, 8 and 10. Thus, the semiconductor power module 1170 is fixed to the cooler 1011 and supported by the cooler 1011.
  • FIG. 11 is a cross-sectional view schematically illustrating a cross section of the semiconductor power module, the cooler, and the frame provided in the inverter according to the first modification of the first embodiment.
  • the frame 1012 further includes a beam 1440, and the semiconductor power module 1170 cooled by the cooler 1011 is fixed to the beam 1440. Ru.
  • the semiconductor power module 1170 may be directly fixed to the frame 1012.
  • a frame configured by combining a plurality of frame members including a plurality of rod-like frame members has a restriction on a position at which a frame member to which a part is fixed is arranged. It has the feature of being small. For this reason, when the part is fixed to the frame, the restriction on the position at which the part is arranged is reduced. For example, when a component is fixed to a column provided in a frame configured by combining a plurality of columns and a plurality of beams, the restriction on the horizontal position for arranging the column to which the component is fixed is small.
  • the smoothing capacitor 1110, the signal terminal connector 1130, the signal wiring 1140, the drive circuit boards 1150 and 1160, the AC bus bar electrodes 1180, 1181 and 1182, the AC connectors 1190, 1191 and 1192 and the current sensor It becomes easy to fix 1200, 1201 and 1202. Also, it becomes easy to arrange these parts so that the gap between these parts is small. In addition, it becomes easy to arrange at least a part of these components in the center of the frame 1012 remote from the outside of the frame 1012. As a result, it becomes easy to miniaturize the inverter 1000, and it becomes easy to reduce the cost required to manufacture the inverter 1000.
  • smoothing capacitor 1110, signal terminal connector 1130, signal wiring 1140, drive circuit boards 1150 and 1160, AC bus bar electrodes 1180, 1181 and 1182, AC connectors 1190, 1191 and 1192, current sensors 1200 and 1201, and 1202 is fixed to the frame 1012 and not fixed to the cooler 1011.
  • parts that do not require cooling, which are included in these parts may be fixed to the frame 1012, and need not be fixed to the cooler 1011.
  • the cooler 1011 may not be a support for supporting these components, and may not have a portion to which these components are fixed.
  • the cooler 1011 does not have to have a part to which these parts are fixed, it is not necessary to make the cooler 1011 larger than the semiconductor power module 1170, and the cooler 1011 can be miniaturized, reduced in weight and cost. It will be easier to do. As a result, it becomes easy to miniaturize the inverter 1000, and it becomes easy to reduce the cost required to manufacture the inverter 1000. If the cooler 1011 is made of metal and has a box-like shape, this advantage is more pronounced.
  • the cooler 1011 is fixed to the frame 1012. Therefore, it is not necessary to fix the cooler 1011 to the inverter case or to integrate it with the inverter case.
  • the electric capacities required for the plurality of inverters respectively accommodated in the plurality of different inverter cases are approximately the same.
  • the plurality of inverters can be shared. As a result, it is easy to reduce the cost required to manufacture the inverter 1000 by the mass production effect.
  • An example in which the inverter 1000 is accommodated in each inverter case of a plurality of different inverter cases will be described in tenth, eleventh, twelfth, and thirteenth embodiments described later.
  • both AC bus bar electrode 1181 and current sensor 1201 are fixed to alignment projection 1420. Thereby, alignment between the AC bus bar electrode 1181 and the current sensor 1201 can be easily performed. Similarly, alignment between the AC bus bar electrode 1180 and the current sensor 1200 can be easily performed, and alignment between the AC bus bar electrode 1182 and the current sensor 1202 can be easily performed.
  • the inverter 1000 it is easy to increase the strength of the frame 1012. Therefore, when the DC connector 1100, the signal terminal connector 1130, and the AC connectors 1190, 1191 and 1192 are fixed to the frame 1012, these connectors are firmly fixed. Thereby, even when an external cable is connected to these connectors, the fixing of these connectors is less likely to be affected.
  • the inverter 1000 a large number of signal wires 1140 are supported by the beams 1317. This reduces the space required to support the signal wiring 1140.
  • FIG. 12 is a cross-sectional view schematically showing a cross section of a capacitor group and a frame provided in the inverter of the first embodiment.
  • the smoothing capacitor 1110 comprises a capacitor group 1500 as illustrated in FIG.
  • Capacitor group 1500 is fixed to bottom plate 1330.
  • the capacitor group 1500 is fixed to the frame 1012.
  • Capacitor group 1500 includes a plurality of integrated capacitors.
  • Each capacitor 1510 which is each of the plurality of capacitors, has a cylindrical shape and has one cylindrical end and the other cylindrical end.
  • the cylindrical axis of each condenser 1510 extends in a first direction D1 parallel to the normal direction of the top surface of the bottom plate 1330.
  • the plurality of capacitors are arranged in a second direction D2 perpendicular to the normal direction of the top surface of the bottom plate 1330.
  • Capacitor group 1500 is fixed to the bottom plate without using a capacitor case. Fixing without using the capacitor case eliminates the need for the capacitor case for accommodating the capacitor group 1500 and the terminals or feet used for fixing the capacitor case. As a result, it becomes easy to miniaturize the smoothing capacitor 1110 and it becomes easy to prevent dead space around the smoothing capacitor 1110.
  • FIG. 13 is a connection diagram illustrating an electrical connection in the smoothing capacitor provided in the inverter of the first embodiment.
  • the smoothing capacitor 1110 includes a capacitor group 1500, a bus bar electrode 1520 and a bus bar electrode 1521 as illustrated in FIG.
  • Each capacitor 1510 comprises a first electrode 1540 and a second electrode 1541.
  • the first electrode 1540 is at one cylindrical end of each capacitor 1510.
  • the second electrode 1541 is at the other cylindrical end of each capacitor 1510.
  • the plurality of first electrodes 1540 provided in capacitor group 1500 are electrically connected to each other by bus bar electrode 1520.
  • the plurality of second electrodes 1541 provided in the capacitor group 1500 are electrically connected to each other by the bus bar electrode 1521. Thereby, the plurality of capacitors included in capacitor group 1500 are electrically connected in parallel.
  • the capacitor group 1500 may be fixed to the bottom plate 1330 after the insulating process is performed on the capacitor group 1500 and the bus bar electrodes 1520 and 1521.
  • FIG. 14 is a top view schematically illustrating an upper surface of a capacitor group and a frame provided in an inverter according to a second modification of the first embodiment.
  • each capacitor 1510 extends in a third direction D3 perpendicular to the normal direction of the top surface of the bottom plate 1330. .
  • FIG. 15 is a cross-sectional view illustrating cross sections of a capacitor group, a frame, and a base plate provided in an inverter according to a third modification of the first embodiment.
  • the inverter 1000 further includes a base plate 1550 illustrated in FIG. 15, the capacitor group 1500 is fixed to the base plate 1550, and the base plate 1550 is fixed to the frame 1012. Be done.
  • FIG. 16 is a cross-sectional view schematically illustrating cross sections of a capacitor group, a frame, and a resin body provided in the inverter according to the fourth modification of the first embodiment.
  • the inverter 1000 further includes a resin body 1560 shown in FIG. 16, the resin body 1560 is fixed to the frame 1012, and the capacitor group 1500 is embedded in the resin body 1560.
  • the resin body 1560 is made of a resin cured product.
  • Capacitor group 1500 is included in resin body 1560 and is sealed with resin body 1560.
  • the capacitor group 1500 may be bonded to the frame 1012 via a bonding medium made of resin without being sealed by the resin body 1560.
  • FIG. 17 is a cross-sectional view schematically illustrating cross sections of a capacitor group, a frame, a resin body, and a base plate provided in the inverter according to the fifth modification of the first embodiment.
  • the inverter 1000 includes a base plate 1570 and a resin body 1571 shown in FIG. 17, the base plate 1570 is fixed to the frame 1012, and the resin body 1571 is a base plate. It is fixed to 1570, and the capacitor group 1500 is embedded in the resin body 1571. Capacitor group 1500 may be bonded to base plate 1570 via a bonding medium made of resin without being sealed by resin body 1560.
  • FIG. 18 is a cross-sectional view schematically illustrating a structure for cooling a part that is desirably added to the inverter of the first embodiment.
  • the inverter 1000 further comprises a heat transfer member 1610, the heat transfer member 1610 contacting the part 1611 and at least one cooler 1011, the part 1611 And the cooler 1011 are thermally connected.
  • the contact of the heat transfer member 1610 with the component 1611 and the cooler 1011 causes heat to be dissipated from the component 1611 to the cooler 1011 via the heat transfer member 1610 to cool the component 1611. This eliminates the need for the component 1611 to be in direct contact with the cooler 1011 and makes it easier to cool the component 1611.
  • the component 1611 is a component that generates a large amount of heat, a component that contacts a component that generates a large amount of heat, a component that is close to a component that generates a large amount of heat, a component that is susceptible to heat, or the like.
  • the components that generate a large amount of heat are the smoothing capacitor 1110, the semiconductor power module 1170, and the like.
  • Parts that contact parts that generate a large amount of heat are DC bus bar electrodes 1120, 1121, 1122, 1123, 1124 and 1125, AC bus bar electrodes 1180, 1181 and 1182, and the like.
  • Parts close to the parts that generate a large amount of heat are drive circuit boards 1150 and 1160, current sensors 1200, 1201 and 1202, and the like.
  • component 1611 comprises smoothing capacitor 1110, DC bus bar electrodes 1120, 1121, 1122, 1123, 1124 and 1125, drive circuit boards 1150 and 1160, AC bus bar electrodes 1180, 1181 and 1182, and current sensors 1200, 1201 and 1202. At least one component selected from the group.
  • the heat transfer member 1610 is fixed to a frame member 1612 such as a column or a beam provided on the frame 1012.
  • a frame member 1612 such as a column or a beam provided on the frame 1012.
  • the heat transfer member 1610 is fixed to the frame 1012.
  • Fixing the heat transfer member 1610 to the frame 1012 suppresses the occurrence of an adverse effect due to the heat transfer member 1610 coming into contact with an unintended portion.
  • the heat transfer member 1610 even when the heat transfer member 1610 has a structure in which the heat transfer member 1610 passes through the air, the heat transfer member 1610 is easily and reliably fixed to the frame member 1612.
  • the heat transfer member 1610 may not be fixed to the frame 1012 and may be held by the frame 1012.
  • the heat transfer member 1610 desirably has flexibility. Thereby, even when the surface of the component 1611 has unevenness or the surface of the component 1611 is a curved surface, the heat transfer member 1610 can be easily brought into contact with the component 1611, and the component 1611 can be effectively transferred to the heat transfer member 1610. Heat is transmitted to When the heat transfer member 1610 is flexible, the support of the heat transfer member 1610 by the frame member 1612 is further facilitated.
  • Fixing of the heat transfer member 1610 to the frame 1012 is also easy, as is fixing of the other components of the inverter 1000 to the frame 1012.
  • FIG. 19 is a cross-sectional view schematically showing a structure for thermal insulation between parts, which is preferably added to the inverter of the first embodiment.
  • the inverter 1000 further includes a heat shield plate 1710, and the heat shield plate 1710 is disposed between the components 1711 and 1712. Thus, the transfer of heat from the component 1712 to the component 1711 is suppressed.
  • the component 1711 is a component sensitive to heat.
  • the component 1712 is a component or the like that generates a large amount of heat. Parts susceptible to heat are drive circuit boards 1150 and 1160, current sensors 1200, 1201 and 1202, and so on.
  • the components that generate a large amount of heat are the smoothing capacitor 1110, the semiconductor power module 1170, and the like.
  • the heat shield plate 1710 is made of resin or the like, and is fixed to a frame member 1713 such as a column or a beam provided on the frame 1012. Thus, the heat shield plate 1710 is fixed to the frame 1012.
  • Fixing of the heat shield plate 1710 to the frame 1012 is also easy, as is fixing of the other components provided in the inverter 1000 to the frame 1012.
  • FIG. 20 is a cross-sectional view schematically illustrating a cross section of an inverter according to a sixth modification of the first embodiment.
  • the side plate 1321 is a frame member having an outer surface 1800 which is a surface facing the outside of the frame 1012, and an AC bus bar electrode 1181 has an end 1810 disposed on the outer surface 1800.
  • the end 1810 contacts the winding 1820 of the motor driven by the inverter 1000 and is electrically connected to the winding 1820.
  • the end 1810 may be disposed inside the side plate 1321.
  • AC bus bar electrodes 1180 and 1182 are also disposed on the outer side surface 1800 of side plate 1321 or inside side plate 1321 and have ends electrically connected to the windings of the motor driven by inverter 1000.
  • a connection portion such as a bolt fastening portion is provided at the end of each AC bus bar electrode of the AC bus bar electrodes 1180, 1181 and 1182, and the end of each AC bus bar electrode is not wound with an AC connector.
  • the direct contact of the end of each AC busbar electrode with the motor windings causes the end of each AC busbar electrode to be electrically connected to the motor windings without an AC connector. This makes it possible to electrically connect the motor to the inverter 1000 without using expensive and large AC connectors, and it is easy to reduce the cost and space required to electrically connect the motor to the inverter 1000. become.
  • each AC bus bar electrode of the AC bus bar electrodes 1180, 1181 and 1182 is the previously described cooled component 1611
  • the heat transfer member 1610 is disposed along the end of each AC bus bar electrode, and at least one cooler Contact 1011. This can suppress heat transfer from the winding of the motor to the inverter 1000.
  • the heat transfer member 1611 may contact the end of each AC bus bar electrode, or may be slightly separated from the end of each AC bus bar electrode.
  • the sixth modification is suitably adopted when the inverter 1000 is accommodated in an inverter case joined to the motor case provided in the motor or integrated with the motor case.
  • the structure includes a plurality of circuit boards, is disposed in a state in which the plurality of circuit boards are electrically connected, and is employed in an electric device that performs a predetermined operation.
  • a plurality of parts having different sizes and shapes are fixed to the frame 1012. Fixing the plurality of parts to the frame 1012 facilitates fixing the plurality of parts so as to reduce the gap between the plurality of parts as described above. In particular, it becomes easy to arrange the large component and the adjacent component so that the gap between the large component and the adjacent component is reduced. Thereby, it becomes easy to arrange a plurality of parts at high density, and it becomes easy to miniaturize the inverter 1000.
  • the DC connector 1100, the DC bus bar electrodes 1120, 1121, 1122, 1123, 1124 and 1125, the signal wiring 1140 and the AC bus bar electrodes 1180, 1181 and 1182 may be fixed to the surface of the frame 1012. .
  • the heat transfer member 1610 is provided, the same applies to the heat transfer member 1610. An electrical insulation process is performed on the surface of the frame member to which these wires are fixed, as needed.
  • the inverter 1000 components other than the semiconductor power module 1170 are fixed to the frame 1012 without being fixed to the cooler 1011.
  • the cooler 1011 can be easily miniaturized, and the cost required for the cooler 1011 can be easily reduced.
  • the inverter 1000 can be accommodated in each inverter case of a plurality of different inverter cases. This makes it easy to share the plurality of inverters respectively accommodated in the plurality of different inverter cases.
  • the inverter 1000 a plurality of parts are fixed to the frame 1012.
  • the plurality of parts By securing the plurality of parts to the frame 1012, as described above, even if the plurality of parts have significantly different sizes and shapes from each other, the plurality of parts may be reduced so as to reduce the gap between the plurality of parts. It becomes easy to fix. This makes it easy to miniaturize the inverter 1000.
  • the frame 1012 is provided with a rod-like frame member, whereby an opening 1340 surrounded by a plurality of frame members including the rod-like frame member is formed in the frame 1012.
  • the opening 1340 makes it easy to reach the inside of the frame 1012 from the outside of the frame 1012 via the opening 1340 and to reach the outside of the frame 1012 from the inside of the frame 1012 via the opening 1340.
  • This makes it easy to insert a tool or the like into the frame 1012 from the outside of the frame 1012 through the opening 1340 when assembling the inverter 1000, and wiring or the like from the inside of the frame 1012 as needed. It is easy to pull it out of the frame 1012 via the unit.
  • An exemplary second embodiment of the present invention relates to an inverter.
  • the back surface of the semiconductor power module 1170 is the surface to be cooled 1400, and the cooling to cool the surface to be cooled 1400 A vessel 1011 is provided, and a cooler 1011 is fixed to the bottom plate 1331.
  • the surface of the semiconductor power module 1170 does not become a surface to be cooled.
  • the back surface of the semiconductor power module is the first surface to be cooled, the first cooler for cooling the first surface to be cooled is provided, and the first cooler is It is fixed to the bottom plate.
  • the surface of the semiconductor power module 1170 is the second surface to be cooled, a second cooler for cooling the second surface to be cooled is provided, and the second cooler is fixed to the inner plate.
  • FIG. 21 is a cross-sectional view schematically illustrating a cross-section of the inverter according to the second embodiment.
  • the position of the cross section shown in FIG. 21 corresponds to the position of the cross section shown in FIG.
  • the inverter 2000 illustrated in FIG. 21 includes an inverter circuit 1010, at least one cooler 2011 and a frame 2012.
  • the inverter circuit 1010 provided in the inverter 2000 of the second embodiment is similar to the inverter 1010 provided in the inverter 1000 of the first embodiment. For this reason, the inverter 2000 of the second embodiment includes the same semiconductor power module 1170 as the semiconductor power module 1170 provided in the inverter 1000 of the first embodiment.
  • the semiconductor power module 1170 has a plate shape.
  • the semiconductor power module 1170 has a first surface to be cooled 2400 and a second surface to be cooled 2401.
  • the first cooled surface 2400 is a back surface to be one main surface of the semiconductor power module 1170.
  • the second cooled surface 2401 is a surface to be the other main surface of the semiconductor power module 1170.
  • At least one cooler 2011 includes a first cooler 2900 and a second cooler 2901.
  • the first cooler 2900 is attached to the first cooled surface 2400 of the semiconductor power module 1170 and cools the first cooled surface 2400.
  • the second cooler 2901 is attached to the second cooled surface 2401 of the semiconductor power module 1170 and cools the second cooled surface 2401.
  • FIG. 22 is a perspective view schematically illustrating a frame provided in the inverter of the second embodiment.
  • the frame 2012 is, as illustrated in FIG. 22, columns 1300, 1301, 1302 and 1303, beams 1310, 1311, 1312, 1313, 1314, 1315, 1316, 1317 and 2318, side plates 1320 and 1321, and a bottom plate 1330. And 1331 and a plurality of frame members including an inner plate 2332.
  • the frame 1012 is configured by combining the plurality of frame members.
  • Frame members of pillars 1300, 1301, 1302, 1303 and 1303, beams 1310, 1311, 1312, 1313, 1314, 1316, 1317, side plates 1320 and 1321 and bottom plates 1330 and 1331 according to the second embodiment. are similar to the frame members provided with the same reference numerals and provided in the inverter 1000 of the first embodiment.
  • the beam 2318 is fixed to the columns 1300 and 1301 and the side plate 1321, and is supported by the columns 1300 and 1301 and the side plate 1321.
  • the beam 2319 is fixed to the columns 1302 and 1303 and the side plate 1321 and is supported by the columns 1302 and 1303 and the side plate 1321.
  • the inner plate 2332 is a plate-like frame member having a plane that extends in the second direction D2 and the third direction D3 which are the spreading directions.
  • the said surface is a main surface.
  • the inner plate 2332 is fixed to the beams 2318 and 2319 and is supported by the beams 2318 and 2319.
  • An inner plate 2332 may be fixed to the pillars 1300, 1301, 1302 and 1303 and the side plates 1321 without the beams 2318 and 2319, and may be supported by the pillars 1300, 1301, 1302 and 1303 and the side plates 1321.
  • the inner plate 2332 is spaced from the bottom plate 1331 in the first direction D1.
  • the first cooler 2900 is fixed to the upper surface of the bottom plate 1331 as the first frame member as illustrated in FIG.
  • the first cooler 2900 is fixed to the bottom plate 1331 and supported by the bottom plate 1331.
  • the second cooler 2901 is fixed to the lower surface of the inner plate 2332 which is the second frame member.
  • the second cooler 2901 is fixed to the bottom plate 2331 and supported by the bottom plate 2331.
  • at least one cooler 2011 is fixed to the frame 2012.
  • the first cooler 2900 and the second cooler 2901 are used to cool both of the first cooled surface 2400 and the second cooled surface 2401 of the plate-like semiconductor power module 1170.
  • Module 1170 is sandwiched.
  • the first cooler 2900 and the second cooler 2901 are large and heavy.
  • the drive circuit boards 1150 and 1160 are close to the second cooler 2901 in the first direction D1, and the smoothing capacitor 1010, DC bus bar electrodes 1120, 1121, 1122, 1123, 1124, and 1125 in the second direction D2.
  • AC busbar electrodes 1180, 1181 and 1182 and current sensors 1200, 1201 and 1202 are close to the first cooler 2900 and the second cooler 2901.
  • first cooler 2900 and the second cooler 2901 are fixed at positions suitable for fixing the first cooler 2900 and the second cooler 2901, respectively. It is easy to arrange the bottom plate 1331 and the inner plate 2332. Therefore, in inverter 2000, fixing of first cooler 2900 and second cooler 2901 can be easily performed. This facilitates reducing the cost of manufacturing an inverter 2000 comprising two coolers 2011 including a first cooler 2900 and a second cooler 2901.
  • An exemplary third embodiment of the present invention relates to an inverter.
  • the back surface of the semiconductor power module 1170 is the surface to be cooled 1400, and the cooling to cool the surface to be cooled 1400 A vessel 1011 is provided, and a cooler 1011 is fixed to the bottom plate 1331.
  • the surface of the semiconductor power module 1170 does not become a surface to be cooled.
  • the back surface of the semiconductor power module is the first surface to be cooled, a first cooler for cooling the first surface to be cooled is provided, and the first cooler is It is fixed to the bottom plate.
  • the surface of the semiconductor power module is a second surface to be cooled, a second cooler for cooling the second surface to be cooled is provided, and the second cooler is fixed to the inner plate.
  • FIG. 23 is a cross-sectional view schematically illustrating a cross-section of the inverter according to the third embodiment.
  • the position of the cross section shown in FIG. 23 corresponds to the position of the cross section shown in FIG.
  • the inverter 3000 illustrated in FIG. 23 includes an inverter circuit 1010, at least one cooler 3011 and a frame 1012.
  • the inverter circuit 1010 and the frame 1012 provided in the inverter 3000 of the third embodiment are the same as the inverter circuit 1010 and the frame 1012 provided in the inverter 1000 of the first embodiment, respectively. Therefore, the inverter 3000 of the third embodiment includes a semiconductor power module 1170 similar to the semiconductor power module 1170 provided in the inverter 1000 of the first embodiment, and a bottom plate 1331 provided in the inverter 1000 of the first embodiment. A similar bottom plate 1331 is provided.
  • the semiconductor power module 1170 has a plate shape.
  • the semiconductor power module 1170 has a first surface to be cooled 3400 and a second surface to be cooled 3401.
  • the first cooled surface 3400 is a back surface to be one main surface of the semiconductor power module 1170.
  • the second cooled surface 3401 is a surface to be the other main surface of the semiconductor power module 1170.
  • the at least one cooler 3011 includes a first cooler 3900 and a second cooler 3901.
  • the first cooler 3900 is attached to the first cooled surface 3400 of the semiconductor power module 1170 and cools the first cooled surface 3400.
  • the second cooler 3901 is attached to the second cooled surface 3401 of the semiconductor power module 1170 and cools the second cooled surface 3401.
  • the first cooler 3900 is fixed to the upper surface of the bottom plate 1331.
  • the second cooler 3901 is also fixed to the upper surface of the bottom plate 1331.
  • the second cooler 3901 is fixed to the bottom plate 1331 and supported by the bottom plate 1331. Accordingly, the first cooler 3900 and the second cooler 3901 are fixed in common to the bottom plate 1331 which is a common frame member, and at least one cooler 3011 is fixed to the frame 1012.
  • the third embodiment as in the first embodiment, it is easy to miniaturize the inverter 3000 and reduce the cost required to manufacture the inverter 3000.
  • the first cooler 3900 is fixed to the lower surface of the beam and the second cooler 3901 is fixed to the upper surface of the beam, so that the first cooler 3900 and the second cooler 3901 are fixed to the beam It may be done.
  • the fourth exemplary embodiment of the present invention relates to an inverter.
  • the main differences between the first embodiment and the fourth embodiment are as follows: In the first embodiment, no DC bus bar electrode for transmitting direct current before smoothing is provided, and direct current after smoothing is transmitted.
  • the DC bus bar electrodes 1120, 1121, 1122, 1123, 1124 and 1125 are provided, and the DC bus bar electrodes 1120, 1121, 1122, 1123, 1124 and 1125 for transmitting the smoothed direct current are not directly supported by the frame 1012.
  • a DC bus bar electrode for transmitting a direct current before smoothing and a DC bus bar electrode for transmitting a direct current after smoothing are provided, and a DC bus bar electrode for transmitting a direct current before smoothing, A DC bus bar electrode for transmitting a direct current after smoothing is fixed to the frame.
  • FIGS. 24 and 25 are cross-sectional views schematically illustrating cross sections of the inverter according to the fourth embodiment.
  • the positions of the cross sections shown in FIGS. 24 and 25 correspond to the positions of the cross sections shown in FIGS. 7 and 8, respectively.
  • the inverter 4000 illustrated in FIGS. 24 and 25 includes an inverter circuit 4010, at least one cooler 1011 and a frame 4012.
  • the cooler 1011 provided in the inverter 4000 of the fourth embodiment is the same as the cooler 1011 provided in the inverter 1000 of the first embodiment.
  • FIG. 26 is a connection diagram illustrating electrical connections in the inverter circuit provided in the inverter of the fourth embodiment.
  • the inverter 4000 constitutes an inverter circuit 4010, and comprises a DC connector 1100, DC bus bar electrodes 4290 and 4291, a smoothing capacitor 1110, DC bus bar electrodes 1120, 1121, 1122, 1123, 1124 and 1125, A signal terminal connector 1130, a signal wiring 1140, drive circuit boards 1150 and 1160, a semiconductor power module 1170, AC busbar electrodes 1180, 1181 and 1182, AC connectors 1190, 1191 and 1192 and current sensors 1200, 1201 and 1202 are provided.
  • semiconductor power module 1170, AC bus bar electrodes 1180, 1181 and 1182, AC connectors 1190, 1191 and 1192 and current sensors 1200, 1201 and 1202 have the same reference symbols as those provided in inverter 1000 of the first embodiment. It is similar to the parts
  • Input terminals 1210 and 1211 of DC connector 1100 contact one end of DC bus bar electrodes 4290 and 4291, respectively.
  • the other ends of DC bus bar electrodes 4290 and 4291 contact electrodes 1220 and 1221 of smoothing capacitor 1110, respectively.
  • input terminals 1210 and 1211 are electrically connected to electrodes 1220 and 1221 via DC bus bar electrodes 4290 and 4291, respectively.
  • the DC bus bar electrode 4290 and the electrode 1220 of the smoothing capacitor 1110 constitute one DC bus bar that transmits direct current before smoothing.
  • the DC bus bar electrode 4291 and the electrode 1221 of the smoothing capacitor 1110 constitute one DC bus bar that transmits direct current before smoothing.
  • the direct current before smoothing input to the DC connector 1100 is transmitted by the DC bus bar electrodes 4290 and 4291 and is input to the electrodes 1220 and 1221 of the smoothing capacitor 1110.
  • FIG. 27 is a perspective view schematically illustrating a frame provided in the inverter of the fourth embodiment.
  • the frame 4012 comprises a plurality of frame members including pillars 1300, 1301, 1302 and 1303, beams 1310, 1311, 1312, 1313, 1314, 1315, 1316 and 1317, side plates 4320 and 4321 and bottom plates 1330 and 4331.
  • the frame 4012 is configured by combining the plurality of frame members.
  • the frame members of the columns 1300, 1301, 1302, 1303 and 1303, the beams 1310, 1311, 1312, 1313, 1314, 1315, 1316 and 1317 and the bottom plate 1330 provided in the inverter 4000 of the fourth embodiment are the same as in the first embodiment. It is similar to the frame member provided with the same reference numeral provided in the inverter 1000.
  • the DC connector 1100 is fixed to the outer surface 4910 of the side plate 4320 as illustrated in FIGS. 24 and 25.
  • the DC connector 1100 is fixed to the side plate 4320, supported by the side plate 4320, and fixed to the frame 4012.
  • the DC bus bar electrode 4290 penetrates the side plate 4320 as illustrated in FIG.
  • the DC bus bar electrode 4290 is fixed to the side plate 4320, supported by the side plate 4320, and fixed to the frame 4012.
  • the DC bus bar electrode 4291 also penetrates the side plate 4320. Accordingly, the DC bus bar electrode 4291 is also fixed to the side plate 4320, supported by the side plate 4320, and fixed to the frame 4012.
  • the DC bus bar electrode 1122 contacts the tip of the protrusion 4920 provided on the bottom plate 4331 as illustrated in FIG.
  • the DC bus bar electrode 1122 is fixed to the bottom plate 4331, supported by the bottom plate 4331, and fixed to the frame 4012.
  • the DC busbar electrodes 1120, 1121, 1123, 1124 and 1125 also contact the tips of the protrusions 4920.
  • the DC bus bar electrodes 1120, 1121, 1123, 1124 and 1125 are also fixed to the bottom plate 4331, supported by the bottom plate 4331, and fixed to the frame 4012.
  • DC bus bar electrode 1122 has a wide shape and only a small length. Further, one end of the DC bus bar electrode 1122 is in contact with the electrode 1232 of the smoothing capacitor 1110, and the other end of the DC bus bar electrode 1122 is in contact with the DC electrode 1242 of the semiconductor power module 1170. For this reason, the DC bus bar electrode 1122 has a complicated shape such as a three-dimensional bent shape.
  • the DC busbar electrodes 1120, 1121, 1123, 1124 and 1125 also have complicated shapes.
  • DC bus bar electrodes 1120, 1121, 1122, 1123, 1124 and 1125 are integrated and the DC bus bar electrodes 1121, 1123 and 1125 are stacked with the DC bus bar electrodes 1120, 1122 and 1124 in order to reduce parasitic inductance.
  • the shape of the DC busbar electrodes 1120, 1121, 1122, 1123, 1124 and 1125 is further complicated.
  • the frame 4012 When the frame 4012 is provided, it is easy to arrange the bottom plate 4331 for fixing the DC bus bar electrode 1122 at a position suitable for fixing the DC bus bar electrode 1122. Therefore, even when the DC bus bar electrode 1122 has a complicated three-dimensional shape that is difficult to support, the DC bus bar electrode 1122 can be easily supported.
  • the DC busbar electrode 1122 is fixed to the bottom plate 4331, after the DC busbar electrode 1122 is fixed to the bottom plate 4331, one end of the DC busbar electrode 1122 is screwed to the electrode 1232 of the smoothing capacitor 1110, By fixing the other end of the DC bus bar electrode 1122 to the DC electrode 1242 of the semiconductor power module 1170 with a screw, it becomes easy to mount the DC bus bar electrode 1122.
  • the dead space generated around the DC bus bar electrodes 4290 and 4291 can be reduced while insulating the DC bus bar electrodes 4290 and 4291. This facilitates placing the DC bus bar electrodes 4290 and 4291 in a small space.
  • the AC bus bar electrode 1181 penetrates the side plate 4321 as illustrated in FIG.
  • the AC bus bar electrode 1181 is fixed to the side plate 4321, supported by the side plate 4321, and fixed to the frame 4012.
  • AC bus bar electrodes 1180 and 1182 also penetrate side plate 4321.
  • the AC bus bar electrodes 1180 and 1182 are also fixed to the side plate 4321, supported by the side plate 4321, and fixed to the frame 4012.
  • the AC connector 1191 is fixed to the outer side 4930 of the side plate 4321 as illustrated in FIGS. 24 and 25.
  • the AC connector 1191 is fixed to the side plate 4321, supported by the side plate 4321, and fixed to the frame 4012.
  • AC connectors 1190 and 1192 are also fixed to the outer side 4930 of side plate 4321.
  • the AC connectors 1190 and 1192 are also fixed to the side plate 4321, supported by the side plate 4321, and fixed to the frame 4012.
  • Parts that can be embedded in frame members such as DC bus bar electrodes 4290 and 4291, DC bus bar electrodes 1120, 1121, 1122, 1123, 1124 and 1125, signal wiring 1140, AC bus bar electrodes 1180, 1181 and 1182 are, for example, insert molds. It may be embedded in the frame member by molding or the like.
  • the DC bus bar electrodes 4290 and 4291, the smoothing capacitor 1110, the DC bus bar electrodes 1120, 1121, 1122, 1123, 1124 and 1125, the plurality of signal wires 1140, the drive circuit boards 1150 and 1160, AC At least one component selected from the group consisting of the bus bar electrodes 1180, 1181 and 1182, and the current sensors 1200, 1201 and 1202 may be the cooled component 1611 described above.
  • the fifth exemplary embodiment of the present invention relates to an inverter.
  • the back surface of the semiconductor power module 1170 is the surface to be cooled 1400.
  • a cooler 1011 for cooling the surface to be cooled 1400 is provided.
  • the surface of the semiconductor power module 1170 does not become a surface to be cooled.
  • the back surface of the semiconductor power module 1170 is the first surface to be cooled.
  • a first cooler for cooling the first surface to be cooled is provided.
  • the surface of the semiconductor power module 1170 becomes a second surface to be cooled.
  • a second cooler is provided for cooling the second surface to be cooled.
  • the frame doubles as a conduit for conducting the coolant from the first cooler to the second cooler.
  • FIGS. 28 and 29 are cross-sectional views schematically showing cross sections of the inverter of the fifth embodiment.
  • the positions of the cross sections shown in FIGS. 28 and 29 correspond to the positions of the cross sections shown in FIGS. 6 and 7, respectively.
  • the inverter 100 illustrated in FIGS. 28 and 29 includes an inverter circuit 1010, at least one cooler 110, and a frame 111. At least one cooler 110 includes a first cooler 120 and a second cooler 121.
  • the inverter circuit 1010 provided in the inverter 100 of the fifth embodiment is the same as the inverter circuit 1010 provided in the inverter 1000 of the first embodiment. Therefore, the inverter 100 according to the fifth embodiment includes a smoothing capacitor 1110 and a semiconductor power module 1170 similar to the smoothing capacitor 1110 and the semiconductor power module 1170 provided in the inverter 1000 according to the first embodiment.
  • the semiconductor power module 1170 has a plate shape.
  • the semiconductor power module 1170 has a first surface to be cooled 130 and a second surface to be cooled 131.
  • the first cooled surface 130 is a back surface to be one main surface of the semiconductor power module 1170.
  • the second cooled surface 131 is a surface to be the other main surface of the semiconductor power module 1170.
  • the semiconductor power module 1170 is disposed between the first cooler 120 and the second cooler 121.
  • the cooling of the semiconductor power module 1170 is performed by a double-sided cooling structure.
  • the first cooler 120 is attached to the first cooled surface 130 of the semiconductor power module 1170 and cools the first cooled surface 130.
  • the second cooler 121 is attached to the second cooled surface 131 of the semiconductor power module 1170 and cools the second cooled surface 131.
  • FIG. 30 is a perspective view schematically illustrating a first cooler and a second cooler provided in the inverter according to the fifth embodiment.
  • the first cooler 120 includes a first cooler body 140, a first coolant inlet pipe 141, and a first coolant outlet pipe 142, as shown in FIG.
  • the tip of the first coolant inlet pipe 141 has a first coolant inlet 150.
  • the tip of the first coolant outlet pipe 142 has a first coolant outlet 160.
  • the first cooler 120 has a first coolant inlet 150 and a first coolant outlet 160.
  • the second cooler 121 includes a second cooler body 170, a second coolant inlet pipe 171, and a second coolant outlet pipe 172.
  • the tip of the second coolant inlet pipe 171 has a second coolant inlet 180.
  • the tip of the second coolant outlet pipe 172 has a second coolant outlet 190.
  • the second cooler 121 has a second coolant inlet 180 and a second coolant outlet 190.
  • FIG. 31 is a perspective view schematically illustrating a first cooler 120 and a second cooler 121 provided in the inverter according to the fifth embodiment, and a part of a frame 111 provided in the inverter.
  • FIG. 32 is a cross-sectional view schematically showing a cross section of the first cooler 120 and the second cooler 121 provided in the inverter of the fifth embodiment, and a part of the frame 111 provided in the inverter. It is.
  • the first cooler 120 and the second cooler 121 are fixed to the frame 111 as illustrated in FIGS. 31 and 32.
  • the second cooler 121 faces the first cooler 120, and the first cooler 120 It is separated in the direction D1 of 1.
  • the second coolant inlet pipe 171 faces the first coolant outlet pipe 142 and is separated from the first coolant outlet pipe 142 in the first direction D1.
  • the frame 111 includes a plate 200, a plate 201, a column 202, a column 203, a column 204 and a column 205.
  • the plate 200 and the plate 201 are plate-like frame members having surfaces extending in the second direction D2 and the third direction D3 which are the spreading directions.
  • the pillars 202, the pillars 203, the pillars 204 and the pillars 205 are rod-like frame members extending in the first direction D1.
  • the first cooler 120 is fixed to the plate 200, the column 202, the column 203, the column 204 and the column 205. For this reason, the first cooler 120 is supported by the plate 200, the pillars 202, the pillars 203, the pillars 204 and the pillars 205.
  • the first cooler 120 has a rectangular shape and includes four corners. The four corners of the first cooler 120 are fixed to the column 202, the column 203, the column 204 and the column 205.
  • the second cooler 121 is fixed to the plate 201, the column 202, the column 203, the column 204 and the column 205. For this reason, the second cooler 121 is supported by the plate 201, the column 202, the column 203, the column 204, and the column 205.
  • the second cooler 121 has a rectangular parallelepiped shape and has four corners. The four corners of the second cooler 121 are fixed to the column 202, the column 203, the column 204 and the column 205.
  • the column 202, the column 203, the column 204 and the column 205 include a column 202 that supports the first coolant outlet pipe 142 and the second coolant inlet pipe 171.
  • the frame 111 comprises a hollow portion 210.
  • the hollow portion 210 has a hollow shape and has a flow passage 220 through which the coolant flows.
  • the hollow portion 210 is provided in the column 202.
  • the first coolant outlet pipe 142 is inserted into the flow path 220.
  • the second cooling fluid inlet pipe 171 is inserted into the flow path 220.
  • the hollow part 210 has one connection end 230 connected to the first coolant outlet 160 and the other connection end 231 connected to the second coolant inlet 180.
  • the coolant can flow from the first cooler 120 to the hollow portion 210.
  • the cooling fluid can flow from the hollow portion 210 to the second cooler 121. Therefore, in the inverter 100, a flow path from the first coolant inlet 150 to the second coolant outlet 190 via the first cooler 120, the hollow portion 210 and the second cooler 121 sequentially is configured. Be done. For this reason, the coolant that has flowed into the first coolant inlet 150 flows sequentially through the first cooler 120, the hollow portion 210, and the second cooler 121, and flows out from the second coolant outlet 190.
  • the hollow portion 210 constitutes a path of the coolant between the first cooler 120 and the second cooler 121, and becomes a part of the coolant pipe.
  • the coolant that has flowed into the first coolant inlet 150 flows through the first coolant inlet pipe 141, the first cooler main body 140, and the first coolant outlet pipe 142 sequentially, and then the first cooling is performed. It flows out from the liquid outlet 160.
  • the cooling fluid flowing to the first cooler body 140 removes heat from the first cooled surface 130 in contact with the first cooler body 140 to cool the first cooled surface 130.
