JPS58164255U - Light emitting light receiving element - Google Patents

Light emitting light receiving element

Info

Publication number
JPS58164255U
JPS58164255U JP6254182U JP6254182U JPS58164255U JP S58164255 U JPS58164255 U JP S58164255U JP 6254182 U JP6254182 U JP 6254182U JP 6254182 U JP6254182 U JP 6254182U JP S58164255 U JPS58164255 U JP S58164255U
Authority
JP
Japan
Prior art keywords
light
emitting element
receiving element
light emitting
element portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6254182U
Other languages
Japanese (ja)
Other versions
JPS6320128Y2 (en
Inventor
司 竹内
文彦 佐藤
Original Assignee
オムロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オムロン株式会社 filed Critical オムロン株式会社
Priority to JP6254182U priority Critical patent/JPS58164255U/en
Publication of JPS58164255U publication Critical patent/JPS58164255U/en
Application granted granted Critical
Publication of JPS6320128Y2 publication Critical patent/JPS6320128Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来提案されている発光受光素子の断面図、第
２図は、この考案に係る発光受光素子の一例を示す断面
図、第３図〜第５図は同素子の製造方法を工程順に説明
する断面図、第６図は、同素子の発光動作説明用の接続
図、第７図は同素子の受光動作説明用め接続図である。 １・・・半導体基板、３・・・受光層、２１・・・電流
狭窄手段、２２・・・分離溝、１００・・・発光素子部
、２００・・・受光素子部。 第５図　− 第６図FIG. 1 is a cross-sectional view of a conventionally proposed light-emitting and light-receiving device, FIG. 2 is a cross-sectional view showing an example of the light-emitting and light-receiving device according to this invention, and FIGS. 3 to 5 show a process for manufacturing the device. 6 is a connection diagram for explaining the light emitting operation of the same element, and FIG. 7 is a connection diagram for explaining the light receiving operation of the same element. DESCRIPTION OF SYMBOLS 1... Semiconductor substrate, 3... Light receiving layer, 21... Current confinement means, 22... Separation groove, 100... Light emitting element part, 200... Light receiving element part. Figure 5 - Figure 6

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体基板主面上に形成された発光素子部と、この発光
素子部に対して環状の分離溝をはさんで上記主面上に形
成された受光素子部と、上記発光素子部にあって、上記
受光素子部の受光層と同じに構成された層の一部に、該
発光素子部の電流通路を狭ばめる電流狭窄手段を設けた
発光受光素子。A light emitting element portion formed on the main surface of the semiconductor substrate, a light receiving element portion formed on the main surface with an annular separation groove sandwiched between the light emitting element portion, and the light emitting element portion, A light-emitting light-receiving element, wherein a current constriction means for narrowing a current path in the light-emitting element part is provided in a part of a layer having the same structure as the light-receiving layer of the light-emitting element part.
JP6254182U 1982-04-28 1982-04-28 Light emitting light receiving element Granted JPS58164255U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6254182U JPS58164255U (en) 1982-04-28 1982-04-28 Light emitting light receiving element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6254182U JPS58164255U (en) 1982-04-28 1982-04-28 Light emitting light receiving element

Publications (2)

Publication Number Publication Date
JPS58164255U true JPS58164255U (en) 1983-11-01
JPS6320128Y2 JPS6320128Y2 (en) 1988-06-03

Family

ID=30072692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6254182U Granted JPS58164255U (en) 1982-04-28 1982-04-28 Light emitting light receiving element

Country Status (1)

Country Link
JP (1) JPS58164255U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62199707U (en) * 1986-06-06 1987-12-19

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5871682A (en) * 1981-10-23 1983-04-28 Fujitsu Ltd Semiconductor light emitting device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5871682A (en) * 1981-10-23 1983-04-28 Fujitsu Ltd Semiconductor light emitting device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62199707U (en) * 1986-06-06 1987-12-19

Also Published As

Publication number Publication date
JPS6320128Y2 (en) 1988-06-03

Similar Documents

Publication Publication Date Title
JPS58164255U (en) Light emitting light receiving element
JPS60125726U (en) Compound semiconductor mirror wafer
JPS59151459U (en) Light emitting light receiving element
JPS59151460U (en) Light emitting light receiving element
JPS58164253U (en) Light emitting light receiving element
JPS59128756U (en) semiconductor laser equipment
JPS59158181U (en) display device
JPS5853167U (en) Semiconductor photodetector
JPS58187146U (en) semiconductor equipment
JPS59127250U (en) light sensor
JPS60172355U (en) semiconductor light emitting device
JPS58105159U (en) light emitting diode element
JPS6054179U (en) Micro light emitting diode display
JPS6011374U (en) display
JPS6139966U (en) Semiconductor composite equipment
JPS5942056U (en) photoelectric converter
JPS6085855U (en) light emitting diode
JPS58148954U (en) semiconductor equipment
JPS6188269U (en)
JPS58129655U (en) Semiconductor optical coupling device
JPS59166457U (en) light emitting diode element
JPS59143055U (en) ZnSe blue light emitting device
JPS6096852U (en) Photocoupler
JPS601181U (en) Coaster with light emitting part
JPS59134146U (en) film carrier