JPS61119344U - - Google Patents
Info
- Publication number
- JPS61119344U JPS61119344U JP120385U JP120385U JPS61119344U JP S61119344 U JPS61119344 U JP S61119344U JP 120385 U JP120385 U JP 120385U JP 120385 U JP120385 U JP 120385U JP S61119344 U JPS61119344 U JP S61119344U
- Authority
- JP
- Japan
- Prior art keywords
- external lead
- out electrodes
- resin
- semiconductor device
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ＡおよびＢは本考案の一実施例を示す平
面透視図および断面透視図、第２図は本考案の一
実施例による半導体装置をプリント板に取り付け
た時の底面図である。第３図ＡおよびＢは従来の
半導体装置の平面透視図および断面透視図、第４
図はその半導体装置をプリント板に取り付けた時
の底面図である。
１……支持体、２……半導体チツプ、３……封
止樹脂、４，５，１４……外部導出電極、６，７
，１６……穴、８……細線、９……配線、１０…
…プリント板。
1A and 1B are a plan perspective view and a sectional perspective view showing an embodiment of the present invention, and FIG. 2 is a bottom view of a semiconductor device according to an embodiment of the present invention attached to a printed board. 3A and 3B are a plan perspective view and a sectional perspective view of a conventional semiconductor device;
The figure is a bottom view of the semiconductor device attached to a printed board. DESCRIPTION OF SYMBOLS 1... Support body, 2... Semiconductor chip, 3... Sealing resin, 4, 5, 14... External lead-out electrode, 6, 7
, 16...hole, 8...thin wire, 9...wiring, 10...
...Printed board.
Claims (1)
ら導出され、該外部導出電極の所定のものの先端
部には半導体素子が取付けられる支持部となつて
いる樹脂封止形半導体装置において、前記支持部
に連続する外部導出電極を複数個にし、前記封止
樹脂の一面から同一方向へ導出した事を特徴とす
る樹脂封止形半導体装置。 (2) 前記支持部に連続する外部導出電極の少く
とも１つは他の外部導出電極と同一列を形成しな
いように配置されていることを特徴とする実用新
案登録請求の範囲第１項記載の樹脂封止形半導体
装置。[Claims for Utility Model Registration] (1) A plurality of external lead-out electrodes are led out from one surface of the sealing resin, and the tips of predetermined external lead-out electrodes serve as supporting parts to which semiconductor elements are attached. A resin-sealed semiconductor device, characterized in that a plurality of external lead-out electrodes are connected to the supporting portion and are led out in the same direction from one surface of the sealing resin. (2) At least one of the external lead-out electrodes continuous with the support part is arranged so as not to form the same row as other external lead-out electrodes, as described in claim 1 of the utility model registration claim. resin-sealed semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP120385U JPS61119344U (en) | 1985-01-09 | 1985-01-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP120385U JPS61119344U (en) | 1985-01-09 | 1985-01-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61119344U true JPS61119344U (en) | 1986-07-28 |
Family
ID=30473736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP120385U Pending JPS61119344U (en) | 1985-01-09 | 1985-01-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61119344U (en) |
-
1985
- 1985-01-09 JP JP120385U patent/JPS61119344U/ja active Pending