  • the cooling fluid having flowed into the second cooling fluid inlet 180 flows through the second cooling fluid inlet piping 171, the second cooler main body 170, and the second cooling fluid outlet piping 172 sequentially, and then the second cooling It flows out from the liquid outlet 190.
  • the cooling fluid flowing to the second cooler main body 170 removes heat from the second cooled surface 131 in contact with the second cooler main body 170 and cools the second cooled surface 131.
  • the coolant is cooling water composed of water or an aqueous solution. Therefore, the first coolant inlet pipe 141 and the second coolant inlet pipe 171 are water inlet pipes.
  • the first coolant outlet pipe 142 and the second coolant outlet pipe 172 are water outlet pipes.
  • the coolant may be a coolant other than the coolant.
  • the first coolant inlet pipe 141 may be inserted into the flow passage 220 at one end of the hollow portion 210.
  • the second coolant outlet pipe 172 may be inserted into the flow path 220 at the other end of the hollow portion 210. Therefore, the hollow portion 210 is connected to the first connection end 230 connected to the first coolant inlet 150 and / or the first coolant outlet 160, and to the second coolant inlet 180 or the second coolant outlet 190. It may have the other connection end 231 connected.
  • a plurality of coolers are required to respectively cool the plurality of heat generating parts.
  • multiple coolers in addition to the space required to hold and fix the multiple coolers, the space occupied by the piping through which the cooling fluid flows, connecting the multiple coolers and the piping to each other
  • the space occupied by connecting parts is also required. This requires a large space. The need for a large space is an obstacle to miniaturizing the inverter.
  • the flow path 220 through which the coolant flows from the first cooler 120 to the second cooler 121 supports the first cooler 120 and the second cooler 121, and It is inside the hollow portion 210 provided in the frame 111 to be fixed. For this reason, it is not necessary to provide cooling piping having a flow path in which the cooling fluid from the first cooler 120 to the second cooler 121 flows independently from the frame 111. In addition, it is not necessary to provide connection parts for connecting the cooling pipe to the first cooler 120 and the second cooler 121. Therefore, although the condition that the first surface to be cooled 130 and the second surface to be cooled 131 are located on the same plane and be close to each other is not satisfied, the first cooler 120 and the second The space required to install the cooler 121 can be reduced.
  • the inverter 100 since the first coolant outlet pipe 142 and the second coolant inlet pipe 171 are inserted into the flow path 220 of the hollow portion 210 having a sufficient length, a sufficient length can be obtained. It is easy to secure the covering cost which it has. For this reason, it is possible to easily prevent the coolant from leaking.
  • the sixth exemplary embodiment of the present invention relates to an inverter.
  • first embodiment a cooler for cooling the surface to be cooled 1400 of the semiconductor power module 1170 is provided.
  • the smoothing capacitor 1110 is not cooled.
  • a first cooler for cooling the first electrode provided in the smoothing capacitor 1110 is provided.
  • a second cooler is provided to cool the surface to be cooled 1400 of the semiconductor power module 1170 and the second electrode provided on the smoothing capacitor 1110.
  • the frame doubles as a conduit for conducting the coolant from the second cooler to the first cooler.
  • FIG. 33 is a cross sectional view schematically illustrating a cross section of the inverter according to the sixth embodiment.
  • the position of the cross section shown in FIG. 33 corresponds to the position of the cross section shown in FIG.
  • the inverter 300 illustrated in FIG. 33 includes an inverter circuit 1010, a first cooler 310, at least one cooler 311, and a frame 312. At least one cooler 311 includes a second cooler 320.
  • the inverter circuit 1010 provided in the inverter 300 of the sixth embodiment is the same as the inverter circuit 1010 provided in the inverter 1000 of the first embodiment. Therefore, the inverter 300 according to the sixth embodiment includes a smoothing capacitor 1110 and a semiconductor power module 1170 similar to the smoothing capacitor 1110 and the semiconductor power module 1170 provided in the inverter 1000 according to the first embodiment.
  • the smoothing capacitor 1110 comprises a capacitor 330, a first electrode 331 and a second electrode 332.
  • the capacitor 330 has one end and the other end.
  • the first electrode 331 is disposed at one end of the capacitor 330.
  • the second electrode 332 is disposed at the other end of the capacitor 330.
  • the semiconductor power module 1170 has a plate shape.
  • the semiconductor power module 1170 has a surface to be cooled 1400.
  • the cooled surface 1400 is a back surface to be one main surface of the semiconductor power module 1170.
  • the smoothing capacitor 1110 is disposed between the first cooler 310 and the second cooler 320. Cooling of the smoothing capacitor 1110 is performed by a double-sided cooling structure.
  • the inverter 300 further includes a first electrical insulator 340 and a second electrical insulator 341.
  • the first electrode 331 is in close contact with or bonded to the first electrical insulator 340.
  • the first electrical insulator 340 is in intimate contact with or bonded to the first cooler 310.
  • the second electrode 332 is in close contact with or bonded to the second electrical insulator 341.
  • the second electrical insulator 341 adheres to the second cooler 320 or is bonded to the second cooler 320.
  • the first cooler 310 cools the first electrode 331 by the first cooler 310, the first electrical insulating material 340, and the first cooler 310 being in close contact with or bonded to each other.
  • the second cooler 320 cools the second electrode 332 by bringing the second cooler 320, the second electrical insulator 341, and the second cooler 320 into close contact or bonding.
  • the first electrical insulator 340 insulates the first electrode 331 to which the active potential is applied from the first cooler 310.
  • the second electrode 332 to which the active potential is applied is insulated from the second cooler 320 by the second electrical insulator 341.
  • the semiconductor power module 1170 is disposed on the second cooler 320.
  • the cooling of the semiconductor power module 1170 is performed by a single-sided cooling structure.
  • the second cooler 320 is attached to the surface to be cooled 1400 of the semiconductor power module 1170, and cools the surface to be cooled 1400 to cool the semiconductor power module 1170.
  • the second cooler 320 has one surface 350 and the other surface 351.
  • the semiconductor power module 1170 and the smoothing capacitor 1110 are both disposed on one surface 350 of the second cooler 320.
  • the first cooler 310 has a first coolant inlet and a first coolant outlet, as with the inverter 100 of the fifth embodiment.
  • the second cooler 320 has a second coolant inlet and a second coolant outlet.
  • the first cooler 310 and the second cooler 320 are fixed to the frame 312.
  • the frame 312 comprises a hollow portion.
  • the hollow portion has a hollow shape and has a flow path through which the coolant flows.
  • the hollow part has one connecting end connected to the first coolant inlet or the first coolant outlet, and the other connecting end connected to the second coolant inlet or the second coolant outlet .
  • the space required to install the first cooler 310 and the second cooler 320 can be reduced, as in the inverter 100 according to the fifth embodiment.
  • the leak of a cooling fluid can be easily prevented similarly to the inverter 100 of 5th Embodiment.
  • the seventh exemplary embodiment of the present invention relates to an inverter.
  • the smoothing capacitor 1110 is not cooled.
  • a first cooler for cooling the first electrode provided in the smoothing capacitor 1110 is provided.
  • a second cooler is provided to cool the second electrode provided on the smoothing capacitor 1110.
  • the frame guides the coolant from the third cooler, which cools the cooled surface 1400 of the semiconductor power module 1170, to the first cooler, and from the first cooler to the second cooler. It also doubles as a pipe that leads the coolant.
  • FIG. 34 is a cross sectional view schematically showing a cross section of the inverter of the seventh embodiment.
  • the position of the cross section shown in FIG. 34 corresponds to the position of the cross section shown in FIG.
  • the inverter 400 illustrated in FIG. 34 includes an inverter circuit 1010, a first cooler 410, a second cooler 411, at least one cooler 412, and a frame 413. At least one cooler 412 includes a third cooler 420.
  • the inverter circuit 1010 provided in the inverter 400 of the seventh embodiment is similar to the inverter circuit 1010 provided in the inverter 1000 of the first embodiment. Therefore, the inverter 400 according to the seventh embodiment includes a smoothing capacitor 1110 and a semiconductor power module 1170 similar to the smoothing capacitor 1110 and the semiconductor power module 1170 provided in the inverter 1000 according to the first embodiment.
  • the smoothing capacitor 1110 comprises a capacitor 434, a first electrode 435 and a second electrode 436.
  • the capacitor 434 has one end and the other end.
  • the first electrode 435 is disposed at one end of the capacitor 434.
  • the second electrode 436 is disposed at the other end of the capacitor 434.
  • the semiconductor power module 1170 has a plate shape.
  • the semiconductor power module 1170 has a surface to be cooled 1400.
  • the cooled surface 1400 is a back surface to be one main surface of the semiconductor power module 1170.
  • the smoothing capacitor 1110 is disposed between the first cooler 410 and the second cooler 411. Cooling of the smoothing capacitor 1110 is performed by a double-sided cooling structure.
  • the inverter 400 further includes a first electrical insulator 440 and a second electrical insulator 441 as in the sixth embodiment.
  • the first electrode 435 is in close contact with or bonded to the first electrical insulator 440.
  • the first electrical insulator 440 is in intimate contact with or bonded to the first cooler 410.
  • the second electrode 436 is in close contact with or bonded to the second electrical insulator 441.
  • the second electrically insulating material 441 is in close contact with the second cooler 411 or joined to the second cooler 411.
  • the first cooler 410 cools the first electrode 435 by bringing the first cooler 410, the first electrical insulator 440, and the first electrode 435 into close contact or bonding. Further, the second cooler 411 cools the second electrode 436 by bringing the second cooler 411, the second electric insulating material 441, and the second electrode 436 into close contact or bonding. .
  • the semiconductor power module 1170 is disposed on the third cooler 420.
  • the cooling of the semiconductor power module 1170 is performed by a single-sided cooling structure.
  • the third cooler 420 is attached to the surface to be cooled 1400 of the semiconductor power module 1170 and cools the surface to be cooled 1400.
  • the first cooler 410 includes a first cooler body 430, a first coolant inlet pipe 431 and a first coolant outlet pipe 432.
  • the tip of the first coolant inlet pipe 431 has a first coolant inlet 450.
  • the tip of the first coolant outlet pipe 432 has a first coolant outlet 460.
  • the first cooler 410 has a first coolant inlet 450 and a first coolant outlet 460.
  • the second cooler 411 includes a second cooler body 470, a second coolant inlet pipe 471 and a second coolant outlet pipe 472.
  • the tip of the second coolant inlet pipe 471 has a second coolant inlet 480.
  • the tip of the second coolant outlet pipe 472 has a second coolant outlet 490.
  • the second cooler 411 has a second coolant inlet 480 and a second coolant outlet 490.
  • the third cooler 420 includes a third cooler body 500, a third coolant inlet pipe 501, and a third coolant outlet pipe 502.
  • the tip of the third coolant inlet piping 501 has a third coolant inlet 510.
  • the tip of the third coolant outlet pipe 502 has a third coolant outlet 520.
  • the third cooler 420 has a third coolant inlet 510 and a third coolant outlet 520.
  • the first cooler 410, the second cooler 411 and the third cooler 420 are fixed to the frame 413.
  • the frame 413 includes a first hollow portion 530 and a second hollow portion 531.
  • the first hollow portion 530 and the second hollow portion 531 have a hollow shape, and have a first flow passage 540 and a second flow passage 550 through which the coolant flows, respectively.
  • the first coolant outlet pipe 432 is inserted into the first flow passage 540.
  • the second coolant inlet pipe 471 is inserted into the first flow passage 540.
  • the first hollow portion 530 has one connection end 560 connected to the first coolant outlet 460 and the other connection end 561 connected to the second coolant inlet 480.
  • the first coolant inlet pipe 431 is inserted into the second flow passage 550.
  • the third coolant outlet pipe 502 is inserted into the second flow passage 550.
  • the second hollow portion 531 has one connection end 570 connected to the first coolant inlet 450 and the other connection end 571 connected to the third coolant outlet 520.
  • the cooling fluid can flow from the first cooler 410 to the first hollow portion 530.
  • the coolant can flow from the first hollow portion 530 to the second cooler 411.
  • the coolant inlet 450 to one connection end 570 of the second hollow portion 531
  • the coolant can flow from the second hollow portion 531 to the first cooler 410.
  • the third coolant outlet 520 to the other connection end 571 of the second hollow portion 531, the coolant can flow from the third cooler 420 to the second hollow portion 531.
  • the inverter 400 includes the third cooler 420, the second hollow portion 531, the first cooler 410, the first hollow portion 530, and the second cooler 411 from the third coolant inlet 510.
  • a flow path passing through the second coolant outlet 490 is configured sequentially. Therefore, the coolant that has flowed into the third coolant inlet 510 is the third cooler 420, the second hollow portion 531, the first cooler 410, the first hollow portion 530, and the second cooler.
  • Flow 411 sequentially flows out of the second coolant outlet 490.
  • the first hollow portion 530 constitutes a path of the coolant between the first cooler 410 and the second cooler 411 and is a part of the coolant pipe.
  • the second hollow portion 531 constitutes a path of the coolant between the third cooler 420 and the first cooler 410 and becomes a part of the coolant pipe.
  • the first coolant inlet pipe 431 may be inserted into the first flow passage 540 at one end of the first hollow portion 530.
  • a second coolant outlet pipe 472 may be inserted into the first flow path 540.
  • the first coolant outlet pipe 432, the second coolant inlet pipe 471 or the second coolant outlet pipe 472 may be inserted into the second flow path 550 at one end of the second hollow portion 531.
  • the third coolant inlet pipe 501 may be inserted into the second flow passage 550.
  • the first hollow portion 530 has one connection end 560 connected to one of the first coolant inlet 450 and the first coolant outlet 460, and the second coolant inlet 480 and the second cooling. It may have the other connection end 561 connected to one of the liquid outlets 490. Also, the second hollow portion 531 is connected to the other of the first coolant inlet 450 and the first coolant outlet 460, or to the other of the second coolant inlet 480 and the second coolant outlet 490. One connection end 570 and the other connection end 571 connected to one of the third coolant inlet 510 and the third coolant outlet 520 may be provided.
  • the inverter 400 of the seventh embodiment it is necessary to cool three surfaces including the surface of the first electrode 435, the surface of the second electrode 436, and the surface to be cooled 1400 of the semiconductor power module 1170.
  • the condition that the three planes are located on the same plane and close to each other is not satisfied.
  • the first flow path 540 through which the cooling fluid flows from the first cooler 410 to the second cooler 411 is the first cooler 410, the second cooling Inside the first hollow portion 530 provided in the frame 413 for supporting and fixing the vessel 411 and the third cooler 420.
  • a first flow passage 530 through which the coolant flows from the third cooler 412 to the first cooler 410 is inside the second hollow portion 531 provided in the frame 413. Therefore, the space required for installing the first cooler 410, the second cooler 411 and the third cooler 420 can be reduced.
  • the leak of a cooling fluid can be easily prevented similarly to the inverter 100 of 5th Embodiment.
  • the first flow path 540 extends in the first direction D1 which is the longitudinal direction
  • the second flow path 550 extends in the second direction D2 which is the lateral direction.
  • the direction D2 in which the second flow channel 550 extends is different from the direction D1 in which the first flow channel 540 extends.
  • An eighth embodiment of the present invention relates to an inverter.
  • first embodiment a cooler for cooling the surface to be cooled 1400 of the semiconductor power module 1170 is provided.
  • the smoothing capacitor 1110 is not cooled.
  • a first cooler for cooling the first electrode provided in the smoothing capacitor 1110 is provided.
  • a second cooler for cooling the second electrode provided on the surface to be cooled 1400 of the semiconductor power module 1170 and the smoothing capacitor 1110 is provided.
  • the frame doubles as a conduit for conducting the coolant from the first cooler to the second cooler.
  • FIG. 35 and FIG. 36 are cross sectional views schematically showing cross sections of the inverter of the eighth embodiment.
  • the inverter 600 illustrated in FIGS. 35 and 36 includes an inverter circuit 1010, a first cooler 610, at least one cooler 611, and a frame 612. At least one cooler 611 includes a second cooler 620.
  • the inverter circuit 1010 provided in the inverter 600 of the eighth embodiment is the same as the inverter circuit 1010 provided in the inverter 1000 of the first embodiment. Therefore, the inverter 600 according to the eighth embodiment includes a smoothing capacitor 1110 and a semiconductor power module 1170 similar to the smoothing capacitor 1110 and the semiconductor power module 1170 provided in the inverter 1000 according to the first embodiment.
  • the smoothing capacitor 1110 comprises a capacitor 630, a first electrode 631 and a second electrode 632.
  • the capacitor 630 has one end and the other end.
  • the first electrode 631 is disposed at one end of the capacitor 630.
  • the second electrode 632 is disposed at the other end of the capacitor 630.
  • the semiconductor power module 1170 has a plate shape.
  • the semiconductor power module 1170 has a surface to be cooled 1400.
  • the cooled surface 1400 is a back surface to be one main surface of the semiconductor power module 1170.
  • the smoothing capacitor 1110 is disposed between the first cooler 610 and the second cooler 620. Cooling of the smoothing capacitor 1110 is performed by a double-sided cooling structure.
  • the inverter 600 further includes a first electrical insulator 640 and a second electrical insulator 641.
  • the first electrode 631 is in close contact with or bonded to the first electrical insulator 640.
  • the first electrical insulator 640 is in intimate contact or bonded to the first cooler 610.
  • the second electrode 632 is in close contact with or bonded to the second electrical insulator 641.
  • the second electrically insulating material 641 is in close contact with the second cooler 620 or joined to the second cooler 620.
  • the first cooler 610 cools the first electrode 631 by bringing the first electrode 631, the first electrical insulator 640, and the first cooler 610 into close contact or bonding.
  • the second cooler 620 cools the second electrode 632 by the second electrode 632, the second electrical insulator 641, and the second cooler 620 being in close contact or bonded.
  • the first electrical insulator 640 insulates the first electrode 631 to which the active potential is applied from the first cooler 610.
  • the second electrode 632 to which an active potential is applied is isolated from the second cooler 620 by the second electrical insulator 641.
  • the semiconductor power module 1170 is disposed on the second cooler 620.
  • the cooling of the semiconductor power module 1170 is performed by a single-sided cooling structure.
  • the second cooler 620 is attached to the surface to be cooled 1400 of the semiconductor power module 1170, and cools the surface to be cooled 1400 to cool the semiconductor power module 1170.
  • the second cooler 620 has one side 650 and the other side 651.
  • the semiconductor power module 1170 is disposed on one side 650.
  • the smoothing capacitor 1110 is disposed on the other surface 651.
  • the semiconductor power module 1170 and the smoothing capacitor 1110 are disposed on one side 650 and the other side 651 of the second cooler 620, respectively, so that both sides of the second cooler 620 are utilized for cooling.
  • the first cooler 610 has a first coolant inlet 660 and a first coolant outlet 670, as in the inverter 100 of the fifth embodiment.
  • the second cooler 620 has a second coolant inlet 680 and a second coolant outlet 690.
  • the first cooler 610 and the second cooler 620 are fixed to the frame 612.
  • the frame 612 comprises a hollow portion 700.
  • the hollow portion 700 has a hollow shape and has a flow path 710 through which the coolant flows.
  • the hollow portion 700 is connected to one connection end 720 connected to the first coolant inlet 660 or the first coolant outlet 670, and to the second coolant inlet 680 or the second coolant outlet 690. It has the other connection end 721.
  • the space required for installing the first cooler 610 and the second cooler 620 can be reduced similarly to the inverter 100 of the fifth embodiment.
  • inverter 600 according to the eighth embodiment it is possible to easily prevent the coolant from leaking similarly to the inverter 100 according to the fifth embodiment.
  • the support of the second cooler 620 by the frame 612 is performed by supporting the four corners of the second cooler 620 with four columns.
  • a flow path 710 through which the coolant flows is provided inside any one of the four columns. For this reason, it is less likely that the frame 612 becomes an obstacle to the mounting of the semiconductor power module 1170 and the smoothing capacitor 1110.
  • the coolant piping does not hinder the mounting of the semiconductor power module 1170 and the smoothing capacitor 1110.
  • the second cooler 620 it is also easy to fix the second cooler 620 to the frame 612 after the semiconductor power module 1170 and the smoothing capacitor 1110 are mounted on the second cooler 620. For this reason, even if it is difficult to mount the heat generating component on the second cooler 620 after the second cooler 620 is fixed to the frame 612 due to restrictions on the mounting process, the second cooler 620 It is possible to cool the semiconductor power module 1170 and the smoothing capacitor 1110 utilizing both sides.
  • the ninth exemplary embodiment of the present invention relates to an inverter.
  • FIG. 37 is a cross sectional view schematically showing a cross section of the inverter of the ninth embodiment.
  • the generated alternating current is a multiphase alternating current having components of first to nth phases.
  • n is an integer of 2 or more.
  • FIG. 37 illustrates the case where the generated alternating current is a three-phase alternating current having a U-phase component, a V-phase component, and a W-phase component.
  • the inverter 800 includes first to nth structures 820, 821 and 822, and a frame 830.
  • the first to n-th structures 820, 821 and 822 respectively include the first to n-th semiconductor power modules and the first to n-th coolers.
  • the first to n-th semiconductor power modules switch direct current to generate components of the first to n-th phases, respectively.
  • the semiconductor power modules included in the first to n-th semiconductor power modules are provided in the inverter according to any of the fifth to eighth embodiments in a structure to which the respective semiconductor power modules belong. Is cooled in the same manner as the semiconductor power module.
  • the first to nth at least one coolers are fixed to the frame 830.
  • First to nth semiconductor power modules are mounted on at least one cooler from the first to nth.
  • at least one cooler from the first to the n-th cools the semiconductor power modules from the first to the n-th, respectively.
  • Each of the at least one cooler included in the at least one cooler from the first to the nth is any one of the fifth to eighth embodiments in a structure to which the at least one cooler belongs.
  • the semiconductor power module is cooled in the same manner as at least one cooler provided in the inverter of the embodiment.
  • each at least one cooler has a coolant inlet and a coolant outlet.
  • the first to n-th structures 820, 821 and 822 are disposed on the first to n-th positions 850, 851 and 852 on the curved surface 840, respectively.
  • the curved surface 840 is a surface of a support that supports the first to n-th structures 820, 821, and 822.
  • the curved surface 840 is, for example, an outer peripheral surface of a motor casing having a cylindrical shape.
  • the first to nth positions 850, 851 and 852 have normal directions different from each other.
  • the first to n-th structures 820, 821 and 822 have inclinations according to the normal directions of the first to n-th positions 850, 851 and 852 on the curved surface 840, respectively.
  • the frame 830 has one connecting end connected to the coolant inlet or the coolant outlet provided in at least one cooler included in the first to n-th coolers, and the first to the first a hollow portion having a cooling fluid inlet or a cooling fluid outlet connected to the cooling fluid outlet provided in at least one other cooling device included in at least one cooler up to n.
  • the hollow portion has a hollow shape and has a flow path through which the coolant flows.
  • the first to n-th structures have different inclinations. For this reason, the hollow portion is often curved or bent. However, when the frame 830 is made of resin, a curved or bent hollow portion can be easily formed.
  • the inverter 800 according to the eighth embodiment can be installed along the curved surface 840, and has a feature that even when installed along the curved surface 840, a dead space such as a gap does not easily occur.
  • the support on which the inverter 800 is mounted can be miniaturized.
  • the tenth embodiment of the present invention relates to a cased inverter.
  • FIG. 38 is a perspective view schematically illustrating the cased inverter of the tenth embodiment.
  • the cased inverter 5000 illustrated in FIG. 38 includes an inverter 5010 and an inverter case 5011.
  • the inverter 5010 is the inverter 1000 according to the first embodiment, and is accommodated in the inverter case 5011.
  • the inverter case 5011 is independent of a motor or a combined device including the motor.
  • the inverter 5010 includes the inverter 2000 of the second embodiment, the inverter 3000 of the third embodiment, the inverter 4000 of the fourth embodiment, the inverter 100 of the fifth embodiment, the inverter 300 of the sixth embodiment, and the inverter of the seventh embodiment.
  • the inverter 400 may be the inverter 400 according to the eighth embodiment or the inverter 800 according to the ninth embodiment.
  • An eleventh embodiment of the present invention relates to a motor with a built-in inverter.
  • FIG. 39 is a perspective view schematically illustrating the motor with a built-in inverter according to the eleventh embodiment.
  • the inverter built-in electric motor 6000 illustrated in FIG. 39 includes an inverter 6010, an electric motor 6011 and an inverter case 6012.
  • the motor 6011 includes a motor case 6020.
  • the inverter 6010 is the inverter 1000 of the first embodiment, and is accommodated in the inverter case 6012.
  • the inverter case 6012 is joined to the motor case 6020 or integrated with the motor case 6020.
  • the inverter 6010 includes the inverter 2000 of the second embodiment, the inverter 3000 of the third embodiment, the inverter 4000 of the fourth embodiment, the inverter 100 of the fifth embodiment, the inverter 300 of the sixth embodiment, and the inverter of the seventh embodiment.
  • the inverter 400 may be the inverter 400 according to the eighth embodiment or the inverter 800 according to the ninth embodiment.
  • the inverter built-in motor 6000 is assembled by housing the inverter 1000 in an inverter case 6012 which is joined to the motor case 6020 or integrated with the motor case 6020. Therefore, the incorporation of the inverter 1000 into the inverter built-in motor 6000 does not affect the manufacture of the motor 6011, and handling such as lifting the motor 6011 hardly occurs when the inverter 1000 is incorporated into the inverter built-in motor 6000.
  • Twelfth Embodiment relates to an inverter-equipped transaxle.
  • FIG. 40 is a schematic view schematically illustrating the internal structure of the inverter built-in transaxle of the twelfth embodiment.
  • the inverter built-in transaxle 7000 illustrated in FIG. 40 includes an inverter 7010, a transaxle 7011 and an inverter case 7012.
  • the transaxle 7011 is mounted, for example, on an electric automobile, and includes an electric motor 7020, a transmission 7021 and a transaxle case 7023.
  • the inverter 7000 is the inverter 1000 of the first embodiment, and is accommodated in the inverter case 7012.
  • the inverter case 7012 is joined to the transaxle case 7023 or integrated with the transaxle case 7023.
  • the inverter 7000 includes the inverter 2000 of the second embodiment, the inverter 3000 of the third embodiment, the inverter 4000 of the fourth embodiment, the inverter 100 of the fifth embodiment, the inverter 300 of the sixth embodiment, and the inverter of the seventh embodiment.
  • the inverter 400 may be the inverter 400 according to the eighth embodiment or the inverter 800 according to the ninth embodiment.
  • the transmission 7021 is a transmission mechanism that transmits the mechanical force generated by the motor 7020.
  • the motor 7020 and the transmission 7021 are accommodated in a transaxle case 7023.
  • the transaxle 7011 which is a combined device including the transmission 7021 may be replaced with a combined device including a transmission mechanism other than the transmission.
  • the thirteenth embodiment of the present invention relates to an inverter-equipped transaxle.
  • FIG. 41 is a schematic view schematically illustrating an internal structure of the inverter built-in transaxle of the thirteenth embodiment.
  • the inverter built-in transaxle 8000 illustrated in FIG. 41 includes an inverter 8010 and a transaxle 8011.
  • the transaxle 8011 is mounted, for example, on an electric automobile, and includes an electric motor 8020, a transmission 8021, and a transaxle case 8022.
  • the inverter 8010 is the inverter 1000 according to the first embodiment, and is accommodated in a hollow space 8030 formed in the transaxle case 8022 and exposed to the outside.
  • the inverter 8010 includes the inverter 2000 of the second embodiment, the inverter 3000 of the third embodiment, the inverter 4000 of the fourth embodiment, the inverter 100 of the fifth embodiment, the inverter 300 of the sixth embodiment, and the inverter of the seventh embodiment.
  • the inverter 400 may be the inverter 400 according to the eighth embodiment or the inverter 800 according to the ninth embodiment.
  • the transaxle case 8022 has a box-like hollow space 8030 that can accommodate the inverter 1000 because it has a complex three-dimensional shape with large unevenness.
  • inverter 1000 is incorporated in inverter built-in transaxle 8000 in a state where it does not significantly protrude from transaxle case 8022.
  • the transmission 8021 is a transmission mechanism that transmits the mechanical force generated by the motor 8020.
  • the motor 8020 and the transmission 8021 are housed in a transaxle case 8023.
  • the transaxle 8011 which is a combined device including the transmission 8021 may be replaced with a combined device including a transmission mechanism other than the transmission.
  • first cooled object Second surface to be cooled 2900, 3900 First cooler, 2901, 3901 Second cooler, 5000 Cased inverter, 5011, 6012, 7012 Inverter case, 6000 ... Motor with built-in inverter, 6011, 7020, 8020 ... motor, 70 0, 8000 ... Transaxle with built-in inverter, 7011, 8011 ... Transaxle, 7021, 8021 ... Transmission, 7023, 8022 ... Transaxle case, 8030 ... Hollow space, 100, 300, 400, 800 ... Inverter, 110, 311, 412, 611 ... at least one cooler, 111, 312, 413, 612, 830 ... frame, 120, 310, 410, 610 ...

Abstract

This inverter is provided with a frame, a semiconductor power module and a cooling device. The frame is configured by combining a plurality of frame members which include a plurality of rod-shaped frame members. The semiconductor power module generates an alternating current by switching the direct current. The cooling device is affixed to the frame and cools the semiconductor power module.

Description

インバータ、ケース入りインバータ、インバータ内蔵電動機及びインバータ内蔵複合装置Inverter, Cased inverter, Inverter built-in motor and inverter built-in combined device
　本発明は、インバータ、ケース入りインバータ、インバータ内蔵電動機及びインバータ内蔵複合装置に関する。 The present invention relates to an inverter, a cased inverter, an inverter built-in motor, and an inverter built-in complex device.
　従来のインバータは、複数の部品及びインバータケースを備える。複数の部品は、冷却器等を含み、インバータケースに固定される。インバータケースは、箱状の形状を有する。部品のインバータケースへの固定は、インバータケースの内壁に設けられたボス部に部品を取り付けることにより行われる。又は、部品のインバータケースへの固定は、部品に設けられた足部をインバータケースの内壁に固定することにより行われる。第１の部品に設けられた足部がインバータケースに固定された第２の部品に固定される場合もある。 The conventional inverter comprises a plurality of parts and an inverter case. The plurality of components include a cooler and the like, and are fixed to the inverter case. The inverter case has a box-like shape. Fixing of the component to the inverter case is performed by attaching the component to a boss provided on the inner wall of the inverter case. Alternatively, fixing of the component to the inverter case is performed by fixing a foot provided on the component to the inner wall of the inverter case. In some cases, the foot provided to the first part is fixed to the second part fixed to the inverter case.
　日本国公開公報特開２０１７－３４７５７号公報に記載された電子制御装置においては、第１パワー基板が第１のモータを駆動し、第２パワー基板が第２のモータを駆動する（請求項１）。第１パワー基板及び第２パワー基板は、モータ駆動回路を構成する複数のスイッチング素子を備える（段落００１８及び００１９）。第１パワー基板に生じた熱は、第１放熱板により放熱され、第２パワー基板に生じた熱は、第２放熱板により放熱される（請求項１）。第１パワー基板及び第１放熱板は、一体化され、第２パワー基板及び第２放熱板は、一体化される（段落０００８）。第１放熱板の一方の側部及び他方の側部は、それぞれ第１フレーム及び第２フレームの第２脚部に固定され、第２放熱板の一方の側部及び他方の側部は、それぞれ第１フレーム及び第２のフレームの第１脚部に固定される（段落００１０）。
日本国公開公報：特開２０１７－３４７５７号公報 In the electronic control device described in Japanese Patent Laid-Open Publication No. 2017-34757, the first power substrate drives the first motor and the second power substrate drives the second motor (claim 1) ). The first power substrate and the second power substrate include a plurality of switching elements constituting a motor drive circuit (paragraphs 0018 and 0019). The heat generated in the first power substrate is dissipated by the first heat dissipation plate, and the heat generated in the second power substrate is dissipated by the second heat dissipation plate (claim 1). The first power substrate and the first heat sink are integrated, and the second power substrate and the second heat sink are integrated (paragraph 0008). One side and the other side of the first heat sink are fixed to the second leg of the first and second frames, respectively, and one side and the other side of the second heat sink are respectively It is fixed to the first leg of the first frame and the second frame (paragraph 0010).
Japanese Patent Publication: JP-A-2017-34757
　インバータは、コネクタ、平滑コンデンサ、半導体パワーモジュール、電流センサ、冷却器等を備え、これらの部品を配置して構成される。これらの部品は、互いに異なる大きさ及び形状を有する部品を含む。このため、次のような場合には、部品の間の隙間が大きくなるという問題がある。すなわち、インバータケースの内壁に設けられたボス部に部品が取り付けられた場合、部品に設けられた足部がインバータケースの内壁に固定された場合、第１の部品に設けられた足部がインバータケースに固定された第２の部品に固定され第１の部品及び第２の部品が積み重ねられた場合等である。特に、大きな部品とそれに隣接する部品との間の隙間が大きくなった場合、大きな部品の周囲に活用されないデッドスペースが生じる。 The inverter includes a connector, a smoothing capacitor, a semiconductor power module, a current sensor, a cooler, and the like, and these components are arranged. These parts include parts having different sizes and shapes. For this reason, in the following cases, there is a problem that the gap between parts becomes large. That is, when the component is attached to the boss provided on the inner wall of the inverter case, and the foot provided on the component is fixed to the inner wall of the inverter case, the foot provided on the first component is the inverter For example, when the first part and the second part are stacked and fixed to the second part fixed to the case. In particular, when the gap between a large part and an adjacent part becomes large, dead space is generated around the large part.
　本発明は、この問題を解決するためになされる。本発明が解決しようとする課題は、複数の部品の間の隙間を小さくすることを容易にし、インバータを小型化することを容易にすることである。 The present invention is made to solve this problem. The problem to be solved by the present invention is to make it easy to reduce the gap between a plurality of parts and to make the inverter smaller.
　本発明の例示的な一つの態様においては、インバータに、フレーム、半導体パワーモジュール及び冷却器が設けられる。フレームは、複数の棒状のフレームメンバーを含む複数のフレームメンバーを組み合わせて構成される。半導体パワーモジュールは、直流をスイッチングし、交流を生成する。冷却器は、フレームに固定され、半導体パワーモジュールを冷却する。 In one exemplary aspect of the invention, the inverter is provided with a frame, a semiconductor power module and a cooler. The frame is configured by combining a plurality of frame members including a plurality of rod-like frame members. The semiconductor power module switches direct current and generates alternating current. The cooler is fixed to the frame and cools the semiconductor power module.
　本発明の例示的な一つの態様によれば、部品が固定されるフレームメンバーを配置する位置に対する制約が小さくなるので、部品を配置する位置に対する制約が小さくなる。これにより、複数の部品の間の隙間を小さくすることが容易になり、インバータを小型化することが容易になる。 According to an exemplary aspect of the present invention, the restriction on the position at which the part is fixed is reduced, and the restriction on the position at which the part is arranged is reduced. This makes it easy to reduce the gap between the plurality of components, and to miniaturize the inverter.
第１実施形態のインバータを模式的に図示する斜視図である。It is a perspective view which illustrates an inverter of a 1st embodiment typically. 第１実施形態のインバータに設けられたインバータ回路における電気的接続を図示する接続図である。It is a connection diagram illustrating electric connection in an inverter circuit provided in an inverter of a 1st embodiment. 第１実施形態のインバータに設けられたフレームを模式的に図示する斜視図である。It is a perspective view which illustrates a frame provided in an inverter of a 1st embodiment typically. 第１実施形態のインバータの上面を模式的に図示する上面図である。It is a top view which illustrates the upper surface of the inverter of a 1st embodiment typically. 第１実施形態のインバータの図４の切断線Ａ－Ａの位置における断面を模式的に図示する断面図である。FIG. 5 is a cross-sectional view schematically illustrating a cross section at a position of a cutting line AA in FIG. 4 of the inverter according to the first embodiment. 第１実施形態のインバータの図４の切断線Ｂ－Ｂの位置における断面を模式的に図示する断面図である。FIG. 5 is a cross-sectional view schematically illustrating a cross-section at the position of cutting line BB in FIG. 4 of the inverter according to the first embodiment. 第１実施形態のインバータの図４の切断線Ｃ－Ｃの位置における断面を模式的に図示する断面図である。FIG. 5 is a cross sectional view schematically illustrating a cross section at a position of a cutting line CC in FIG. 4 of the inverter according to the first embodiment. 第１実施形態のインバータの図４の切断線Ｄ－Ｄの位置における断面を模式的に図示する断面図である。FIG. 5 is a cross-sectional view schematically illustrating a cross section at a position of a cutting line DD in FIG. 4 of the inverter according to the first embodiment. 第１実施形態のインバータの図４の切断線Ｅ－Ｅの位置における断面を模式的に図示する断面図である。FIG. 5 is a cross sectional view schematically illustrating a cross section at a position of a cutting line EE in FIG. 4 of the inverter according to the first embodiment. 第１実施形態のインバータの図４の切断線Ｆ－Ｆの位置における断面を模式的に図示する断面図である。FIG. 5 is a cross-sectional view schematically illustrating a cross section at a position of a cutting line FF in FIG. 4 of the inverter according to the first embodiment. 第１実施形態の第１変形例のインバータに設けられた半導体パワーモジュール、冷却器及びフレームの断面を模式的に図示する断面図である。It is sectional drawing which illustrates typically the cross section of the semiconductor power module provided in the inverter of the 1st modification of 1st Embodiment, a cooler, and a flame | frame. 第１実施形態のインバータに設けられたコンデンサ群及びフレームの断面を模式的に図示する断面図である。FIG. 2 is a cross-sectional view schematically illustrating a cross section of a capacitor group and a frame provided in the inverter of the first embodiment. 第１実施形態のインバータに設けられた平滑コンデンサにおける電気的接続を図示する接続図である。It is a connection diagram illustrating electric connection in a smoothing capacitor provided in an inverter of a 1st embodiment. 第１実施形態の第２変形例のインバータに設けられたコンデンサ群及びフレームの上面を模式的に図示する上面図である。It is a top view which illustrates typically the upper surface of the capacitor group provided in the inverter of the 2nd modification of a 1st embodiment, and a frame. 第１実施形態の第３変形例のインバータに設けられたコンデンサ群、フレーム及びベース板の断面を模式的に図示する断面図である。It is sectional drawing which illustrates typically the cross section of the capacitor group provided in the inverter of the 3rd modification of 1st Embodiment, a flame | frame, and a base board. 第１実施形態の第４変形例のインバータに設けられたコンデンサ群、フレーム及び樹脂体の断面を模式的に図示する断面図である。It is sectional drawing which illustrates typically the cross section of the capacitor group provided in the inverter of the 4th modification of 1st Embodiment, a flame | frame, and a resin body. 第１実施形態の第５変形例のインバータに設けられたコンデンサ群、フレーム、樹脂体及びベース板の断面を模式的に図示する断面図である。It is sectional drawing which illustrates typically the cross section of the capacitor group provided in the inverter of the 5th modification of 1st Embodiment, a flame | frame, a resin body, and a base plate. 第１実施形態のインバータに望ましくは付加される部品の冷却のための構造を模式的に図示する断面図である。FIG. 5 is a cross-sectional view schematically illustrating a structure for cooling a component that is desirably added to the inverter of the first embodiment. 第１実施形態のインバータに望ましくは付加される部品間の遮熱のための構造を模式的に図示する断面図である。It is sectional drawing which illustrates typically the structure for the heat insulation between the components preferably added to the inverter of 1st Embodiment. 第１実施形態の第６変形例のインバータの断面を模式的に図示する断面図である。It is a sectional view which illustrates a section of an inverter of a 6th modification of a 1st embodiment typically. 第２実施形態のインバータの断面を模式的に図示する斜視図である。It is a perspective view which illustrates a cross section of an inverter of a 2nd embodiment typically. 第２実施形態のインバータに設けられたフレームを模式的に図示する斜視図である。It is a perspective view which illustrates a frame provided in an inverter of a 2nd embodiment typically. 第３実施形態のインバータの断面を模式的に図示する斜視図である。It is a perspective view which illustrates a cross section of an inverter of a 3rd embodiment typically. 第４実施形態のインバータの断面を模式的に図示する断面図である。It is a sectional view which illustrates a section of an inverter of a 4th embodiment typically. 第４実施形態のインバータの断面を模式的に図示する断面図である。It is a sectional view which illustrates a section of an inverter of a 4th embodiment typically. 第４実施形態のインバータに設けられたインバータ回路における電気的接続を図示する接続図である。It is a connection diagram illustrating electric connection in an inverter circuit provided in an inverter of a 4th embodiment. 第４実施形態のインバータに設けられたフレームを模式的に図示する斜視図である。It is a perspective view which illustrates a frame provided in an inverter of a 4th embodiment typically. 第５実施形態のインバータの断面を模式的に図示する断面図である。It is a sectional view which illustrates a section of an inverter of a 5th embodiment typically. 第５実施形態のインバータの断面を模式的に図示する断面図である。It is a sectional view which illustrates a section of an inverter of a 5th embodiment typically. 第５実施形態のインバータに設けられた第１の冷却器及び第２の冷却器を模式的に図示する斜視図である。It is a perspective view which illustrates the 1st cooler and the 2nd cooler which were provided in the inverter of a 5th embodiment typically. 第５実施形態のインバータに設けられた第１の冷却器及び第２の冷却器、並びに当該インバータに設けられたフレームの一部を模式的に図示する斜視図である。It is a perspective view which illustrates typically a part of the frame provided in the 1st cooler and the 2nd cooler which were provided in the inverter of a 5th embodiment, and the inverter concerned. 第５実施形態のインバータに設けられた第１の冷却器及び第２の冷却器、並びに当該インバータに設けられたフレームの一部の断面を模式的に図示する断面図である。It is sectional drawing which illustrates typically the cross section of the 1st cooler and 2nd cooler which were provided in the inverter of 5th Embodiment, and a part of flame | frame provided in the said inverter. 第６実施形態のインバータの断面を模式的に図示する断面図である。It is a sectional view which illustrates a section of an inverter of a 6th embodiment typically. 第７実施形態のインバータの断面を模式的に図示する断面図である。It is sectional drawing which illustrates the cross section of the inverter of 7th Embodiment typically. 第８実施形態のインバータの断面を模式的に図示する断面図である。It is sectional drawing which illustrates the cross section of the inverter of 8th Embodiment typically. 第８実施形態のインバータの断面を模式的に図示する断面図である。It is sectional drawing which illustrates the cross section of the inverter of 8th Embodiment typically. 第９実施形態のインバータの断面を模式的に図示する断面図である。It is a sectional view which illustrates a section of an inverter of a 9th embodiment typically. 第１０実施形態のケース入りインバータを模式的に図示する斜視図である。It is a perspective view which illustrates the cased inverter of 10th Embodiment typically. 第１１実施形態のインバータ内蔵電動機を模式的に図示する斜視図である。It is a perspective view which illustrates an inverter built-in electric motor of an 11th embodiment typically. 第１２実施形態のインバータ内蔵トランスアクスルの内部構造を模式的に図示する模式図である。It is a schematic diagram which illustrates the internal structure of the inverter built-in transaxle of 12th Embodiment typically. 第１３実施形態のインバータ内蔵トランスアクスルの内部構造を模式的に図示する模式図である。It is a schematic diagram which illustrates the internal structure of the inverter built-in transaxle of 13th Embodiment typically.
