JPH0323946U - - Google Patents
Info
- Publication number
- JPH0323946U JPH0323946U JP8418889U JP8418889U JPH0323946U JP H0323946 U JPH0323946 U JP H0323946U JP 8418889 U JP8418889 U JP 8418889U JP 8418889 U JP8418889 U JP 8418889U JP H0323946 U JPH0323946 U JP H0323946U
- Authority
- JP
- Japan
- Prior art keywords
- package
- utility
- sides
- scope
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 description 2
Description
第１図は本考案に係わる半導体実装用パツケー
ジの一実施例を示した斜視図、第２図は従来の半
導体実装用パツケージの斜視図、第３図は実装例
の正面図である。
１……リードフレーム、２……パツケージ、３
……基板、４……ＩＣチツプ。
FIG. 1 is a perspective view showing an embodiment of a semiconductor packaging package according to the present invention, FIG. 2 is a perspective view of a conventional semiconductor packaging package, and FIG. 3 is a front view of a mounting example. 1...Lead frame, 2...Package, 3
...board, 4...IC chip.
Claims (1)
た事を特徴とする半導体実装用パツケージ。 A semiconductor mounting package characterized by having lead frames attached to both sides of the package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8418889U JPH0323946U (en) | 1989-07-17 | 1989-07-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8418889U JPH0323946U (en) | 1989-07-17 | 1989-07-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0323946U true JPH0323946U (en) | 1991-03-12 |
Family
ID=31632467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8418889U Pending JPH0323946U (en) | 1989-07-17 | 1989-07-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0323946U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6169159A (en) * | 1984-09-13 | 1986-04-09 | Toshiba Corp | Integrated circuit device |
| JPS6423560A (en) * | 1987-07-20 | 1989-01-26 | Olympus Optical Co | Semiconductor device and method of mounting same |
-
1989
- 1989-07-17 JP JP8418889U patent/JPH0323946U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6169159A (en) * | 1984-09-13 | 1986-04-09 | Toshiba Corp | Integrated circuit device |
| JPS6423560A (en) * | 1987-07-20 | 1989-01-26 | Olympus Optical Co | Semiconductor device and method of mounting same |