JPS58148954U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS58148954U JPS58148954U JP4719182U JP4719182U JPS58148954U JP S58148954 U JPS58148954 U JP S58148954U JP 4719182 U JP4719182 U JP 4719182U JP 4719182 U JP4719182 U JP 4719182U JP S58148954 U JPS58148954 U JP S58148954U
- Authority
- JP
- Japan
- Prior art keywords
- light
- hole
- semiconductor equipment
- semiconductor device
- receiving element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図Ａ、 Ｂはそれぞれこの考案による半導体装置の
断面図および上面図、第２図はこの考案の装置をフォト
カプラに適用した構成図、第３図はこの考案の装置を適
用したフォトマイクロセンサの構成図、第４図および第
５図は従来のフォトカプラを示す構成図である。
１１・・・・・・受光素子、ｌｌａ・・・・・・主面、
１２・・・・・・孔部、１２ａ・・・・・・側面、１３
・・・・・・反射膜、１４・・・・・・発光素子。Figures 1A and B are a cross-sectional view and a top view of a semiconductor device according to this invention, respectively, Figure 2 is a configuration diagram in which the device of this invention is applied to a photocoupler, and Figure 3 is a photomicrograph to which the device of this invention is applied. The configuration diagram of the sensor, FIGS. 4 and 5, is a configuration diagram showing a conventional photocoupler. 11... Light receiving element, lla... Principal surface,
12... Hole, 12a... Side, 13
...Reflection film, 14... Light emitting element.
Claims (1)
、受光素子の主面の一部に該主面側へ末広がり状の孔部
を設けるとともに、少なくとも孔゛ 部の側面に反射
膜を形成し、この孔部の内底部に発光素子を載置したこ
とを特徴とする半導体装置。In a semiconductor device comprising a hybrid of a light-emitting and a light-receiving element, a part of the main surface of the light-receiving element is provided with a hole that widens toward the main surface, and a reflective film is formed on at least the side surface of the hole. A semiconductor device characterized in that a light emitting element is placed at the inner bottom of a hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4719182U JPS58148954U (en) | 1982-03-31 | 1982-03-31 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4719182U JPS58148954U (en) | 1982-03-31 | 1982-03-31 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58148954U true JPS58148954U (en) | 1983-10-06 |
Family
ID=30058159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4719182U Pending JPS58148954U (en) | 1982-03-31 | 1982-03-31 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58148954U (en) |
-
1982
- 1982-03-31 JP JP4719182U patent/JPS58148954U/en active Pending
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