　１　第１実施形態
　１．１　インバータの概略
　本発明の例示的な第１実施形態は、インバータに関する。 1 First Embodiment 1.1 Outline of Inverter The first exemplary embodiment of the present invention relates to an inverter.
　図１は、第１実施形態のインバータを模式的に図示する斜視図である。 FIG. 1 is a perspective view schematically illustrating the inverter of the first embodiment.
　図１に図示されるインバータ１０００は、インバータ回路１０１０、少なくともひとつの冷却器１０１１及びフレーム１０１２を備える。インバータ１０００がこれらの構成要素以外の構成要素を備えてもよい。 The inverter 1000 illustrated in FIG. 1 comprises an inverter circuit 1010, at least one cooler 1011 and a frame 1012. The inverter 1000 may include components other than these components.
　インバータ回路１０１０には、直流及び制御用の信号が入力される。インバータ回路１０１０は、入力された信号にしたがって入力された直流をスイッチングし、三相交流を生成する。生成された三相交流は、インバータ回路１０１０から出力される。これにより、インバータ１０００は、直流を三相交流に変換する電力変換装置として動作する。冷却器１０１１は、インバータ回路１０１０が発生した熱を放熱する。インバータ回路１０１０に設けられた主要な部品及び冷却器１０１１は、支持体となるフレーム１０１２に固定され、フレーム１０１２により支持される。出力された三相交流は、電動機に供給される。生成された三相交流が電動機以外の負荷に供給されてもよい。インバータ１０００が三相交流以外の交流を生成してもよい。例えば、インバータ１０００が単相交流を生成してもよい。 The inverter circuit 1010 receives DC and control signals. The inverter circuit 1010 switches the direct current input according to the input signal to generate a three-phase alternating current. The generated three-phase alternating current is output from the inverter circuit 1010. Thus, inverter 1000 operates as a power converter that converts direct current into three-phase alternating current. The cooler 1011 dissipates the heat generated by the inverter circuit 1010. The main components provided in the inverter circuit 1010 and the cooler 1011 are fixed to a frame 1012 as a support and supported by the frame 1012. The output three-phase alternating current is supplied to the motor. The generated three-phase alternating current may be supplied to loads other than the motor. The inverter 1000 may generate an alternating current other than the three-phase alternating current. For example, inverter 1000 may generate a single phase alternating current.
　１．２　インバータ回路
　図２は、第１実施形態のインバータに設けられたインバータ回路における電気的接続を図示する接続図である。 1.2 Inverter Circuit FIG. 2 is a connection diagram illustrating an electrical connection in the inverter circuit provided in the inverter of the first embodiment.
　インバータ１０００は、図２に図示されるように、インバータ回路１０１０を構成する、ＤＣコネクタ１１００、平滑コンデンサ１１１０、ＤＣバスバ電極１１２０，１１２１，１１２２，１１２３，１１２４及び１１２５、信号端子コネクタ１１３０、信号配線１１４０、駆動回路基板１１５０及び１１６０、半導体パワーモジュール１１７０、ＡＣバスバ電極１１８０，１１８１及び１１８２、ＡＣコネクタ１１９０，１１９１及び１１９２並びに電流センサ１２００，１２０１及び１２０２を備える。インバータ回路１０１０がこれらの部品以外の部品を備えてもよい。 As illustrated in FIG. 2, the inverter 1000 configures an inverter circuit 1010, and includes a DC connector 1100, a smoothing capacitor 1110, DC bus bar electrodes 1120, 1121, 1122, 1123, 1124 and 1125, a signal terminal connector 1130, and signal wiring. 1140, a drive circuit board 1150 and 1160, a semiconductor power module 1170, AC bus bar electrodes 1180, 1181 and 1182, AC connectors 1190, 1191 and 1192 and current sensors 1200, 1201 and 1202. The inverter circuit 1010 may include components other than these components.
　ＤＣコネクタ１１００の入力端子１２１０及び１２１１は、それぞれ平滑コンデンサ１１１０の電極１２２０及び１２２１に接触する。これにより、入力端子１２１０及び１２１１は、それぞれ電極１２２０及び１２２１に電気的に接続される。 The input terminals 1210 and 1211 of the DC connector 1100 contact the electrodes 1220 and 1221 of the smoothing capacitor 1110, respectively. Thus, the input terminals 1210 and 1211 are electrically connected to the electrodes 1220 and 1221, respectively.
　平滑コンデンサ１１１０の電極１２３０，１２３１，１２３２，１２３３，１２３４及び１２３５は、それぞれＤＣバスバ電極１１２０，１１２１，１１２２，１１２３，１１２４及び１１２５の一方の端部に接触する。ＤＣバスバ電極１１２０，１１２１，１１２２，１１２３，１１２４及び１１２５の他方の端部は、それぞれ半導体パワーモジュール１１７０のＤＣ電極１２４０，１２４１，１２４２，１２４３，１２４４及び１２４５に接触する。これにより、電極１２３０，１２３１，１２３２，１２３３，１２３４及び１２３５は、それぞれＤＣバスバ電極１１２０，１１２１，１１２２，１１２３，１１２４及び１１２５を介してＤＣ電極１２４０，１２４１，１２４２，１２４３，１２４４及び１２４５に電気的に接続される。 The electrodes 1230, 1231, 1232, 1233, 1234 and 1235 of the smoothing capacitor 1110 contact one end of the DC bus bar electrodes 1120, 1121, 1122, 1123, 1124 and 1125 respectively. The other ends of the DC busbar electrodes 1120, 1121, 1122, 1123, 1124 and 1125 contact the DC electrodes 1240, 1241, 1242, 1243, 1244 and 1245 of the semiconductor power module 1170, respectively. As a result, the electrodes 1230, 1231, 1232, 1233, 1234 and 1235 are electrically connected to the DC electrodes 1240, 1241, 1242, 1243, 1244 and 1245 through the DC busbar electrodes 1120, 1121, 1122, 1123, 1124 and 1125 respectively. Connected.
　ＤＣバスバ電極１１２０，１１２２及び１１２４は、それぞれＵ相、Ｖ相及びＷ相用のＰ電極バスバである。ＤＣバスバ電極１１２１，１１２３及び１１２５は、それぞれＵ相、Ｖ相及びＷ相用のＮ電極バスバである。 The DC bus bar electrodes 1120, 1122 and 1124 are P electrode bus bars for U phase, V phase and W phase, respectively. The DC bus bar electrodes 1121, 1123 and 1125 are N electrode bus bars for U phase, V phase and W phase, respectively.
　半導体パワーモジュール１１７０のＡＣ電極１２５０，１２５１及び１２５２は、それぞれＡＣバスバ電極１１８０，１１８１及び１１８２の一方の端部に接触する。ＡＣバスバ電極１１８０，１１８１及び１１８２の他方の端部は、それぞれＡＣコネクタ１１９０の出力端子１２６０、ＡＣコネクタ１１９１の出力端子１２６１及びＡＣコネクタ１１９２の出力端子１２６２に接触する。これにより、ＡＣ電極１２５０，１２５１及び１２５２は、それぞれＡＣバスバ電極１１８０，１１８１及び１１８２を介して出力端子１２６０，１２６１及び１２６２に電気的に接続される。 The AC electrodes 1250, 1251 and 1252 of the semiconductor power module 1170 are in contact with one ends of the AC busbar electrodes 1180, 1181 and 1182, respectively. The other ends of the AC bus bar electrodes 1180, 1181 and 1182 contact the output terminal 1260 of the AC connector 1190, the output terminal 1261 of the AC connector 1191, and the output terminal 1262 of the AC connector 1192, respectively. Thus, the AC electrodes 1250, 1251 and 1252 are electrically connected to the output terminals 1260, 1261 and 1262 through the AC busbar electrodes 1180, 1181 and 1182, respectively.
　半導体パワーモジュール１１７０のＤＣ電極１２４０，１２４１，１２４２，１２４３，１２４４及び１２４５は、直流の入力端子となる。半導体パワーモジュール１１７０のＡＣ電極１２５０，１２５１及び１２５２は、交流の出力端子となる。 The DC electrodes 1240, 1241, 1242, 1243, 1244 and 1245 of the semiconductor power module 1170 serve as DC input terminals. The AC electrodes 1250, 1251 and 1252 of the semiconductor power module 1170 become an AC output terminal.
　信号端子コネクタ１１３０の複数の端子１２７０は、それぞれ複数の信号配線１１４０の一方の端部に接触する。複数の信号配線１１４０の他方の端部は、それぞれ駆動回路基板１１５０及び１１６０の複数の電極１２８０に接触する。これにより、複数の端子１２７０は、それぞれ複数の信号配線１１４０を介して複数の電極１２８０に電気的に接続される。 The plurality of terminals 1270 of the signal terminal connector 1130 are in contact with one ends of the plurality of signal wirings 1140, respectively. The other ends of the plurality of signal wirings 1140 contact the plurality of electrodes 1280 of the drive circuit boards 1150 and 1160, respectively. Thus, the plurality of terminals 1270 are electrically connected to the plurality of electrodes 1280 via the plurality of signal wirings 1140, respectively.
　ＤＣコネクタ１１００の入力端子１２１０及び１２１１には、高電圧の平滑前の直流が外部から入力される。ＤＣコネクタ１１００に外部から入力された平滑前の直流は、平滑コンデンサ１１１０の電極１２２０及び１２２１に入力され、平滑コンデンサ１１１０により平滑される。これにより、平滑コンデンサ１１１０が平滑後の直流を生成する。平滑後の直流は、平滑コンデンサ１１１０の電極１２３０及び１２３１から出力され、平滑コンデンサ１１１０の電極１２３２及び１２３３から出力され、平滑コンデンサ１１１０の電極１２３４及び１２３５から出力される。電極１２３０及び１２３１から出力された平滑後の直流は、ＤＣバスバ電極１１２０及び１１２１により伝送され、半導体パワーモジュール１１７０のＤＣ電極１２４０及び１２４１に入力される。電極１２３２及び１２３３から出力された平滑後の直流は、ＤＣバスバ電極１１２２及び１１２３により伝送され、半導体パワーモジュール１１７０のＤＣ電極１２４２及び１２４３に入力される。電極１２３４及び１２３５から出力された平滑後の直流は、ＤＣバスバ電極１１２４及び１１２５により伝送され、半導体パワーモジュール１１７０のＤＣ電極１２４４及び１２４５に入力される。これにより、半導体パワーモジュール１１７０によりスイッチングされる直流が平滑後の直流になる。 A direct current before high voltage smoothing is input from the outside to the input terminals 1210 and 1211 of the DC connector 1100. The direct current before smoothing input from the outside to the DC connector 1100 is input to the electrodes 1220 and 1221 of the smoothing capacitor 1110 and smoothed by the smoothing capacitor 1110. Thus, the smoothing capacitor 1110 generates a smoothed direct current. The smoothed direct current is output from the electrodes 1230 and 1231 of the smoothing capacitor 1110, is output from the electrodes 1232 and 1233 of the smoothing capacitor 1110, and is output from the electrodes 1234 and 1235 of the smoothing capacitor 1110. The smoothed direct current output from the electrodes 1230 and 1231 is transmitted by the DC bus bar electrodes 1120 and 1121, and input to the DC electrodes 1240 and 1241 of the semiconductor power module 1170. The smoothed direct current output from the electrodes 1232 and 1233 is transmitted by the DC bus bar electrodes 1122 and 1123 and input to the DC electrodes 1242 and 1243 of the semiconductor power module 1170. The smoothed direct current output from the electrodes 1234 and 1235 is transmitted by the DC bus bar electrodes 1124 and 1125 and input to the DC electrodes 1244 and 1245 of the semiconductor power module 1170. Thereby, the direct current switched by the semiconductor power module 1170 becomes the smoothed direct current.
　信号端子コネクタ１１３０の端子１２７０には、制御用の信号が外部から入力される。信号端子コネクタ１１３０に入力された信号は、信号配線１１４０により伝送され、駆動回路基板１１５０及び１１６０の電極１２８０に入力される。 A control signal is input from the outside to the terminal 1270 of the signal terminal connector 1130. The signal input to the signal terminal connector 1130 is transmitted by the signal wiring 1140 and input to the electrodes 1280 of the drive circuit boards 1150 and 1160.
　駆動回路基板１１５０及び１１６０は、入力された信号に基づいて半導体パワーモジュール１１７０を駆動する。半導体パワーモジュール１１７０は、駆動回路基板１１５０及び１１６０による駆動にしたがって、ＤＣ電極１２４０及び１２４１に入力された直流をスイッチングし、ＤＣ電極１２４２及び１２４３に入力された直流をスイッチングし、ＤＣ電極１２４４及び１２４５に入力された直流をスイッチングする。これより、半導体パワーモジュール１１７０が三相交流を生成する。生成された三相交流は、半導体パワーモジュール１１７０のＡＣ電極１２５０，１２５１及び１２５２から出力される。出力された三相交流は、ＡＣバスバ電極１１８０，１１８１及び１１８２により伝送され、ＡＣコネクタ１１９０の出力端子１２６０、ＡＣコネクタ１１９１の出力端子１２６１及びＡＣコネクタ１１９２の出力端子１２６２に入力される。入力された三相交流は、出力端子１２６０，１２６１及び１２６２から外部に出力される。インバータ１０００が単相交流を生成する場合は、インバータ１０００は、直流をスイッチングし単相交流を生成する半導体パワーモジュール、生成された単相交流を伝送するＡＣバスバ電極、及び伝送されてきた単相交流を外部に出力する出力端子を備える。より一般的には、インバータ１０００は、直流をスイッチングし交流を生成する半導体パワーモジュール、生成された交流を伝送するＡＣバスバ電極、及び伝送されてきた交流を外部に出力するＡＣコネクタを備える。 The drive circuit boards 1150 and 1160 drive the semiconductor power module 1170 based on the input signal. The semiconductor power module 1170 switches direct current input to the DC electrodes 1240 and 1241 and switches direct current input to the DC electrodes 1242 and 1243 according to driving by the drive circuit boards 1150 and 1160, and DC electrodes 1244 and 1245. Switch the direct current input to. Thus, the semiconductor power module 1170 generates a three-phase alternating current. The generated three-phase alternating current is output from the AC electrodes 1250, 1251 and 1252 of the semiconductor power module 1170. The output three-phase alternating current is transmitted by the AC bus bar electrodes 1180, 1181, and 1182, and is input to the output terminal 1260 of the AC connector 1190, the output terminal 1261 of the AC connector 1191, and the output terminal 1262 of the AC connector 1192. The input three-phase alternating current is output from the output terminals 1260, 1261 and 1262 to the outside. When the inverter 1000 generates a single-phase alternating current, the inverter 1000 is a semiconductor power module that switches direct current to generate a single-phase alternating current, an AC bus bar electrode that transmits the generated single-phase alternating current, and the transmitted single-phase alternating current It has an output terminal for outputting alternating current to the outside. More generally, the inverter 1000 includes a semiconductor power module that switches direct current and generates alternating current, an AC bus bar electrode that transmits the generated alternating current, and an AC connector that outputs the transmitted alternating current to the outside.
　電流センサ１２００，１２０１及び１２０２は、それぞれ、ＡＣバスバ電極１１８０，１１８１及び１１８２の上又は下に配置され、ＡＣバスバ電極１１８０，１１８１及び１１８２に流れる電流の大きさを検知する。検知された電流の大きさは、電動機に流れる電流を制御するために用いられる。 Current sensors 1200, 1201 and 1202 are disposed above or below AC busbar electrodes 1180, 1181 and 1182, respectively, and detect the magnitude of the current flowing through AC busbar electrodes 1180, 1181 and 1182. The magnitude of the detected current is used to control the current flowing to the motor.
　平滑コンデンサ１１１０の電極１２２０は、平滑前の直流を伝送するひとつのＤＣバスバを構成する。平滑コンデンサ１１１０の電極１２２１は、平滑前の直流を伝送するひとつのＤＣバスバを構成する。 The electrode 1220 of the smoothing capacitor 1110 constitutes one DC bus bar that transmits direct current before smoothing. The electrode 1221 of the smoothing capacitor 1110 constitutes one DC bus bar that transmits direct current before smoothing.
　平滑コンデンサ１１１０の電極１２３０、バスバ電極１１２０及び半導体パワーモジュール１１７０のＤＣ電極１２４０は、平滑後の直流を伝送するひとつのＤＣバスバを構成する。平滑コンデンサ１１１０の電極１２３１、バスバ電極１１２１及び半導体パワーモジュール１１７０のＤＣ電極１２４１は、平滑後の直流を伝送するひとつのＤＣバスバを構成する。平滑コンデンサ１１１０の電極１２３２、バスバ電極１１２２及び半導体パワーモジュール１１７０のＤＣ電極１２４２は、平滑後の直流を伝送するひとつのＤＣバスバを構成する。平滑コンデンサ１１１０の電極１２３３、バスバ電極１１２３及び半導体パワーモジュール１１７０のＤＣ電極１２４３は、平滑後の直流を伝送するひとつのＤＣバスバを構成する。平滑コンデンサ１１１０の電極１２３４、バスバ電極１１２４及び半導体パワーモジュール１１７０のＤＣ電極１２４４は、平滑後の直流を伝送するひとつのＤＣバスバを構成する。平滑コンデンサ１１１０の電極１２３５、バスバ電極１１２５及び半導体パワーモジュール１１７０のＤＣ電極１２４５は、平滑後の直流を伝送するひとつのＤＣバスバを構成する。 The electrode 1230 of the smoothing capacitor 1110, the bus bar electrode 1120, and the DC electrode 1240 of the semiconductor power module 1170 constitute one DC bus bar that transmits the smoothed direct current. The electrode 1231 of the smoothing capacitor 1110, the bus bar electrode 1121, and the DC electrode 1241 of the semiconductor power module 1170 constitute one DC bus bar that transmits the smoothed direct current. The electrode 1232 of the smoothing capacitor 1110, the bus bar electrode 1122, and the DC electrode 1242 of the semiconductor power module 1170 constitute one DC bus bar that transmits the smoothed direct current. The electrode 1233 of the smoothing capacitor 1110, the bus bar electrode 1123, and the DC electrode 1243 of the semiconductor power module 1170 constitute one DC bus bar that transmits the smoothed direct current. The electrode 1234 of the smoothing capacitor 1110, the bus bar electrode 1124, and the DC electrode 1244 of the semiconductor power module 1170 constitute one DC bus bar that transmits the smoothed direct current. The electrode 1235 of the smoothing capacitor 1110, the bus bar electrode 1125, and the DC electrode 1245 of the semiconductor power module 1170 constitute one DC bus bar that transmits the smoothed direct current.
　半導体パワーモジュール１１７０のＡＣ電極１２５０及びＡＣバスバ電極１１８０は、交流を伝送するひとつのＡＣバスバを構成する。半導体パワーモジュール１１７０のＡＣ電極１２５１及びＡＣバスバ電極１１８１は、交流を伝送するひとつのＡＣバスバを構成する。半導体パワーモジュール１１７０のＡＣ電極１２５２及びＡＣバスバ電極１１８２は、交流を伝送するひとつのＡＣバスバを構成する。 The AC electrode 1250 and the AC bus bar electrode 1180 of the semiconductor power module 1170 constitute one AC bus bar transmitting an alternating current. The AC electrode 1251 and the AC bus bar electrode 1181 of the semiconductor power module 1170 constitute one AC bus bar transmitting an alternating current. The AC electrode 1252 and the AC bus bar electrode 1182 of the semiconductor power module 1170 constitute one AC bus bar transmitting an alternating current.
　１．３　フレーム
　図３は、第１実施形態のインバータに設けられたフレームを模式的に図示する斜視図である。 1.3 Frame FIG. 3 is a perspective view schematically illustrating a frame provided in the inverter of the first embodiment.
　フレーム１０１２は、図３に図示されるように、柱１３００，１３０１，１３０２及び１３０３、梁１３１０，１３１１，１３１２，１３１３，１３１４，１３１５，１３１６及び１３１７、側板１３２０及び１３２１並びに底板１３３０及び１３３１を含む複数のフレームメンバーを備える。フレーム１０１２は、当該複数のフレームメンバーを組み合わせて構成される。当該複数のフレームメンバーは、柱１３００，１３０１，１３０２及び１３０３並びに梁１３１０，１３１１，１３１２，１３１３，１３１４，１３１５，１３１６及び１３１７を含む複数の棒状のフレームメンバーを含む。 The frame 1012 includes pillars 1300, 1301, 1302 and 1303, beams 1310, 1311, 1312, 1313, 1314, 1316 and 1317, side plates 1320 and 1321, and bottom plates 1330 and 1331, as shown in FIG. It has a plurality of frame members. The frame 1012 is configured by combining the plurality of frame members. The plurality of frame members includes a plurality of rod-like frame members including pillars 1300, 1301, 1302 and 1303 and beams 1310, 1311, 1312, 1313, 1314, 1315, 1316 and 1317.
　柱１３００，１３０１，１３０２及び１３０３は、第１の方向Ｄ１に延びる第１の棒状のフレームメンバーである。なお、本実施形態では柱の数を４本としたが、柱の数が増減されてもよい。 The pillars 1300, 1301, 1302, and 1303 are first rod-like frame members extending in the first direction D1. Although the number of columns is four in the present embodiment, the number of columns may be increased or decreased.
　梁１３１０，１３１１，１３１２，１３１３，１３１４，１３１５，１３１６及び１３１７は、第２の方向Ｄ２に延びる第２の棒状のフレームメンバーである。第２の方向Ｄ２は、第１の方向Ｄ１と異なる方向であり、例えば第１の方向Ｄ１と垂直をなす方向である。なお、本実施形態では梁の数を８本としたが、梁の数が増減されてもよい。 Beams 1310, 1311, 1312, 1313, 1314, 1315, 1316 and 1317 are second rod-like frame members extending in the second direction D2. The second direction D2 is a direction different from the first direction D1, and is, for example, a direction perpendicular to the first direction D1. Although the number of beams is eight in the present embodiment, the number of beams may be increased or decreased.
　側板１３２０及び１３２１は、広がり方向である第１の方向Ｄ１及び第３の方向Ｄ３に広がる面を有する板状のフレームメンバーである。第３の方向Ｄ３は、第１の方向Ｄ１及び第２の方向Ｄ２と異なる方向であり、例えば第１の方向Ｄ１及び第２の方向Ｄ２と垂直をなす方向である。当該面は、主面である。なお、本実施形態では側板の数を２枚としたが、側板の数が増減されてもよい。 The side plates 1320 and 1321 are plate-like frame members having surfaces extending in the first direction D1 and the third direction D3 which are the spreading directions. The third direction D3 is a direction different from the first direction D1 and the second direction D2, and is, for example, a direction perpendicular to the first direction D1 and the second direction D2. The said surface is a main surface. Although the number of side plates is two in the present embodiment, the number of side plates may be increased or decreased.
　底板１３３０及び１３３１は、広がり方向である第２の方向Ｄ２及び第３の方向Ｄ３に広がる面を有する板状のフレームメンバーである。当該面は、主面である。底板の数が増減されてもよい。 The bottom plates 1330 and 1331 are plate-like frame members having surfaces extending in the second direction D2 and the third direction D3 which are the spreading directions. The said surface is a main surface. The number of bottom plates may be increased or decreased.
　側板１３２０は、第２の方向Ｄ２の第１の位置にある。柱１３００及び１３０２は、第２の方向Ｄ２の第２の位置にある。柱１３０１及び１３０３は、第２の方向Ｄ２の第３の位置にある。側板１３２１は、第２の方向Ｄ２の第４の位置にある。第２の方向Ｄ２の第１の位置、第２の位置、第３の位置及び第４の位置は、互いに異なる。柱１３００及び１３０１は、第３の方向Ｄ３の第１の位置にある。柱１３０２及び１３０３は、第３の方向Ｄ３の第２の位置にある。第３の方向Ｄ３の第１の位置及び第２の位置は、互いに異なる。 The side plate 1320 is at a first position in the second direction D2. The pillars 1300 and 1302 are in the second position in the second direction D2. The pillars 1301 and 1303 are at a third position in the second direction D2. The side plate 1321 is at a fourth position in the second direction D2. The first position, the second position, the third position and the fourth position in the second direction D2 are different from each other. The pillars 1300 and 1301 are in the first position in the third direction D3. The pillars 1302 and 1303 are in the second position in the third direction D3. The first position and the second position in the third direction D3 are different from each other.
　梁１３１０及び１３１１並びに底板１３３０及び１３３１は、第１の方向Ｄ１の第１の位置にある。梁１３１２及び１３１３は、第１の方向Ｄ１の第２の位置にある。梁１３１４及び１３１５は、第１の方向Ｄ１の第３の位置にある。梁１３１６及び１３１７は、第１の方向Ｄ１の第４の位置にある。第１の方向Ｄ１の第１の位置、第２の位置、第３の位置及び第４の位置は、互いに異なる。梁１３１０，１３１２，１３１４及び１３１６は、第３の方向Ｄ３の第１の位置にある。梁１３１１，１３１３，１３１５及び１３１７は、第３の方向Ｄ３の第２の位置にある。 The beams 1310 and 1311 and the bottom plates 1330 and 1331 are at a first position in the first direction D1. Beams 1312 and 1313 are at a second position in a first direction D1. Beams 1314 and 1315 are at a third position in the first direction D1. Beams 1316 and 1317 are at a fourth position in the first direction D1. The first position, the second position, the third position and the fourth position in the first direction D1 are different from each other. Beams 1310, 1312, 1314 and 1316 are in a first position in a third direction D3. Beams 1311, 1313, 1315 and 1317 are at a second position in the third direction D3.
　梁１３１０は、柱１３００及び１３０１並びに側板１３２０及び１３２１に固定され、柱１３００及び１３０１並びに側板１３２０及び１３２１により支持される。梁１３１１は、柱１３０２及び１３０３並びに側板１３２０及び１３２１に固定され、柱１３０２及び１３０３並びに側板１３２０及び１３２１により支持される。 The beam 1310 is fixed to the columns 1300 and 1301 and the side plates 1320 and 1321, and is supported by the columns 1300 and 1301 and the side plates 1320 and 1321. The beam 1311 is fixed to the columns 1302 and 1303 and the side plates 1320 and 1321, and is supported by the columns 1302 and 1303 and the side plates 1320 and 1321.
　底板１３３０は、第３の方向Ｄ３に広がり、底板１３３０の第３の方向Ｄ３の一方の端部及び他方の端部は、それぞれフレーム１０１２の外周にある梁１３１０及び１３１１に固定される。これにより、底板１３３０は、梁１３１０及び１３１１により支持される。底板１３３０が、梁１３１０及び１３１１を介さずに柱１３００及び１３０２並びに側板１３２０に固定されてもよい。底板１３３１は、第３の方向Ｄ３に広がり、底板１３３１の第３の方向Ｄ３の一方の端部及び他方の端部は、それぞれフレーム１０１２の外周にある梁１３１０及び１３１１に固定される。これにより、底板１３３１は、梁１３１０及び１３１１により支持される。底板１３３１が、梁１３１０及び１３１１を介さずに柱１３００，１３０１，１３０２及び１３０３並びに側板１３２１に固定されてもよい。 The bottom plate 1330 extends in the third direction D3, and one end and the other end of the bottom plate 1330 in the third direction D3 are fixed to beams 1310 and 1311 on the outer periphery of the frame 1012, respectively. Thus, the bottom plate 1330 is supported by the beams 1310 and 1311. The bottom plate 1330 may be fixed to the pillars 1300 and 1302 and the side plate 1320 without the beams 1310 and 1311. The bottom plate 1331 extends in the third direction D3, and one end and the other end of the bottom plate 1331 in the third direction D3 are fixed to beams 1310 and 1311 on the outer periphery of the frame 1012, respectively. Thus, the bottom plate 1331 is supported by the beams 1310 and 1311. The bottom plate 1331 may be fixed to the columns 1300, 1301, 1302 and 1303 and the side plate 1321 without the beams 1310 and 1311.
　梁１３１２及び１３１４は、柱１３００及び１３０１並びに側板１３２１に固定され、柱１３００及び１３０１並びに側板１３２１により支持される。梁１３１３及び１３１５は、柱１３０２及び１３０３並びに側板１３２１に固定され、柱１３０２及び１３０３並びに側板１３２１により支持される。梁１３１６は、柱１３００及び１３０１並びに側板１３２０及び１３２１に固定され、柱１３００及び１３０１並びに側板１３２０及び１３２１により支持される。梁１３１７は、柱１３０２及び１３０３並びに側板１３２０及び１３２１に固定され、柱１３０２及び１３０３並びに側板１３２０及び１３２１により支持される。 Beams 1312 and 1314 are fixed to pillars 1300 and 1301 and side plate 1321 and supported by pillars 1300 and 1301 and side plate 1321. Beams 1313 and 1315 are fixed to columns 1302 and 1303 and side plate 1321 and supported by columns 1302 and 1303 and side plate 1321. The beam 1316 is fixed to the pillars 1300 and 1301 and the side plates 1320 and 1321, and is supported by the pillars 1300 and 1301 and the side plates 1320 and 1321. The beam 1317 is fixed to the columns 1302 and 1303 and the side plates 1320 and 1321, and is supported by the columns 1302 and 1303 and the side plates 1320 and 1321.
　フレーム１０１２は、柱１３００，１３０１，１３０２及び１３０３並びに梁１３１０，１３１１，１３１２，１３１３，１３１４，１３１５，１３１６及び１３１７を含む複数の棒状のフレームメンバーを備える。このため、フレーム１０１２には、棒状のフレームメンバーを含む複数のフレームメンバーに囲まれる開口部１３４０が形成される。開口部１３４０により、フレーム１０１２の外部から開口部１３４０を経由してフレーム１０１２の内部に到達すること、及びフレーム１０１２の内部から開口部１３４０を経由してフレーム１０１２の外部に到達することが容易になる。これにより、インバータ１０００を組み立てる際にフレーム１０１２の外部から開口部１３４０を経由してフレーム１０１２の内部に工具等を差し込む作業が容易になり、必要に応じて配線等をフレーム１０１２の内部から開口部１３４０を経由してフレーム１０１２の外部に引き出すことが容易になる。 The frame 1012 comprises a plurality of rod-like frame members including pillars 1300, 1301, 1302 and 1303 and beams 1310, 1311, 1312, 1313, 1314, 1315, 1316 and 1317. For this reason, the frame 1012 is formed with an opening 1340 surrounded by a plurality of frame members including rod-like frame members. The opening 1340 makes it easy to reach the inside of the frame 1012 from the outside of the frame 1012 via the opening 1340 and to reach the outside of the frame 1012 from the inside of the frame 1012 via the opening 1340. Become. This makes it easy to insert a tool or the like from the outside of the frame 1012 through the opening 1340 into the interior of the frame 1012 when assembling the inverter 1000, and allows wiring etc. to be opened from the inside of the frame 1012 as necessary. It is easy to pull it out of the frame 1012 via 1340.
　第１の方向Ｄ１は、例えば鉛直方向であり、第２の方向Ｄ２及び第３の方向Ｄ３は、例えば水平方向である。しかし、第１の方向Ｄ１、第２の方向Ｄ２及び第３の方向Ｄ３がこれらの方向とは異なる方向であってもよい。 The first direction D1 is, for example, the vertical direction, and the second direction D2 and the third direction D3 are, for example, the horizontal direction. However, the first direction D1, the second direction D2, and the third direction D3 may be different from these directions.
　１．４　半導体パワーモジュールの冷却
　図４は、第１実施形態のインバータの上面を模式的に図示する上面図である。図５、図６、図７、図８、図９及び図１０は、第１実施形態のインバータの断面を模式的に図示する断面図である。図５、図６、図７、図８、図９及び図１０に図示される断面は、それぞれ図４の切断線Ａ－Ａ，Ｂ－Ｂ，Ｃ－Ｃ，Ｄ－Ｄ，Ｅ－Ｅ及びＦ－Ｆの位置における断面である。 1.4 Cooling of Semiconductor Power Module FIG. 4 is a top view schematically illustrating the top of the inverter according to the first embodiment. 5, 6, 7, 8, 9, and 10 are cross-sectional views schematically showing cross sections of the inverter of the first embodiment. The cross sections shown in FIG. 5, FIG. 6, FIG. 7, FIG. 8, FIG. 9, and FIG. 10 respectively correspond to the cutting lines AA, BB, CC, DD, EE and FIG. It is a cross section in the position of FF.
　半導体パワーモジュール１１７０は、図７、図８及び図１０に図示されるように、板形状であり、被冷却面１４００を有する。被冷却面１４００は、半導体パワーモジュール１１７０の一方の主面となる裏面である。 The semiconductor power module 1170 is plate-shaped and has a surface to be cooled 1400 as shown in FIGS. 7, 8 and 10. The cooled surface 1400 is a back surface to be one main surface of the semiconductor power module 1170.
　少なくともひとつの冷却器１０１１は、１個の冷却器である。冷却器１０１１は、半導体パワーモジュール１１７０の被冷却面１４００に取り付けられ、被冷却面１４００を冷却する。これにより、少なくともひとつの冷却器１０１１は、半導体パワーモジュール１１７０を冷却する。 At least one cooler 1011 is a single cooler. The cooler 1011 is attached to the surface to be cooled 1400 of the semiconductor power module 1170 and cools the surface to be cooled 1400. Accordingly, at least one cooler 1011 cools the semiconductor power module 1170.
　被冷却面１４００が半導体パワーモジュール１１７０の他方の主面である表面であってもよい。また、板形状の半導体パワーモジュール１１７０が板形状でない半導体パワーモジュールに置き換えられ、冷却器１０１１が板形状でない半導体パワーモジュールを冷却してもよい。冷却器の数が増加させられてもよい。 The surface to be cooled 1400 may be the other main surface of the semiconductor power module 1170. Alternatively, the plate-shaped semiconductor power module 1170 may be replaced with a non-plate-shaped semiconductor power module, and the cooler 1011 may cool the non-plate-shaped semiconductor power module. The number of coolers may be increased.
　１．５　部品の固定
　ＤＣコネクタ１１００、平滑コンデンサ１１１０、信号端子コネクタ１１３０、信号配線１１４０、駆動回路基板１１５０及び１１６０、ＡＣバスバ電極１１８０，１１８１及び１１８２、ＡＣコネクタ１１９０，１１９１及び１１９２並びに電流センサ１２００，１２０１及び１２０２は、図４から図１０に図示されるように、フレーム１０１２に固定され、フレーム１０１２により支持される。ただし、これらの部品に含まれる主要な部品がフレーム１０１２に固定されるにとどまる場合もある。例えば、ＤＣバスバ電極１１２０，１１２１，１１２２，１１２３，１１２４及び１１２５並びに半導体パワーモジュール１１７０に含まれる部品の少なくとも一部がフレーム１０１２に固定されてもよい。また、信号配線１１４０、ＡＣバスバ電極１１８０，１１８１及び１１８２等のフレーム１０１２に埋め込むことができる部品が、フレーム１０１２に埋め込まれてもよい。したがって、ＤＣコネクタ１１００、平滑コンデンサ１１１０、ＤＣバスバ電極１１２０，１１２１，１１２２，１１２３，１１２４及び１１２５、信号端子コネクタ１１３０、信号配線１１４０、駆動回路基板１１５０及び１１６０、半導体パワーモジュール１１７０、ＡＣバスバ電極１１８０，１１８１及び１１８２、ＡＣコネクタ１１９０，１１９１及び１１９２並びに電流センサ１２００，１２０１及び１２０２からなる群より選択される少なくともひとつの部品は、フレーム１０１２に固定されるか、又は埋め込まれる。 1.5 Fixing of parts DC connector 1100, smoothing capacitor 1110, signal terminal connector 1130, signal wiring 1140, drive circuit boards 1150 and 1160, AC bus bar electrodes 1180, 1181 and 1182, AC connectors 1190, 1191 and 1192 and current sensor 1200 1201 and 1202 are fixed to the frame 1012 and supported by the frame 1012 as illustrated in FIGS. 4 to 10. However, the main parts included in these parts may remain fixed to the frame 1012. For example, at least a portion of the components included in the DC bus bar electrodes 1120, 1121, 1122, 1123, 1124 and 1125 and the semiconductor power module 1170 may be fixed to the frame 1012. In addition, components that can be embedded in the frame 1012 such as the signal wiring 1140 and the AC bus bar electrodes 1180, 1181 and 1182 may be embedded in the frame 1012. Therefore, DC connector 1100, smoothing capacitor 1110, DC bus bar electrodes 1120, 1121, 1122, 1123, 1124 and 1125, signal terminal connector 1130, signal wiring 1140, drive circuit boards 1150 and 1160, semiconductor power module 1170, AC bus bar electrode 1180 , 1181 and 1182, AC connectors 1190, 1191 and 1192 and current sensors 1200, 1201 and 1202 are at least one component selected or fixed to the frame 1012.
