JPS5877058U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS5877058U JPS5877058U JP17163081U JP17163081U JPS5877058U JP S5877058 U JPS5877058 U JP S5877058U JP 17163081 U JP17163081 U JP 17163081U JP 17163081 U JP17163081 U JP 17163081U JP S5877058 U JPS5877058 U JP S5877058U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- heat sink
- fixed
- semiconductor element
- semiconductor equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来例の要部横断面図、第２図は樹脂モールド
前の状態を示す平面図、第３図はリードの彎曲状態を示
す側面図、第４図は本案の一実施例を示す横断面図であ
る。
図中、１は放熱板、３はリード、３□〜３７はリード片
、４は半導体素子、５は金属細線である。Fig. 1 is a cross-sectional view of the main part of the conventional example, Fig. 2 is a plan view showing the state before resin molding, Fig. 3 is a side view showing the curved state of the lead, and Fig. 4 is an embodiment of the present invention. FIG. In the figure, 1 is a heat sink, 3 is a lead, 3□ to 37 are lead pieces, 4 is a semiconductor element, and 5 is a thin metal wire.
Claims (1)
よりなるリードを、特定のリード片が放熱板に固定され
、他のリード片が半導体素子の近傍に位置するように配
設し、かつ半導体素子の電極とリード片とを金属細線に
て接続したものにおいて、上記リードを、放熱板を構成
する金属部材の熱膨張係数より充分に小さい金属部材に
て構成したことを特徴とする半導体装置。A semiconductor element is fixed to a heat sink, and a lead consisting of a plurality of lead pieces is arranged such that a specific lead piece is fixed to the heat sink and other lead pieces are located near the semiconductor element, and the semiconductor element is fixed to the heat sink. 1. A semiconductor device in which an electrode of an element and a lead piece are connected by a thin metal wire, wherein the lead is made of a metal member having a coefficient of thermal expansion sufficiently smaller than that of a metal member constituting a heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17163081U JPS5877058U (en) | 1981-11-17 | 1981-11-17 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17163081U JPS5877058U (en) | 1981-11-17 | 1981-11-17 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5877058U true JPS5877058U (en) | 1983-05-24 |
Family
ID=29963547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17163081U Pending JPS5877058U (en) | 1981-11-17 | 1981-11-17 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5877058U (en) |
-
1981
- 1981-11-17 JP JP17163081U patent/JPS5877058U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5877058U (en) | semiconductor equipment | |
| JPS60939U (en) | semiconductor equipment | |
| JPS5887359U (en) | semiconductor equipment | |
| JPS605147U (en) | semiconductor equipment | |
| JPS58158453U (en) | semiconductor equipment | |
| JPS5947954U (en) | Overcurrent protection element | |
| JPS59191744U (en) | semiconductor equipment | |
| JPS58155835U (en) | semiconductor equipment | |
| JPS602841U (en) | semiconductor mounting board | |
| JPS5889951U (en) | semiconductor equipment | |
| JPS5933254U (en) | semiconductor equipment | |
| JPS58140636U (en) | semiconductor equipment | |
| JPS587346U (en) | semiconductor equipment | |
| JPS5958941U (en) | semiconductor equipment | |
| JPS5844857U (en) | semiconductor equipment | |
| JPS58155836U (en) | semiconductor equipment | |
| JPS6142853U (en) | Resin-encapsulated semiconductor device | |
| JPS5839058U (en) | semiconductor equipment | |
| JPS60113642U (en) | semiconductor equipment | |
| JPS6115744U (en) | semiconductor equipment | |
| JPS588947U (en) | Lead frame for semiconductor devices | |
| JPS59192845U (en) | semiconductor equipment | |
| JPS59191742U (en) | semiconductor equipment | |
| JPS5991747U (en) | semiconductor equipment | |
| JPS5844844U (en) | semiconductor equipment |