JPS59143068U - Case for hybrid integrated circuit - Google Patents

Case for hybrid integrated circuit

Info

Publication number
JPS59143068U
JPS59143068U JP3527183U JP3527183U JPS59143068U JP S59143068 U JPS59143068 U JP S59143068U JP 3527183 U JP3527183 U JP 3527183U JP 3527183 U JP3527183 U JP 3527183U JP S59143068 U JPS59143068 U JP S59143068U
Authority
JP
Japan
Prior art keywords
case
integrated circuit
hybrid integrated
printed board
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3527183U
Other languages
Japanese (ja)
Inventor
月原　保久
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP3527183U priority Critical patent/JPS59143068U/en
Publication of JPS59143068U publication Critical patent/JPS59143068U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の混成集積回路部品の断面図、第２図は本
考案の実施例によるケースの外観図、第３図は本考案に
係る混成集積回路部品の断面図である。 ′　１・・・部品、２・・・リード、３・・・基板、４
・・・ケース、５・・・樹脂、６・・・プリント板、７
・・・穴、８・・・半田、９・・・空気層、１０・・・
突出部。FIG. 1 is a sectional view of a conventional hybrid integrated circuit component, FIG. 2 is an external view of a case according to an embodiment of the present invention, and FIG. 3 is a sectional view of a hybrid integrated circuit component according to the present invention. ' 1...Parts, 2...Leads, 3...Board, 4
...Case, 5...Resin, 6...Printed board, 7
... hole, 8 ... solder, 9 ... air layer, 10 ...
protrusion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リードを取り付は混成集積回路基板をケース内に収納し
、前記ケース内に樹脂を充填して内部を固定し、前記り
−ｐをプリント板に挿通して前記ケースを該プリント板
上に搭載するようにした混成集積回路において、前記ケ
ースの開口部の端縁の一部に突出部を設け、前記プリン
ト板への取り付は時に、該プリント板の取付面と前記ケ
ースの開口部端縁との間に、部分的な隙間が形成される
ようにしたことを特徴とする混成集積回路用ケース。To attach the leads, store the hybrid integrated circuit board in a case, fill the case with resin to fix the inside, insert the lead into the printed board, and mount the case on the printed board. In the hybrid integrated circuit, a protrusion is provided on a part of the edge of the opening of the case, and the mounting on the printed board is sometimes carried out between the mounting surface of the printed board and the edge of the opening of the case. A case for a hybrid integrated circuit, characterized in that a partial gap is formed between the case and the case.
JP3527183U 1983-03-11 1983-03-11 Case for hybrid integrated circuit Pending JPS59143068U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3527183U JPS59143068U (en) 1983-03-11 1983-03-11 Case for hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3527183U JPS59143068U (en) 1983-03-11 1983-03-11 Case for hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPS59143068U true JPS59143068U (en) 1984-09-25

Family

ID=30165972

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3527183U Pending JPS59143068U (en) 1983-03-11 1983-03-11 Case for hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS59143068U (en)

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