　半導体パワーモジュール１１７０が実装された冷却器１０１１も、図７、図８及び図１０に図示されるように、フレーム１０１２に固定され、フレーム１０１２により支持される。 The cooler 1011 on which the semiconductor power module 1170 is mounted is also fixed to the frame 1012 and supported by the frame 1012 as illustrated in FIGS. 7, 8 and 10.
　ＤＣコネクタ１１００は、図７及び図８に図示されるように、側板１３２０に形成された開口部１４１０に挿入される。これにより、ＤＣコネクタ１１００は、側板１３２０に固定され、側板１３２０により支持される。 The DC connector 1100 is inserted into the opening 1410 formed in the side plate 1320 as illustrated in FIGS. 7 and 8. Thus, the DC connector 1100 is fixed to the side plate 1320 and supported by the side plate 1320.
　平滑コンデンサ１１１０は、図６、図７、図８及び図９に図示されるように、底板１３３０の上面に固定される。これにより、平滑コンデンサ１１１０は、底板１３３０に固定され、底板１３３０により支持される。 The smoothing capacitor 1110 is fixed to the upper surface of the bottom plate 1330 as illustrated in FIGS. 6, 7, 8 and 9. Thereby, the smoothing capacitor 1110 is fixed to the bottom plate 1330 and supported by the bottom plate 1330.
　ＡＣバスバ電極１１８１は、図８に図示されるように、側板１３２１に設けられた突起１４２０の先端に固定される。これにより、ＡＣバスバ電極１１８１は、側板１３２１に固定され、側板１３２１により支持される。ＡＣバスバ電極１１８０及び１１８２も、側板１３２１に設けられた突起の先端に固定される。これにより、ＡＣバスバ電極１１８０及び１１８２も、側板１３２１に固定され、側板１３２１により支持される。ただし、ＡＣバスバ電極１１８０，１１８１及び１１８２が、梁に固定されてもよい。 The AC bus bar electrode 1181 is fixed to the tip of a protrusion 1420 provided on the side plate 1321 as illustrated in FIG. Thus, the AC bus bar electrode 1181 is fixed to the side plate 1321 and supported by the side plate 1321. AC bus bar electrodes 1180 and 1182 are also fixed to the tips of the projections provided on the side plate 1321. Thus, the AC bus bar electrodes 1180 and 1182 are also fixed to the side plate 1321 and supported by the side plate 1321. However, the AC bus bar electrodes 1180, 1181, and 1182 may be fixed to the beam.
　ＡＣコネクタ１１９１は、図７及び図８に図示されるように、側板１３２１に形成された開口部１４３１に挿入される。これにより、ＡＣコネクタ１１９１は、側板１３２１に固定され、側板１３２１により支持される。ＡＣコネクタ１１９０及び１１９２も、それぞれ、図３に図示される、側板１３２１に形成された開口部１４３０及び１４３２に挿入される。これにより、ＡＣコネクタ１１９０及び１１９２は、側板１３２１に固定され、側板１３２１により支持される。 The AC connector 1191 is inserted into an opening 1431 formed in the side plate 1321 as illustrated in FIGS. 7 and 8. Thus, the AC connector 1191 is fixed to the side plate 1321 and supported by the side plate 1321. AC connectors 1190 and 1192 are also inserted into openings 1430 and 1432 formed in side plate 1321, respectively, as illustrated in FIG. Thus, the AC connectors 1190 and 1192 are fixed to the side plate 1321 and supported by the side plate 1321.
　信号端子コネクタ１１３０は、図５及び図１０に図示されるように、梁１３１７の上面に固定される。これにより、信号端子コネクタ１１３０は、梁１３１７に固定され、梁１３１７により支持される。 The signal terminal connector 1130 is fixed to the top surface of the beam 1317 as illustrated in FIGS. 5 and 10. Thus, the signal terminal connector 1130 is fixed to the beam 1317 and supported by the beam 1317.
　信号配線１１４０は、図５及び図１０に図示されるように、梁１３１７を貫通する。これにより、信号配線１１４０は、梁１３１７に固定され、梁１３１７により支持される。 The signal wires 1140 pass through the beams 1317 as illustrated in FIGS. Thus, the signal wiring 1140 is fixed to the beam 1317 and supported by the beam 1317.
　フレーム１０１２に磁性体粉又は金属粉が混入されてもよい。又は、フレーム１０１２に巻かれた磁性体箔又は金属箔により信号配線１１４０が囲まれてもよい。これにより、電気シールド効果が生じ、磁性体粉等により（フレームの内と外とで）電磁場が遮蔽され、信号配線１１４０に対するノイズの出入りが規制され、インバータ１０００の電気的動作が安定する。 Magnetic powder or metal powder may be mixed in the frame 1012. Alternatively, the signal wire 1140 may be surrounded by magnetic foil or metal foil wound around the frame 1012. As a result, an electric shielding effect is generated, and the electromagnetic field is shielded (at the inside and the outside of the frame) by the magnetic powder or the like, and the noise ingress to the signal wiring 1140 is restricted, and the electrical operation of the inverter 1000 is stabilized.
　電流センサ１２０１は、図８に図示されるように、側板１３２１に設けられた突起１４２０の先端に固定される。これにより、電流センサ１２０１は、側板１３２１に固定され、側板１３２１により支持される。電流センサ１２００及び１２０２も、側板１３２１に設けられた突起の先端に固定される。これにより、電流センサ１２００及び１２０２も、側板１３２１に固定され、側板１３２１により支持される。電流センサ１２００，１２０１及び１２０２が梁に固定されてもよい。 The current sensor 1201 is fixed to the tip of a protrusion 1420 provided on the side plate 1321 as illustrated in FIG. Thus, the current sensor 1201 is fixed to the side plate 1321 and supported by the side plate 1321. The current sensors 1200 and 1202 are also fixed to the tips of the protrusions provided on the side plate 1321. Thus, the current sensors 1200 and 1202 are also fixed to the side plate 1321 and supported by the side plate 1321. Current sensors 1200, 1201 and 1202 may be fixed to the beam.
　駆動回路基板１１５０の一方の端部及び他方の端部は、図１０に図示されるように、それぞれ梁１３１４及び１３１５の上面に固定される。これにより、駆動回路基板１１５０は、梁１３１４及び１３１５に固定され、梁１３１４及び１３１５により支持される。 One end and the other end of the drive circuit board 1150 are fixed to the top surfaces of beams 1314 and 1315, respectively, as illustrated in FIG. Thus, the drive circuit board 1150 is fixed to the beams 1314 and 1315 and supported by the beams 1314 and 1315.
　駆動回路基板１１６０の一方の端部及び他方の端部は、図１０に図示されるように、それぞれ梁１３１２及び１３１３の上面に固定される。これにより、駆動回路基板１１６０は、梁１３１２及び１３１３に固定され、梁１３１２及び１３１３により支持される。 One end and the other end of the drive circuit board 1160 are fixed to the top surfaces of beams 1312 and 1313, respectively, as shown in FIG. Thus, the drive circuit board 1160 is fixed to the beams 1312 and 1313 and supported by the beams 1312 and 1313.
　冷却器１０１１は、図６、図７、図８及び図１０に図示されるように、底板１３３１の上面に固定される。これにより、冷却器１０１１は、底板１３３１に固定され、底板１３３１により支持される。 The cooler 1011 is fixed to the upper surface of the bottom plate 1331 as illustrated in FIG. 6, FIG. 7, FIG. 8 and FIG. Thus, the cooler 1011 is fixed to the bottom plate 1331 and supported by the bottom plate 1331.
　互いに分離された底板１３３０及び１３３１が一体化された底板に置き換えられ、平滑コンデンサ１１１０及び冷却器１０１１が一体化された底板に固定されてもよい。 The bottom plates 1330 and 1331 separated from each other may be replaced with an integrated bottom plate, and the smoothing capacitor 1110 and the cooler 1011 may be fixed to the integrated bottom plate.
　半導体パワーモジュール１１７０は、図７、図８及び図１０に図示されるように、冷却器１０１１の上面に固定される。これにより、半導体パワーモジュール１１７０は、冷却器１０１１に固定され、冷却器１０１１により支持される。 The semiconductor power module 1170 is fixed to the upper surface of the cooler 1011 as illustrated in FIGS. 7, 8 and 10. Thus, the semiconductor power module 1170 is fixed to the cooler 1011 and supported by the cooler 1011.
　図１１は、第１実施形態の第１変形例のインバータに設けられた半導体パワーモジュール、冷却器及びフレームの断面を模式的に図示する断面図である。 FIG. 11 is a cross-sectional view schematically illustrating a cross section of the semiconductor power module, the cooler, and the frame provided in the inverter according to the first modification of the first embodiment.
　第１実施形態の第１変形例のインバータ１０００においては、図１１に図示されるように、フレーム１０１２が梁１４４０をさらに備え、冷却器１０１１により冷却される半導体パワーモジュール１１７０が梁１４４０に固定される。このように半導体パワーモジュール１１７０がフレーム１０１２に直接的に固定されてもよい。 In the inverter 1000 according to the first modification of the first embodiment, as illustrated in FIG. 11, the frame 1012 further includes a beam 1440, and the semiconductor power module 1170 cooled by the cooler 1011 is fixed to the beam 1440. Ru. Thus, the semiconductor power module 1170 may be directly fixed to the frame 1012.
　１．６　フレームへの固定の利点
　一般的に言って、複数の棒状のフレームメンバーを含む複数のフレームメンバーを組み合わせて構成されるフレームは、部品が固定されるフレームメンバーを配置する位置に対する制約が小さいという特徴を有する。このため、当該フレームに部品が固定される場合は、部品を配置する位置に対する制約が小さくなる。例えば、複数の柱及び複数の梁を組み合わせて構成されるフレームに設けられた柱に部品が固定される場合は、部品が固定される柱を配置する水平位置に対する制約が小さいため、部品を配置する位置に対する制約が小さくなる。また、当該フレームに設けられた梁に部品が固定される場合は、柱を配置する水平位置に対する制約が小さく、梁を柱に固定する鉛直位置に対する制約が小さいため、部品を配置する位置に対する制約が小さくなる。部品を配置する位置に対する制約の小ささにより、部品を固定することが容易になる。また、複数の部品の間の隙間が小さくなるように複数の部品を配置することが容易になる。特に、大きな部品とそれに隣接する部品との間の隙間が小さくなるように大きな部品及びそれに隣接する部品を配置することが容易になる。また、フレームの外側から離れたフレームの中心部に部品を配置することが容易になる。これにより、インバータを小型化することが容易になり、インバータの製造に要するコストを減らすことが容易になる。 1.6 Advantages of Fixing to Frames Generally speaking, a frame configured by combining a plurality of frame members including a plurality of rod-like frame members has a restriction on a position at which a frame member to which a part is fixed is arranged. It has the feature of being small. For this reason, when the part is fixed to the frame, the restriction on the position at which the part is arranged is reduced. For example, when a component is fixed to a column provided in a frame configured by combining a plurality of columns and a plurality of beams, the restriction on the horizontal position for arranging the column to which the component is fixed is small. There is less restriction on the location of In addition, when the component is fixed to the beam provided in the frame, the restriction on the horizontal position where the column is arranged is small, and the restriction on the vertical position where the beam is fixed to the column is small. Becomes smaller. The small constraint on the position of the part makes it easy to fix the part. In addition, it becomes easy to arrange the plurality of parts so that the gap between the plurality of parts is reduced. In particular, it becomes easy to arrange the large component and the adjacent component so that the gap between the large component and the adjacent component is reduced. Also, it becomes easy to place the components in the center of the frame remote from the outside of the frame. As a result, it becomes easy to miniaturize the inverter, and it becomes easy to reduce the cost required to manufacture the inverter.
　具体的に言って、インバータ１０００においては、平滑コンデンサ１１１０、信号端子コネクタ１１３０、信号配線１１４０、駆動回路基板１１５０及び１１６０、ＡＣバスバ電極１１８０，１１８１及び１１８２、ＡＣコネクタ１１９０，１１９１及び１１９２並びに電流センサ１２００，１２０１及び１２０２を固定することが容易になる。また、これらの部品の間の隙間が小さくなるようにこれらの部品を配置することが容易になる。また、フレーム１０１２の外側から離れたフレーム１０１２の中心部にこれらの部品の少なくとも一部を配置することが容易になる。これにより、インバータ１０００を小型化することが容易になり、インバータ１０００の製造に要するコストを減らすことが容易になる。 Specifically, in the inverter 1000, the smoothing capacitor 1110, the signal terminal connector 1130, the signal wiring 1140, the drive circuit boards 1150 and 1160, the AC bus bar electrodes 1180, 1181 and 1182, the AC connectors 1190, 1191 and 1192 and the current sensor It becomes easy to fix 1200, 1201 and 1202. Also, it becomes easy to arrange these parts so that the gap between these parts is small. In addition, it becomes easy to arrange at least a part of these components in the center of the frame 1012 remote from the outside of the frame 1012. As a result, it becomes easy to miniaturize the inverter 1000, and it becomes easy to reduce the cost required to manufacture the inverter 1000.
　また、インバータ１０００においては、平滑コンデンサ１１１０、信号端子コネクタ１１３０、信号配線１１４０、駆動回路基板１１５０及び１１６０、ＡＣバスバ電極１１８０，１１８１及び１１８２、ＡＣコネクタ１１９０，１１９１及び１１９２並びに電流センサ１２００，１２０１及び１２０２が、フレーム１０１２に固定され、冷却器１０１１に固定されない。特に、これらの部品に含まれる冷却を要しない部品は、フレーム１０１２に固定されればよく、冷却器１０１１に固定される必要はない。このため、冷却器１０１１は、これらの部品を支持する支持体でなくてもよく、これらの部品が固定される部分を有しなくてもよい。 In inverter 1000, smoothing capacitor 1110, signal terminal connector 1130, signal wiring 1140, drive circuit boards 1150 and 1160, AC bus bar electrodes 1180, 1181 and 1182, AC connectors 1190, 1191 and 1192, current sensors 1200 and 1201, and 1202 is fixed to the frame 1012 and not fixed to the cooler 1011. In particular, parts that do not require cooling, which are included in these parts, may be fixed to the frame 1012, and need not be fixed to the cooler 1011. For this reason, the cooler 1011 may not be a support for supporting these components, and may not have a portion to which these components are fixed.
　これらの部品が固定される部分を冷却器１０１１が有しなくてもよいことにより、冷却器１０１１を半導体パワーモジュール１１７０より大きくする必要がなくなり、冷却器１０１１を小型化、軽量化及び低コスト化することが容易になる。これにより、インバータ１０００を小型化することが容易になり、インバータ１０００の製造に要するコストを減らすことが容易になる。冷却器１０１１が金属からなり箱状の形状を有する場合は、この利点がより顕著になる。 Since the cooler 1011 does not have to have a part to which these parts are fixed, it is not necessary to make the cooler 1011 larger than the semiconductor power module 1170, and the cooler 1011 can be miniaturized, reduced in weight and cost. It will be easier to do. As a result, it becomes easy to miniaturize the inverter 1000, and it becomes easy to reduce the cost required to manufacture the inverter 1000. If the cooler 1011 is made of metal and has a box-like shape, this advantage is more pronounced.
　また、インバータ１０００においては、冷却器１０１１がフレーム１０１２に固定される。このため、冷却器１０１１をインバータケースに固定する、又はインバータケースと一体化する必要がない。冷却器１０１１をインバータケースに固定する、又はインバータケースと一体化する必要がないことにより、互いに異なる複数のインバータケースにそれぞれ収容される複数のインバータに要求される電気容量が同程度である場合は、当該複数のインバータを共通化できる。これにより、量産効果によりインバータ１０００の製造に要するコストを減らすことが容易になる。互いに異なる複数のインバータケースの各インバータケースにインバータ１０００が収容される例は、後述する第１０実施形態、第１１実施形態、第１２実施形態及び第１３実施形態において説明する。 Further, in the inverter 1000, the cooler 1011 is fixed to the frame 1012. Therefore, it is not necessary to fix the cooler 1011 to the inverter case or to integrate it with the inverter case. When it is not necessary to fix the cooler 1011 to the inverter case or to integrate it with the inverter case, the electric capacities required for the plurality of inverters respectively accommodated in the plurality of different inverter cases are approximately the same. The plurality of inverters can be shared. As a result, it is easy to reduce the cost required to manufacture the inverter 1000 by the mass production effect. An example in which the inverter 1000 is accommodated in each inverter case of a plurality of different inverter cases will be described in tenth, eleventh, twelfth, and thirteenth embodiments described later.
　また、インバータ１０００においては、ＡＣバスバ電極１１８１及び電流センサ１２０１の両方が位置合わせ用の突起１４２０に固定される。これにより、ＡＣバスバ電極１１８１と電流センサ１２０１との位置合わせを容易に行うことができる。同様に、ＡＣバスバ電極１１８０と電流センサ１２００との位置合わせを容易に行うことができ、ＡＣバスバ電極１１８２と電流センサ１２０２との位置合わせを容易に行うことができる。 Further, in inverter 1000, both AC bus bar electrode 1181 and current sensor 1201 are fixed to alignment projection 1420. Thereby, alignment between the AC bus bar electrode 1181 and the current sensor 1201 can be easily performed. Similarly, alignment between the AC bus bar electrode 1180 and the current sensor 1200 can be easily performed, and alignment between the AC bus bar electrode 1182 and the current sensor 1202 can be easily performed.
　また、インバータ１０００においては、フレーム１０１２の強度を高くすることが容易である。このため、ＤＣコネクタ１１００、信号端子コネクタ１１３０並びにＡＣコネクタ１１９０，１１９１及び１１９２がフレーム１０１２に固定された場合は、これらのコネクタが強固に固定される。これにより、これらのコネクタに外部ケーブルが接続された場合においても、これらのコネクタの固定に影響が生じにくくなる。 Further, in the inverter 1000, it is easy to increase the strength of the frame 1012. Therefore, when the DC connector 1100, the signal terminal connector 1130, and the AC connectors 1190, 1191 and 1192 are fixed to the frame 1012, these connectors are firmly fixed. Thereby, even when an external cable is connected to these connectors, the fixing of these connectors is less likely to be affected.
　また、インバータ１０００においては、多数の信号配線１１４０が梁１３１７により支持される。これにより、信号配線１１４０の支持に要するスペースが小さくなる。 Further, in the inverter 1000, a large number of signal wires 1140 are supported by the beams 1317. This reduces the space required to support the signal wiring 1140.
　１．７　平滑コンデンサ
　図１２は、第１実施形態のインバータに設けられたコンデンサ群及びフレームの断面を模式的に図示する断面図である。 1.7 Smoothing Capacitor FIG. 12 is a cross-sectional view schematically showing a cross section of a capacitor group and a frame provided in the inverter of the first embodiment.
　平滑コンデンサ１１１０は、図１２に図示されるように、コンデンサ群１５００を備える。コンデンサ群１５００は、底板１３３０に固定される。これにより、コンデンサ群１５００は、フレーム１０１２に固定される。 The smoothing capacitor 1110 comprises a capacitor group 1500 as illustrated in FIG. Capacitor group 1500 is fixed to bottom plate 1330. Thus, the capacitor group 1500 is fixed to the frame 1012.
　コンデンサ群１５００は、纏められた複数のコンデンサを含む。当該複数のコンデンサの各々である各コンデンサ１５１０は、円筒状の形状を有し、一方の円筒端及び他方の円筒端を有する。各コンデンサ１５１０の円筒軸は、底板１３３０の上面の法線方向と平行をなす第１の方向Ｄ１に延びる。当該複数のコンデンサは、底板１３３０の上面の法線方向と垂直をなす第２の方向Ｄ２に配列される。 Capacitor group 1500 includes a plurality of integrated capacitors. Each capacitor 1510, which is each of the plurality of capacitors, has a cylindrical shape and has one cylindrical end and the other cylindrical end. The cylindrical axis of each condenser 1510 extends in a first direction D1 parallel to the normal direction of the top surface of the bottom plate 1330. The plurality of capacitors are arranged in a second direction D2 perpendicular to the normal direction of the top surface of the bottom plate 1330.
　コンデンサ群１５００は、コンデンサケースを用いることなく底板に固定される。コンデンサケースを用いずに固定することにより、コンデンサ群１５００を収容するコンデンサケース、及びコンデンサケースを固定するために用いられる端子又は足部が不要になる。これにより、平滑コンデンサ１１１０を小型化することが容易になり、平滑コンデンサ１１１０の周辺にデッドスペースが生じないようにすることが容易になる。 Capacitor group 1500 is fixed to the bottom plate without using a capacitor case. Fixing without using the capacitor case eliminates the need for the capacitor case for accommodating the capacitor group 1500 and the terminals or feet used for fixing the capacitor case. As a result, it becomes easy to miniaturize the smoothing capacitor 1110 and it becomes easy to prevent dead space around the smoothing capacitor 1110.
　図１３は、第１実施形態のインバータに設けられた平滑コンデンサにおける電気的接続を図示する接続図である。 FIG. 13 is a connection diagram illustrating an electrical connection in the smoothing capacitor provided in the inverter of the first embodiment.
　平滑コンデンサ１１１０は、図１３に図示されるように、コンデンサ群１５００、バスバ電極１５２０及びバスバ電極１５２１を備える。 The smoothing capacitor 1110 includes a capacitor group 1500, a bus bar electrode 1520 and a bus bar electrode 1521 as illustrated in FIG.
　各コンデンサ１５１０は、第１の電極１５４０及び第２の電極１５４１を備える。第１の電極１５４０は、各コンデンサ１５１０の一方の円筒端にある。第２の電極１５４１は、各コンデンサ１５１０の他方の円筒端にある。コンデンサ群１５００に備えられる複数の第１の電極１５４０は、バスバ電極１５２０により互いに電気的に接続される。コンデンサ群１５００に備えられる複数の第２の電極１５４１は、バスバ電極１５２１により互いに電気的に接続される。これにより、コンデンサ群１５００に含まれる複数のコンデンサは、電気的に並列接続される。 Each capacitor 1510 comprises a first electrode 1540 and a second electrode 1541. The first electrode 1540 is at one cylindrical end of each capacitor 1510. The second electrode 1541 is at the other cylindrical end of each capacitor 1510. The plurality of first electrodes 1540 provided in capacitor group 1500 are electrically connected to each other by bus bar electrode 1520. The plurality of second electrodes 1541 provided in the capacitor group 1500 are electrically connected to each other by the bus bar electrode 1521. Thereby, the plurality of capacitors included in capacitor group 1500 are electrically connected in parallel.
　コンデンサ群１５００並びにバスバ電極１５２０及び１５２１に対して絶縁処理が行われてからコンデンサ群１５００が底板１３３０に固定されてもよい。 The capacitor group 1500 may be fixed to the bottom plate 1330 after the insulating process is performed on the capacitor group 1500 and the bus bar electrodes 1520 and 1521.
　図１４は、第１実施形態の第２変形例のインバータに設けられたコンデンサ群及びフレームの上面を模式的に図示する上面図である。 FIG. 14 is a top view schematically illustrating an upper surface of a capacitor group and a frame provided in an inverter according to a second modification of the first embodiment.
　第１実施形態の第２変形例のインバータ１０００においては、図１４に図示されるように、各コンデンサ１５１０の円筒軸が底板１３３０の上面の法線方向と垂直をなす第３の方向Ｄ３に延びる。 In the inverter 1000 of the second modification of the first embodiment, as shown in FIG. 14, the cylindrical axis of each capacitor 1510 extends in a third direction D3 perpendicular to the normal direction of the top surface of the bottom plate 1330. .
　図１５は、第１実施形態の第３変形例のインバータに設けられたコンデンサ群、フレーム及びベース板の断面を図示する断面図である。 FIG. 15 is a cross-sectional view illustrating cross sections of a capacitor group, a frame, and a base plate provided in an inverter according to a third modification of the first embodiment.
　第１実施形態の第３変形例のインバータ１０００においては、インバータ１０００が図１５に図示されるベース板１５５０をさらに備え、コンデンサ群１５００がベース板１５５０に固定され、ベース板１５５０がフレーム１０１２に固定される。 In the inverter 1000 according to the third modification of the first embodiment, the inverter 1000 further includes a base plate 1550 illustrated in FIG. 15, the capacitor group 1500 is fixed to the base plate 1550, and the base plate 1550 is fixed to the frame 1012. Be done.
　図１６は、第１実施形態の第４変形例のインバータに設けられたコンデンサ群、フレーム及び樹脂体の断面を模式的に図示する断面図である。 FIG. 16 is a cross-sectional view schematically illustrating cross sections of a capacitor group, a frame, and a resin body provided in the inverter according to the fourth modification of the first embodiment.
　第１実施形態の第４変形例のインバータ１０００においては、インバータ１０００が図１６に図示される樹脂体１５６０をさらに備え、樹脂体１５６０がフレーム１０１２に固定され、コンデンサ群１５００が樹脂体１５６０に埋め込まれる。樹脂体１５６０は、樹脂硬化物からなる。コンデンサ群１５００は、樹脂体１５６０に包含され、樹脂体１５６０により封止される。コンデンサ群１５００が、樹脂体１５６０に封止されない状態で樹脂からなる接合媒体を介してフレーム１０１２に接合されてもよい。 In the inverter 1000 according to the fourth modification of the first embodiment, the inverter 1000 further includes a resin body 1560 shown in FIG. 16, the resin body 1560 is fixed to the frame 1012, and the capacitor group 1500 is embedded in the resin body 1560. Be The resin body 1560 is made of a resin cured product. Capacitor group 1500 is included in resin body 1560 and is sealed with resin body 1560. The capacitor group 1500 may be bonded to the frame 1012 via a bonding medium made of resin without being sealed by the resin body 1560.
　図１７は、第１実施形態の第５変形例のインバータに設けられたコンデンサ群、フレーム、樹脂体及びベース板の断面を模式的に図示する断面図である。 FIG. 17 is a cross-sectional view schematically illustrating cross sections of a capacitor group, a frame, a resin body, and a base plate provided in the inverter according to the fifth modification of the first embodiment.
　第１実施形態の第５変形例のインバータ１０００においては、インバータ１０００が図１７に図示されるベース板１５７０及び樹脂体１５７１を備え、ベース板１５７０がフレーム１０１２に固定され、樹脂体１５７１がベース板１５７０に固定され、コンデンサ群１５００が樹脂体１５７１に埋め込まれる。コンデンサ群１５００が、樹脂体１５６０に封止されない状態で樹脂からなる接合媒体を介してベース板１５７０に接合されてもよい。 In an inverter 1000 according to a fifth modification of the first embodiment, the inverter 1000 includes a base plate 1570 and a resin body 1571 shown in FIG. 17, the base plate 1570 is fixed to the frame 1012, and the resin body 1571 is a base plate. It is fixed to 1570, and the capacitor group 1500 is embedded in the resin body 1571. Capacitor group 1500 may be bonded to base plate 1570 via a bonding medium made of resin without being sealed by resin body 1560.
　１．８　部品の冷却
　図１８は、第１実施形態のインバータに望ましくは付加される部品の冷却のための構造を模式的に図示する断面図である。 1.8 Cooling of Parts FIG. 18 is a cross-sectional view schematically illustrating a structure for cooling a part that is desirably added to the inverter of the first embodiment.
　図１８に図示される部品の冷却のための構造１６００においては、インバータ１０００が、伝熱部材１６１０をさらに備え、伝熱部材１６１０が、部品１６１１及び少なくともひとつの冷却器１０１１に接触し、部品１６１１と冷却器１０１１とを熱的に繋ぐ。伝熱部材１６１０の部品１６１１及び冷却器１０１１への接触により、部品１６１１から伝熱部材１６１０を経由して冷却器１０１１に熱が排熱され、部品１６１１が冷却される。これにより、部品１６１１を冷却器１０１１に直接的に接触させる必要がなくなり、部品１６１１を冷却することが容易になる。 In the structure 1600 for cooling a part illustrated in FIG. 18, the inverter 1000 further comprises a heat transfer member 1610, the heat transfer member 1610 contacting the part 1611 and at least one cooler 1011, the part 1611 And the cooler 1011 are thermally connected. The contact of the heat transfer member 1610 with the component 1611 and the cooler 1011 causes heat to be dissipated from the component 1611 to the cooler 1011 via the heat transfer member 1610 to cool the component 1611. This eliminates the need for the component 1611 to be in direct contact with the cooler 1011 and makes it easier to cool the component 1611.
　部品１６１１は、発熱が大きい部品、発熱が大きい部品に接触する部品、発熱が大きい部品に近接する部品、熱に弱い部品等である。発熱が大きい部品は、平滑コンデンサ１１１０、半導体パワーモジュール１１７０等である。発熱が大きい部品に接触する部品は、ＤＣバスバ電極１１２０，１１２１，１１２２，１１２３，１１２４及び１１２５、ＡＣバスバ電極１１８０，１１８１及び１１８２等である。発熱が大きい部品に近接する部品は、駆動回路基板１１５０及び１１６０、電流センサ１２００，１２０１及び１２０２等である。熱に弱い部品は、駆動回路基板１１５０及び１１６０、電流センサ１２００，１２０１及び１２０２等である。したがって、部品１６１１は、平滑コンデンサ１１１０、ＤＣバスバ電極１１２０，１１２１，１１２２，１１２３，１１２４及び１１２５、駆動回路基板１１５０及び１１６０、ＡＣバスバ電極１１８０，１１８１及び１１８２並びに電流センサ１２００，１２０１及び１２０２からなる群より選択される少なくともひとつの部品である。 The component 1611 is a component that generates a large amount of heat, a component that contacts a component that generates a large amount of heat, a component that is close to a component that generates a large amount of heat, a component that is susceptible to heat, or the like. The components that generate a large amount of heat are the smoothing capacitor 1110, the semiconductor power module 1170, and the like. Parts that contact parts that generate a large amount of heat are DC bus bar electrodes 1120, 1121, 1122, 1123, 1124 and 1125, AC bus bar electrodes 1180, 1181 and 1182, and the like. Parts close to the parts that generate a large amount of heat are drive circuit boards 1150 and 1160, current sensors 1200, 1201 and 1202, and the like. Parts susceptible to heat are drive circuit boards 1150 and 1160, current sensors 1200, 1201 and 1202, and so on. Therefore, component 1611 comprises smoothing capacitor 1110, DC bus bar electrodes 1120, 1121, 1122, 1123, 1124 and 1125, drive circuit boards 1150 and 1160, AC bus bar electrodes 1180, 1181 and 1182, and current sensors 1200, 1201 and 1202. At least one component selected from the group.
　伝熱部材１６１０は、フレーム１０１２に設けられた柱、梁等のフレームメンバー１６１２に固定される。これにより、伝熱部材１６１０がフレーム１０１２に固定される。伝熱部材１６１０のフレーム１０１２への固定により、伝熱部材１６１０が意図しない部位に接触して悪影響が生じることが抑制される。また、伝熱部材１６１０が宙を通る構造等が採用される場合においても、伝熱部材１６１０がフレームメンバー１６１２に容易かつ確実に固定される。伝熱部材１６１０がフレーム１０１２に固定されずフレーム１０１２に保持されるにとどまる場合もある。 The heat transfer member 1610 is fixed to a frame member 1612 such as a column or a beam provided on the frame 1012. Thus, the heat transfer member 1610 is fixed to the frame 1012. Fixing the heat transfer member 1610 to the frame 1012 suppresses the occurrence of an adverse effect due to the heat transfer member 1610 coming into contact with an unintended portion. In addition, even when the heat transfer member 1610 has a structure in which the heat transfer member 1610 passes through the air, the heat transfer member 1610 is easily and reliably fixed to the frame member 1612. The heat transfer member 1610 may not be fixed to the frame 1012 and may be held by the frame 1012.
　伝熱部材１６１０は、望ましくは柔軟性を有する。これにより、部品１６１１の表面が凹凸を有する場合、又は部品１６１１の表面が曲面である場合においても、伝熱部材１６１０が部品１６１１に容易に接触させられ、部品１６１１から伝熱部材１６１０に効果的に熱が伝えられる。伝熱部材１６１０が柔軟性を有する場合は、フレームメンバー１６１２による伝熱部材１６１０の支持がさらに容易になる。 The heat transfer member 1610 desirably has flexibility. Thereby, even when the surface of the component 1611 has unevenness or the surface of the component 1611 is a curved surface, the heat transfer member 1610 can be easily brought into contact with the component 1611, and the component 1611 can be effectively transferred to the heat transfer member 1610. Heat is transmitted to When the heat transfer member 1610 is flexible, the support of the heat transfer member 1610 by the frame member 1612 is further facilitated.
　伝熱部材１６１０のフレーム１０１２への固定も、インバータ１０００に設けられたその他の部品のフレーム１０１２への固定と同様に、容易である。 Fixing of the heat transfer member 1610 to the frame 1012 is also easy, as is fixing of the other components of the inverter 1000 to the frame 1012.
　１．９　部品間の遮熱
　図１９は、第１実施形態のインバータに望ましくは付加される、部品間の遮熱のための構造を模式的に図示する断面図である。 1.9 Thermal insulation between parts FIG. 19 is a cross-sectional view schematically showing a structure for thermal insulation between parts, which is preferably added to the inverter of the first embodiment.
　図１９に図示される部品間の遮熱のための構造１７００においては、インバータ１０００が遮熱板１７１０をさらに備え、遮熱板１７１０が部品１７１１と部品１７１２との間に配置される。これにより、部品１７１２から部品１７１１に熱が伝わることが抑制される。 In the structure 1700 for heat insulation between components illustrated in FIG. 19, the inverter 1000 further includes a heat shield plate 1710, and the heat shield plate 1710 is disposed between the components 1711 and 1712. Thus, the transfer of heat from the component 1712 to the component 1711 is suppressed.
　部品１７１１は、熱に弱い部品等である。部品１７１２は、発熱が大きい部品等である。熱に弱い部品は、駆動回路基板１１５０及び１１６０、電流センサ１２００，１２０１及び１２０２等である。発熱が大きい部品は、平滑コンデンサ１１１０、半導体パワーモジュール１１７０等である。 The component 1711 is a component sensitive to heat. The component 1712 is a component or the like that generates a large amount of heat. Parts susceptible to heat are drive circuit boards 1150 and 1160, current sensors 1200, 1201 and 1202, and so on. The components that generate a large amount of heat are the smoothing capacitor 1110, the semiconductor power module 1170, and the like.
　遮熱板１７１０は、樹脂等からなり、フレーム１０１２に設けられた柱、梁等のフレームメンバー１７１３に固定される。これにより、遮熱板１７１０がフレーム１０１２に固定される。 The heat shield plate 1710 is made of resin or the like, and is fixed to a frame member 1713 such as a column or a beam provided on the frame 1012. Thus, the heat shield plate 1710 is fixed to the frame 1012.
　遮熱板１７１０のフレーム１０１２への固定も、インバータ１０００に設けられたその他の部品のフレーム１０１２への固定と同様に、容易である。 Fixing of the heat shield plate 1710 to the frame 1012 is also easy, as is fixing of the other components provided in the inverter 1000 to the frame 1012.
　１．１０　巻き線の直接的な接続
　図２０は、第１実施形態の第６変形例のインバータの断面を模式的に図示する断面図である。 1.10 Direct Connection of Windings FIG. 20 is a cross-sectional view schematically illustrating a cross section of an inverter according to a sixth modification of the first embodiment.
　第１実施形態の第６変形例のインバータ１０００においては、図２０に図示されるように、側板１３２１が、フレーム１０１２の外側を向く表面である外側面１８００を有するフレームメンバーであり、ＡＣバスバ電極１１８１が、外側面１８００に配置される端部１８１０を有する。端部１８１０は、インバータ１０００により駆動される電動機の巻き線１８２０に接触し、巻き線１８２０に電気的に接続される。端部１８１０が側板１３２１の内部に配置されてもよい。ＡＣバスバ電極１１８０及び１１８２も、側板１３２１の外側面１８００又は側板１３２１の内部に配置され、インバータ１０００により駆動される電動機の巻き線に電気的に接続される端部を有する。 In the inverter 1000 according to the sixth modification of the first embodiment, as shown in FIG. 20, the side plate 1321 is a frame member having an outer surface 1800 which is a surface facing the outside of the frame 1012, and an AC bus bar electrode 1181 has an end 1810 disposed on the outer surface 1800. The end 1810 contacts the winding 1820 of the motor driven by the inverter 1000 and is electrically connected to the winding 1820. The end 1810 may be disposed inside the side plate 1321. AC bus bar electrodes 1180 and 1182 are also disposed on the outer side surface 1800 of side plate 1321 or inside side plate 1321 and have ends electrically connected to the windings of the motor driven by inverter 1000.
　ＡＣバスバ電極１１８０，１１８１及び１１８２の各ＡＣバスバ電極の端部には、ボルト締結部のような接続部位が設けられ、各ＡＣバスバ電極の端部は、ＡＣコネクタを介さずに電動機の巻き線に直接的に接触する。各ＡＣバスバ電極の端部の電動機の巻き線への直接的な接触により、各ＡＣバスバ電極の端部は、ＡＣコネクタを介さずに電動機の巻き線に電気的に接続される。これにより、高価で大きいＡＣコネクタを使用せずに電動機をインバータ１０００に電気的に接続することが可能になり、電動機をインバータ１０００に電気的に接続するのに要するコスト及びスペースを減らすことが容易になる。 A connection portion such as a bolt fastening portion is provided at the end of each AC bus bar electrode of the AC bus bar electrodes 1180, 1181 and 1182, and the end of each AC bus bar electrode is not wound with an AC connector. In direct contact with The direct contact of the end of each AC busbar electrode with the motor windings causes the end of each AC busbar electrode to be electrically connected to the motor windings without an AC connector. This makes it possible to electrically connect the motor to the inverter 1000 without using expensive and large AC connectors, and it is easy to reduce the cost and space required to electrically connect the motor to the inverter 1000. become.
　ＡＣバスバ電極１１８０，１１８１及び１１８２の各ＡＣバスバ電極が先述した冷却される部品１６１１である場合は、伝熱部材１６１０が、各ＡＣバスバ電極の端部に沿って配置され、少なくともひとつの冷却器１０１１に接触する。これにより、電動機の巻き線からインバータ１０００に熱が伝わることを抑制できる。伝熱部材１６１１は、各ＡＣバスバ電極の端部に接触してもよいし、各ＡＣバスバ電極の端部からわずかに離れてもよい。 If each AC bus bar electrode of the AC bus bar electrodes 1180, 1181 and 1182 is the previously described cooled component 1611, the heat transfer member 1610 is disposed along the end of each AC bus bar electrode, and at least one cooler Contact 1011. This can suppress heat transfer from the winding of the motor to the inverter 1000. The heat transfer member 1611 may contact the end of each AC bus bar electrode, or may be slightly separated from the end of each AC bus bar electrode.
