JPH0459174U - - Google Patents
Info
- Publication number
- JPH0459174U JPH0459174U JP9980290U JP9980290U JPH0459174U JP H0459174 U JPH0459174 U JP H0459174U JP 9980290 U JP9980290 U JP 9980290U JP 9980290 U JP9980290 U JP 9980290U JP H0459174 U JPH0459174 U JP H0459174U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- copper foil
- solder resist
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000007689 inspection Methods 0.000 claims 2
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図及び第２図はこの考案に係るプリント基
板の実施例を示し、第１図は要部の平面図、第２
図は放射状パターンの平面図である。
主な符号の説明、１……プリント基板、２……
プリント基板の捨て基板部、２ａ……捨て基板部
のミシン目、３……放射状パターン、３ａ……放
射状パターンの銅箔パターン、３ｂ……放射状パ
ターンのソルダーレジストパターン。
1 and 2 show an embodiment of the printed circuit board according to this invention, FIG. 1 is a plan view of the main part, and FIG.
The figure is a plan view of the radial pattern. Explanation of main symbols, 1...Printed circuit board, 2...
A sacrificial board portion of a printed circuit board, 2a... perforation of a sacrificial board portion, 3... a radial pattern, 3a... a copper foil pattern with a radial pattern, 3b... a solder resist pattern with a radial pattern.
Claims (1)
ジストを印刷したプリント基板において、 上記プリント基板に検査用銅箔パターンとソル
ダーレジストパターンとを設けて構成したことを
特徴とするプリント基板。 ２ 上記検査用銅箔パターンとソルダーレジスト
パターンとを放射状に形成したことを特徴とする
請求項１記載のプリント基板。[Claims for Utility Model Registration] 1. A printed circuit board in which a solder resist is printed on a copper foil pattern of the printed circuit board, characterized in that the printed circuit board is provided with a copper foil pattern for inspection and a solder resist pattern. Printed board. 2. The printed circuit board according to claim 1, wherein the copper foil pattern for inspection and the solder resist pattern are formed radially.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9980290U JPH0459174U (en) | 1990-09-26 | 1990-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9980290U JPH0459174U (en) | 1990-09-26 | 1990-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0459174U true JPH0459174U (en) | 1992-05-21 |
Family
ID=31841989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9980290U Pending JPH0459174U (en) | 1990-09-26 | 1990-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0459174U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005301057A (en) * | 2004-04-14 | 2005-10-27 | Hitachi Displays Ltd | Display apparatus |
-
1990
- 1990-09-26 JP JP9980290U patent/JPH0459174U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005301057A (en) * | 2004-04-14 | 2005-10-27 | Hitachi Displays Ltd | Display apparatus |
| JP4721651B2 (en) * | 2004-04-14 | 2011-07-13 | 株式会社 日立ディスプレイズ | Display device |