JPH02110400U - - Google Patents

Info

Publication number
JPH02110400U
JPH02110400U JP2012589U JP2012589U JPH02110400U JP H02110400 U JPH02110400 U JP H02110400U JP 2012589 U JP2012589 U JP 2012589U JP 2012589 U JP2012589 U JP 2012589U JP H02110400 U JPH02110400 U JP H02110400U
Authority
JP
Japan
Prior art keywords
shield plate
main body
package type
body surface
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012589U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2012589U priority Critical patent/JPH02110400U/ja
Publication of JPH02110400U publication Critical patent/JPH02110400U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図ないし第2図は本考案の一実施例に係り
、第1図は断面図、第2図は分解斜視図である。
第3図ないし第4図は従来例に係り、第3図は断
面図、第4図は分解斜視図である。 1……基板、2……FPタイプIC、3……シ
ールド板、5……両面テープ(接着層)。
1 and 2 relate to one embodiment of the present invention, in which FIG. 1 is a sectional view and FIG. 2 is an exploded perspective view.
3 and 4 relate to a conventional example, with FIG. 3 being a sectional view and FIG. 4 being an exploded perspective view. 1... Board, 2... FP type IC, 3... Shield plate, 5... Double-sided tape (adhesive layer).

Claims (1)

【実用新案登録請求の範囲】 パターン面にフラツトパツケージタイプICが
搭載された基板の前記パターン面にシールド板を
取り付けるシールド板の取り付け構造であつて、 前記シールド板の取付面のうち、フラツトパツ
ケージタイプICの本体表面とほぼ対応する位置
にのみ接着層を形成し、この接着層と前記ICの
本体表面との貼り合わせによりシールド板をIC
上に固定したことを特徴とするシールド板の取り
付け構造。
[Scope of Claim for Utility Model Registration] A shield plate mounting structure in which a shield plate is attached to the pattern surface of a substrate on which a flat package type IC is mounted, wherein a flat package type IC is mounted on the pattern surface of the board. An adhesive layer is formed only at a position that approximately corresponds to the main body surface of the package type IC, and the shield plate is attached to the IC main body surface by bonding this adhesive layer to the IC main body surface.
A shield plate mounting structure characterized by being fixed on top.
JP2012589U 1989-02-22 1989-02-22 Pending JPH02110400U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012589U JPH02110400U (en) 1989-02-22 1989-02-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012589U JPH02110400U (en) 1989-02-22 1989-02-22

Publications (1)

Publication Number Publication Date
JPH02110400U true JPH02110400U (en) 1990-09-04

Family

ID=31236233

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012589U Pending JPH02110400U (en) 1989-02-22 1989-02-22

Country Status (1)

Country Link
JP (1) JPH02110400U (en)

Similar Documents

Publication Publication Date Title
JPH02110400U (en)
JPH0270436U (en)
JPS6249271U (en)
JPS60122139U (en) Pine surge tool for toothbrush attachment
JPS6413759U (en)
JPS63132475U (en)
JPS62124852U (en)
JPH0317616U (en)
JPH0184489U (en)
JPS6127260U (en) semiconductor pressure sensor
JPH0336166U (en)
JPS61143825U (en)
JPH0447542U (en)
JPS62192648U (en)
JPH01135797U (en)
JPS61119957U (en)
JPS6138997U (en) Board for mounting electronic components
JPS63132467U (en)
JPS61188362U (en)
JPS62166065U (en)
JPH0326588U (en)
JPH0465453U (en)
JPS5965551U (en) Thick film hybrid integrated circuit
JPS645291U (en)
JPS62149870U (en)