　第６変形例は、電動機に設けられた電動機ケースに接合された、又は当該電動機ケースと一体化されたインバータケースにインバータ１０００が収容される場合に好適に採用される。 The sixth modification is suitably adopted when the inverter 1000 is accommodated in an inverter case joined to the motor case provided in the motor or integrated with the motor case.
　１．１１　他の構造との対比
　１．１１．１　同じ大きさを有する複数の回路基板が金属等からなるフレームに固定される構造との対比
　以下では、同じ大きさを有する複数の回路基板が金属等からなるフレームに固定される構造との対比を行う。当該構造は、複数の回路基板を備え、複数の回路基板が電気的に接続された状態で配置され、所定の動作を行う電気機器において採用される。 1.11 Comparison with Other Structures 1.11.1 Comparison with Structures in which Circuit Boards of the Same Size Are Fixed to a Frame Made of Metal etc. Below, Circuit Boards with the Same Size are Contrast with the structure fixed to the frame made of metal etc. The structure includes a plurality of circuit boards, is disposed in a state in which the plurality of circuit boards are electrically connected, and is employed in an electric device that performs a predetermined operation.
　インバータ１０００においては、互いに異なる大きさ及び形状を有する複数の部品がフレーム１０１２に固定される。複数の部品のフレーム１０１２への固定により、先述したように、複数の部品の間の隙間が小さくなるように複数の部品を固定することが容易になる。特に、大きな部品とそれに隣接する部品との間の隙間が小さくなるように大きな部品及びそれに隣接する部品を配置することが容易になる。これにより、複数の部品を高密度で配置することが容易になり、インバータ１０００を小型化することが容易になる。 In the inverter 1000, a plurality of parts having different sizes and shapes are fixed to the frame 1012. Fixing the plurality of parts to the frame 1012 facilitates fixing the plurality of parts so as to reduce the gap between the plurality of parts as described above. In particular, it becomes easy to arrange the large component and the adjacent component so that the gap between the large component and the adjacent component is reduced. Thereby, it becomes easy to arrange a plurality of parts at high density, and it becomes easy to miniaturize the inverter 1000.
　加えて、インバータ１０００においては、ＤＣコネクタ１１００、ＤＣバスバ電極１１２０，１１２１，１１２２，１１２３，１１２４及び１１２５、信号配線１１４０並びにＡＣバスバ電極１１８０，１１８１及び１１８２がフレーム１０１２の表面に固定されてもよい。また、これらの配線を樹脂体に埋設するインサートモールド構造をインバータ１０００において必ずしも採用する必要はない。これにより、インバータ１０００の製造に要するコストを減らすことが容易になる。伝熱部材１６１０が設けられた場合は、伝熱部材１６１０についても同様のことが言える。これらの配線が固定されるフレームメンバーの表面等には、必要に応じて電気絶縁処理が行われる。 In addition, in the inverter 1000, the DC connector 1100, the DC bus bar electrodes 1120, 1121, 1122, 1123, 1124 and 1125, the signal wiring 1140 and the AC bus bar electrodes 1180, 1181 and 1182 may be fixed to the surface of the frame 1012. . In addition, it is not necessary to adopt in the inverter 1000 an insert mold structure in which these wires are embedded in a resin body. This makes it easy to reduce the cost required to manufacture the inverter 1000. When the heat transfer member 1610 is provided, the same applies to the heat transfer member 1610. An electrical insulation process is performed on the surface of the frame member to which these wires are fixed, as needed.
　１．１１．２　冷却器に立てられた柱に回路基板等が固定される構造との対比
　以下では、冷却器に立てられた柱に回路基板等が固定される構造との対比を行う。当該構造に類似する構造がインバータにおいて採用された場合は、複数の部品が固定される部分を冷却器が有しなくてはならない。このため、冷却器を小型化することが困難になり、冷却器に要するコストを減らすことが困難になる。これにより、インバータを軽量化することが困難になり、インバータ１０００を製造するのに要するコストを減らすことが困難になる。 1.11.2 Comparison with the structure in which the circuit board etc. is fixed to the column set in the cooler In the following, the comparison with the structure in which the circuit board etc. is fixed to the column set in the cooler is carried out. If a structure similar to the structure is adopted in the inverter, the cooler must have a part to which a plurality of parts are fixed. For this reason, it becomes difficult to miniaturize the cooler, and it becomes difficult to reduce the cost required for the cooler. As a result, it becomes difficult to reduce the weight of the inverter, and it becomes difficult to reduce the cost required to manufacture the inverter 1000.
　これに対して、インバータ１０００においては、半導体パワーモジュール１１７０以外の部品が、冷却器１０１１に固定されず、フレーム１０１２に固定される。半導体パワーモジュール１１７０以外の部品がフレーム１０１２に固定されることにより、半導体パワーモジュール１１７０以外の部品を冷却器１０１１の主面に対向して配置する必要がなくなる。これにより、冷却器１０１１を小型化することが容易になり、冷却器１０１１に要するコストを減らすことが容易になる。 On the other hand, in the inverter 1000, components other than the semiconductor power module 1170 are fixed to the frame 1012 without being fixed to the cooler 1011. By fixing the components other than the semiconductor power module 1170 to the frame 1012, it is not necessary to place the components other than the semiconductor power module 1170 opposite to the main surface of the cooler 1011. As a result, the cooler 1011 can be easily miniaturized, and the cost required for the cooler 1011 can be easily reduced.
　１．１１．３　インバータケースに立てられた柱に回路基板等が固定される構造との対比
　以下では、インバータケースに立てられた柱に回路基板等が固定される構造との対比を行う。当該構造に類似する構造がインバータにおいて採用された場合は、互いに異なる複数のインバータケースの各インバータケースに、各インバータケースにおけるインバータ搭載条件に適合するインバータが収容されなければならない。これにより、互いに異なる複数のインバータケースにそれぞれ収容される複数のインバータを共通化することが困難になる。 1.11.3 Comparison with the structure in which the circuit board etc. is fixed to the column set up in the inverter case In the following, the comparison with the structure in which the circuit board etc. is fixed to the column set up in the inverter case is carried out. When the structure similar to the said structure is employ | adopted in the inverter, the inverter which adapts the inverter mounting condition in each inverter case must be accommodated in each inverter case of a several different inverter case. This makes it difficult to share a plurality of inverters respectively accommodated in a plurality of different inverter cases.
　これに対して、インバータ１０００は、互いに異なる複数のインバータケースの各インバータケースに収容できる。これにより、互いに異なる複数のインバータケースにそれぞれ収容される複数のインバータを共通化することが容易になる。 On the other hand, the inverter 1000 can be accommodated in each inverter case of a plurality of different inverter cases. This makes it easy to share the plurality of inverters respectively accommodated in the plurality of different inverter cases.
　１．１１．４　枠形状を有する板材に素子実装基板、配線基板等が載せられた構造との対比
　以下では、枠形状を有する板材に素子実装基板、配線基板等が載せられた構造との対比を行う。当該構造に類似する構造がインバータにおいて採用された場合は、複数の部品が板材に沿って配置されなければならない。複数の部品が板材に沿って配置されることにより、複数の部品が互いに著しく異なる大きさ及び形状を有する場合に、複数の部品の間の隙間が小さくなるように複数の部品を固定することが困難になる。これにより、インバータを小型化することが困難になる。 1.11.4 Comparison with a structure in which an element mounting substrate, a wiring board, and the like are mounted on a plate material having a frame shape In the following, a comparison with a structure in which an element mounting substrate, a wiring board, and the like is mounted on a plate material having a frame shape I do. If a structure similar to that is employed in the inverter, then multiple parts must be placed along the plate. Fixing the plurality of parts so that a gap between the plurality of parts is reduced when the plurality of parts are arranged along the plate so that the plurality of parts have significantly different sizes and shapes from one another It will be difficult. This makes it difficult to miniaturize the inverter.
　これに対して、インバータ１０００においては、複数の部品がフレーム１０１２に固定される。複数の部品のフレーム１０１２への固定により、複数の部品が互いに著しく異なる大きさ及び形状を有する場合であっても、先述したように、複数の部品の間の隙間が小さくなるように複数の部品を固定することが容易になる。これにより、インバータ１０００を小型化することが容易になる。 On the other hand, in the inverter 1000, a plurality of parts are fixed to the frame 1012. By securing the plurality of parts to the frame 1012, as described above, even if the plurality of parts have significantly different sizes and shapes from each other, the plurality of parts may be reduced so as to reduce the gap between the plurality of parts. It becomes easy to fix. This makes it easy to miniaturize the inverter 1000.
　また、インバータ１０００においては、フレーム１０１２が棒状のフレームメンバーを備えることにより、棒状のフレームメンバーを含む複数のフレームメンバーに囲まれる開口部１３４０がフレーム１０１２に形成される。開口部１３４０により、フレーム１０１２の外部から開口部１３４０を経由してフレーム１０１２の内部に到達すること、及びフレーム１０１２の内部から開口部１３４０を経由してフレーム１０１２の外部に到達することが容易になる。これにより、インバータ１０００を組み立てる際にフレーム１０１２の外部から開口部１３４０を経由してフレーム１０１２の内部に工具等を差し込む作業が容易になり、必要に応じて配線等をフレーム１０１２の内部から当該開口部を経由してフレーム１０１２の外部に引き出すことが容易になる。 Further, in the inverter 1000, the frame 1012 is provided with a rod-like frame member, whereby an opening 1340 surrounded by a plurality of frame members including the rod-like frame member is formed in the frame 1012. The opening 1340 makes it easy to reach the inside of the frame 1012 from the outside of the frame 1012 via the opening 1340 and to reach the outside of the frame 1012 from the inside of the frame 1012 via the opening 1340. Become. This makes it easy to insert a tool or the like into the frame 1012 from the outside of the frame 1012 through the opening 1340 when assembling the inverter 1000, and wiring or the like from the inside of the frame 1012 as needed. It is easy to pull it out of the frame 1012 via the unit.
　２　第２実施形態
　本発明の例示的な第２実施形態は、インバータに関する。 2 Second Embodiment An exemplary second embodiment of the present invention relates to an inverter.
　第１実施形態と第２実施形態との主な相違は、以下の点にある：第１実施形態においては、半導体パワーモジュール１１７０の裏面が被冷却面１４００となり、被冷却面１４００を冷却する冷却器１０１１が設けられ、冷却器１０１１が底板１３３１に固定される。しかし、半導体パワーモジュール１１７０の表面が被冷却面とならない。これに対して、第２実施形態においては、半導体パワーモジュールの裏面が第１の被冷却面となり、第１の被冷却面を冷却する第１の冷却器が設けられ、第１の冷却器が底板に固定される。加えて、半導体パワーモジュール１１７０の表面が第２の被冷却面となり、第２の被冷却面を冷却する第２の冷却器が設けられ、第２の冷却器が内部板に固定される。 The main differences between the first embodiment and the second embodiment are as follows: In the first embodiment, the back surface of the semiconductor power module 1170 is the surface to be cooled 1400, and the cooling to cool the surface to be cooled 1400 A vessel 1011 is provided, and a cooler 1011 is fixed to the bottom plate 1331. However, the surface of the semiconductor power module 1170 does not become a surface to be cooled. On the other hand, in the second embodiment, the back surface of the semiconductor power module is the first surface to be cooled, the first cooler for cooling the first surface to be cooled is provided, and the first cooler is It is fixed to the bottom plate. In addition, the surface of the semiconductor power module 1170 is the second surface to be cooled, a second cooler for cooling the second surface to be cooled is provided, and the second cooler is fixed to the inner plate.
　図２１は、第２実施形態のインバータの断面を模式的に図示する断面図である。図２１に図示される断面の位置は、図７に図示される断面の位置に相当する。 FIG. 21 is a cross-sectional view schematically illustrating a cross-section of the inverter according to the second embodiment. The position of the cross section shown in FIG. 21 corresponds to the position of the cross section shown in FIG.
　図２１に図示されるインバータ２０００は、インバータ回路１０１０、少なくともひとつの冷却器２０１１及びフレーム２０１２を備える。 The inverter 2000 illustrated in FIG. 21 includes an inverter circuit 1010, at least one cooler 2011 and a frame 2012.
　第２実施形態のインバータ２０００に設けられたインバータ回路１０１０は、第１実施形態のインバータ１０００に設けられたインバータ１０１０と同様のものである。このため、第２実施形態のインバータ２０００は、第１実施形態のインバータ１０００に設けられた半導体パワーモジュール１１７０と同様の半導体パワーモジュール１１７０を備える。 The inverter circuit 1010 provided in the inverter 2000 of the second embodiment is similar to the inverter 1010 provided in the inverter 1000 of the first embodiment. For this reason, the inverter 2000 of the second embodiment includes the same semiconductor power module 1170 as the semiconductor power module 1170 provided in the inverter 1000 of the first embodiment.
　半導体パワーモジュール１１７０は、板形状である。半導体パワーモジュール１１７０は、第１の被冷却面２４００及び第２の被冷却面２４０１を有する。第１の被冷却面２４００は、半導体パワーモジュール１１７０の一方の主面となる裏面である。第２の被冷却面２４０１は、半導体パワーモジュール１１７０の他方の主面となる表面である。 The semiconductor power module 1170 has a plate shape. The semiconductor power module 1170 has a first surface to be cooled 2400 and a second surface to be cooled 2401. The first cooled surface 2400 is a back surface to be one main surface of the semiconductor power module 1170. The second cooled surface 2401 is a surface to be the other main surface of the semiconductor power module 1170.
　少なくともひとつの冷却器２０１１は、第１の冷却器２９００及び第２の冷却器２９０１を含む。第１の冷却器２９００は、半導体パワーモジュール１１７０の第１の被冷却面２４００に取り付けられ、第１の被冷却面２４００を冷却する。第２の冷却器２９０１は、半導体パワーモジュール１１７０の第２の被冷却面２４０１に取り付けられ、第２の被冷却面２４０１を冷却する。 At least one cooler 2011 includes a first cooler 2900 and a second cooler 2901. The first cooler 2900 is attached to the first cooled surface 2400 of the semiconductor power module 1170 and cools the first cooled surface 2400. The second cooler 2901 is attached to the second cooled surface 2401 of the semiconductor power module 1170 and cools the second cooled surface 2401.
　図２２は、第２実施形態のインバータに設けられたフレームを模式的に図示する斜視図である。 FIG. 22 is a perspective view schematically illustrating a frame provided in the inverter of the second embodiment.
　フレーム２０１２は、図２２に図示されるように、柱１３００，１３０１，１３０２及び１３０３、梁１３１０，１３１１，１３１２，１３１３，１３１４，１３１５，１３１６，１３１７，２３１８及び２３１９、側板１３２０及び１３２１、底板１３３０及び１３３１並びに内部板２３３２を含む複数のフレームメンバーを備える。フレーム１０１２は、当該複数のフレームメンバーを組み合わせて構成される。第２実施形態のインバータ２０００に設けられた柱１３００，１３０１，１３０２及び１３０３、梁１３１０，１３１１，１３１２，１３１３，１３１４，１３１５，１３１６及び１３１７、側板１３２０及び１３２１並びに底板１３３０及び１３３１の各フレームメンバーは、第１実施形態のインバータ１０００に設けられた同じ参照符号が付与されたフレームメンバーと同様のものである。 The frame 2012 is, as illustrated in FIG. 22, columns 1300, 1301, 1302 and 1303, beams 1310, 1311, 1312, 1313, 1314, 1315, 1316, 1317 and 2318, side plates 1320 and 1321, and a bottom plate 1330. And 1331 and a plurality of frame members including an inner plate 2332. The frame 1012 is configured by combining the plurality of frame members. Frame members of pillars 1300, 1301, 1302, 1303 and 1303, beams 1310, 1311, 1312, 1313, 1314, 1316, 1317, side plates 1320 and 1321 and bottom plates 1330 and 1331 according to the second embodiment. Are similar to the frame members provided with the same reference numerals and provided in the inverter 1000 of the first embodiment.
　梁２３１８は、柱１３００及び１３０１並びに側板１３２１に固定され、柱１３００及び１３０１並びに側板１３２１により支持される。梁２３１９は、柱１３０２及び１３０３並びに側板１３２１に固定され、柱１３０２及び１３０３並びに側板１３２１により支持される。 The beam 2318 is fixed to the columns 1300 and 1301 and the side plate 1321, and is supported by the columns 1300 and 1301 and the side plate 1321. The beam 2319 is fixed to the columns 1302 and 1303 and the side plate 1321 and is supported by the columns 1302 and 1303 and the side plate 1321.
　内部板２３３２は、広がり方向である第２の方向Ｄ２及び第３の方向Ｄ３に広がる面を有する板状のフレームメンバーである。当該面は、主面である。内部板２３３２は、梁２３１８及び２３１９に固定され、梁２３１８及び２３１９により支持される。内部板２３３２が、梁２３１８及び２３１９を介さずに柱１３００，１３０１，１３０２及び１３０３並びに側板１３２１に固定され、柱１３００，１３０１，１３０２及び１３０３並びに側板１３２１により支持されてもよい。内部板２３３２は、底板１３３１から第１の方向Ｄ１に離間して配置される。 The inner plate 2332 is a plate-like frame member having a plane that extends in the second direction D2 and the third direction D3 which are the spreading directions. The said surface is a main surface. The inner plate 2332 is fixed to the beams 2318 and 2319 and is supported by the beams 2318 and 2319. An inner plate 2332 may be fixed to the pillars 1300, 1301, 1302 and 1303 and the side plates 1321 without the beams 2318 and 2319, and may be supported by the pillars 1300, 1301, 1302 and 1303 and the side plates 1321. The inner plate 2332 is spaced from the bottom plate 1331 in the first direction D1.
　第１の冷却器２９００は、図２１に図示されるように、第１のフレームメンバーとなる底板１３３１の上面に固定される。これにより、第１の冷却器２９００は、底板１３３１に固定され、底板１３３１により支持される。第２の冷却器２９０１は、第２のフレームメンバーとなる内部板２３３２の下面に固定される。これにより、第２の冷却器２９０１は、底板２３３１に固定され、底板２３３１により支持される。これらにより、少なくともひとつの冷却器２０１１は、フレーム２０１２に固定される。 The first cooler 2900 is fixed to the upper surface of the bottom plate 1331 as the first frame member as illustrated in FIG. Thus, the first cooler 2900 is fixed to the bottom plate 1331 and supported by the bottom plate 1331. The second cooler 2901 is fixed to the lower surface of the inner plate 2332 which is the second frame member. Thus, the second cooler 2901 is fixed to the bottom plate 2331 and supported by the bottom plate 2331. Thus, at least one cooler 2011 is fixed to the frame 2012.
　第２実施形態においても、第１実施形態と同様に、インバータ２０００を小型化し、インバータ２０００の製造に要するコストを減らすことが容易である。 Also in the second embodiment, as in the first embodiment, it is easy to miniaturize the inverter 2000 and reduce the cost required to manufacture the inverter 2000.
　インバータ２０００においては、板状の半導体パワーモジュール１１７０の第１の被冷却面２４００及び第２の被冷却面２４０１の両方を冷却するために第１の冷却器２９００及び第２の冷却器２９０１により半導体モジュール１１７０が挟まれる。また、第１の冷却器２９００及び第２の冷却器２９０１は、大きく重い。さらに、第１の方向Ｄ１について駆動回路基板１１５０及び１１６０が第２の冷却器２９０１に近接し、第２の方向Ｄ２について平滑コンデンサ１０１０、ＤＣバスバ電極１１２０，１１２１，１１２２，１１２３，１１２４及び１１２５、ＡＣバスバ電極１１８０，１１８１及び１１８２並びに電流センサ１２００，１２０１及び１２０２が第１の冷却器２９００及び第２の冷却器２９０１に近接する。このため、フレーム２０１２が設けられない場合は、第１の冷却器２９００及び第２の冷却器２９０１を固定することが容易でない。しかし、フレーム２０１２が設けられた場合は、第１の冷却器２９００及び第２の冷却器２９０１を固定するのに適した位置に第１の冷却器２９００及び第２の冷却器２９０１をそれぞれ固定する底板１３３１及び内部板２３３２を配置することが容易である。したがって、インバータ２０００においては、第１の冷却器２９００及び第２の冷却器２９０１の固定を容易に行うことができる。これにより、第１の冷却器２９００及び第２の冷却器２９０１を含む２個の冷却器２０１１を備えるインバータ２０００を製造するコストを減らすことが容易になる。 In the inverter 2000, the first cooler 2900 and the second cooler 2901 are used to cool both of the first cooled surface 2400 and the second cooled surface 2401 of the plate-like semiconductor power module 1170. Module 1170 is sandwiched. Also, the first cooler 2900 and the second cooler 2901 are large and heavy. Furthermore, the drive circuit boards 1150 and 1160 are close to the second cooler 2901 in the first direction D1, and the smoothing capacitor 1010, DC bus bar electrodes 1120, 1121, 1122, 1123, 1124, and 1125 in the second direction D2. AC busbar electrodes 1180, 1181 and 1182 and current sensors 1200, 1201 and 1202 are close to the first cooler 2900 and the second cooler 2901. Therefore, when the frame 2012 is not provided, it is not easy to fix the first cooler 2900 and the second cooler 2901. However, when the frame 2012 is provided, the first cooler 2900 and the second cooler 2901 are fixed at positions suitable for fixing the first cooler 2900 and the second cooler 2901, respectively. It is easy to arrange the bottom plate 1331 and the inner plate 2332. Therefore, in inverter 2000, fixing of first cooler 2900 and second cooler 2901 can be easily performed. This facilitates reducing the cost of manufacturing an inverter 2000 comprising two coolers 2011 including a first cooler 2900 and a second cooler 2901.
　３　第３実施形態
　本発明の例示的な第３実施形態は、インバータに関する。 3 Third Embodiment An exemplary third embodiment of the present invention relates to an inverter.
　第１実施形態と第３実施形態との主な相違は、以下の点にある：第１実施形態においては、半導体パワーモジュール１１７０の裏面が被冷却面１４００となり、被冷却面１４００を冷却する冷却器１０１１が設けられ、冷却器１０１１が底板１３３１に固定される。しかし、半導体パワーモジュール１１７０の表面が被冷却面とならない。これに対して、第３実施形態においては、半導体パワーモジュールの裏面が第１の被冷却面となり、第１の被冷却面を冷却する第１の冷却器が設けられ、第１の冷却器が底板に固定される。加えて、半導体パワーモジュールの表面が第２の被冷却面となり、第２の被冷却面を冷却する第２の冷却器が設けられ、第２の冷却器が内部板に固定される。 The main differences between the first embodiment and the third embodiment are as follows: In the first embodiment, the back surface of the semiconductor power module 1170 is the surface to be cooled 1400, and the cooling to cool the surface to be cooled 1400 A vessel 1011 is provided, and a cooler 1011 is fixed to the bottom plate 1331. However, the surface of the semiconductor power module 1170 does not become a surface to be cooled. On the other hand, in the third embodiment, the back surface of the semiconductor power module is the first surface to be cooled, a first cooler for cooling the first surface to be cooled is provided, and the first cooler is It is fixed to the bottom plate. In addition, the surface of the semiconductor power module is a second surface to be cooled, a second cooler for cooling the second surface to be cooled is provided, and the second cooler is fixed to the inner plate.
　図２３は、第３実施形態のインバータの断面を模式的に図示する断面図である。図２３に図示される断面の位置は、図７に図示される断面の位置に相当する。 FIG. 23 is a cross-sectional view schematically illustrating a cross-section of the inverter according to the third embodiment. The position of the cross section shown in FIG. 23 corresponds to the position of the cross section shown in FIG.
　図２３に図示されるインバータ３０００は、インバータ回路１０１０、少なくともひとつの冷却器３０１１及びフレーム１０１２を備える。 The inverter 3000 illustrated in FIG. 23 includes an inverter circuit 1010, at least one cooler 3011 and a frame 1012.
　第３実施形態のインバータ３０００に設けられたインバータ回路１０１０及びフレーム１０１２は、それぞれ第１実施形態のインバータ１０００に設けられたインバータ回路１０１０及びフレーム１０１２と同様のものである。このため、第３実施形態のインバータ３０００は、第１実施形態のインバータ１０００に設けられた半導体パワーモジュール１１７０と同様の半導体パワーモジュール１１７０、及び第１実施形態のインバータ１０００に設けられた底板１３３１と同様の底板１３３１を備える。 The inverter circuit 1010 and the frame 1012 provided in the inverter 3000 of the third embodiment are the same as the inverter circuit 1010 and the frame 1012 provided in the inverter 1000 of the first embodiment, respectively. Therefore, the inverter 3000 of the third embodiment includes a semiconductor power module 1170 similar to the semiconductor power module 1170 provided in the inverter 1000 of the first embodiment, and a bottom plate 1331 provided in the inverter 1000 of the first embodiment. A similar bottom plate 1331 is provided.
　半導体パワーモジュール１１７０は、板形状である。半導体パワーモジュール１１７０は、第１の被冷却面３４００及び第２の被冷却面３４０１を有する。第１の被冷却面３４００は、半導体パワーモジュール１１７０の一方の主面となる裏面である。第２の被冷却面３４０１は、半導体パワーモジュール１１７０の他方の主面となる表面である。 The semiconductor power module 1170 has a plate shape. The semiconductor power module 1170 has a first surface to be cooled 3400 and a second surface to be cooled 3401. The first cooled surface 3400 is a back surface to be one main surface of the semiconductor power module 1170. The second cooled surface 3401 is a surface to be the other main surface of the semiconductor power module 1170.
　少なくともひとつの冷却器３０１１は、第１の冷却器３９００及び第２の冷却器３９０１を含む。第１の冷却器３９００は、半導体パワーモジュール１１７０の第１の被冷却面３４００に取り付けられ、第１の被冷却面３４００を冷却する。第２の冷却器３９０１は、半導体パワーモジュール１１７０の第２の被冷却面３４０１に取り付けられ、第２の被冷却面３４０１を冷却する。 The at least one cooler 3011 includes a first cooler 3900 and a second cooler 3901. The first cooler 3900 is attached to the first cooled surface 3400 of the semiconductor power module 1170 and cools the first cooled surface 3400. The second cooler 3901 is attached to the second cooled surface 3401 of the semiconductor power module 1170 and cools the second cooled surface 3401.
　第１の冷却器３９００は、底板１３３１の上面に固定される。これにより、第１の冷却器３９００は、底板１３３１に固定され、底板１３３１により支持される。第２の冷却器３９０１も、底板１３３１の上面に固定される。これにより、第２の冷却器３９０１は、底板１３３１に固定され、底板１３３１により支持される。これにより、第１の冷却器３９００及び第２の冷却器３９０１は、共通のフレームメンバーである底板１３３１に共通して固定され、少なくともひとつの冷却器３０１１は、フレーム１０１２に固定される。 The first cooler 3900 is fixed to the upper surface of the bottom plate 1331. Thus, the first cooler 3900 is fixed to the bottom plate 1331 and supported by the bottom plate 1331. The second cooler 3901 is also fixed to the upper surface of the bottom plate 1331. Thus, the second cooler 3901 is fixed to the bottom plate 1331 and supported by the bottom plate 1331. Accordingly, the first cooler 3900 and the second cooler 3901 are fixed in common to the bottom plate 1331 which is a common frame member, and at least one cooler 3011 is fixed to the frame 1012.
　第３実施形態においても、第１実施形態と同様に、インバータ３０００を小型化し、インバータ３０００の製造に要するコストを減らすことが容易である。 Also in the third embodiment, as in the first embodiment, it is easy to miniaturize the inverter 3000 and reduce the cost required to manufacture the inverter 3000.
　梁等のフレームメンバーが第１の方向Ｄ１について大きさを有することを利用して、互いに異なる第１の方向Ｄ１の位置に配置される第１の冷却器３９００及び第２の冷却器３９０１が当該フレームメンバーに固定されてもよい。例えば、第１の冷却器３９００が梁の下面に固定され第２の冷却器３９０１が当該梁の上面に固定されることにより第１の冷却器３９００及び第２の冷却器３９０１が当該梁に固定されてもよい。 The first cooler 3900 and the second cooler 3901 disposed at positions in the first direction D1 different from each other utilizing the fact that the frame members such as beams have sizes in the first direction D1 It may be fixed to a frame member. For example, the first cooler 3900 is fixed to the lower surface of the beam and the second cooler 3901 is fixed to the upper surface of the beam, so that the first cooler 3900 and the second cooler 3901 are fixed to the beam It may be done.
　４　第４実施形態
　本発明の例示的な第４実施形態は、インバータに関する。 4 Fourth Embodiment The fourth exemplary embodiment of the present invention relates to an inverter.
　第１実施形態と第４実施形態との主な相違は、以下の点にある：第１実施形態においては、平滑前の直流を伝送するＤＣバスバ電極が設けられず、平滑後の直流を伝送するＤＣバスバ電極１１２０，１１２１，１１２２，１１２３，１１２４及び１１２５が設けられ、平滑後の直流を伝送するＤＣバスバ電極１１２０，１１２１，１１２２，１１２３，１１２４及び１１２５がフレーム１０１２に直接支持されない。これに対して、第４実施形態においては、平滑前の直流を伝送するＤＣバスバ電極、及び平滑後の直流を伝送するＤＣバスバ電極が設けられ、平滑前の直流を伝送するＤＣバスバ電極、並びに平滑後の直流を伝送するＤＣバスバ電極がフレームに固定される。 The main differences between the first embodiment and the fourth embodiment are as follows: In the first embodiment, no DC bus bar electrode for transmitting direct current before smoothing is provided, and direct current after smoothing is transmitted. The DC bus bar electrodes 1120, 1121, 1122, 1123, 1124 and 1125 are provided, and the DC bus bar electrodes 1120, 1121, 1122, 1123, 1124 and 1125 for transmitting the smoothed direct current are not directly supported by the frame 1012. On the other hand, in the fourth embodiment, a DC bus bar electrode for transmitting a direct current before smoothing and a DC bus bar electrode for transmitting a direct current after smoothing are provided, and a DC bus bar electrode for transmitting a direct current before smoothing, A DC bus bar electrode for transmitting a direct current after smoothing is fixed to the frame.
　図２４及び図２５は、第４実施形態のインバータの断面を模式的に図示する断面図である。図２４及び図２５に図示される断面の位置は、それぞれ図７及び図８に図示される断面の位置に相当する。 24 and 25 are cross-sectional views schematically illustrating cross sections of the inverter according to the fourth embodiment. The positions of the cross sections shown in FIGS. 24 and 25 correspond to the positions of the cross sections shown in FIGS. 7 and 8, respectively.
　図２４及び図２５に図示されるインバータ４０００は、インバータ回路４０１０、少なくともひとつの冷却器１０１１及びフレーム４０１２を備える。 The inverter 4000 illustrated in FIGS. 24 and 25 includes an inverter circuit 4010, at least one cooler 1011 and a frame 4012.
　第４実施形態のインバータ４０００に設けられた冷却器１０１１は、第１実施形態のインバータ１０００に設けられた冷却器１０１１と同様のものである。 The cooler 1011 provided in the inverter 4000 of the fourth embodiment is the same as the cooler 1011 provided in the inverter 1000 of the first embodiment.
　図２６は、第４実施形態のインバータに設けられたインバータ回路における電気的接続を図示する接続図である。 FIG. 26 is a connection diagram illustrating electrical connections in the inverter circuit provided in the inverter of the fourth embodiment.
　インバータ４０００は、図２６に図示されるように、インバータ回路４０１０を構成する、ＤＣコネクタ１１００、ＤＣバスバ電極４２９０及び４２９１、平滑コンデンサ１１１０、ＤＣバスバ電極１１２０，１１２１，１１２２，１１２３，１１２４及び１１２５、信号端子コネクタ１１３０、信号配線１１４０、駆動回路基板１１５０及び１１６０、半導体パワーモジュール１１７０、ＡＣバスバ電極１１８０，１１８１及び１１８２、ＡＣコネクタ１１９０，１１９１及び１１９２並びに電流センサ１２００，１２０１及び１２０２を備える。 As shown in FIG. 26, the inverter 4000 constitutes an inverter circuit 4010, and comprises a DC connector 1100, DC bus bar electrodes 4290 and 4291, a smoothing capacitor 1110, DC bus bar electrodes 1120, 1121, 1122, 1123, 1124 and 1125, A signal terminal connector 1130, a signal wiring 1140, drive circuit boards 1150 and 1160, a semiconductor power module 1170, AC busbar electrodes 1180, 1181 and 1182, AC connectors 1190, 1191 and 1192 and current sensors 1200, 1201 and 1202 are provided.
　第４実施形態のインバータ４０００に設けられたＤＣコネクタ１１００、平滑コンデンサ１１１０、ＤＣバスバ電極１１２０，１１２１，１１２２，１１２３，１１２４及び１１２５、信号端子コネクタ１１３０、信号配線１１４０、駆動回路基板１１５０及び１１６０、半導体パワーモジュール１１７０、ＡＣバスバ電極１１８０，１１８１及び１１８２、ＡＣコネクタ１１９０，１１９１及び１１９２並びに電流センサ１２００，１２０１及び１２０２の各部品は、第１実施形態のインバータ１０００に設けられた同じ参照符号が付された部品と同様のものである。 DC connector 1100, smoothing capacitor 1110, DC bus bar electrodes 1120, 1121, 1122, 1123, 1124 and 1125 provided in the inverter 4000 of the fourth embodiment, signal terminal connector 1130, signal wiring 1140, drive circuit boards 1150 and 1160, The components of semiconductor power module 1170, AC bus bar electrodes 1180, 1181 and 1182, AC connectors 1190, 1191 and 1192 and current sensors 1200, 1201 and 1202 have the same reference symbols as those provided in inverter 1000 of the first embodiment. It is similar to the parts
　以下では、第４実施形態のインバータ４０００に設けられたインバータ回路４０１０が第１実施形態のインバータ１０００に設けられたインバータ回路１０１０と相違する点について説明する。 Hereinafter, differences between the inverter circuit 4010 provided in the inverter 4000 of the fourth embodiment and the inverter circuit 1010 provided in the inverter 1000 of the first embodiment will be described.
　ＤＣコネクタ１１００の入力端子１２１０及び１２１１は、それぞれＤＣバスバ電極４２９０及び４２９１の一方の端部に接触する。ＤＣバスバ電極４２９０及び４２９１の他方の端部は、それぞれ平滑コンデンサ１１１０の電極１２２０及び１２２１に接触する。これにより、入力端子１２１０及び１２１１は、それぞれＤＣバスバ電極４２９０及び４２９１を介して電極１２２０及び１２２１に電気的に接続される。 Input terminals 1210 and 1211 of DC connector 1100 contact one end of DC bus bar electrodes 4290 and 4291, respectively. The other ends of DC bus bar electrodes 4290 and 4291 contact electrodes 1220 and 1221 of smoothing capacitor 1110, respectively. Thereby, input terminals 1210 and 1211 are electrically connected to electrodes 1220 and 1221 via DC bus bar electrodes 4290 and 4291, respectively.
　ＤＣバスバ電極４２９０及び平滑コンデンサ１１１０の電極１２２０は、平滑前の直流を伝送するひとつのＤＣバスバを構成する。ＤＣバスバ電極４２９１及び平滑コンデンサ１１１０の電極１２２１は、平滑前の直流を伝送するひとつのＤＣバスバを構成する。 The DC bus bar electrode 4290 and the electrode 1220 of the smoothing capacitor 1110 constitute one DC bus bar that transmits direct current before smoothing. The DC bus bar electrode 4291 and the electrode 1221 of the smoothing capacitor 1110 constitute one DC bus bar that transmits direct current before smoothing.
　ＤＣコネクタ１１００に入力された平滑前の直流は、ＤＣバスバ電極４２９０及び４２９１により伝送され、平滑コンデンサ１１１０の電極１２２０及び１２２１に入力される。 The direct current before smoothing input to the DC connector 1100 is transmitted by the DC bus bar electrodes 4290 and 4291 and is input to the electrodes 1220 and 1221 of the smoothing capacitor 1110.
　図２７は、第４実施形態のインバータに設けられたフレームを模式的に図示する斜視図である。 FIG. 27 is a perspective view schematically illustrating a frame provided in the inverter of the fourth embodiment.
　フレーム４０１２は、柱１３００，１３０１，１３０２及び１３０３、梁１３１０，１３１１，１３１２，１３１３，１３１４，１３１５，１３１６及び１３１７、側板４３２０及び４３２１並びに底板１３３０及び４３３１を含む複数のフレームメンバーを備える。フレーム４０１２は、当該複数のフレームメンバーを組み合わせて構成される。 The frame 4012 comprises a plurality of frame members including pillars 1300, 1301, 1302 and 1303, beams 1310, 1311, 1312, 1313, 1314, 1315, 1316 and 1317, side plates 4320 and 4321 and bottom plates 1330 and 4331. The frame 4012 is configured by combining the plurality of frame members.
　第４実施形態のインバータ４０００に設けられた柱１３００，１３０１，１３０２及び１３０３、梁１３１０，１３１１，１３１２，１３１３，１３１４，１３１５，１３１６及び１３１７並びに底板１３３０の各フレームメンバーは、第１実施形態のインバータ１０００に設けられた同じ参照符号が付与されたフレームメンバーと同様のものである。 The frame members of the columns 1300, 1301, 1302, 1303 and 1303, the beams 1310, 1311, 1312, 1313, 1314, 1315, 1316 and 1317 and the bottom plate 1330 provided in the inverter 4000 of the fourth embodiment are the same as in the first embodiment. It is similar to the frame member provided with the same reference numeral provided in the inverter 1000.
　以下では、側板４３２０及び４３２１並びに底板４３３１がそれぞれ第１実施形態のインバータ１０００に設けられた側板１３２０及び１３２１並びに底板１３３１と相違する点について説明する。 In the following, differences between the side plates 4320 and 4321 and the bottom plate 4331 with the side plates 1320 and 1321 and the bottom plate 1331 provided in the inverter 1000 according to the first embodiment will be described.
　ＤＣコネクタ１１００は、図２４及び図２５に図示されるように、側板４３２０の外側面４９１０に固定される。これにより、ＤＣコネクタ１１００は、側板４３２０に固定され、側板４３２０により支持され、フレーム４０１２に固定される。 The DC connector 1100 is fixed to the outer surface 4910 of the side plate 4320 as illustrated in FIGS. 24 and 25. Thus, the DC connector 1100 is fixed to the side plate 4320, supported by the side plate 4320, and fixed to the frame 4012.
　ＤＣバスバ電極４２９０は、図２４に図示されるように、側板４３２０を貫通する。これにより、ＤＣバスバ電極４２９０は、側板４３２０に固定され、側板４３２０により支持され、フレーム４０１２に固定される。ＤＣバスバ電極４２９１も、側板４３２０を貫通する。これにより、ＤＣバスバ電極４２９１も、側板４３２０に固定され、側板４３２０により支持され、フレーム４０１２に固定される。 The DC bus bar electrode 4290 penetrates the side plate 4320 as illustrated in FIG. Thus, the DC bus bar electrode 4290 is fixed to the side plate 4320, supported by the side plate 4320, and fixed to the frame 4012. The DC bus bar electrode 4291 also penetrates the side plate 4320. Accordingly, the DC bus bar electrode 4291 is also fixed to the side plate 4320, supported by the side plate 4320, and fixed to the frame 4012.
