JPS62124852U - - Google Patents
Info
- Publication number
- JPS62124852U JPS62124852U JP1057486U JP1057486U JPS62124852U JP S62124852 U JPS62124852 U JP S62124852U JP 1057486 U JP1057486 U JP 1057486U JP 1057486 U JP1057486 U JP 1057486U JP S62124852 U JPS62124852 U JP S62124852U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- mounting
- frame
- mounting surface
- frame plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 8
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 230000001681 protective effect Effects 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
Description
図は本案実施例に係るもので、第１図はウエー
ハを取り付けたフレーム板の平面図、第２図はそ
の断面図である。
１：ウエーハ取付用フレーム板、２：ウエーハ
取付面、４：フレーム部、５：ウエーハ。
The figures relate to an embodiment of the present invention; FIG. 1 is a plan view of a frame plate to which a wafer is attached, and FIG. 2 is a sectional view thereof. 1: Frame plate for wafer mounting, 2: Wafer mounting surface, 4: Frame part, 5: Wafer.
Claims (1)
ーム部を合成樹脂板で一体に形成したことを特徴
とする半導体ウエーハ取付用フレーム板。 (2) 半導体ウエーハ取付面のウエーハ取付位置
に粘着剤が塗布され、該粘着剤面に保護シートを
貼付してなる請求の範囲第１項記載の半導体ウエ
ーハ取付用フレーム板。 (3) 半導体ウエーハ取付面の板厚をフレーム部
よりも薄く、凹陥して形成してなる請求の範囲第
１項又は第２項記載の半導体ウエーハ取付用フレ
ーム板。 (4) 半導体ウエーハ取付面にウエーハの外形パ
ターンを表示してなる請求の範囲第１項乃至第３
項の何れかに記載の半導体ウエーハ取付用フレー
ム板。[Claims for Utility Model Registration] (1) A frame plate for mounting a semiconductor wafer, characterized in that the semiconductor wafer mounting surface and the frame portion around it are integrally formed of a synthetic resin plate. (2) The frame board for mounting a semiconductor wafer according to claim 1, wherein an adhesive is applied to the wafer mounting position of the semiconductor wafer mounting surface, and a protective sheet is affixed to the adhesive surface. (3) The frame plate for mounting a semiconductor wafer according to claim 1 or 2, wherein the semiconductor wafer mounting surface is thinner than the frame portion and is formed in a recessed manner. (4) Claims 1 to 3 in which the external pattern of the wafer is displayed on the mounting surface of the semiconductor wafer.
A frame plate for mounting a semiconductor wafer according to any one of paragraphs.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1057486U JPH0231788Y2 (en) | 1986-01-28 | 1986-01-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1057486U JPH0231788Y2 (en) | 1986-01-28 | 1986-01-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62124852U true JPS62124852U (en) | 1987-08-08 |
| JPH0231788Y2 JPH0231788Y2 (en) | 1990-08-28 |
Family
ID=30796993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1057486U Expired JPH0231788Y2 (en) | 1986-01-28 | 1986-01-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231788Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5328422B2 (en) * | 2009-03-02 | 2013-10-30 | 信越ポリマー株式会社 | Electronic component holder |
-
1986
- 1986-01-28 JP JP1057486U patent/JPH0231788Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0231788Y2 (en) | 1990-08-28 |