JPS58138275U - Structure of board bonding terminal - Google Patents
Structure of board bonding terminalInfo
- Publication number
- JPS58138275U JPS58138275U JP1982035102U JP3510282U JPS58138275U JP S58138275 U JPS58138275 U JP S58138275U JP 1982035102 U JP1982035102 U JP 1982035102U JP 3510282 U JP3510282 U JP 3510282U JP S58138275 U JPS58138275 U JP S58138275U
- Authority
- JP
- Japan
- Prior art keywords
- bonding terminal
- board bonding
- substrate
- terminal
- abstract
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Multi-Conductor Connections (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来のセラミック基板接合端子とセラミック基
板の挿着状態を示す斜視図、第2図aは、セラミック基
板側面の凸部を示す断面図、第2図すは、セラミック基
板側面の凹部を示す断面図、第3図は本考案になるセラ
ミック基板接合端子の斜視図、第4図は第3図に示した
端子をセラミック基板に挿着した状態を示す斜視図であ
る。
1・・・セラミック基板、2・・・端子、2a・・・セ
ラミック基板接合端子、16・・・舌片。Fig. 1 is a perspective view showing how a conventional ceramic board bonding terminal and a ceramic board are inserted, Fig. 2a is a sectional view showing a convex part on the side surface of the ceramic board, and Fig. 2 shows a concave part on the side face of the ceramic board. 3 is a perspective view of a ceramic substrate bonding terminal according to the present invention, and FIG. 4 is a perspective view showing the terminal shown in FIG. 3 inserted into a ceramic substrate. DESCRIPTION OF SYMBOLS 1... Ceramic board, 2... Terminal, 2a... Ceramic board bonding terminal, 16... Tongue piece.
Claims (1)
部配線とを結合する基板接合端子において、該端子に基
板の側面に接する舌片を設けたことを特徴とする基板接
合端子の構造。A structure of a substrate bonding terminal for coupling an electric circuit formed on a substrate by printing or vapor deposition or the like with external wiring, characterized in that the terminal is provided with a tongue piece that contacts the side surface of the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982035102U JPS58138275U (en) | 1982-03-15 | 1982-03-15 | Structure of board bonding terminal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982035102U JPS58138275U (en) | 1982-03-15 | 1982-03-15 | Structure of board bonding terminal |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58138275U true JPS58138275U (en) | 1983-09-17 |
Family
ID=30046584
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1982035102U Pending JPS58138275U (en) | 1982-03-15 | 1982-03-15 | Structure of board bonding terminal |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58138275U (en) |
-
1982
- 1982-03-15 JP JP1982035102U patent/JPS58138275U/en active Pending
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