　ＤＣバスバ電極１１２２は、図２４に図示されるように、底板４３３１に設けられた突起４９２０の先端に接触する。これにより、ＤＣバスバ電極１１２２は、底板４３３１に固定され、底板４３３１により支持され、フレーム４０１２に固定される。ＤＣバスバ電極１１２０，１１２１，１１２３，１１２４及び１１２５も、突起４９２０の先端に接触する。これにより、ＤＣバスバ電極１１２０，１１２１，１１２３，１１２４及び１１２５も、底板４３３１に固定され、底板４３３１により支持され、フレーム４０１２に固定される。 The DC bus bar electrode 1122 contacts the tip of the protrusion 4920 provided on the bottom plate 4331 as illustrated in FIG. Thus, the DC bus bar electrode 1122 is fixed to the bottom plate 4331, supported by the bottom plate 4331, and fixed to the frame 4012. The DC busbar electrodes 1120, 1121, 1123, 1124 and 1125 also contact the tips of the protrusions 4920. Thus, the DC bus bar electrodes 1120, 1121, 1123, 1124 and 1125 are also fixed to the bottom plate 4331, supported by the bottom plate 4331, and fixed to the frame 4012.
　インバータ４０００においては、ＤＣバスバ電極１１２２が、幅広の形状を有し、わずかな長さしか有しない。また、ＤＣバスバ電極１１２２の一方の端部は、平滑コンデンサ１１１０の電極１２３２に接触させられ、ＤＣバスバ電極１１２２の他方の端部は、半導体パワーモジュール１１７０のＤＣ電極１２４２に接触させられる。このため、ＤＣバスバ電極１１２２は、立体的な折り曲げ形状等の複雑な形状を有する。ＤＣバスバ電極１１２０，１１２１，１１２３，１１２４及び１１２５も、同様に、複雑な形状を有する。寄生インダクタンスを小さくするために、ＤＣバスバ電極１１２０，１１２１，１１２２，１１２３，１１２４及び１１２５が一体化されＤＣバスバ電極１１２１，１１２３及び１１２５がＤＣバスバ電極１１２０，１１２２及び１１２４と積層された場合は、ＤＣバスバ電極１１２０，１１２１，１１２２，１１２３，１１２４及び１１２５の形状はさらに複雑になる。 In inverter 4000, DC bus bar electrode 1122 has a wide shape and only a small length. Further, one end of the DC bus bar electrode 1122 is in contact with the electrode 1232 of the smoothing capacitor 1110, and the other end of the DC bus bar electrode 1122 is in contact with the DC electrode 1242 of the semiconductor power module 1170. For this reason, the DC bus bar electrode 1122 has a complicated shape such as a three-dimensional bent shape. The DC busbar electrodes 1120, 1121, 1123, 1124 and 1125 also have complicated shapes. When the DC bus bar electrodes 1120, 1121, 1122, 1123, 1124 and 1125 are integrated and the DC bus bar electrodes 1121, 1123 and 1125 are stacked with the DC bus bar electrodes 1120, 1122 and 1124 in order to reduce parasitic inductance, The shape of the DC busbar electrodes 1120, 1121, 1122, 1123, 1124 and 1125 is further complicated.
　フレーム４０１２が設けられた場合は、ＤＣバスバ電極１１２２の固定に適した位置にＤＣバスバ電極１１２２を固定する底板４３３１を配置することが容易である。このため、ＤＣバスバ電極１１２２が支持困難な複雑な立体形状を有する場合でも、ＤＣバスバ電極１１２２を容易に支持できる。ＤＣバスバ電極１１２２が底板４３３１に固定される場合は、ＤＣバスバ電極１１２２が底板４３３１に固定された後に、ＤＣバスバ電極１１２２の一方の端部を平滑コンデンサ１１１０の電極１２３２にねじにて固定し、ＤＣバスバ電極１１２２の他方の端部を半導体パワーモジュール１１７０のＤＣ電極１２４２にねじにて固定することにより、ＤＣバスバ電極１１２２を実装することが容易になる。これに対して、フレーム４０１２が設けられない場合は、ＤＣバスバ電極１１２２を固定する構成要素を設けることが容易ではなく、固定されずに宙に浮いたＤＣバスバ電極１１２２の一方の電極を平滑コンデンサ１１１０の電極１２３２にねじにて固定し、固定されずに宙に浮いたＤＣバスバ電極１１２２の他方の端部を半導体パワーモジュール１１７０のＤＣ電極１２４２にねじにて固定する作業が必要になる。ＤＣバスバ電極１１２０，１１２１，１１２３，１１２４及び１１２５についても、同様のことがいえる。 When the frame 4012 is provided, it is easy to arrange the bottom plate 4331 for fixing the DC bus bar electrode 1122 at a position suitable for fixing the DC bus bar electrode 1122. Therefore, even when the DC bus bar electrode 1122 has a complicated three-dimensional shape that is difficult to support, the DC bus bar electrode 1122 can be easily supported. When the DC busbar electrode 1122 is fixed to the bottom plate 4331, after the DC busbar electrode 1122 is fixed to the bottom plate 4331, one end of the DC busbar electrode 1122 is screwed to the electrode 1232 of the smoothing capacitor 1110, By fixing the other end of the DC bus bar electrode 1122 to the DC electrode 1242 of the semiconductor power module 1170 with a screw, it becomes easy to mount the DC bus bar electrode 1122. On the other hand, when the frame 4012 is not provided, it is not easy to provide a component for fixing the DC bus bar electrode 1122, and one electrode of the DC bus bar electrode 1122 which is not fixed and floats in the air is smoothed. It is necessary to fix the other end of the DC bus bar electrode 1122 which is fixed to the electrode 1232 of 1110 with a screw and is not fixed and floated in the air to the DC electrode 1242 of the semiconductor power module 1170 with a screw. The same is true for the DC bus bar electrodes 1120, 1121, 1123, 1124 and 1125.
　また、インバータ４０００においては、ＤＣバスバ電極４２９０及び４２９１がフレーム４０１２に固定されるため、ＤＣバスバ電極４２９０及び４２９１を絶縁しながらＤＣバスバ電極４２９０及び４２９１の周辺に生じるデッドスペースを減らすことができる。これにより、小さなスペースにＤＣバスバ電極４２９０及び４２９１を配置することが容易になる。 Further, in the inverter 4000, since the DC bus bar electrodes 4290 and 4291 are fixed to the frame 4012, the dead space generated around the DC bus bar electrodes 4290 and 4291 can be reduced while insulating the DC bus bar electrodes 4290 and 4291. This facilitates placing the DC bus bar electrodes 4290 and 4291 in a small space.
　ＡＣバスバ電極１１８１は、図２５に図示されるように、側板４３２１を貫通する。これにより、ＡＣバスバ電極１１８１は、側板４３２１に固定され、側板４３２１により支持され、フレーム４０１２に固定される。同様に、ＡＣバスバ電極１１８０及び１１８２も、側板４３２１を貫通する。これにより、ＡＣバスバ電極１１８０及び１１８２も、側板４３２１に固定され、側板４３２１により支持され、フレーム４０１２に固定される。 The AC bus bar electrode 1181 penetrates the side plate 4321 as illustrated in FIG. Thus, the AC bus bar electrode 1181 is fixed to the side plate 4321, supported by the side plate 4321, and fixed to the frame 4012. Similarly, AC bus bar electrodes 1180 and 1182 also penetrate side plate 4321. Thus, the AC bus bar electrodes 1180 and 1182 are also fixed to the side plate 4321, supported by the side plate 4321, and fixed to the frame 4012.
　ＡＣコネクタ１１９１は、図２４及び図２５に図示されるように、側板４３２１の外側面４９３０に固定される。これにより、ＡＣコネクタ１１９１は、側板４３２１に固定され、側板４３２１により支持され、フレーム４０１２に固定される。同様に、ＡＣコネクタ１１９０及び１１９２も、側板４３２１の外側面４９３０に固定される。これにより、ＡＣコネクタ１１９０及び１１９２も、側板４３２１に固定され、側板４３２１により支持され、フレーム４０１２に固定される。 The AC connector 1191 is fixed to the outer side 4930 of the side plate 4321 as illustrated in FIGS. 24 and 25. Thus, the AC connector 1191 is fixed to the side plate 4321, supported by the side plate 4321, and fixed to the frame 4012. Similarly, AC connectors 1190 and 1192 are also fixed to the outer side 4930 of side plate 4321. Thus, the AC connectors 1190 and 1192 are also fixed to the side plate 4321, supported by the side plate 4321, and fixed to the frame 4012.
　ＤＣバスバ電極４２９０及び４２９１、ＤＣバスバ電極１１２０，１１２１，１１２２，１１２３，１１２４及び１１２５、信号配線１１４０、ＡＣバスバ電極１１８０，１１８１及び１１８２等のフレームメンバーに埋め込むことができる部品は、例えば、インサートモールド成型等により、フレームメンバーに埋め込まれてもよい。 Parts that can be embedded in frame members such as DC bus bar electrodes 4290 and 4291, DC bus bar electrodes 1120, 1121, 1122, 1123, 1124 and 1125, signal wiring 1140, AC bus bar electrodes 1180, 1181 and 1182 are, for example, insert molds. It may be embedded in the frame member by molding or the like.
　第４実施形態のインバータ４０００においては、ＤＣコネクタ１１００、ＤＣバスバ電極４２９０及び４２９１、平滑コンデンサ１１１０、ＤＣバスバ電極１１２０，１１２１，１１２２，１１２３，１１２４及び１１２５、信号端子コネクタ１１３０、複数の信号配線１１４０、駆動回路基板１１５０及び１１６０、半導体パワーモジュール１１７０、ＡＣバスバ電極１１８０，１１８１及び１１８２、ＡＣコネクタ１１９０，１１９１及び１１９２、電流センサ１２００，１２０１及び１２０２からなる群より選択される少なくともひとつの部品がフレーム４０１２に固定されるか、又は埋め込まれる。 In the inverter 4000 of the fourth embodiment, the DC connector 1100, the DC bus bar electrodes 4290 and 4291, the smoothing capacitor 1110, the DC bus bar electrodes 1120, 1121, 1122, 1123, 1124 and 1125, the signal terminal connector 1130, a plurality of signal wires 1140. , At least one component selected from the group consisting of drive circuit boards 1150 and 1160, semiconductor power module 1170, AC busbar electrodes 1180, 1181 and 1182, AC connectors 1190, 1191 and 1192, current sensors 1200, 1201 and 1202 as a frame It is fixed to 4012 or embedded.
　第４実施形態のインバータ４０００においては、ＤＣバスバ電極４２９０及び４２９１、平滑コンデンサ１１１０、ＤＣバスバ電極１１２０，１１２１，１１２２，１１２３，１１２４及び１１２５、複数の信号配線１１４０、駆動回路基板１１５０及び１１６０、ＡＣバスバ電極１１８０，１１８１及び１１８２、並びに電流センサ１２００，１２０１及び１２０２からなる群より選択される少なくともひとつの部品が先述した冷却される部品１６１１になりうる。 In the inverter 4000 of the fourth embodiment, the DC bus bar electrodes 4290 and 4291, the smoothing capacitor 1110, the DC bus bar electrodes 1120, 1121, 1122, 1123, 1124 and 1125, the plurality of signal wires 1140, the drive circuit boards 1150 and 1160, AC At least one component selected from the group consisting of the bus bar electrodes 1180, 1181 and 1182, and the current sensors 1200, 1201 and 1202 may be the cooled component 1611 described above.
　第４実施形態においても、第１実施形態と同様に、インバータ４０００を小型化し、インバータ４０００の製造に要するコストを減らすことが容易である。 Also in the fourth embodiment, as in the first embodiment, it is easy to miniaturize the inverter 4000 and reduce the cost required to manufacture the inverter 4000.
　５　第５実施形態
　本発明の例示的な第５実施形態は、インバータに関する。 5 Fifth Embodiment The fifth exemplary embodiment of the present invention relates to an inverter.
　第１実施形態と第５実施形態との主な相違は、以下の点にある：第１実施形態においては、半導体パワーモジュール１１７０の裏面が被冷却面１４００となる。また、被冷却面１４００を冷却する冷却器１０１１が設けられる。しかし、半導体パワーモジュール１１７０の表面が被冷却面とならない。これに対して、第５実施形態においては、半導体パワーモジュール１１７０の裏面が第１の被冷却面となる。また、第１の被冷却面を冷却する第１の冷却器が設けられる。加えて、半導体パワーモジュール１１７０の表面が第２の被冷却面となる。また、第２の被冷却面を冷却する第２の冷却器が設けられる。さらに加えて、フレームが、第１の冷却器から第２の冷却器へ冷却液を導く配管を兼ねる。 The main differences between the first embodiment and the fifth embodiment are as follows: In the first embodiment, the back surface of the semiconductor power module 1170 is the surface to be cooled 1400. In addition, a cooler 1011 for cooling the surface to be cooled 1400 is provided. However, the surface of the semiconductor power module 1170 does not become a surface to be cooled. On the other hand, in the fifth embodiment, the back surface of the semiconductor power module 1170 is the first surface to be cooled. Also, a first cooler for cooling the first surface to be cooled is provided. In addition, the surface of the semiconductor power module 1170 becomes a second surface to be cooled. Also, a second cooler is provided for cooling the second surface to be cooled. Additionally, the frame doubles as a conduit for conducting the coolant from the first cooler to the second cooler.
　以下では、上記の相違に関連する第５実施形態のインバータの構成が説明される。 The configuration of the inverter according to the fifth embodiment related to the above difference will be described below.
　図２８及び図２９は、第５実施形態のインバータの断面を模式的に図示する断面図である。図２８及び図２９に図示される断面の位置は、それぞれ図６及び図７に図示される断面の位置に相当する。 28 and 29 are cross-sectional views schematically showing cross sections of the inverter of the fifth embodiment. The positions of the cross sections shown in FIGS. 28 and 29 correspond to the positions of the cross sections shown in FIGS. 6 and 7, respectively.
　図２８及び図２９に図示されるインバータ１００は、インバータ回路１０１０、少なくともひとつの冷却器１１０及びフレーム１１１を備える。少なくともひとつの冷却器１１０は、第１の冷却器１２０及び第２の冷却器１２１を含む。 The inverter 100 illustrated in FIGS. 28 and 29 includes an inverter circuit 1010, at least one cooler 110, and a frame 111. At least one cooler 110 includes a first cooler 120 and a second cooler 121.
　第５実施形態のインバータ１００に設けられたインバータ回路１０１０は、第１実施形態のインバータ１０００に設けられたインバータ回路１０１０と同様のものである。このため、第５実施形態のインバータ１００は、第１実施形態のインバータ１０００に設けられた平滑コンデンサ１１１０及び半導体パワーモジュール１１７０とそれぞれ同様の平滑コンデンサ１１１０及び半導体パワーモジュール１１７０を備える。 The inverter circuit 1010 provided in the inverter 100 of the fifth embodiment is the same as the inverter circuit 1010 provided in the inverter 1000 of the first embodiment. Therefore, the inverter 100 according to the fifth embodiment includes a smoothing capacitor 1110 and a semiconductor power module 1170 similar to the smoothing capacitor 1110 and the semiconductor power module 1170 provided in the inverter 1000 according to the first embodiment.
　半導体パワーモジュール１１７０は、板形状である。半導体パワーモジュール１１７０は、第１の被冷却面１３０及び第２の被冷却面１３１を有する。第１の被冷却面１３０は、半導体パワーモジュール１１７０の一方の主面となる裏面である。第２の被冷却面１３１は、半導体パワーモジュール１１７０の他方の主面となる表面である。 The semiconductor power module 1170 has a plate shape. The semiconductor power module 1170 has a first surface to be cooled 130 and a second surface to be cooled 131. The first cooled surface 130 is a back surface to be one main surface of the semiconductor power module 1170. The second cooled surface 131 is a surface to be the other main surface of the semiconductor power module 1170.
　半導体パワーモジュール１１７０は、第１の冷却器１２０と第２の冷却器１２１との間に配置される。半導体パワーモジュール１１７０の冷却は、両面冷却構造により行われる。第１の冷却器１２０は、半導体パワーモジュール１１７０の第１の被冷却面１３０に取り付けられ、第１の被冷却面１３０を冷却する。また、第２の冷却器１２１は、半導体パワーモジュール１１７０の第２の被冷却面１３１に取り付けられ、第２の被冷却面１３１を冷却する。 The semiconductor power module 1170 is disposed between the first cooler 120 and the second cooler 121. The cooling of the semiconductor power module 1170 is performed by a double-sided cooling structure. The first cooler 120 is attached to the first cooled surface 130 of the semiconductor power module 1170 and cools the first cooled surface 130. Further, the second cooler 121 is attached to the second cooled surface 131 of the semiconductor power module 1170 and cools the second cooled surface 131.
　図３０は、第５実施形態のインバータに設けられた第１の冷却器及び第２の冷却器を模式的に図示する斜視図である。 FIG. 30 is a perspective view schematically illustrating a first cooler and a second cooler provided in the inverter according to the fifth embodiment.
　第１の冷却器１２０は、図３０に図示されるように、第１の冷却器本体１４０、第１の冷却液入口配管１４１及び第１の冷却液出口配管１４２を備える。第１の冷却液入口配管１４１の先端は、第１の冷却液入口１５０を有する。第１の冷却液出口配管１４２の先端は、第１の冷却液出口１６０を有する。したがって、第１の冷却器１２０は、第１の冷却液入口１５０及び第１の冷却液出口１６０を有する。 The first cooler 120 includes a first cooler body 140, a first coolant inlet pipe 141, and a first coolant outlet pipe 142, as shown in FIG. The tip of the first coolant inlet pipe 141 has a first coolant inlet 150. The tip of the first coolant outlet pipe 142 has a first coolant outlet 160. Thus, the first cooler 120 has a first coolant inlet 150 and a first coolant outlet 160.
　第２の冷却器１２１は、第２の冷却器本体１７０、第２の冷却液入口配管１７１及び第２の冷却液出口配管１７２を備える。第２の冷却液入口配管１７１の先端は、第２の冷却液入口１８０を有する。第２の冷却液出口配管１７２の先端は、第２の冷却液出口１９０を有する。したがって、第２の冷却器１２１は、第２の冷却液入口１８０及び第２の冷却液出口１９０を有する。 The second cooler 121 includes a second cooler body 170, a second coolant inlet pipe 171, and a second coolant outlet pipe 172. The tip of the second coolant inlet pipe 171 has a second coolant inlet 180. The tip of the second coolant outlet pipe 172 has a second coolant outlet 190. Thus, the second cooler 121 has a second coolant inlet 180 and a second coolant outlet 190.
　図３１は、第５実施形態のインバータに設けられた第１の冷却器１２０及び第２の冷却器１２１、並びに当該インバータに設けられたフレーム１１１の一部を模式的に図示する斜視図である。図３２は、第５実施形態のインバータに設けられた第１の冷却器１２０及び第２の冷却器１２１、並びに当該インバータに設けられたフレーム１１１の一部の断面を模式的に図示する断面図である。 FIG. 31 is a perspective view schematically illustrating a first cooler 120 and a second cooler 121 provided in the inverter according to the fifth embodiment, and a part of a frame 111 provided in the inverter. . FIG. 32 is a cross-sectional view schematically showing a cross section of the first cooler 120 and the second cooler 121 provided in the inverter of the fifth embodiment, and a part of the frame 111 provided in the inverter. It is.
　第１の冷却器１２０及び第２の冷却器１２１は、図３１及び図３２に図示されるように、フレーム１１１に固定される。第１の冷却器１２０及び第２の冷却器１２１がフレーム１１１に固定された状態においては、第２の冷却器１２１は、第１の冷却器１２０に対向し、第１の冷却器１２０から第１の方向Ｄ１に離れている。また、第２の冷却液入口配管１７１は、第１の冷却液出口配管１４２に対向し、第１の冷却液出口配管１４２から第１の方向Ｄ１に離れている。 The first cooler 120 and the second cooler 121 are fixed to the frame 111 as illustrated in FIGS. 31 and 32. In a state where the first cooler 120 and the second cooler 121 are fixed to the frame 111, the second cooler 121 faces the first cooler 120, and the first cooler 120 It is separated in the direction D1 of 1. Further, the second coolant inlet pipe 171 faces the first coolant outlet pipe 142 and is separated from the first coolant outlet pipe 142 in the first direction D1.
　フレーム１１１は、板２００、板２０１、柱２０２、柱２０３、柱２０４及び柱２０５を備える。板２００及び板２０１は、広がり方向である第２の方向Ｄ２及び第３の方向Ｄ３に広がる面を有する板状のフレームメンバーである。柱２０２、柱２０３、柱２０４及び柱２０５は、第１の方向Ｄ１に延びる棒状のフレームメンバーである。 The frame 111 includes a plate 200, a plate 201, a column 202, a column 203, a column 204 and a column 205. The plate 200 and the plate 201 are plate-like frame members having surfaces extending in the second direction D2 and the third direction D3 which are the spreading directions. The pillars 202, the pillars 203, the pillars 204 and the pillars 205 are rod-like frame members extending in the first direction D1.
　第１の冷却器１２０は、板２００、柱２０２、柱２０３、柱２０４及び柱２０５に固定される。このため、第１の冷却器１２０は、板２００、柱２０２、柱２０３、柱２０４及び柱２０５により支持される。第１の冷却器１２０は、直方体状の形状を有し、四隅を備える。第１の冷却器１２０の四隅は、柱２０２、柱２０３、柱２０４及び柱２０５に固定される。 The first cooler 120 is fixed to the plate 200, the column 202, the column 203, the column 204 and the column 205. For this reason, the first cooler 120 is supported by the plate 200, the pillars 202, the pillars 203, the pillars 204 and the pillars 205. The first cooler 120 has a rectangular shape and includes four corners. The four corners of the first cooler 120 are fixed to the column 202, the column 203, the column 204 and the column 205.
　第２の冷却器１２１は、板２０１、柱２０２、柱２０３、柱２０４及び柱２０５に固定される。このため、第２の冷却器１２１は、板２０１、柱２０２、柱２０３、柱２０４及び柱２０５により支持される。第２の冷却器１２１は、直方体状の形状を有し、四隅を備える。第２の冷却器１２１の四隅は、柱２０２、柱２０３、柱２０４及び柱２０５に固定される。 The second cooler 121 is fixed to the plate 201, the column 202, the column 203, the column 204 and the column 205. For this reason, the second cooler 121 is supported by the plate 201, the column 202, the column 203, the column 204, and the column 205. The second cooler 121 has a rectangular parallelepiped shape and has four corners. The four corners of the second cooler 121 are fixed to the column 202, the column 203, the column 204 and the column 205.
　柱２０２、柱２０３、柱２０４及び柱２０５は、第１の冷却液出口配管１４２及び第２の冷却液入口配管１７１を支持する柱２０２を含む。 The column 202, the column 203, the column 204 and the column 205 include a column 202 that supports the first coolant outlet pipe 142 and the second coolant inlet pipe 171.
　フレーム１１１は、中空部２１０を備える。中空部２１０は、中空の形状を有し、冷却液が流れる流路２２０を有する。中空部２１０は、柱２０２に設けられる。 The frame 111 comprises a hollow portion 210. The hollow portion 210 has a hollow shape and has a flow passage 220 through which the coolant flows. The hollow portion 210 is provided in the column 202.
　中空部２１０の一端においては、第１の冷却液出口配管１４２が流路２２０に挿入される。中空部２１０の他端においては、第２の冷却液入口配管１７１が流路２２０に挿入される。このため、中空部２１０は、第１の冷却液出口１６０に接続される一方の接続端２３０、及び第２の冷却液入口１８０に接続される他方の接続端２３１を有する。 At one end of the hollow portion 210, the first coolant outlet pipe 142 is inserted into the flow path 220. At the other end of the hollow portion 210, the second cooling fluid inlet pipe 171 is inserted into the flow path 220. For this purpose, the hollow part 210 has one connection end 230 connected to the first coolant outlet 160 and the other connection end 231 connected to the second coolant inlet 180.
　中空部２１０の一方の接続端２３０が第１の冷却液出口１６０に接続されることにより、第１の冷却器１２０から中空部２１０に冷却液を流すことができる。また、中空部２１０の他方の接続端２３１が第２の冷却液入口１８０に接続されることにより、中空部２１０から第２の冷却器１２１に冷却液を流すことができる。したがって、インバータ１００には、第１の冷却液入口１５０から第１の冷却器１２０、中空部２１０及び第２の冷却器１２１を順次に経由し第２の冷却液出口１９０に至る流路が構成される。このため、第１の冷却液入口１５０に流入した冷却液は、第１の冷却器１２０、中空部２１０及び第２の冷却器１２１を順次に流れ、第２の冷却液出口１９０から流出する。中空部２１０は、第１の冷却器１２０と第２の冷却器１２１との間にある冷却液の経路を構成し、冷却液配管の一部になる。 By connecting one connection end 230 of the hollow portion 210 to the first coolant outlet 160, the coolant can flow from the first cooler 120 to the hollow portion 210. Further, by connecting the other connection end 231 of the hollow portion 210 to the second cooling fluid inlet 180, the cooling fluid can flow from the hollow portion 210 to the second cooler 121. Therefore, in the inverter 100, a flow path from the first coolant inlet 150 to the second coolant outlet 190 via the first cooler 120, the hollow portion 210 and the second cooler 121 sequentially is configured. Be done. For this reason, the coolant that has flowed into the first coolant inlet 150 flows sequentially through the first cooler 120, the hollow portion 210, and the second cooler 121, and flows out from the second coolant outlet 190. The hollow portion 210 constitutes a path of the coolant between the first cooler 120 and the second cooler 121, and becomes a part of the coolant pipe.
　第１の冷却液入口１５０に流入した冷却液は、第１の冷却液入口配管１４１、第１の冷却器本体１４０及び第１の冷却液出口配管１４２を順次に流れた後に、第１の冷却液出口１６０から流出する。第１の冷却器本体１４０に流れる冷却液は、第１の冷却器本体１４０に接触する第１の被冷却面１３０から熱を奪い、第１の被冷却面１３０を冷却する。 The coolant that has flowed into the first coolant inlet 150 flows through the first coolant inlet pipe 141, the first cooler main body 140, and the first coolant outlet pipe 142 sequentially, and then the first cooling is performed. It flows out from the liquid outlet 160. The cooling fluid flowing to the first cooler body 140 removes heat from the first cooled surface 130 in contact with the first cooler body 140 to cool the first cooled surface 130.
　第２の冷却液入口１８０に流入した冷却液は、第２の冷却液入口配管１７１、第２の冷却器本体１７０及び第２の冷却液出口配管１７２を順次に流れた後に、第２の冷却液出口１９０から流出する。第２の冷却器本体１７０に流れる冷却液は、第２の冷却器本体１７０に接触する第２の被冷却面１３１から熱を奪い、第２の被冷却面１３１を冷却する。 The cooling fluid having flowed into the second cooling fluid inlet 180 flows through the second cooling fluid inlet piping 171, the second cooler main body 170, and the second cooling fluid outlet piping 172 sequentially, and then the second cooling It flows out from the liquid outlet 190. The cooling fluid flowing to the second cooler main body 170 removes heat from the second cooled surface 131 in contact with the second cooler main body 170 and cools the second cooled surface 131.
　冷却液は、水又は水溶液からなる冷却水である。したがって、第１の冷却液入口配管１４１及び第２の冷却液入口配管１７１は、水入口配管である。また、第１の冷却液出口配管１４２及び第２の冷却液出口配管１７２は、水出口配管である。冷却液が冷却水以外の冷却液であってもよい。 The coolant is cooling water composed of water or an aqueous solution. Therefore, the first coolant inlet pipe 141 and the second coolant inlet pipe 171 are water inlet pipes. The first coolant outlet pipe 142 and the second coolant outlet pipe 172 are water outlet pipes. The coolant may be a coolant other than the coolant.
　中空部２１０の一端において第１の冷却液入口配管１４１が流路２２０に挿入されてもよい。中空部２１０の他端において第２の冷却液出口配管１７２が流路２２０に挿入されてもよい。したがって、中空部２１０は、第１の冷却液入口１５０及び又は第１の冷却液出口１６０に接続される一方の接続端２３０、及び第２の冷却液入口１８０又は第２の冷却液出口１９０に接続される他方の接続端２３１を有しうる。 The first coolant inlet pipe 141 may be inserted into the flow passage 220 at one end of the hollow portion 210. The second coolant outlet pipe 172 may be inserted into the flow path 220 at the other end of the hollow portion 210. Therefore, the hollow portion 210 is connected to the first connection end 230 connected to the first coolant inlet 150 and / or the first coolant outlet 160, and to the second coolant inlet 180 or the second coolant outlet 190. It may have the other connection end 231 connected.
　複数の部品が発熱する場合、発熱体の表面、裏面等の複数の面が発熱する場合等においては、複数の発熱部分が同一平面上に位置し互いに近接しているという条件が満たされない限り、複数の発熱部分をそれぞれ冷却する複数の冷却器が必要である。しかし、複数の冷却器が設けられた場合は、複数の冷却器を保持及び固定するのに必要なスペースに加えて、冷却液が流れる配管が占めるスペース、複数の冷却器と配管とを互いに接続する接続部品が占めるスペース等も必要になる。このため、大きなスペースが必要になる。大きなスペースが必要になることは、インバータを小型化することの障害となる。 When a plurality of parts generate heat, and when a plurality of surfaces such as the front surface and the back surface of the heating element generate heat, etc., the condition that the plurality of heat generation portions are located on the same plane and are close to each other is not satisfied. A plurality of coolers are required to respectively cool the plurality of heat generating parts. However, when multiple coolers are provided, in addition to the space required to hold and fix the multiple coolers, the space occupied by the piping through which the cooling fluid flows, connecting the multiple coolers and the piping to each other The space occupied by connecting parts is also required. This requires a large space. The need for a large space is an obstacle to miniaturizing the inverter.
　これに対して、インバータ１００においては、第１の冷却器１２０から第２の冷却器１２１へ向かう冷却液が流れる流路２２０が、第１の冷却器１２０及び第２の冷却器１２１を支持及び固定するフレーム１１１に設けられる中空部２１０の内部にある。このため、第１の冷却器１２０から第２の冷却器１２１へ向かう冷却液が流れる流路を有する冷却配管をフレーム１１１から独立して設ける必要がなくなる。また、当該冷却配管を第１の冷却器１２０及び第２の冷却器１２１に接続する接続部品を設ける必要もなくなる。このため、第１の被冷却面１３０及び第２の被冷却面１３１が同一平面上に位置し互いに近接しているという条件が満たされないにもかかわらず、第１の冷却器１２０及び第２の冷却器１２１を設置するのに要するスペースを小さくすることができる。 On the other hand, in the inverter 100, the flow path 220 through which the coolant flows from the first cooler 120 to the second cooler 121 supports the first cooler 120 and the second cooler 121, and It is inside the hollow portion 210 provided in the frame 111 to be fixed. For this reason, it is not necessary to provide cooling piping having a flow path in which the cooling fluid from the first cooler 120 to the second cooler 121 flows independently from the frame 111. In addition, it is not necessary to provide connection parts for connecting the cooling pipe to the first cooler 120 and the second cooler 121. Therefore, although the condition that the first surface to be cooled 130 and the second surface to be cooled 131 are located on the same plane and be close to each other is not satisfied, the first cooler 120 and the second The space required to install the cooler 121 can be reduced.
　また、インバータ１００においては、第１の冷却液出口配管１４２及び第２の冷却液入口配管１７１が、十分な長さを有する中空部２１０の流路２２０に挿入されるため、十分な長さを有する被せ代を確保することが容易である。このため、冷却液の漏れを容易に防止することができる。 Further, in the inverter 100, since the first coolant outlet pipe 142 and the second coolant inlet pipe 171 are inserted into the flow path 220 of the hollow portion 210 having a sufficient length, a sufficient length can be obtained. It is easy to secure the covering cost which it has. For this reason, it is possible to easily prevent the coolant from leaking.
　６　第６実施形態
　本発明の例示的な第６実施形態は、インバータに関する。 6 Sixth Embodiment The sixth exemplary embodiment of the present invention relates to an inverter.
　第１実施形態と第６実施形態との主な相違は、以下の点にある：第１実施形態においては、半導体パワーモジュール１１７０の被冷却面１４００を冷却する冷却器が設けられる。しかし、平滑コンデンサ１１１０が冷却されない。これに対して、第６実施形態においては、平滑コンデンサ１１１０に設けられた第１の電極を冷却する第１の冷却器が設けられる。加えて、半導体パワーモジュール１１７０の被冷却面１４００及び平滑コンデンサ１１１０に設けられた第２の電極を冷却する第２の冷却器が設けられる。さらに加えて、フレームが、第２の冷却器から第１の冷却器へ冷却液を導く配管を兼ねる。 The main differences between the first embodiment and the sixth embodiment are as follows: In the first embodiment, a cooler for cooling the surface to be cooled 1400 of the semiconductor power module 1170 is provided. However, the smoothing capacitor 1110 is not cooled. On the other hand, in the sixth embodiment, a first cooler for cooling the first electrode provided in the smoothing capacitor 1110 is provided. In addition, a second cooler is provided to cool the surface to be cooled 1400 of the semiconductor power module 1170 and the second electrode provided on the smoothing capacitor 1110. Additionally, the frame doubles as a conduit for conducting the coolant from the second cooler to the first cooler.
　以下では、上記の相違に関連する第６実施形態のインバータの構成が説明される。 In the following, the configuration of the inverter of the sixth embodiment relating to the above difference will be described.
　図３３は、第６実施形態のインバータの断面を模式的に図示する断面図である。図３３に図示される断面の位置は、図７に図示される断面の位置に相当する。 FIG. 33 is a cross sectional view schematically illustrating a cross section of the inverter according to the sixth embodiment. The position of the cross section shown in FIG. 33 corresponds to the position of the cross section shown in FIG.
　図３３に図示されるインバータ３００は、インバータ回路１０１０、第１の冷却器３１０、少なくともひとつの冷却器３１１及びフレーム３１２を備える。少なくともひとつの冷却器３１１は、第２の冷却器３２０を含む。 The inverter 300 illustrated in FIG. 33 includes an inverter circuit 1010, a first cooler 310, at least one cooler 311, and a frame 312. At least one cooler 311 includes a second cooler 320.
　第６実施形態のインバータ３００に設けられたインバータ回路１０１０は、第１実施形態のインバータ１０００に設けられたインバータ回路１０１０と同様のものである。このため、第６実施形態のインバータ３００は、第１実施形態のインバータ１０００に設けられた平滑コンデンサ１１１０及び半導体パワーモジュール１１７０とそれぞれ同様の平滑コンデンサ１１１０及び半導体パワーモジュール１１７０を備える。 The inverter circuit 1010 provided in the inverter 300 of the sixth embodiment is the same as the inverter circuit 1010 provided in the inverter 1000 of the first embodiment. Therefore, the inverter 300 according to the sixth embodiment includes a smoothing capacitor 1110 and a semiconductor power module 1170 similar to the smoothing capacitor 1110 and the semiconductor power module 1170 provided in the inverter 1000 according to the first embodiment.
　平滑コンデンサ１１１０は、コンデンサ３３０、第１の電極３３１及び第２の電極３３２を備える。コンデンサ３３０は、一端及び他端を有する。第１の電極３３１は、コンデンサ３３０の一端に配置される。第２の電極３３２は、コンデンサ３３０の他端に配置される。 The smoothing capacitor 1110 comprises a capacitor 330, a first electrode 331 and a second electrode 332. The capacitor 330 has one end and the other end. The first electrode 331 is disposed at one end of the capacitor 330. The second electrode 332 is disposed at the other end of the capacitor 330.
　半導体パワーモジュール１１７０は、板形状である。半導体パワーモジュール１１７０は、被冷却面１４００を有する。被冷却面１４００は、半導体パワーモジュール１１７０の一方の主面となる裏面である。 The semiconductor power module 1170 has a plate shape. The semiconductor power module 1170 has a surface to be cooled 1400. The cooled surface 1400 is a back surface to be one main surface of the semiconductor power module 1170.
　平滑コンデンサ１１１０は、第１の冷却器３１０と第２の冷却器３２０との間に配置される。平滑コンデンサ１１１０の冷却は、両面冷却構造により行われる。インバータ３００は、第１の電気絶縁材３４０及び第２の電気絶縁材３４１をさらに備える。第１の電極３３１は、第１の電気絶縁材３４０に密着するか、又は接合される。第１の電気絶縁材３４０は、第１の冷却器３１０に密着するか、又は接合される。第２の電極３３２は、第２の電気絶縁材３４１に密着するか、又は接合される。第２の電気絶縁材３４１は、第２の冷却器３２０に密着するか、又は第２の冷却器３２０に接合される。第１の冷却器３１０、第１の電気絶縁材３４０、および第１の冷却器３１０とが、密着又は接合されることにより、第１の冷却器３１０は、第１の電極３３１を冷却する。第２の冷却器３２０、第２の電気絶縁材３４１、および第２の冷却器３２０とが、密着又は接合されることにより、第２の冷却器３２０は、第２の電極３３２を冷却する。第１の電気絶縁材３４０により、活電位が与えられる第１の電極３３１が第１の冷却器３１０から絶縁される。第２の電気絶縁材３４１により、活電位が与えられる第２の電極３３２が第２の冷却器３２０から絶縁される。 The smoothing capacitor 1110 is disposed between the first cooler 310 and the second cooler 320. Cooling of the smoothing capacitor 1110 is performed by a double-sided cooling structure. The inverter 300 further includes a first electrical insulator 340 and a second electrical insulator 341. The first electrode 331 is in close contact with or bonded to the first electrical insulator 340. The first electrical insulator 340 is in intimate contact with or bonded to the first cooler 310. The second electrode 332 is in close contact with or bonded to the second electrical insulator 341. The second electrical insulator 341 adheres to the second cooler 320 or is bonded to the second cooler 320. The first cooler 310 cools the first electrode 331 by the first cooler 310, the first electrical insulating material 340, and the first cooler 310 being in close contact with or bonded to each other. The second cooler 320 cools the second electrode 332 by bringing the second cooler 320, the second electrical insulator 341, and the second cooler 320 into close contact or bonding. The first electrical insulator 340 insulates the first electrode 331 to which the active potential is applied from the first cooler 310. The second electrode 332 to which the active potential is applied is insulated from the second cooler 320 by the second electrical insulator 341.
　半導体パワーモジュール１１７０は、第２の冷却器３２０上に配置される。半導体パワーモジュール１１７０の冷却は、片面冷却構造により行われる。第２の冷却器３２０は、半導体パワーモジュール１１７０の被冷却面１４００に取り付けられ、被冷却面１４００を冷却することにより半導体パワーモジュール１１７０を冷却する。 The semiconductor power module 1170 is disposed on the second cooler 320. The cooling of the semiconductor power module 1170 is performed by a single-sided cooling structure. The second cooler 320 is attached to the surface to be cooled 1400 of the semiconductor power module 1170, and cools the surface to be cooled 1400 to cool the semiconductor power module 1170.
　第２の冷却器３２０は、一方の面３５０及び他方の面３５１を有する。半導体パワーモジュール１１７０及び平滑コンデンサ１１１０は、いずれも第２の冷却器３２０の一方の面３５０上に配置される。 The second cooler 320 has one surface 350 and the other surface 351. The semiconductor power module 1170 and the smoothing capacitor 1110 are both disposed on one surface 350 of the second cooler 320.
　第６実施形態のインバータ３００においても、第５実施形態のインバータ１００と同様に、第１の冷却器３１０が第１の冷却液入口及び第１の冷却液出口を有する。また、第２の冷却器３２０が第２の冷却液入口及び第２の冷却液出口を有する。第１の冷却器３１０及び第２の冷却器３２０は、フレーム３１２に固定される。フレーム３１２は、中空部を備える。中空部は、中空の形状を有し、冷却液が流れる流路を有する。中空部は、第１の冷却液入口又は第１の冷却液出口に接続される一方の接続端、及び第２の冷却液入口又は第２の冷却液出口に接続される他方の接続端を有する。 Also in the inverter 300 of the sixth embodiment, the first cooler 310 has a first coolant inlet and a first coolant outlet, as with the inverter 100 of the fifth embodiment. Also, the second cooler 320 has a second coolant inlet and a second coolant outlet. The first cooler 310 and the second cooler 320 are fixed to the frame 312. The frame 312 comprises a hollow portion. The hollow portion has a hollow shape and has a flow path through which the coolant flows. The hollow part has one connecting end connected to the first coolant inlet or the first coolant outlet, and the other connecting end connected to the second coolant inlet or the second coolant outlet .
