JPH021872U - - Google Patents
Info
- Publication number
- JPH021872U JPH021872U JP8006588U JP8006588U JPH021872U JP H021872 U JPH021872 U JP H021872U JP 8006588 U JP8006588 U JP 8006588U JP 8006588 U JP8006588 U JP 8006588U JP H021872 U JPH021872 U JP H021872U
- Authority
- JP
- Japan
- Prior art keywords
- wide part
- view
- circuit board
- printed circuit
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
Landscapes
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案一実施例の斜視図、第２図は同
上のプリント基板に実装した状態を示す正面図、
第３図は他の実施例の斜視図、第４図はさらに他
の実施例の斜視図、第５図は他の電子部品の端子
構造を示す正面図、第６図は電子部品実装用のソ
ケツトの断面図である。
１は部品本体、１ａは直付け手段、２は端子ピ
ン、３は幅広部、４はリード線半田付け用孔、Ｘ
は電子部品である。
Fig. 1 is a perspective view of one embodiment of the present invention, Fig. 2 is a front view showing the state mounted on the same printed circuit board,
Fig. 3 is a perspective view of another embodiment, Fig. 4 is a perspective view of still another embodiment, Fig. 5 is a front view showing the terminal structure of another electronic component, and Fig. 6 is a perspective view of another embodiment. FIG. 3 is a cross-sectional view of the socket. 1 is the component body, 1a is the direct attachment means, 2 is the terminal pin, 3 is the wide part, 4 is the lead wire soldering hole,
is an electronic component.
Claims (1)
端子ピンの基部に幅広部を設けることによりプリ
ント基板実装用のシヨルダーを形成し、この幅広
部にリード線半田付け用の孔を穿設したことを特
徴とする電子部品。 A shoulder for mounting a printed circuit board is formed by providing a wide part at the base of a terminal pin that protrudes from a component body equipped with a direct attachment means, and a hole for lead wire soldering is bored in this wide part. Electronic components featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8006588U JPH021872U (en) | 1988-06-15 | 1988-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8006588U JPH021872U (en) | 1988-06-15 | 1988-06-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH021872U true JPH021872U (en) | 1990-01-09 |
Family
ID=31304913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8006588U Pending JPH021872U (en) | 1988-06-15 | 1988-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH021872U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4850816A (en) * | 1971-10-22 | 1973-07-17 | ||
| JPS5051708U (en) * | 1973-09-07 | 1975-05-19 | ||
| JPS52140810U (en) * | 1976-04-20 | 1977-10-25 | ||
| JPS5636455U (en) * | 1979-08-29 | 1981-04-08 | ||
| JPS63262280A (en) * | 1987-03-25 | 1988-10-28 | ヴアルテル・ユスト・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフトウング | Over-pick-coloring automatic coloring stamp |
| JPH02124160U (en) * | 1989-03-24 | 1990-10-12 |
-
1988
- 1988-06-15 JP JP8006588U patent/JPH021872U/ja active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4850816A (en) * | 1971-10-22 | 1973-07-17 | ||
| JPS5051708U (en) * | 1973-09-07 | 1975-05-19 | ||
| JPS555332Y2 (en) * | 1973-09-07 | 1980-02-07 | ||
| JPS52140810U (en) * | 1976-04-20 | 1977-10-25 | ||
| JPS5636455U (en) * | 1979-08-29 | 1981-04-08 | ||
| JPS5730127Y2 (en) * | 1979-08-29 | 1982-07-01 | ||
| JPS63262280A (en) * | 1987-03-25 | 1988-10-28 | ヴアルテル・ユスト・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフトウング | Over-pick-coloring automatic coloring stamp |
| JPH0576917B2 (en) * | 1987-03-25 | 1993-10-25 | Just Gmbh Walter | |
| JPH02124160U (en) * | 1989-03-24 | 1990-10-12 |