JPH0233443U - - Google Patents
Info
- Publication number
- JPH0233443U JPH0233443U JP1988110661U JP11066188U JPH0233443U JP H0233443 U JPH0233443 U JP H0233443U JP 1988110661 U JP1988110661 U JP 1988110661U JP 11066188 U JP11066188 U JP 11066188U JP H0233443 U JPH0233443 U JP H0233443U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- board
- frame
- notch
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Description
第１図はこの考案の半導体装置の一実施例を示
す平面図および斜視図、第２図は従来の半導体装
置を示す斜視図である。
１……基板、２……半導体素子、３……金属細
線、４……枠板、５……切欠部、７……封止樹脂
、９……溝。
FIG. 1 is a plan view and a perspective view showing an embodiment of the semiconductor device of this invention, and FIG. 2 is a perspective view showing a conventional semiconductor device. DESCRIPTION OF SYMBOLS 1...Substrate, 2...Semiconductor element, 3...Metal thin wire, 4...Frame plate, 5...Notch, 7...Sealing resin, 9...Groove.
Claims (1)
の電極部は基板上の配線パターンに金属細線によ
り配線され、その配線部と素子部を囲むように枠
板が基板表面に配置され、この枠板の一部には切
欠部が設けられ、この切欠部から枠板内側に充填
された封止樹脂により前記配線部および素子部が
覆われる半導体装置において、 枠板内側から枠板外側に通じる空気抜き用の溝
を基板表面に形成したことを特徴とする半導体装
置。[Claims for Utility Model Registration] A semiconductor element is directly mounted on a substrate, the electrode part of the element is wired with thin metal wires in the wiring pattern on the board, and a frame plate is attached to the substrate so as to surround the wiring part and the element part. In a semiconductor device which is arranged on the surface, a notch is provided in a part of the frame board, and the wiring part and the element part are covered with a sealing resin filled inside the frame board from the notch, the inside of the frame board. 1. A semiconductor device characterized in that a groove for air vent is formed on a surface of a substrate leading from the outside of a frame plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988110661U JPH0233443U (en) | 1988-08-25 | 1988-08-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988110661U JPH0233443U (en) | 1988-08-25 | 1988-08-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0233443U true JPH0233443U (en) | 1990-03-02 |
Family
ID=31348022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988110661U Pending JPH0233443U (en) | 1988-08-25 | 1988-08-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0233443U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007149926A (en) * | 2005-11-28 | 2007-06-14 | Matsushita Electric Ind Co Ltd | Casing structure and information apparatus using the same |
-
1988
- 1988-08-25 JP JP1988110661U patent/JPH0233443U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007149926A (en) * | 2005-11-28 | 2007-06-14 | Matsushita Electric Ind Co Ltd | Casing structure and information apparatus using the same |
| JP4654893B2 (en) * | 2005-11-28 | 2011-03-23 | パナソニック株式会社 | Housing structure of information equipment |