　第６実施形態のインバータ３００においても、第５実施形態のインバータ１００と同様に、第１の冷却器３１０及び第２の冷却器３２０を設置するのに要するスペースを小さくすることができる。 Also in the inverter 300 according to the sixth embodiment, the space required to install the first cooler 310 and the second cooler 320 can be reduced, as in the inverter 100 according to the fifth embodiment.
　また、第６実施形態のインバータ３００においても、第５実施形態のインバータ１００と同様に、冷却液の漏れを容易に防止することができる。 Moreover, also in the inverter 300 of 6th Embodiment, the leak of a cooling fluid can be easily prevented similarly to the inverter 100 of 5th Embodiment.
　７　第７実施形態
　本発明の例示的な第７実施形態は、インバータに関する。 7 Seventh Embodiment The seventh exemplary embodiment of the present invention relates to an inverter.
　第１実施形態と第７実施形態との主な相違は、以下の点にある。第１実施形態においては、平滑コンデンサ１１１０が冷却されない。これに対して、第７実施形態においては、平滑コンデンサ１１１０に設けられた第１の電極を冷却する第１の冷却器が設けられる。加えて、平滑コンデンサ１１１０に設けられた第２の電極を冷却する第２の冷却器が設けられる。さらに加えて、フレームが、半導体パワーモジュール１１７０の被冷却面１４００を冷却する第３の冷却器から第１の冷却器へ冷却液を導く配管、及び第１の冷却器から第２の冷却器へ冷却液を導く配管を兼ねる。 The main differences between the first embodiment and the seventh embodiment are as follows. In the first embodiment, the smoothing capacitor 1110 is not cooled. On the other hand, in the seventh embodiment, a first cooler for cooling the first electrode provided in the smoothing capacitor 1110 is provided. In addition, a second cooler is provided to cool the second electrode provided on the smoothing capacitor 1110. In addition, the frame guides the coolant from the third cooler, which cools the cooled surface 1400 of the semiconductor power module 1170, to the first cooler, and from the first cooler to the second cooler. It also doubles as a pipe that leads the coolant.
　以下では、上記の相違に関連する第７実施形態のインバータの構成が説明される。 Hereinafter, the configuration of the inverter according to the seventh embodiment related to the above difference will be described.
　図３４は、第７実施形態のインバータの断面を模式的に図示する断面図である。図３４に図示される断面の位置は、図６に図示される断面の位置に相当する。 FIG. 34 is a cross sectional view schematically showing a cross section of the inverter of the seventh embodiment. The position of the cross section shown in FIG. 34 corresponds to the position of the cross section shown in FIG.
　図３４に図示されるインバータ４００は、インバータ回路１０１０、第１の冷却器４１０、第２の冷却器４１１、少なくともひとつの冷却器４１２及びフレーム４１３を備える。少なくともひとつの冷却器４１２は、第３の冷却器４２０を含む。 The inverter 400 illustrated in FIG. 34 includes an inverter circuit 1010, a first cooler 410, a second cooler 411, at least one cooler 412, and a frame 413. At least one cooler 412 includes a third cooler 420.
　第７実施形態のインバータ４００に設けられたインバータ回路１０１０は、第１実施形態のインバータ１０００に設けられたインバータ回路１０１０と同様のものである。このため、第７実施形態のインバータ４００は、第１実施形態のインバータ１０００に設けられた平滑コンデンサ１１１０及び半導体パワーモジュール１１７０とそれぞれ同様の平滑コンデンサ１１１０及び半導体パワーモジュール１１７０を備える。 The inverter circuit 1010 provided in the inverter 400 of the seventh embodiment is similar to the inverter circuit 1010 provided in the inverter 1000 of the first embodiment. Therefore, the inverter 400 according to the seventh embodiment includes a smoothing capacitor 1110 and a semiconductor power module 1170 similar to the smoothing capacitor 1110 and the semiconductor power module 1170 provided in the inverter 1000 according to the first embodiment.
　平滑コンデンサ１１１０は、コンデンサ４３４、第１の電極４３５及び第２の電極４３６を備える。コンデンサ４３４は、一端及び他端を有する。第１の電極４３５は、コンデンサ４３４の一端に配置される。第２の電極４３６は、コンデンサ４３４の他端に配置される。 The smoothing capacitor 1110 comprises a capacitor 434, a first electrode 435 and a second electrode 436. The capacitor 434 has one end and the other end. The first electrode 435 is disposed at one end of the capacitor 434. The second electrode 436 is disposed at the other end of the capacitor 434.
　半導体パワーモジュール１１７０は、板形状である。半導体パワーモジュール１１７０は、被冷却面１４００を有する。被冷却面１４００は、半導体パワーモジュール１１７０の一方の主面となる裏面である。 The semiconductor power module 1170 has a plate shape. The semiconductor power module 1170 has a surface to be cooled 1400. The cooled surface 1400 is a back surface to be one main surface of the semiconductor power module 1170.
　平滑コンデンサ１１１０は、第１の冷却器４１０と第２の冷却器４１１との間に配置される。平滑コンデンサ１１１０の冷却は、両面冷却構造により行われる。インバータ４００は、第６実施形態と同様に、第１の電気絶縁材４４０及び第２の電気絶縁材４４１をさらに備える。第１の電極４３５は、第１の電気絶縁材４４０に密着するか、又は接合される。第１の電気絶縁材４４０は、第１の冷却器４１０に密着するか、又は接合される。第２の電極４３６は、第２の電気絶縁材４４１に密着するか、又は接合される。第２の電気絶縁材４４１は、第２の冷却器４１１に密着するか、又は第２の冷却器４１１に接合される。第１の冷却器４１０、第１の電気絶縁材４４０、および第１の電極４３５とが、密着又は接合されることにより、第１の冷却器４１０は、第１の電極４３５を冷却する。また、第２の冷却器４１１、第２の電気絶縁材４４１、および第２の電極４３６とが、密着又は接合されることにより、第２の冷却器４１１は、第２の電極４３６を冷却する。 The smoothing capacitor 1110 is disposed between the first cooler 410 and the second cooler 411. Cooling of the smoothing capacitor 1110 is performed by a double-sided cooling structure. The inverter 400 further includes a first electrical insulator 440 and a second electrical insulator 441 as in the sixth embodiment. The first electrode 435 is in close contact with or bonded to the first electrical insulator 440. The first electrical insulator 440 is in intimate contact with or bonded to the first cooler 410. The second electrode 436 is in close contact with or bonded to the second electrical insulator 441. The second electrically insulating material 441 is in close contact with the second cooler 411 or joined to the second cooler 411. The first cooler 410 cools the first electrode 435 by bringing the first cooler 410, the first electrical insulator 440, and the first electrode 435 into close contact or bonding. Further, the second cooler 411 cools the second electrode 436 by bringing the second cooler 411, the second electric insulating material 441, and the second electrode 436 into close contact or bonding. .
　半導体パワーモジュール１１７０は、第３の冷却器４２０上に配置される。半導体パワーモジュール１１７０の冷却は、片面冷却構造により行われる。第３の冷却器４２０は、半導体パワーモジュール１１７０の被冷却面１４００に取り付けられ、被冷却面１４００を冷却する。 The semiconductor power module 1170 is disposed on the third cooler 420. The cooling of the semiconductor power module 1170 is performed by a single-sided cooling structure. The third cooler 420 is attached to the surface to be cooled 1400 of the semiconductor power module 1170 and cools the surface to be cooled 1400.
　第１の冷却器４１０は、第１の冷却器本体４３０、第１の冷却液入口配管４３１及び第１の冷却液出口配管４３２を備える。第１の冷却液入口配管４３１の先端は、第１の冷却液入口４５０を有する。第１の冷却液出口配管４３２の先端は、第１の冷却液出口４６０を有する。したがって、第１の冷却器４１０は、第１の冷却液入口４５０及び第１の冷却液出口４６０を有する。 The first cooler 410 includes a first cooler body 430, a first coolant inlet pipe 431 and a first coolant outlet pipe 432. The tip of the first coolant inlet pipe 431 has a first coolant inlet 450. The tip of the first coolant outlet pipe 432 has a first coolant outlet 460. Thus, the first cooler 410 has a first coolant inlet 450 and a first coolant outlet 460.
　第２の冷却器４１１は、第２の冷却器本体４７０、第２の冷却液入口配管４７１及び第２の冷却液出口配管４７２を備える。第２の冷却液入口配管４７１の先端は、第２の冷却液入口４８０を有する。第２の冷却液出口配管４７２の先端は、第２の冷却液出口４９０を有する。したがって、第２の冷却器４１１は、第２の冷却液入口４８０及び第２の冷却液出口４９０を有する。 The second cooler 411 includes a second cooler body 470, a second coolant inlet pipe 471 and a second coolant outlet pipe 472. The tip of the second coolant inlet pipe 471 has a second coolant inlet 480. The tip of the second coolant outlet pipe 472 has a second coolant outlet 490. Thus, the second cooler 411 has a second coolant inlet 480 and a second coolant outlet 490.
　第３の冷却器４２０は、第３の冷却器本体５００、第３の冷却液入口配管５０１及び第３の冷却液出口配管５０２を備える。第３の冷却液入口配管５０１の先端は、第３の冷却液入口５１０を有する。第３の冷却液出口配管５０２の先端は、第３の冷却液出口５２０を有する。したがって、第３の冷却器４２０は、第３の冷却液入口５１０及び第３の冷却液出口５２０を有する。 The third cooler 420 includes a third cooler body 500, a third coolant inlet pipe 501, and a third coolant outlet pipe 502. The tip of the third coolant inlet piping 501 has a third coolant inlet 510. The tip of the third coolant outlet pipe 502 has a third coolant outlet 520. Thus, the third cooler 420 has a third coolant inlet 510 and a third coolant outlet 520.
　第１の冷却器４１０、第２の冷却器４１１及び第３の冷却器４２０は、フレーム４１３に固定される。 The first cooler 410, the second cooler 411 and the third cooler 420 are fixed to the frame 413.
　フレーム４１３は、第１の中空部５３０及び第２の中空部５３１を備える。第１の中空部５３０及び第２の中空部５３１は、中空の形状を有し、それぞれ冷却液が流れる第１の流路５４０及び第２の流路５５０を有する。 The frame 413 includes a first hollow portion 530 and a second hollow portion 531. The first hollow portion 530 and the second hollow portion 531 have a hollow shape, and have a first flow passage 540 and a second flow passage 550 through which the coolant flows, respectively.
　第１の中空部５３０の一端においては、第１の冷却液出口配管４３２が第１の流路５４０に挿入される。第１の中空部５３０の他端においては、第２の冷却液入口配管４７１が第１の流路５４０に挿入される。このため、第１の中空部５３０は、第１の冷却液出口４６０に接続される一方の接続端５６０、及び第２の冷却液入口４８０に接続される他方の接続端５６１を有する。 At one end of the first hollow portion 530, the first coolant outlet pipe 432 is inserted into the first flow passage 540. At the other end of the first hollow portion 530, the second coolant inlet pipe 471 is inserted into the first flow passage 540. To this end, the first hollow portion 530 has one connection end 560 connected to the first coolant outlet 460 and the other connection end 561 connected to the second coolant inlet 480.
　第２の中空部５３１の一端においては、第１の冷却液入口配管４３１が第２の流路５５０に挿入される。第２の中空部５３１の他端においては、第３の冷却液出口配管５０２が第２の流路５５０に挿入される。このため、第２の中空部５３１は、第１の冷却液入口４５０に接続される一方の接続端５７０、及び第３の冷却液出口５２０に接続される他方の接続端５７１を有する。 At one end of the second hollow portion 531, the first coolant inlet pipe 431 is inserted into the second flow passage 550. At the other end of the second hollow portion 531, the third coolant outlet pipe 502 is inserted into the second flow passage 550. To this end, the second hollow portion 531 has one connection end 570 connected to the first coolant inlet 450 and the other connection end 571 connected to the third coolant outlet 520.
　第１の中空部５３０の一方の接続端５６０が第１の冷却液出口４６０に接続されることにより、第１の冷却器４１０から第１の中空部５３０に冷却液を流すことができる。また、第１の中空部５３０の他方の接続端５６１が第２の冷却液入口４８０に接続されることにより、第１の中空部５３０から第２の冷却器４１１に冷却液を流すことができる。また、第１の冷却液入口４５０が第２の中空部５３１の一方の接続端５７０に接続されることにより、第２の中空部５３１から第１の冷却器４１０に冷却液を流すことができる。また、第３の冷却液出口５２０が第２の中空部５３１の他方の接続端５７１に接続されることにより、第３の冷却器４２０から第２の中空部５３１に冷却液を流すことができる。したがって、インバータ４００には、第３の冷却液入口５１０から第３の冷却器４２０、第２の中空部５３１、第１の冷却器４１０、第１の中空部５３０及び第２の冷却器４１１を順次に経由し第２の冷却液出口４９０に至る流路が構成される。このため、第３の冷却液入口５１０に流入した冷却液は、第３の冷却器４２０、第２の中空部５３１、第１の冷却器４１０、第１の中空部５３０及び第２の冷却器４１１を順次に流れ、第２の冷却液出口４９０から流出する。第１の中空部５３０は、第１の冷却器４１０と第２の冷却器４１１との間にある冷却液の経路を構成し、冷却液配管の一部になる。第２の中空部５３１は、第３の冷却器４２０と第１の冷却器４１０との間にある冷却液の経路を構成し、冷却液配管の一部になる。 By connecting one connection end 560 of the first hollow portion 530 to the first coolant outlet 460, the cooling fluid can flow from the first cooler 410 to the first hollow portion 530. Further, by connecting the other connection end 561 of the first hollow portion 530 to the second coolant inlet 480, the coolant can flow from the first hollow portion 530 to the second cooler 411. . Further, by connecting the first coolant inlet 450 to one connection end 570 of the second hollow portion 531, the coolant can flow from the second hollow portion 531 to the first cooler 410. . Further, by connecting the third coolant outlet 520 to the other connection end 571 of the second hollow portion 531, the coolant can flow from the third cooler 420 to the second hollow portion 531. . Therefore, the inverter 400 includes the third cooler 420, the second hollow portion 531, the first cooler 410, the first hollow portion 530, and the second cooler 411 from the third coolant inlet 510. A flow path passing through the second coolant outlet 490 is configured sequentially. Therefore, the coolant that has flowed into the third coolant inlet 510 is the third cooler 420, the second hollow portion 531, the first cooler 410, the first hollow portion 530, and the second cooler. Flow 411 sequentially flows out of the second coolant outlet 490. The first hollow portion 530 constitutes a path of the coolant between the first cooler 410 and the second cooler 411 and is a part of the coolant pipe. The second hollow portion 531 constitutes a path of the coolant between the third cooler 420 and the first cooler 410 and becomes a part of the coolant pipe.
　第１の中空部５３０の一端において第１の冷却液入口配管４３１が第１の流路５４０に挿入されてもよい。第１の中空部５３０の他端において第２の冷却液出口配管４７２が第１の流路５４０に挿入されてもよい。第２の中空部５３１の一端において第１の冷却液出口配管４３２、第２の冷却液入口配管４７１又は第２の冷却液出口配管４７２が第２の流路５５０に挿入されてもよい。第２の中空部５３１の他端において第３の冷却液入口配管５０１が第２の流路５５０に挿入されてもよい。したがって、第１の中空部５３０は、第１の冷却液入口４５０及び第１の冷却液出口４６０の一方に接続される一方の接続端５６０、並びに第２の冷却液入口４８０及び第２の冷却液出口４９０の一方に接続される他方の接続端５６１を有しうる。また、第２の中空部５３１は、第１の冷却液入口４５０及び第１の冷却液出口４６０の他方、又は第２の冷却液入口４８０及び第２の冷却液出口４９０の他方に接続される一方の接続端５７０、並びに第３の冷却液入口５１０及び第３の冷却液出口５２０の一方に接続される他方の接続端５７１を有しうる。 The first coolant inlet pipe 431 may be inserted into the first flow passage 540 at one end of the first hollow portion 530. At the other end of the first hollow portion 530, a second coolant outlet pipe 472 may be inserted into the first flow path 540. The first coolant outlet pipe 432, the second coolant inlet pipe 471 or the second coolant outlet pipe 472 may be inserted into the second flow path 550 at one end of the second hollow portion 531. At the other end of the second hollow portion 531, the third coolant inlet pipe 501 may be inserted into the second flow passage 550. Thus, the first hollow portion 530 has one connection end 560 connected to one of the first coolant inlet 450 and the first coolant outlet 460, and the second coolant inlet 480 and the second cooling. It may have the other connection end 561 connected to one of the liquid outlets 490. Also, the second hollow portion 531 is connected to the other of the first coolant inlet 450 and the first coolant outlet 460, or to the other of the second coolant inlet 480 and the second coolant outlet 490. One connection end 570 and the other connection end 571 connected to one of the third coolant inlet 510 and the third coolant outlet 520 may be provided.
　第７実施形態のインバータ４００においては、第１の電極４３５の表面、第２の電極４３６の表面及び半導体パワーモジュール１１７０の被冷却面１４００からなる３個の面が冷却される必要がある。一方で、当該３個の面が同一平面上に位置し互いに近接しているという条件は、満たされない。しかし、第７実施形態のインバータ４００においては、第１の冷却器４１０から第２の冷却器４１１へ向かう冷却液が流れる第１の流路５４０が、第１の冷却器４１０、第２の冷却器４１１及び第３の冷却器４２０を支持及び固定するフレーム４１３に設けられた第１の中空部５３０の内部にある。また、第３の冷却器４１２から第１の冷却器４１０へ向かう冷却液が流れる第１の流路５３０が、当該フレーム４１３に設けられた第２の中空部５３１の内部にある。このため、第１の冷却器４１０、第２の冷却器４１１及び第３の冷却器４２０を設置するのに要するスペースを小さくすることができる。 In the inverter 400 of the seventh embodiment, it is necessary to cool three surfaces including the surface of the first electrode 435, the surface of the second electrode 436, and the surface to be cooled 1400 of the semiconductor power module 1170. On the other hand, the condition that the three planes are located on the same plane and close to each other is not satisfied. However, in the inverter 400 according to the seventh embodiment, the first flow path 540 through which the cooling fluid flows from the first cooler 410 to the second cooler 411 is the first cooler 410, the second cooling Inside the first hollow portion 530 provided in the frame 413 for supporting and fixing the vessel 411 and the third cooler 420. In addition, a first flow passage 530 through which the coolant flows from the third cooler 412 to the first cooler 410 is inside the second hollow portion 531 provided in the frame 413. Therefore, the space required for installing the first cooler 410, the second cooler 411 and the third cooler 420 can be reduced.
　また、第７実施形態のインバータ４００においては、第５実施形態のインバータ１００と同様に、冷却液の漏れを容易に防止することができる。 Moreover, in the inverter 400 of 7th Embodiment, the leak of a cooling fluid can be easily prevented similarly to the inverter 100 of 5th Embodiment.
　また、第７実施形態のインバータ４００においては、第１の流路５４０が縦方向である第１の方向Ｄ１に延び、第２の流路５５０が横方向である第２の方向Ｄ２に延びるため、第２の流路５５０が延びる方向Ｄ２が第１の流路５４０が延びる方向Ｄ１と異なる。それにもかかわらず、第７実施形態のインバータ４００においては、第１の冷却器４１０、第２の冷却器４１１及び第３の冷却器４２０を設置するのに要するスペースを小さくすることができる。また、冷却液の循環を容易に行うことができる。 In the inverter 400 according to the seventh embodiment, the first flow path 540 extends in the first direction D1 which is the longitudinal direction, and the second flow path 550 extends in the second direction D2 which is the lateral direction. The direction D2 in which the second flow channel 550 extends is different from the direction D1 in which the first flow channel 540 extends. Nevertheless, in the inverter 400 of the seventh embodiment, the space required for installing the first cooler 410, the second cooler 411 and the third cooler 420 can be reduced. In addition, the coolant can be circulated easily.
　８　第８実施形態
　本発明の例示的な第８実施形態は、インバータに関する。 Eighth Embodiment An eighth embodiment of the present invention relates to an inverter.
　第１実施形態と第８実施形態との主な相違は、以下の点にある：第１実施形態においては、半導体パワーモジュール１１７０の被冷却面１４００を冷却する冷却器が設けられる。しかし、平滑コンデンサ１１１０が冷却されない。これに対して、第８実施形態においては、平滑コンデンサ１１１０に設けられた第１の電極を冷却する第１の冷却器が設けられる。また、半導体パワーモジュール１１７０の被冷却面１４００及び平滑コンデンサ１１１０に設けられた第２の電極を冷却する第２の冷却器が設けられる。さらに加えて、フレームが、第１の冷却器から第２の冷却器へ冷却液を導く配管を兼ねる。 The main differences between the first embodiment and the eighth embodiment are as follows: In the first embodiment, a cooler for cooling the surface to be cooled 1400 of the semiconductor power module 1170 is provided. However, the smoothing capacitor 1110 is not cooled. On the other hand, in the eighth embodiment, a first cooler for cooling the first electrode provided in the smoothing capacitor 1110 is provided. In addition, a second cooler for cooling the second electrode provided on the surface to be cooled 1400 of the semiconductor power module 1170 and the smoothing capacitor 1110 is provided. Additionally, the frame doubles as a conduit for conducting the coolant from the first cooler to the second cooler.
　以下では、上記の相違に関連する第８実施形態のインバータの構成が説明される。 Hereinafter, the configuration of the inverter according to the eighth embodiment related to the above difference will be described.
　図３５及び図３６は、第８実施形態のインバータの断面を模式的に図示する断面図である。 FIG. 35 and FIG. 36 are cross sectional views schematically showing cross sections of the inverter of the eighth embodiment.
　図３５及び図３６に図示されるインバータ６００は、インバータ回路１０１０、第１の冷却器６１０、少なくともひとつの冷却器６１１及びフレーム６１２を備える。少なくともひとつの冷却器６１１は、第２の冷却器６２０を含む。 The inverter 600 illustrated in FIGS. 35 and 36 includes an inverter circuit 1010, a first cooler 610, at least one cooler 611, and a frame 612. At least one cooler 611 includes a second cooler 620.
　第８実施形態のインバータ６００に設けられたインバータ回路１０１０は、第１実施形態のインバータ１０００に設けられたインバータ回路１０１０と同様のものである。このため、第８実施形態のインバータ６００は、第１実施形態のインバータ１０００に設けられた平滑コンデンサ１１１０及び半導体パワーモジュール１１７０とそれぞれ同様の平滑コンデンサ１１１０及び半導体パワーモジュール１１７０を備える。 The inverter circuit 1010 provided in the inverter 600 of the eighth embodiment is the same as the inverter circuit 1010 provided in the inverter 1000 of the first embodiment. Therefore, the inverter 600 according to the eighth embodiment includes a smoothing capacitor 1110 and a semiconductor power module 1170 similar to the smoothing capacitor 1110 and the semiconductor power module 1170 provided in the inverter 1000 according to the first embodiment.
　平滑コンデンサ１１１０は、コンデンサ６３０、第１の電極６３１及び第２の電極６３２を備える。コンデンサ６３０は、一端及び他端を有する。第１の電極６３１は、コンデンサ６３０の一端に配置される。第２の電極６３２は、コンデンサ６３０の他端に配置される。 The smoothing capacitor 1110 comprises a capacitor 630, a first electrode 631 and a second electrode 632. The capacitor 630 has one end and the other end. The first electrode 631 is disposed at one end of the capacitor 630. The second electrode 632 is disposed at the other end of the capacitor 630.
　半導体パワーモジュール１１７０は、板形状である。半導体パワーモジュール１１７０は、被冷却面１４００を有する。被冷却面１４００は、半導体パワーモジュール１１７０の一方の主面となる裏面である。 The semiconductor power module 1170 has a plate shape. The semiconductor power module 1170 has a surface to be cooled 1400. The cooled surface 1400 is a back surface to be one main surface of the semiconductor power module 1170.
　平滑コンデンサ１１１０は、第１の冷却器６１０と第２の冷却器６２０との間に配置される。平滑コンデンサ１１１０の冷却は、両面冷却構造により行われる。インバータ６００は、第１の電気絶縁材６４０及び第２の電気絶縁材６４１をさらに備える。第１の電極６３１は、第１の電気絶縁材６４０に密着するか、又は接合される。第１の電気絶縁材６４０は、第１の冷却器６１０に密着するか、又は接合される。第２の電極６３２は、第２の電気絶縁材６４１に密着するか、又は接合される。第２の電気絶縁材６４１は、第２の冷却器６２０に密着するか、又は第２の冷却器６２０に接合される。第１の電極６３１、第１の電気絶縁材６４０、及び第１の冷却器６１０は密着又は接合されることにより、第１の冷却器６１０は、第１の電極６３１を冷却する。第２の電極６３２、第２の電気絶縁材６４１、及び第２の冷却器６２０は密着又は接合されることにより、第２の冷却器６２０は、第２の電極６３２を冷却する。第１の電気絶縁材６４０により、活電位が与えられる第１の電極６３１が第１の冷却器６１０から絶縁される。第２の電気絶縁材６４１により、活電位が与えられる第２の電極６３２が第２の冷却器６２０から絶縁される。 The smoothing capacitor 1110 is disposed between the first cooler 610 and the second cooler 620. Cooling of the smoothing capacitor 1110 is performed by a double-sided cooling structure. The inverter 600 further includes a first electrical insulator 640 and a second electrical insulator 641. The first electrode 631 is in close contact with or bonded to the first electrical insulator 640. The first electrical insulator 640 is in intimate contact or bonded to the first cooler 610. The second electrode 632 is in close contact with or bonded to the second electrical insulator 641. The second electrically insulating material 641 is in close contact with the second cooler 620 or joined to the second cooler 620. The first cooler 610 cools the first electrode 631 by bringing the first electrode 631, the first electrical insulator 640, and the first cooler 610 into close contact or bonding. The second cooler 620 cools the second electrode 632 by the second electrode 632, the second electrical insulator 641, and the second cooler 620 being in close contact or bonded. The first electrical insulator 640 insulates the first electrode 631 to which the active potential is applied from the first cooler 610. The second electrode 632 to which an active potential is applied is isolated from the second cooler 620 by the second electrical insulator 641.
　半導体パワーモジュール１１７０は、第２の冷却器６２０上に配置される。半導体パワーモジュール１１７０の冷却は、片面冷却構造により行われる。第２の冷却器６２０は、半導体パワーモジュール１１７０の被冷却面１４００に取り付けられ、被冷却面１４００を冷却することにより半導体パワーモジュール１１７０を冷却する。 The semiconductor power module 1170 is disposed on the second cooler 620. The cooling of the semiconductor power module 1170 is performed by a single-sided cooling structure. The second cooler 620 is attached to the surface to be cooled 1400 of the semiconductor power module 1170, and cools the surface to be cooled 1400 to cool the semiconductor power module 1170.
　第２の冷却器６２０は、一方の面６５０及び他方の面６５１を有する。半導体パワーモジュール１１７０は、一方の面６５０上に配置される。平滑コンデンサ１１１０は、他方の面６５１上に配置される。半導体パワーモジュール１１７０及び平滑コンデンサ１１１０がそれぞれ第２の冷却器６２０の一方の面６５０及び他方の面６５１上に配置されることにより、第２の冷却器６２０の両面が冷却に活用される。 The second cooler 620 has one side 650 and the other side 651. The semiconductor power module 1170 is disposed on one side 650. The smoothing capacitor 1110 is disposed on the other surface 651. The semiconductor power module 1170 and the smoothing capacitor 1110 are disposed on one side 650 and the other side 651 of the second cooler 620, respectively, so that both sides of the second cooler 620 are utilized for cooling.
　第８実施形態のインバータ６００においても、第５実施形態のインバータ１００と同様に、第１の冷却器６１０が第１の冷却液入口６６０及び第１の冷却液出口６７０を有する。また、第２の冷却器６２０が第２の冷却液入口６８０及び第２の冷却液出口６９０を有する。第１の冷却器６１０及び第２の冷却器６２０は、フレーム６１２に固定される。フレーム６１２は、中空部７００を備える。中空部７００は、中空の形状を有し、冷却液が流れる流路７１０を有する。中空部７００は、第１の冷却液入口６６０又は第１の冷却液出口６７０に接続される一方の接続端７２０、及び第２の冷却液入口６８０又は第２の冷却液出口６９０に接続される他方の接続端７２１を有する。 Also in the inverter 600 of the eighth embodiment, the first cooler 610 has a first coolant inlet 660 and a first coolant outlet 670, as in the inverter 100 of the fifth embodiment. Also, the second cooler 620 has a second coolant inlet 680 and a second coolant outlet 690. The first cooler 610 and the second cooler 620 are fixed to the frame 612. The frame 612 comprises a hollow portion 700. The hollow portion 700 has a hollow shape and has a flow path 710 through which the coolant flows. The hollow portion 700 is connected to one connection end 720 connected to the first coolant inlet 660 or the first coolant outlet 670, and to the second coolant inlet 680 or the second coolant outlet 690. It has the other connection end 721.
　第８実施形態のインバータ６００においても、第５実施形態のインバータ１００と同様に、第１の冷却器６１０及び第２の冷却器６２０を設置するのに要するスペースを小さくすることができる。 Also in the inverter 600 of the eighth embodiment, the space required for installing the first cooler 610 and the second cooler 620 can be reduced similarly to the inverter 100 of the fifth embodiment.
　また、第８実施形態のインバータ６００においても、第５実施形態のインバータ１００と同様に、冷却液の漏れを容易に防止することができる。 Further, also in the inverter 600 according to the eighth embodiment, it is possible to easily prevent the coolant from leaking similarly to the inverter 100 according to the fifth embodiment.
　また、第８実施形態のインバータ６００においては、フレーム６１２による第２の冷却器６２０の支持が、第２の冷却器６２０の四隅をそれぞれ４本の柱により支持することにより行われる。また、冷却液が流れる流路７１０が４本の柱のいずれかの柱の内部に設けられる。このため、フレーム６１２が半導体パワーモジュール１１７０及び平滑コンデンサ１１１０の実装の障害となることは起こりにくい。また、冷却液配管が半導体パワーモジュール１１７０及び平滑コンデンサ１１１０の実装の障害となることはない。 In the inverter 600 according to the eighth embodiment, the support of the second cooler 620 by the frame 612 is performed by supporting the four corners of the second cooler 620 with four columns. In addition, a flow path 710 through which the coolant flows is provided inside any one of the four columns. For this reason, it is less likely that the frame 612 becomes an obstacle to the mounting of the semiconductor power module 1170 and the smoothing capacitor 1110. In addition, the coolant piping does not hinder the mounting of the semiconductor power module 1170 and the smoothing capacitor 1110.
　また、第８実施形態のインバータ６００においては、半導体パワーモジュール１１７０及び平滑コンデンサ１１１０を第２の冷却器６２０に実装した後に第２の冷却器６２０をフレーム６１２に固定することも容易である。このため、実装工程上の制約により第２の冷却器６２０をフレーム６１２に固定した後に発熱部品を第２の冷却器６２０に実装することが困難である場合においても、第２の冷却器６２０の両面を活用した半導体パワーモジュール１１７０及び平滑コンデンサ１１１０の冷却が可能である。 In the inverter 600 according to the eighth embodiment, it is also easy to fix the second cooler 620 to the frame 612 after the semiconductor power module 1170 and the smoothing capacitor 1110 are mounted on the second cooler 620. For this reason, even if it is difficult to mount the heat generating component on the second cooler 620 after the second cooler 620 is fixed to the frame 612 due to restrictions on the mounting process, the second cooler 620 It is possible to cool the semiconductor power module 1170 and the smoothing capacitor 1110 utilizing both sides.
　９　第９実施形態
　本発明の例示的な第９実施形態は、インバータに関する。 9 ninth embodiment The ninth exemplary embodiment of the present invention relates to an inverter.
　図３７は、第９実施形態のインバータの断面を模式的に図示する断面図である。 FIG. 37 is a cross sectional view schematically showing a cross section of the inverter of the ninth embodiment.
　図３７に図示されるインバータ８００においては、生成される交流が、第１から第ｎまでの相の成分を有する多相交流である。ｎは、２以上の整数である。図３７には、ｎが３である場合が例示される。すなわち、図３７には、生成される交流がＵ相成分、Ｖ相成分及びＷ相成分を有する三相交流である場合が例示される。 In the inverter 800 illustrated in FIG. 37, the generated alternating current is a multiphase alternating current having components of first to nth phases. n is an integer of 2 or more. The case where n is 3 is illustrated by FIG. That is, FIG. 37 illustrates the case where the generated alternating current is a three-phase alternating current having a U-phase component, a V-phase component, and a W-phase component.
　インバータ８００は、第１から第ｎまでの構造体８２０，８２１及び８２２、及びフレーム８３０を備える。第１から第ｎまでの構造体８２０，８２１及び８２２は、それぞれ第１から第ｎまでの半導体パワーモジュール及び第１から第ｎまでの少なくともひとつの冷却器を備える。 The inverter 800 includes first to nth structures 820, 821 and 822, and a frame 830. The first to n- th structures 820, 821 and 822 respectively include the first to n-th semiconductor power modules and the first to n-th coolers.
　第１から第ｎまでの半導体パワーモジュールは、直流をスイッチングし、それぞれ第１から第ｎまでの相の成分を生成する。第１から第ｎまでの半導体パワーモジュールに含まれる各半導体パワーモジュールは、当該各半導体パワーモジュールが属する構造体において、第５実施形態から第８実施形態までのいずれかの実施形態のインバータに設けられる半導体パワーモジュールと同様に冷却される。 The first to n-th semiconductor power modules switch direct current to generate components of the first to n-th phases, respectively. The semiconductor power modules included in the first to n-th semiconductor power modules are provided in the inverter according to any of the fifth to eighth embodiments in a structure to which the respective semiconductor power modules belong. Is cooled in the same manner as the semiconductor power module.
　第１から第ｎまでの少なくともひとつの冷却器は、フレーム８３０に固定される。第１から第ｎまでの少なくともひとつの冷却器には、それぞれ第１から第ｎまでの半導体パワーモジュールが実装される。このため、第１から第ｎまでの少なくともひとつの冷却器は、それぞれ第１から第ｎまでの半導体パワーモジュールを冷却する。第１から第ｎまでの少なくともひとつの冷却器に含まれる各少なくともひとつの冷却器は、当該各少なくともひとつの冷却器が属する構造体において、第５実施形態から第８実施形態までのいずれかの実施形態のインバータに設けられる少なくともひとつの冷却器と同様に半導体パワーモジュールを冷却する。このため、各少なくともひとつの冷却器は、冷却液入口及び冷却液出口を有する。 The first to nth at least one coolers are fixed to the frame 830. First to nth semiconductor power modules are mounted on at least one cooler from the first to nth. For this reason, at least one cooler from the first to the n-th cools the semiconductor power modules from the first to the n-th, respectively. Each of the at least one cooler included in the at least one cooler from the first to the nth is any one of the fifth to eighth embodiments in a structure to which the at least one cooler belongs. The semiconductor power module is cooled in the same manner as at least one cooler provided in the inverter of the embodiment. For this purpose, each at least one cooler has a coolant inlet and a coolant outlet.
　第１から第ｎまでの構造体８２０，８２１及び８２２は、それぞれ湾曲面８４０上の第１から第ｎまでの位置８５０，８５１及び８５２上に配置される。湾曲面８４０は、第１から第ｎまでの構造体８２０，８２１及び８２２を支持する支持体の表面であり、例えば円筒状の形状を有するモータ筐体の外周面である。第１から第ｎまでの位置８５０，８５１及び８５２は、互いに異なる法線方向を有する。第１から第ｎまでの構造体８２０，８２１及び８２２は、それぞれ湾曲面８４０上の第１から第ｎまでの位置８５０，８５１及び８５２が有する法線方向に応じた傾きを有する。 The first to n- th structures 820, 821 and 822 are disposed on the first to n- th positions 850, 851 and 852 on the curved surface 840, respectively. The curved surface 840 is a surface of a support that supports the first to n- th structures 820, 821, and 822. The curved surface 840 is, for example, an outer peripheral surface of a motor casing having a cylindrical shape. The first to nth positions 850, 851 and 852 have normal directions different from each other. The first to n- th structures 820, 821 and 822 have inclinations according to the normal directions of the first to n- th positions 850, 851 and 852 on the curved surface 840, respectively.
　フレーム８３０は、第１から第ｎまでの少なくともひとつの冷却器に含まれる一の少なくともひとつの冷却器に備えられる冷却液入口又は冷却液出口に接続される一方の接続端、及び第１から第ｎまでの少なくともひとつの冷却器に含まれる他の少なくともひとつの冷却器に備えられる冷却液入口又は冷却液出口に接続される他方の接続端を有する中空部を備える。中空部は、中空の形状を有し、冷却液が流れる流路を有する。 The frame 830 has one connecting end connected to the coolant inlet or the coolant outlet provided in at least one cooler included in the first to n-th coolers, and the first to the first a hollow portion having a cooling fluid inlet or a cooling fluid outlet connected to the cooling fluid outlet provided in at least one other cooling device included in at least one cooler up to n. The hollow portion has a hollow shape and has a flow path through which the coolant flows.
　第１から第ｎまでの構造物は、互いに異なる傾きを有する。このため、中空部は、湾曲又は屈曲することが多い。しかし、フレーム８３０を樹脂により構成することにより、湾曲又は屈曲した中空部を容易に形成することができる。 The first to n-th structures have different inclinations. For this reason, the hollow portion is often curved or bent. However, when the frame 830 is made of resin, a curved or bent hollow portion can be easily formed.
　第８実施形態のインバータ８００は、湾曲面８４０に沿って設置することができ、湾曲面８４０に沿って設置された場合においても隙間等のデッドスペースを生じにくいという特徴を有する。このため、インバータ８００が搭載された支持体を小型化することができる。 The inverter 800 according to the eighth embodiment can be installed along the curved surface 840, and has a feature that even when installed along the curved surface 840, a dead space such as a gap does not easily occur. Thus, the support on which the inverter 800 is mounted can be miniaturized.
　１０　第１０実施形態
　本発明の例示的な第１０実施形態は、ケース入りインバータに関する。 10 Tenth Embodiment The tenth embodiment of the present invention relates to a cased inverter.
　図３８は、第１０実施形態のケース入りインバータを模式的に図示する斜視図である。 FIG. 38 is a perspective view schematically illustrating the cased inverter of the tenth embodiment.
　図３８に図示されるケース入りインバータ５０００は、インバータ５０１０及びインバータケース５０１１を備える。 The cased inverter 5000 illustrated in FIG. 38 includes an inverter 5010 and an inverter case 5011.
　インバータ５０１０は、第１実施形態のインバータ１０００であり、インバータケース５０１１に収容される。インバータケース５０１１は、電動機、又は電動機を備える複合装置から独立している。インバータ５０１０が、第２実施形態のインバータ２０００、第３実施形態のインバータ３０００、第４実施形態のインバータ４０００、第５実施形態のインバータ１００、第６実施形態のインバータ３００、第７実施形態のインバータ４００、第８実施形態のインバータ６００又は第９実施形態のインバータ８００であってもよい。 The inverter 5010 is the inverter 1000 according to the first embodiment, and is accommodated in the inverter case 5011. The inverter case 5011 is independent of a motor or a combined device including the motor. The inverter 5010 includes the inverter 2000 of the second embodiment, the inverter 3000 of the third embodiment, the inverter 4000 of the fourth embodiment, the inverter 100 of the fifth embodiment, the inverter 300 of the sixth embodiment, and the inverter of the seventh embodiment. The inverter 400 may be the inverter 400 according to the eighth embodiment or the inverter 800 according to the ninth embodiment.
