JPS6130254U - Semiconductor device mounting mechanism - Google Patents
Semiconductor device mounting mechanismInfo
- Publication number
- JPS6130254U JPS6130254U JP11543984U JP11543984U JPS6130254U JP S6130254 U JPS6130254 U JP S6130254U JP 11543984 U JP11543984 U JP 11543984U JP 11543984 U JP11543984 U JP 11543984U JP S6130254 U JPS6130254 U JP S6130254U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- mounting mechanism
- device mounting
- heat sink
- spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【図面の簡単な説明】
第１図は従来の半導体装置の取付け機構の例を示す斜視
図、第２図は本考案半導体装置の取付け機構の一実施例
を示す分解斜視図、第３図は本考案半導体装置の取付け
機構の一実施例の正面図、第４図は第３図の側面図、第
５図は第３図の背面図である。
１は半導体装置、２は印刷配線基板、３は放熱板、５は
断面略コ字状の帯状スプリング、６は−孔、８はダボで
ある。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing an example of a conventional mounting mechanism for a semiconductor device, FIG. 2 is an exploded perspective view showing an example of a mounting mechanism for a semiconductor device of the present invention, and FIG. FIG. 4 is a front view of one embodiment of the mounting mechanism of the semiconductor device of the present invention, FIG. 4 is a side view of FIG. 3, and FIG. 5 is a rear view of FIG. 3. 1 is a semiconductor device, 2 is a printed wiring board, 3 is a heat sink, 5 is a strip spring having a substantially U-shaped cross section, 6 is a hole, and 8 is a dowel.
Claims (1)
るに上記放熱板と半導体装置とを断面略コ字状の帯状ス
プリングにより所定の力で挾持する様にすると共に該帯
状スプリングに孔を設け、上記放熱板の所定位置に上記
帯状スプリングの孔に係合するダボを設けたことを特徴
とする半導体装置の取付け機構。To fix a semiconductor device to a heat sink fixed on a printed wiring board, the heat sink and the semiconductor device are held together with a predetermined force by a strip spring having a substantially U-shaped cross section, and holes are provided in the strip spring. . A mounting mechanism for a semiconductor device, characterized in that a dowel is provided at a predetermined position of the heat dissipation plate to engage with a hole of the band-shaped spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11543984U JPS6130254U (en) | 1984-07-27 | 1984-07-27 | Semiconductor device mounting mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11543984U JPS6130254U (en) | 1984-07-27 | 1984-07-27 | Semiconductor device mounting mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6130254U true JPS6130254U (en) | 1986-02-24 |
Family
ID=30674409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11543984U Pending JPS6130254U (en) | 1984-07-27 | 1984-07-27 | Semiconductor device mounting mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6130254U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013033682A (en) * | 2011-08-03 | 2013-02-14 | Mitsubishi Electric Corp | Power source device, and lighting fixture |
-
1984
- 1984-07-27 JP JP11543984U patent/JPS6130254U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013033682A (en) * | 2011-08-03 | 2013-02-14 | Mitsubishi Electric Corp | Power source device, and lighting fixture |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6130254U (en) | Semiconductor device mounting mechanism | |
| JPS58180692U (en) | printed board | |
| JPS58138394U (en) | Mounting structure of heat sink on printed circuit board | |
| JPS59111048U (en) | Heat sink mounting device | |
| JPS6073295U (en) | Mounting device for heat generating parts | |
| JPS58155896U (en) | Cooling structure for printed board components | |
| JPS5916196U (en) | Heat dissipation structure of printed board | |
| JPS6127297U (en) | Heat dissipation structure of printed circuit board | |
| JPS5926255U (en) | transistor mounting bracket | |
| JPS58168146U (en) | Mounting structure of heat sink | |
| JPS60106389U (en) | Printed circuit board fixing device | |
| JPS587351U (en) | Heat dissipation mechanism | |
| JPS6037247U (en) | Transistor heat dissipation mounting structure | |
| JPS60116248U (en) | Heat sink for semiconductor devices | |
| JPS58162696U (en) | control panel | |
| JPS6037284U (en) | Integrated circuit component mounting equipment | |
| JPS59173395U (en) | Heat dissipation device for electronic components | |
| JPS60160586U (en) | Printed circuit board mounting device | |
| JPS6027449U (en) | Transistor heat dissipation device | |
| JPS59149639U (en) | Transistor holding device | |
| JPS6061737U (en) | Structure of transistor heat sink | |
| JPS5970348U (en) | Transistor mounting parts | |
| JPS58147295U (en) | Heatsink for printed board mounting | |
| JPS614491U (en) | Heat sink for electronic components | |
| JPS59112950U (en) | Semiconductor mounting structure |