JPH0268474U - - Google Patents
Info
- Publication number
- JPH0268474U JPH0268474U JP14916988U JP14916988U JPH0268474U JP H0268474 U JPH0268474 U JP H0268474U JP 14916988 U JP14916988 U JP 14916988U JP 14916988 U JP14916988 U JP 14916988U JP H0268474 U JPH0268474 U JP H0268474U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- wiring board
- printed wiring
- solder resist
- outer peripheral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図ａ及びｂはそれぞれ本考案の第１の実施
例の平面図及びＡ―Ａ′線断面図、第２図は本考
案の第２の実施例の平面図、第３図ａ及びｂはそ
れぞれ従来の印刷配線板の一例の平面図及びＢ―
Ｂ′線断面図、第４図は印刷配線板の製造方法を
工程順に説明するための流れ図、第５図は部品実
装方法を工程順に説明するための流れ図である。
１，１ａ…パツド、２，２ａ…パターン、３…
ソルダーレジスト、４，４ａ…基材。
Figures 1a and b are a plan view and a sectional view taken along the line A-A' of the first embodiment of the present invention, Figure 2 is a plan view of the second embodiment of the present invention, and Figures 3a and b B- is a plan view of an example of a conventional printed wiring board, respectively.
A sectional view taken along the line B', FIG. 4 is a flowchart for explaining the printed wiring board manufacturing method in the order of steps, and FIG. 5 is a flowchart for explaining the component mounting method in the order of steps. 1, 1a...padded, 2,2a...pattern, 3...
Solder resist, 4, 4a...base material.
Claims (1)
て、前記パツドの外周縁上に櫛の歯状に形成され
たソルダーレジストの被膜を有することを特徴と
する印刷配線板。 1. A printed wiring board having a pad for surface mounting, characterized in that the pad has a solder resist coating formed in the shape of comb teeth on the outer peripheral edge of the pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14916988U JPH0268474U (en) | 1988-11-15 | 1988-11-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14916988U JPH0268474U (en) | 1988-11-15 | 1988-11-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0268474U true JPH0268474U (en) | 1990-05-24 |
Family
ID=31421155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14916988U Pending JPH0268474U (en) | 1988-11-15 | 1988-11-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0268474U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007036106A (en) * | 2005-07-29 | 2007-02-08 | Shinano Kenshi Co Ltd | Printed circuit board and its manufacturing method |
| JPWO2010052942A1 (en) * | 2008-11-06 | 2012-04-05 | イビデン株式会社 | Electronic component built-in wiring board and manufacturing method thereof |
| JP2021086983A (en) * | 2019-11-29 | 2021-06-03 | 大日本印刷株式会社 | Wiring board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6255375B2 (en) * | 1980-04-01 | 1987-11-19 | Nishimu Denshi Kogyo Kk |
-
1988
- 1988-11-15 JP JP14916988U patent/JPH0268474U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6255375B2 (en) * | 1980-04-01 | 1987-11-19 | Nishimu Denshi Kogyo Kk |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007036106A (en) * | 2005-07-29 | 2007-02-08 | Shinano Kenshi Co Ltd | Printed circuit board and its manufacturing method |
| JPWO2010052942A1 (en) * | 2008-11-06 | 2012-04-05 | イビデン株式会社 | Electronic component built-in wiring board and manufacturing method thereof |
| JP2021086983A (en) * | 2019-11-29 | 2021-06-03 | 大日本印刷株式会社 | Wiring board |