　１１　第１１実施形態
　本発明の例示的な第１１実施形態は、インバータ内蔵電動機に関する。 Eleventh Embodiment An eleventh embodiment of the present invention relates to a motor with a built-in inverter.
　図３９は、第１１実施形態のインバータ内蔵電動機を模式的に図示する斜視図である。 FIG. 39 is a perspective view schematically illustrating the motor with a built-in inverter according to the eleventh embodiment.
　図３９に図示されるインバータ内蔵電動機６０００は、インバータ６０１０、電動機６０１１及びインバータケース６０１２を備える。 The inverter built-in electric motor 6000 illustrated in FIG. 39 includes an inverter 6010, an electric motor 6011 and an inverter case 6012.
　電動機６０１１は、電動機ケース６０２０を備える。 The motor 6011 includes a motor case 6020.
　インバータ６０１０は、第１実施形態のインバータ１０００であり、インバータケース６０１２に収容される。インバータケース６０１２は、電動機ケース６０２０に接合されるか、又は電動機ケース６０２０と一体化される。インバータ６０１０が、第２実施形態のインバータ２０００、第３実施形態のインバータ３０００、第４実施形態のインバータ４０００、第５実施形態のインバータ１００、第６実施形態のインバータ３００、第７実施形態のインバータ４００、第８実施形態のインバータ６００又は第９実施形態のインバータ８００であってもよい。 The inverter 6010 is the inverter 1000 of the first embodiment, and is accommodated in the inverter case 6012. The inverter case 6012 is joined to the motor case 6020 or integrated with the motor case 6020. The inverter 6010 includes the inverter 2000 of the second embodiment, the inverter 3000 of the third embodiment, the inverter 4000 of the fourth embodiment, the inverter 100 of the fifth embodiment, the inverter 300 of the sixth embodiment, and the inverter of the seventh embodiment. The inverter 400 may be the inverter 400 according to the eighth embodiment or the inverter 800 according to the ninth embodiment.
　インバータ内蔵電動機６０００は、電動機ケース６０２０に接合されるか、又は電動機ケース６０２０と一体化されたインバータケース６０１２にインバータ１０００を収容することにより組み立てられる。このため、インバータ内蔵電動機６０００へのインバータ１０００の内蔵は、電動機６０１１の製造に影響を与えず、インバータ内蔵電動機６０００へのインバータ１０００の内蔵にあたって電動機６０１１を持ち上げる等のハンドリングは発生しにくい。 The inverter built-in motor 6000 is assembled by housing the inverter 1000 in an inverter case 6012 which is joined to the motor case 6020 or integrated with the motor case 6020. Therefore, the incorporation of the inverter 1000 into the inverter built-in motor 6000 does not affect the manufacture of the motor 6011, and handling such as lifting the motor 6011 hardly occurs when the inverter 1000 is incorporated into the inverter built-in motor 6000.
　１２　第１２実施形態
　本発明の例示的な第１２実施形態は、インバータ内蔵トランスアクスルに関する。 Twelfth Embodiment The twelfth embodiment of the present invention relates to an inverter-equipped transaxle.
　図４０は、第１２実施形態のインバータ内蔵トランスアクスルの内部構造を模式的に図示する模式図である。 FIG. 40 is a schematic view schematically illustrating the internal structure of the inverter built-in transaxle of the twelfth embodiment.
　図４０に図示されるインバータ内蔵トランスアクスル７０００は、インバータ７０１０、トランスアクスル７０１１及びインバータケース７０１２を備える。トランスアクスル７０１１は、例えば電動自動車に搭載され、電動機７０２０、変速機７０２１及びトランスアクスルケース７０２３を備える。 The inverter built-in transaxle 7000 illustrated in FIG. 40 includes an inverter 7010, a transaxle 7011 and an inverter case 7012. The transaxle 7011 is mounted, for example, on an electric automobile, and includes an electric motor 7020, a transmission 7021 and a transaxle case 7023.
　インバータ７０００は、第１実施形態のインバータ１０００であり、インバータケース７０１２に収容される。インバータケース７０１２は、トランスアクスルケース７０２３に接合されるか、又はトランスアクスルケース７０２３と一体化される。インバータ７０００が、第２実施形態のインバータ２０００、第３実施形態のインバータ３０００、第４実施形態のインバータ４０００、第５実施形態のインバータ１００、第６実施形態のインバータ３００、第７実施形態のインバータ４００、第８実施形態のインバータ６００又は第９実施形態のインバータ８００であってもよい。 The inverter 7000 is the inverter 1000 of the first embodiment, and is accommodated in the inverter case 7012. The inverter case 7012 is joined to the transaxle case 7023 or integrated with the transaxle case 7023. The inverter 7000 includes the inverter 2000 of the second embodiment, the inverter 3000 of the third embodiment, the inverter 4000 of the fourth embodiment, the inverter 100 of the fifth embodiment, the inverter 300 of the sixth embodiment, and the inverter of the seventh embodiment. The inverter 400 may be the inverter 400 according to the eighth embodiment or the inverter 800 according to the ninth embodiment.
　変速機７０２１は、電動機７０２０により発生させられた機械力を伝達する伝達機構である。電動機７０２０及び変速機７０２１は、トランスアクスルケース７０２３に収容される。 The transmission 7021 is a transmission mechanism that transmits the mechanical force generated by the motor 7020. The motor 7020 and the transmission 7021 are accommodated in a transaxle case 7023.
　変速機７０２１を備える複合装置であるトランスアクスル７０１１が、変速機以外の伝達機構を備える複合装置に置き換えられてもよい。 The transaxle 7011 which is a combined device including the transmission 7021 may be replaced with a combined device including a transmission mechanism other than the transmission.
　１３　第１３実施形態
　本発明の例示的な第１３実施形態は、インバータ内蔵トランスアクスルに関する。 Thirteenth Embodiment The thirteenth embodiment of the present invention relates to an inverter-equipped transaxle.
　図４１は、第１３実施形態のインバータ内蔵トランスアクスルの内部構造を模式的に図示する模式図である。 FIG. 41 is a schematic view schematically illustrating an internal structure of the inverter built-in transaxle of the thirteenth embodiment.
　図４１に図示されるインバータ内蔵トランスアクスル８０００は、インバータ８０１０及びトランスアクスル８０１１を備える。トランスアクスル８０１１は、例えば電動自動車に搭載され、電動機８０２０、変速機８０２１及びトランスアクスルケース８０２２を備える。 The inverter built-in transaxle 8000 illustrated in FIG. 41 includes an inverter 8010 and a transaxle 8011. The transaxle 8011 is mounted, for example, on an electric automobile, and includes an electric motor 8020, a transmission 8021, and a transaxle case 8022.
　インバータ８０１０は、第１実施形態のインバータ１０００であり、トランスアクスルケース８０２２に形成され外部に露出する窪み空間８０３０に収容される。インバータ８０１０が、第２実施形態のインバータ２０００、第３実施形態のインバータ３０００、第４実施形態のインバータ４０００、第５実施形態のインバータ１００、第６実施形態のインバータ３００、第７実施形態のインバータ４００、第８実施形態のインバータ６００又は第９実施形態のインバータ８００であってもよい。 The inverter 8010 is the inverter 1000 according to the first embodiment, and is accommodated in a hollow space 8030 formed in the transaxle case 8022 and exposed to the outside. The inverter 8010 includes the inverter 2000 of the second embodiment, the inverter 3000 of the third embodiment, the inverter 4000 of the fourth embodiment, the inverter 100 of the fifth embodiment, the inverter 300 of the sixth embodiment, and the inverter of the seventh embodiment. The inverter 400 may be the inverter 400 according to the eighth embodiment or the inverter 800 according to the ninth embodiment.
　トランスアクスルケース８０２２は、大きな凹凸を有する複雑な立体形状を有するため、インバータ１０００を収容できる箱状の窪み空間８０３０を有する。そのような窪み空間８０３０にインバータ１０００を収容することにより、インバータ１０００がトランスアクスルケース８０２２から著しく突出しない状態でインバータ内蔵トランスアクスル８０００に内蔵される。 The transaxle case 8022 has a box-like hollow space 8030 that can accommodate the inverter 1000 because it has a complex three-dimensional shape with large unevenness. By housing inverter 1000 in such a hollow space 8030, inverter 1000 is incorporated in inverter built-in transaxle 8000 in a state where it does not significantly protrude from transaxle case 8022.
　変速機８０２１は、電動機８０２０により発生させられた機械力を伝達する伝達機構である。電動機８０２０及び変速機８０２１は、トランスアクスルケース８０２３に収容される。 The transmission 8021 is a transmission mechanism that transmits the mechanical force generated by the motor 8020. The motor 8020 and the transmission 8021 are housed in a transaxle case 8023.
　変速機８０２１を備える複合装置であるトランスアクスル８０１１が、変速機以外の伝達機構を備える複合装置に置き換えられてもよい。 The transaxle 8011 which is a combined device including the transmission 8021 may be replaced with a combined device including a transmission mechanism other than the transmission.
　この発明は詳細に説明されたが、上記した説明は、すべての局面において、例示であって、この発明がそれに限定されるものではない。例示されていない無数の変形例が、この発明の範囲から外れることなく想定され得るものと解される。 Although the present invention has been described in detail, the above description is an exemplification in all aspects, and the present invention is not limited thereto. It is understood that countless variations not illustrated are conceivable without departing from the scope of the present invention.
　１０００，２０００，３０００，４０００，５０１０，６０１０，７０１０，８０１０…インバータ、１０１１，２０１１，３０１１…少なくともひとつの冷却器、１０１２，２０１２…フレーム、１１００…ＤＣコネクタ、１１１０…平滑コンデンサ１１２０，１１２１，１１２２，１１２３，１１２４，１１２５，４２９０，４２９１…ＤＣバスバ電極、１１３０…信号端子コネクタ、１１４０…信号配線、１１５０，１１６０…駆動回路基板、１１７０…半導体パワーモジュール、１１８０，１１８１，１１８２…ＡＣバスバ電極、１１９０，１１９１，１１９２…ＡＣコネクタ、１２００，１２０１，１２０２…電流センサ、１３００，１３０１，１３０２，１３０３…柱、１３１０，１３１１，１３１２，１３１３，１３１４，１３１５，１３１６，１３１７，１４４０，２３１９，２３２０…梁、１３２０，１３２１…側板、１３３０，１３３１…底板、１４００…被冷却面、１５００…コンデンサ群、１５１０…各コンデンサ、１５４０…第１の電極、１５４１…第２の電極、１５５０，１５７０…ベース板、１５６０，１５７１…樹脂体、１６１０…伝熱部材、１６１２…フレームメンバー、１８２０…巻き線、２３３２…内部板、２４００，３４００…第１の被冷却面、　２４０１，３４０１…第２の被冷却面、２９００，３９００…第１の冷却器、２９０１，３９０１…第２の冷却器、５０００…ケース入りインバータ、５０１１，６０１２，７０１２…インバータケース、６０００…インバータ内蔵電動機、６０１１，７０２０，８０２０…電動機、７０００，８０００…インバータ内蔵トランスアクスル、７０１１，８０１１…トランスアクスル、７０２１，８０２１…変速機、７０２３，８０２２…トランスアクスルケース、８０３０…窪み空間、１００，３００，４００，８００…インバータ、１１０，３１１，４１２，６１１…少なくともひとつの冷却器、１１１，３１２，４１３，６１２，８３０…フレーム、１２０，３１０，４１０，６１０…第１の冷却器、１２１，３２０，４１１，６２０…第２の冷却器、４２０…第３の冷却器、１３０…第１の被冷却面、１３１…第２の被冷却面、１５０，４５０…第１の冷却液入口、１６０，４６０…第１の冷却液出口、１８０，４８０…第２の冷却液入口、１９０，４９０…第２の冷却液出口、５１０…第３の冷却液入口、５２０…第３の冷却液出口、２１０…中空部、５３０…第１の中空部、５３１…第２の中空部、３３０，４３４，６３０…コンデンサ、３３１，４３５，６３１…第１の電極、３３２，４３６，６３２…第２の電極、８２０，８２１，８２２…構造体 1000, 2000, 3000, 4000, 5010, 6010, 7010, 8010 ... inverter, 1011, 2011, 3011 ... at least one cooler, 1012, 2012 ... frame, 1100 ... DC connector, 1110 ... smoothing capacitor 1120, 1121, 1122 , 1123, 1124, 1125, 4290, 4291 ... DC bus bar electrode, 1130 ... signal terminal connector, 1140 ... signal wiring, 1150, 1160 ... drive circuit board, 1170 ... semiconductor power module, 1180, 1181, 1182 ... AC bus bar electrode, 1190, 1191, 1192 ... AC connector, 1200, 1201, 1202 ... current sensor, 1300, 1301, 1302, 1303 ... pillar, 1310, 1311, 1312, 1313, 1314, 315, 1316, 1317, 1440, 2319, 2320 ... beam, 1320, 1321 ... side plate, 1330, 1331 ... bottom plate, 1400 ... cooled surface, 1500 ... capacitor group, 1510 ... each capacitor, 1540 ... first electrode, 1541 ... second electrode, 1550, 1570 ... base plate, 1560, 1571 ... resin body, 1610 ... heat transfer member, 1612 ... frame member, 1820 ... winding, 2332 ... inner plate, 2400, 3400 ... first cooled object Second surface to be cooled, 2900, 3900 First cooler, 2901, 3901 Second cooler, 5000 Cased inverter, 5011, 6012, 7012 Inverter case, 6000 ... Motor with built-in inverter, 6011, 7020, 8020 ... motor, 70 0, 8000 ... Transaxle with built-in inverter, 7011, 8011 ... Transaxle, 7021, 8021 ... Transmission, 7023, 8022 ... Transaxle case, 8030 ... Hollow space, 100, 300, 400, 800 ... Inverter, 110, 311, 412, 611 ... at least one cooler, 111, 312, 413, 612, 830 ... frame, 120, 310, 410, 610 ... first cooler, 121, 320, 411, 620 ... second cooler, 420: third cooler, 130: first cooled surface, 131: second cooled surface, 150, 450: first coolant inlet, 160, 460: first coolant outlet, 180, 480 ... second coolant inlet, 190, 490 ... second coolant outlet, 510 ... third coolant inlet, 520 ... third Cooling fluid outlet 210 hollow portion 530 first hollow portion 531 second hollow portion 330, 434, 630 condenser, 331 435 631 first electrode 332 436 632 Second electrode, 820, 821, 822 ... structure

Claims (30)

  1. 　複数の棒状のフレームメンバーを含む複数のフレームメンバーを備え、前記複数のフレームメンバーを組み合わせて構成されるフレームと、
    　直流をスイッチングし、交流を生成する半導体パワーモジュールと、
    　前記フレームに固定され、前記半導体パワーモジュールを冷却する少なくともひとつの冷却器と、
    を備えるインバータ。     A frame comprising a plurality of frame members including a plurality of rod-like frame members, and configured by combining the plurality of frame members;
    A semiconductor power module that switches direct current and generates alternating current;
    At least one cooler fixed to the frame and cooling the semiconductor power module;
    An inverter comprising:
  2. 　前記半導体パワーモジュールは、前記フレームに固定される、請求項１のインバータ。 The inverter according to claim 1, wherein the semiconductor power module is fixed to the frame.
  3. 　前記半導体パワーモジュールは、第１の被冷却面及び第２の被冷却面を有し、
    　前記少なくともひとつの冷却器は、前記第１の被冷却面を冷却する第１の冷却器、及び前記第２の被冷却面を冷却する第２の冷却器を含み、
    　前記複数のフレームメンバーは、前記第１の冷却器が固定される第１のフレームメンバー、及び前記第２の冷却器が固定される第２のフレームメンバーを含む、請求項１又は２のインバータ。     The semiconductor power module has a first cooled surface and a second cooled surface.
    The at least one cooler includes a first cooler for cooling the first surface to be cooled, and a second cooler for cooling the second surface to be cooled,
    The inverter according to claim 1, wherein the plurality of frame members include a first frame member to which the first cooler is fixed, and a second frame member to which the second cooler is fixed.
  4. 　前記半導体パワーモジュールは、板形状であり、
    　前記第１の被冷却面は、一方の主面であり、
    　前記第２の被冷却面は、他方の主面であり、
    　前記複数の棒状のフレームメンバーは、第１の方向に延びる第１の棒状のフレームメンバー、及び前記第１の方向と異なる第２の方向に延びる第２の棒状のフレームメンバーを含み、
    　前記第１のフレームメンバーは、前記第１の棒状のフレームメンバー又は前記第２の棒状のフレームメンバーに固定され、前記第１の方向と異なる広がり方向に広がる面を有し、
    　前記第２のフレームメンバーは、前記第１の棒状のフレームメンバー又は前記第２の棒状のフレームメンバーに固定され、前記広がり方向に広がる面を有し、前記第１のフレームメンバーから前記第１の方向に離間して配置される、請求項３のインバータ。     The semiconductor power module has a plate shape,
    The first cooled surface is one of the main surfaces,
    The second cooled surface is the other main surface,
    The plurality of rod-like frame members includes a first rod-like frame member extending in a first direction, and a second rod-like frame member extending in a second direction different from the first direction,
    The first frame member is fixed to the first rod-shaped frame member or the second rod-shaped frame member, and has a surface which spreads in a spreading direction different from the first direction.
    The second frame member is fixed to the first rod-shaped frame member or the second rod-shaped frame member, and has a surface that spreads in the spreading direction, and the first frame member is extended from the first frame member. The inverter of claim 3, wherein the inverters are spaced apart in a direction.
  5. 　前記半導体パワーモジュールは、第１の被冷却面及び第２の被冷却面を有し、
    　前記少なくともひとつの冷却器は、前記第１の被冷却面を冷却する第１の冷却器、及び前記第２の被冷却面を冷却する第２の冷却器を含み、
    　前記複数のフレームメンバーは、前記第１の冷却器及び前記第２の冷却器が共通して固定される共通のフレームメンバーを含む、請求項１又は２のインバータ。     The semiconductor power module has a first cooled surface and a second cooled surface.
    The at least one cooler includes a first cooler for cooling the first surface to be cooled, and a second cooler for cooling the second surface to be cooled,
    The inverter according to claim 1, wherein the plurality of frame members include a common frame member to which the first cooler and the second cooler are fixed in common.
  6. 　前記半導体パワーモジュールは、板形状であり、
    　前記第１の被冷却面は、一方の主面であり、
    　前記第２の被冷却面は、他方の主面であり、
    　前記複数の棒状のフレームメンバーは、第１の方向に延びる第１の棒状のフレームメンバー、及び前記第１の方向と異なる第２の方向に延びる第２の棒状のフレームメンバーを含み、
    　前記共通のフレームメンバーは、前記第１の棒状のフレームメンバー又は前記第２の棒状のフレームメンバーに固定され、前記第１の方向と異なる広がり方向に広がる面を有する、請求項５のインバータ。     The semiconductor power module has a plate shape,
    The first cooled surface is one of the main surfaces,
    The second cooled surface is the other main surface,
    The plurality of rod-like frame members includes a first rod-like frame member extending in a first direction, and a second rod-like frame member extending in a second direction different from the first direction,
    The inverter according to claim 5, wherein the common frame member is fixed to the first rod-shaped frame member or the second rod-shaped frame member and has a surface that spreads in a spreading direction different from the first direction.
  7. 　平滑前の直流を平滑し、平滑後の直流を生成する平滑コンデンサをさらに備え、
    　前記直流は、前記平滑後の直流であり、
    　前記平滑コンデンサは、電気的に並列接続される複数のコンデンサを備え前記フレームに固定されるコンデンサ群を備える、請求項１から６までのいずれかのインバータ。     It further comprises a smoothing capacitor that smoothes the DC before smoothing and generates the DC after smoothing,
    The direct current is a direct current after the smoothing,
    The inverter according to any one of claims 1 to 6, wherein the smoothing capacitor comprises a plurality of capacitors electrically connected in parallel, and a capacitor group fixed to the frame.
  8. 　平滑前の直流を平滑し、平滑後の直流を生成する平滑コンデンサと、
    　前記フレームに固定されるベース板と、
    をさらに備え、
    　前記直流は、前記平滑後の直流であり、
    　前記平滑コンデンサは、電気的に並列接続される複数のコンデンサを備え前記ベース板に固定されるコンデンサ群を備える、請求項１から６までのいずれかのインバータ。     A smoothing capacitor for smoothing the DC before smoothing and generating the smoothed DC;
    A base plate fixed to the frame;
    And further
    The direct current is a direct current after the smoothing,
    The inverter according to any one of claims 1 to 6, wherein the smoothing capacitor comprises a plurality of capacitors electrically connected in parallel, and a capacitor group fixed to the base plate.
  9. 　平滑前の直流を平滑し、平滑後の直流を生成する平滑コンデンサと、
    　前記フレームに固定される樹脂体と、
    をさらに備え、
    　前記直流は、前記平滑後の直流であり、
    　前記平滑コンデンサは、電気的に並列接続される複数のコンデンサを備え前記樹脂体に埋め込まれるコンデンサ群を備える、請求項１から６までのいずれかのインバータ。     A smoothing capacitor for smoothing the DC before smoothing and generating the smoothed DC;
    A resin body fixed to the frame;
    And further
    The direct current is a direct current after the smoothing,
    The inverter according to any one of claims 1 to 6, wherein the smoothing capacitor comprises a plurality of capacitors electrically connected in parallel and a capacitor group embedded in the resin body.
  10. 　平滑前の直流を平滑し、平滑後の直流を生成する平滑コンデンサと、
    　前記フレームに固定されるベース板と、
    　前記ベース板に固定される樹脂体と、
    をさらに備え、
    　前記直流は、前記平滑後の直流であり、
    　前記平滑コンデンサは、電気的に並列接続される複数のコンデンサを備え前記樹脂体に埋め込まれるコンデンサ群を備える、請求項１から６までのいずれかのインバータ。     A smoothing capacitor for smoothing the DC before smoothing and generating the smoothed DC;
    A base plate fixed to the frame;
    A resin body fixed to the base plate;
    And further
    The direct current is a direct current after the smoothing,
    The inverter according to any one of claims 1 to 6, wherein the smoothing capacitor comprises a plurality of capacitors electrically connected in parallel and a capacitor group embedded in the resin body.
  11. 　前記複数のコンデンサの各々は、円筒状の形状を有し、一方の円筒端及び他方の円筒端を有し、前記一方の円筒端にある第１の電極及び前記他方の円筒端にある第２の電極を備え、
    　前記コンデンサ群に備えられる複数の第１の電極が互いに電気的に接続され、
    　前記コンデンサ群に備えられる複数の第２の電極が互いに電気的に接続される、請求項７から１０までのいずれかのインバータ。     Each of the plurality of capacitors has a cylindrical shape, has one cylindrical end and the other cylindrical end, and has a first electrode at the one cylindrical end and a second electrode at the other cylindrical end. Equipped with an electrode of
    A plurality of first electrodes provided in the capacitor group are electrically connected to each other;
    The inverter according to any one of claims 7 to 10, wherein a plurality of second electrodes provided in said capacitor group are electrically connected to each other.
  12. 　前記フレームに固定され、平滑前の直流が外部から入力されるＤＣコネクタと、
    　前記平滑前の直流を平滑し、平滑後の直流を生成する平滑コンデンサと、
    をさらに備え、
    　前記直流は、前記平滑後の直流である、請求項１から１１までのいずれかのインバータ。     A DC connector fixed to the frame and to which a direct current before smoothing is input from the outside;
    A smoothing capacitor for smoothing the direct current before the smoothing and generating the smoothed direct current;
    And further
    The inverter according to any one of claims 1 to 11, wherein the direct current is a direct current after the smoothing.
  13. 　前記フレームに固定されるか又は埋め込まれ、平滑前の直流を伝送するＤＣバスバ電極と、
    　前記平滑前の直流を平滑し、平滑後の直流を生成する平滑コンデンサと、をさらに備え、
    　前記直流は、前記平滑後の直流である、請求項１から１２までのいずれかのインバータ。     A DC bus bar electrode fixed to or embedded in the frame and transmitting a direct current before smoothing;
    And a smoothing capacitor for smoothing the direct current before the smoothing and generating the smoothed direct current.
    The inverter according to any one of claims 1 to 12, wherein the direct current is a direct current after the smoothing.
  14. 　平滑前の直流を平滑し、平滑後の直流を生成する平滑コンデンサと、
    　前記フレームに固定されるか又は埋め込まれ、前記平滑後の直流を伝送するＤＣバスバ電極と、をさらに備え、
    　前記直流は、前記平滑後の直流である、請求項１から１３までのいずれかのインバータ。     A smoothing capacitor for smoothing the DC before smoothing and generating the smoothed DC;
    And DC bus bar electrodes fixed to or embedded in the frame and transmitting the smoothed direct current.
    The inverter according to any one of claims 1 to 13, wherein the direct current is a direct current after the smoothing.
  15. 　前記フレームに固定されるか又は埋め込まれ、前記交流を伝送するＡＣバスバ電極をさらに備える、請求項１から１４までのいずれかのインバータ。 15. An inverter according to any of the preceding claims, further comprising an AC bus bar electrode fixed or embedded in the frame and transmitting the alternating current.
  16. 　信号が外部から入力される信号端子コネクタ、前記信号を伝送する信号配線、前記信号に基づいて前記半導体パワーモジュールを駆動する駆動回路基板、前記交流を伝送するＡＣバスバ電極、前記交流を外部に出力するＡＣコネクタ、及び前記ＡＣバスバ電極に流れる電流の大きさを検知する電流センサからなる群より選択され、前記フレームに固定されるか又は埋め込まれる少なくともひとつの部品をさらに備える、請求項１から１５までのいずれかのインバータ。 A signal terminal connector to which a signal is input from the outside, a signal wiring to transmit the signal, a drive circuit board to drive the semiconductor power module based on the signal, an AC bus bar electrode to transmit the alternating current, and the alternating current to the outside 16. The method according to claim 1, further comprising at least one component selected from the group consisting of: an AC connector, and a current sensor for detecting the magnitude of the current flowing through the AC bus bar electrode, and fixed or embedded in the frame. Up to any inverter.
  17. 　平滑前の直流を伝送するＤＣバスバ電極、前記平滑前の直流を平滑し平滑後の直流を生成する平滑コンデンサ、前記平滑後の直流を伝送するＤＣバスバ電極、前記半導体パワーモジュールを駆動する駆動回路基板、前記交流を伝送するＡＣバスバ電極及び前記ＡＣバスバ電極に流れる電流の大きさを検知する電流センサからなる群より選択される少なくともひとつの部品、並びに前記少なくともひとつの冷却器に固定され、前記フレームに固定されるか又は保持される伝熱部材をさらに備える、請求項１から１６までのいずれかのインバータ。 DC bus bar electrode for transmitting DC before smoothing, smoothing capacitor for smoothing DC before smoothing and generating DC after smoothing, DC bus bar electrode for transmitting DC after smoothing, driving circuit for driving the semiconductor power module Fixed to at least one component selected from the group consisting of a substrate, an AC bus bar electrode for transmitting the alternating current, and a current sensor for detecting the magnitude of current flowing in the AC bus bar electrode, and fixed to the at least one cooler; 17. An inverter according to any of the preceding claims, further comprising a heat transfer member fixed or held to the frame.
  18. 　前記交流を伝送するＡＣバスバ電極をさらに備え、
    　前記複数のフレームメンバーは、前記フレームの外側を向く表面を有するフレームメン
    バーを備え、
    　前記ＡＣバスバ電極は、前記表面又は前記フレームメンバーの内部に配置され電動機の
    巻き線に電気的に接続される端部を有し、
    　前記端部に沿って配置され前記少なくともひとつの冷却器に固定される伝熱部材をさらに備える、請求項１から１７までのいずれかのインバータ。     It further comprises an AC bus bar electrode for transmitting the alternating current,
    The plurality of frame members comprises a frame member having an outwardly facing surface of the frame,
    The AC bus bar electrode has an end disposed on the surface or inside the frame member and electrically connected to a winding of a motor,
    18. An inverter according to any of the preceding claims, further comprising a heat transfer member disposed along the end and secured to the at least one cooler.
  19. 　前記複数の棒状のフレームメンバーは、第１の方向に延びる第１の棒状のフレームメンバー、及び前記第１の方向と異なる第２の方向に延び前記第１の棒状のフレームメンバーに固定される第２の棒状のフレームメンバーを含む、請求項１から１８までのいずれかのインバータ。 The plurality of rod-like frame members are fixed to a first rod-like frame member extending in a first direction and a second rod-like frame member extending in a second direction different from the first direction 19. An inverter according to any of the preceding claims, comprising two rod-shaped frame members.
  20. 　前記半導体パワーモジュールは、第１の被冷却面及び第２の被冷却面を有し、
    　前記少なくともひとつの冷却器は、前記第１の被冷却面を冷却し第１の冷却液入口及び第１の冷却液出口を有する第１の冷却器、並びに前記第２の被冷却面を冷却し第２の冷却液入口及び第２の冷却液出口を有する第２の冷却器を含み、
    　前記フレームは、中空部を備え、
    　前記中空部は、前記第１の冷却液入口又は前記第１の冷却液出口に接続される一方の接続端、及び前記第２の冷却液入口又は前記第２の冷却液出口に接続される他方の接続端を有し、中空の形状を有し、冷却液が流れる流路を有する中空部を備える、請求項１から１９までのいずれかのインバータ。     The semiconductor power module has a first cooled surface and a second cooled surface.
    The at least one cooler cools the first surface to be cooled and cools the first cooler having a first coolant inlet and a first coolant outlet, and the second surface to be cooled Including a second cooler having a second coolant inlet and a second coolant outlet;
    The frame comprises a hollow portion,
    The hollow portion is connected to the first coolant inlet or one connection end connected to the first coolant outlet, and the other connected to the second coolant inlet or the second coolant outlet. 20. An inverter according to any of the preceding claims, comprising a hollow portion having a connection end, a hollow shape, and a flow passage through which the coolant flows.
  21. 　直流を平滑し、一端及び他端を有するコンデンサと、前記一端に配置される第１の電極と、前記他端に配置される第２の電極とを備える平滑コンデンサと、
    　前記フレームに固定され、前記第１の電極を冷却し、第１の冷却液入口及び第１の冷却液出口を有する第１の冷却器と、
    　前記フレームに固定され、前記第２の電極を冷却し、第２の冷却液入口及び第２の冷却液出口を有する第２の冷却器と、をさらに備え、
    　前記フレームは、第１の中空部を備え、
    　前記第１の中空部は、前記第１の冷却液入口及び前記第１の冷却液出口の一方に接続される一方の接続端、並びに前記第２の冷却液入口及び前記第２の冷却液出口の一方に接続される他方の接続端を有し、中空の形状を有し、冷却液が流れる第１の流路を有する、請求項１から１９までのいずれかのインバータ。     Smoothing a direct current, a smoothing capacitor comprising a capacitor having one end and the other end, a first electrode disposed at the one end, and a second electrode disposed at the other end;
    A first cooler fixed to the frame, cooling the first electrode, and having a first coolant inlet and a first coolant outlet;
    Further comprising a second cooler fixed to the frame, cooling the second electrode, and having a second coolant inlet and a second coolant outlet.
    The frame comprises a first hollow portion,
    The first hollow portion has one connecting end connected to one of the first coolant inlet and the first coolant outlet, and the second coolant inlet and the second coolant outlet. 20. An inverter according to any of the preceding claims, having the other connection end connected to one of the two, having a hollow shape and having a first flow path through which the coolant flows.
  22. 　前記少なくともひとつの冷却器は、第３の冷却液入口及び第３の冷却液出口を有する第３の冷却器を含み、
    　前記フレームは、第２の中空部をさらに備え、
    　前記第２の中空部は、前記第１の冷却液入口及び前記第１の冷却液出口の他方、又は前記第２の冷却液入口及び前記第２の冷却液出口の他方に接続される一方の接続端、並びに前記第３の冷却液入口及び前記第３の冷却液出口の一方に接続される他方の接続端を有し、中空の形状を有し、冷却液が流れる第２の流路を有する、請求項２１のインバータ。     The at least one cooler includes a third cooler having a third coolant inlet and a third coolant outlet.
    The frame further comprises a second hollow portion,
    The second hollow portion is connected to the other of the first coolant inlet and the first coolant outlet, or to the other of the second coolant inlet and the second coolant outlet. A connection end, and the other connection end connected to one of the third coolant inlet and the third coolant outlet, having a hollow shape and having a second flow path through which the coolant flows 22. The inverter of claim 21.
  23. 　直流を平滑し、一端及び他端を有するコンデンサと、前記一端に配置される第１の電極と、前記他端に配置される第２の電極とを備える平滑コンデンサと、
    　前記フレームに固定され、前記第１の電極を冷却し、第１の冷却液入口及び第１の冷却液出口を有する第１の冷却器と、をさらに備え、
    　前記少なくともひとつの冷却器は、前記半導体パワーモジュール及び前記第２の電極を冷却し、第２の冷却液入口及び第２の冷却液出口を有する第２の冷却器を含み、
    　前記フレームは、中空部を備え、
    　前記中空部は、前記第１の冷却液入口又は前記第１の冷却液出口に接続される一方の接続端、及び前記第２の冷却液入口又は前記第２の冷却液出口に接続される他方の接続端を有し、中空の形状を有し、冷却液が流れる流路を有する、請求項１から１９までのいずれかのインバータ。     Smoothing a direct current, a smoothing capacitor comprising a capacitor having one end and the other end, a first electrode disposed at the one end, and a second electrode disposed at the other end;
    Further comprising: a first cooler fixed to the frame, cooling the first electrode, and having a first coolant inlet and a first coolant outlet;
    The at least one cooler includes a second cooler for cooling the semiconductor power module and the second electrode and having a second coolant inlet and a second coolant outlet.
    The frame comprises a hollow portion,
    The hollow portion is connected to the first coolant inlet or one connection end connected to the first coolant outlet, and the other connected to the second coolant inlet or the second coolant outlet. 20. An inverter according to any of the preceding claims, having a connecting end, having a hollow shape and having a flow path through which the coolant flows.
  24. 　前記第２の冷却器は、一方の面及び他方の面を有し、
    　前記半導体パワーモジュール及び前記平滑コンデンサは、前記一方の面上に配置される、請求項２３のインバータ。     The second cooler has one side and the other side,
    The inverter according to claim 23, wherein the semiconductor power module and the smoothing capacitor are disposed on the one surface.
  25. 　前記第２の冷却器は、一方の面及び他方の面を有し、
    　前記半導体パワーモジュールは、前記一方の面上に配置され、
    　前記平滑コンデンサは、前記他方の面上に配置される、請求項２３のインバータ。     The second cooler has one side and the other side,
    The semiconductor power module is disposed on the one surface,
    24. The inverter of claim 23, wherein the smoothing capacitor is disposed on the other side.
  26. 　前記交流は、第１から第ｎまでの相の成分を有しｎが２以上の整数である多相交流であり、
    　前記半導体パワーモジュールを含み、直流をスイッチングし前記第１から第ｎまでの相の成分をそれぞれ生成する第１から第ｎまでの半導体パワーモジュールと、
    　前記フレームに固定され、前記少なくともひとつの冷却器を含み、前記第１から第ｎまでの半導体パワーモジュールをそれぞれ冷却する第１から第ｎまでの少なくともひとつの冷却器と、を備え、
    　前記第１から第ｎまでの半導体パワーモジュール及び前記第１から第ｎまでの少なくともひとつの冷却器をそれぞれ備える第１から第ｎまでの構造体が、湾曲面上の互いに異なる法線方向を有する第１から第ｎまでの位置の上にそれぞれ配置され、
    　第１から第ｎまでの少なくともひとつの冷却器の各々は、冷却液入口及び冷却液出口を備え、
    　前記フレームは、中空部を備え、
    　前記中空部は、前記第１から第ｎまでの少なくともひとつの冷却器に含まれる一の少なくともひとつの冷却器に備えられる冷却液入口及び冷却液出口の一方に接続される一方の接続端、並びに前記第１から第ｎまでの少なくともひとつの冷却器に含まれる他の少なくともひとつの冷却器に備えられる冷却液入口及び冷却液出口の一方に接続される他方の接続端を有し、中空の形状を有し、冷却液が流れる流路を有する、請求項１から２５までのいずれかのインバータ。     The alternating current is a polyphase alternating current having components of the first to n-th phases and n is an integer of 2 or more,
    First to nth semiconductor power modules, each of which includes the semiconductor power module, switches direct current, and generates components of the first to nth phases, respectively;
    And at least one cooler, which is fixed to the frame, includes the at least one cooler, and cools the first to n-th semiconductor power modules, respectively.
    The first to n-th structures respectively including the first to n-th semiconductor power modules and the first to n-th coolers have different normal directions on curved surfaces. Respectively disposed on the first to nth positions,
    Each of the first to n-th at least one coolers comprises a coolant inlet and a coolant outlet,
    The frame comprises a hollow portion,
    The hollow portion is one connection end connected to one of a coolant inlet and a coolant outlet provided in at least one cooler included in the at least one cooler from the first to the nth, and A hollow shape having a cooling fluid inlet provided to at least one other cooler included in the first to n-th at least one coolers and the other connection end connected to one of the cooling fluid outlets 26. An inverter according to any of the preceding claims, comprising a flow path through which the coolant flows.
  27. 　請求項１から２６までのいずれかのインバータと、
    　前記インバータを収容するインバータケースと、を備えるケース入りインバータ。     An inverter according to any one of claims 1 to 26,
    And an inverter case accommodating the inverter.
  28. 　請求項１から２６までのいずれかのインバータと、
    　電動機ケースを備える電動機と、
    　前記電動機ケースに接合されるか又は前記電動機ケースと一体化され、前記インバータを収容するインバータケースと、を備えるインバータ内蔵電動機。     An inverter according to any one of claims 1 to 26,
    A motor comprising a motor case,
    An inverter built-in electric motor comprising: an inverter case joined to the motor case or integrated with the motor case and accommodating the inverter.
  29. 　請求項１から２６までのいずれかのインバータと、
    　機械力を発生する電動機、前記機械力を伝達する伝達機構、並びに前記電動機及び前記伝達機構を収容する複合装置ケースを備える複合装置と、
    　前記複合装置ケースに接合されるか又は前記複合装置ケースと一体化され、前記インバータを収容するインバータケースと、を備えるインバータ内蔵複合装置。     An inverter according to any one of claims 1 to 26,
    A composite device comprising a motor generating mechanical force, a transmission mechanism transmitting the mechanical force, and a composite device case accommodating the motor and the transmission mechanism;
    An inverter case joined to the integrated device case or integrated with the integrated device case and containing the inverter.
  30. 　請求項１から２６までのいずれかのインバータと、
    　機械力を発生する電動機、前記機械力を伝達する伝達機構、並びに前記電動機及び前記伝達機構を収容する複合装置ケースを備え、外部に露出し前記インバータを収容する窪み空間が前記複合装置ケースに形成される複合装置と、を備えるインバータ内蔵複合装置。     An inverter according to any one of claims 1 to 26,
    An electric machine generating mechanical force, a transmission mechanism transmitting the mechanical force, and a combined device case accommodating the electric motor and the transmission mechanism, and a recessed space exposed to the outside and accommodating the inverter is formed in the combined device case And an integrated device with an inverter.
PCT/JP2018/045424 2017-12-14 2018-12-11 Inverter, inverter in case, electric motor having built-in inverter, and composite device having built-in inverter WO2019117119A1 (en)

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