JPS60156755U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS60156755U JPS60156755U JP4293284U JP4293284U JPS60156755U JP S60156755 U JPS60156755 U JP S60156755U JP 4293284 U JP4293284 U JP 4293284U JP 4293284 U JP4293284 U JP 4293284U JP S60156755 U JPS60156755 U JP S60156755U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- semiconductor device
- view
- lead wire
- cross
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａおよびｂは、それぞれ従来公知の半導体装置の
一例を示す平面図および側面図である。
第２図はハンダ付実装の除虫ずる外部り一１゛線の浮き
上り現象を示す図、第３図および第４図は、それぞれ本
考案の一実施例を示す半導体装置の側面図、第５図ａお
よびｂは、それぞれ本考案半導体装置のハンダ付実装状
況を示す断面図である。
１・・・・・・樹脂封止体、２，５・・・・・・外部リ
ード線、 −３・・・・・・回路基板、４・・・・
・・ハンダ・バンブ、Ｐ・・・・・・樹脂封止体の角（
支へ）。FIGS. 1a and 1b are a plan view and a side view, respectively, showing an example of a conventionally known semiconductor device. FIG. 2 is a diagram showing a rising phenomenon of a line outside the insect repellent slide in soldered mounting, and FIGS. 3 and 4 are a side view and a side view of a semiconductor device showing an embodiment of the present invention, respectively. FIGS. 5a and 5b are cross-sectional views showing the soldering and mounting state of the semiconductor device of the present invention, respectively. 1... Resin sealing body, 2, 5... External lead wire, -3... Circuit board, 4...
・・Solder bump, P・・・・Corner of resin sealing body (
to the support).
Claims (1)
する半導体装置。A semiconductor device characterized by having an external lead wire having a figure-7 cross-sectional shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4293284U JPS60156755U (en) | 1984-03-26 | 1984-03-26 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4293284U JPS60156755U (en) | 1984-03-26 | 1984-03-26 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60156755U true JPS60156755U (en) | 1985-10-18 |
Family
ID=30554129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4293284U Pending JPS60156755U (en) | 1984-03-26 | 1984-03-26 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60156755U (en) |
-
1984
- 1984-03-26 JP JP4293284U patent/JPS60156755U/en active Pending
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