JPS5954951U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS5954951U JPS5954951U JP14874982U JP14874982U JPS5954951U JP S5954951 U JPS5954951 U JP S5954951U JP 14874982 U JP14874982 U JP 14874982U JP 14874982 U JP14874982 U JP 14874982U JP S5954951 U JPS5954951 U JP S5954951U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- metal plate
- shielded
- semiconductor
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例である金属板を示す斜視図、
第２図は本考案の一実施例である絶縁チップを半導体の
パッケージのリードピンに装着した斜視図、第３図は本
考案の一実施例である金属板で遮蔽された半導体装置を
示す斜視図である。
図中１・・・・・・金属板、２・・・・・・貫通孔、３
・・・・・・半導体パッケージ、４・・・・・・リード
ピン、５・・・・・・絶縁チップ。FIG. 1 is a perspective view showing a metal plate which is an embodiment of the present invention;
FIG. 2 is a perspective view of an insulating chip mounted on the lead pins of a semiconductor package, which is an embodiment of the present invention, and FIG. 3 is a perspective view of a semiconductor device shielded with a metal plate, which is an embodiment of the present invention. It is. In the figure 1...Metal plate, 2...Through hole, 3
... Semiconductor package, 4 ... Lead pin, 5 ... Insulation chip.
Claims (1)
縁層を介して金属板により遮蔽されてなることを特徴と
する半導体装置。A semiconductor device characterized in that lead pins arranged on a substrate housing a semiconductor element are shielded by a metal plate via an insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14874982U JPS5954951U (en) | 1982-09-30 | 1982-09-30 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14874982U JPS5954951U (en) | 1982-09-30 | 1982-09-30 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5954951U true JPS5954951U (en) | 1984-04-10 |
Family
ID=30330392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14874982U Pending JPS5954951U (en) | 1982-09-30 | 1982-09-30 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5954951U (en) |
-
1982
- 1982-09-30 JP JP14874982U patent/JPS5954951U/en active Pending
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