JPH01104063U - - Google Patents

Info

Publication number
JPH01104063U
JPH01104063U JP19583887U JP19583887U JPH01104063U JP H01104063 U JPH01104063 U JP H01104063U JP 19583887 U JP19583887 U JP 19583887U JP 19583887 U JP19583887 U JP 19583887U JP H01104063 U JPH01104063 U JP H01104063U
Authority
JP
Japan
Prior art keywords
wiring board
electrically
mounting terminal
shaped fitting
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19583887U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19583887U priority Critical patent/JPH01104063U/ja
Publication of JPH01104063U publication Critical patent/JPH01104063U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Combinations Of Printed Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図および第2図は本考案の一実施例を示す
もので、第1図は混成集積回路を印刷配線基板に
実装した状態の縦断面図、第2図は取付端子の斜
視図である。 1……混成IC、2……電子部品、3……配線
基板、4……取付端子、5……U形端子、6……
ピン、7……印刷配線基板、8……部品用パター
ン、9……はんだ、10……位置決め孔。
Figures 1 and 2 show an embodiment of the present invention, with Figure 1 being a longitudinal sectional view of a hybrid integrated circuit mounted on a printed wiring board, and Figure 2 being a perspective view of a mounting terminal. . 1...Mixed IC, 2...Electronic component, 3...Wiring board, 4...Mounting terminal, 5...U-shaped terminal, 6...
Pin, 7...Printed wiring board, 8...Component pattern, 9...Solder, 10...Positioning hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 配線基板に電子部品を搭載して、その入出力用
パターンに取付端子のU形金具を電気・機械的に
取付け、取付端子のU形金具の底面を印刷配線基
板の部品用パターンにはんだにて電気・機械的に
接続してなることを特徴とする面付用混成集積回
路。
Mount the electronic component on the wiring board, electrically and mechanically attach the U-shaped fitting of the mounting terminal to the input/output pattern, and solder the bottom of the U-shaped fitting of the mounting terminal to the component pattern of the printed wiring board. A surface-mounted hybrid integrated circuit characterized by being electrically and mechanically connected.
JP19583887U 1987-12-25 1987-12-25 Pending JPH01104063U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19583887U JPH01104063U (en) 1987-12-25 1987-12-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19583887U JPH01104063U (en) 1987-12-25 1987-12-25

Publications (1)

Publication Number Publication Date
JPH01104063U true JPH01104063U (en) 1989-07-13

Family

ID=31486494

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19583887U Pending JPH01104063U (en) 1987-12-25 1987-12-25

Country Status (1)

Country Link
JP (1) JPH01104063U (en)

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