JPS6122394U - Cooling device inside the package - Google Patents
Cooling device inside the packageInfo
- Publication number
- JPS6122394U JPS6122394U JP10520484U JP10520484U JPS6122394U JP S6122394 U JPS6122394 U JP S6122394U JP 10520484 U JP10520484 U JP 10520484U JP 10520484 U JP10520484 U JP 10520484U JP S6122394 U JPS6122394 U JP S6122394U
- Authority
- JP
- Japan
- Prior art keywords
- cooling device
- package
- device inside
- components located
- located above
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は、電子回路パッケージが、シェルフに搭載され
た状態の斜視図、第2図は、本考案の一実施例の対流誘
導板を搭載した電子回路パッケージの外観図である。
1・・・・・・パッケージ、2・・・・・・対流誘導板
、3・・・・・・シエルフ。FIG. 1 is a perspective view of an electronic circuit package mounted on a shelf, and FIG. 2 is an external view of an electronic circuit package equipped with a convection guide plate according to an embodiment of the present invention. 1...Package, 2...Convection guide plate, 3...Shelf.
Claims (1)
う電子回路パッケージに於で、上下関係に位置する部品
間に対流誘導板を設け、上に位置する部品が、下に位置
する部品の熱の影響を受けないようにすることを特徴と
するパッケージ内冷却装置。In electronic circuit packages that are equipped with semiconductors and other electrical components and are cooled by convection, a convection guide plate is installed between the components located above and below, so that the components located above absorb the heat of the components located below. An in-package cooling device characterized by being unaffected.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10520484U JPS6122394U (en) | 1984-07-13 | 1984-07-13 | Cooling device inside the package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10520484U JPS6122394U (en) | 1984-07-13 | 1984-07-13 | Cooling device inside the package |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6122394U true JPS6122394U (en) | 1986-02-08 |
Family
ID=30664539
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10520484U Pending JPS6122394U (en) | 1984-07-13 | 1984-07-13 | Cooling device inside the package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6122394U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016136466A1 (en) * | 2015-02-25 | 2016-09-01 | 株式会社日立エルジーデータストレージ | Light module and scanning image display device |
-
1984
- 1984-07-13 JP JP10520484U patent/JPS6122394U/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016136466A1 (en) * | 2015-02-25 | 2016-09-01 | 株式会社日立エルジーデータストレージ | Light module and scanning image display device |
JP2016157824A (en) * | 2015-02-25 | 2016-09-01 | 株式会社日立エルジーデータストレージ | Optical module and scanning type image display device |
CN107112717A (en) * | 2015-02-25 | 2017-08-29 | 日立乐金光科技株式会社 | Optical module and ing image display device |
US10148920B2 (en) | 2015-02-25 | 2018-12-04 | Hitachi-Lg Data Storage, Inc. | Optical module and scanning-type image display device |
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